CN105318983A - Flexible thin film thermocouple temperature sensor and preparation method thereof - Google Patents

Flexible thin film thermocouple temperature sensor and preparation method thereof Download PDF

Info

Publication number
CN105318983A
CN105318983A CN201510727789.5A CN201510727789A CN105318983A CN 105318983 A CN105318983 A CN 105318983A CN 201510727789 A CN201510727789 A CN 201510727789A CN 105318983 A CN105318983 A CN 105318983A
Authority
CN
China
Prior art keywords
film
thermopair
flexible substrate
temperature sensor
negative pole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510727789.5A
Other languages
Chinese (zh)
Inventor
白庆星
景涛
张龙赐
谢明
龚星
谷晨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 48 Research Institute
Original Assignee
CETC 48 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 48 Research Institute filed Critical CETC 48 Research Institute
Priority to CN201510727789.5A priority Critical patent/CN105318983A/en
Publication of CN105318983A publication Critical patent/CN105318983A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a flexible thin film thermocouple temperature sensor and a preparation method thereof. The sensor comprises a flexible substrate plated with an anode thermocouple film and a cathode thermocouple film; one end of the anode thermocouple film and one end of the cathode thermocouple film are in butt joint to form a film joint, and the other end of the anode thermocouple film and the other end of the cathode thermocouple film are respectively in connection with bonding pads; the bonding pad at the end of the anode thermocouple film is welded with an anode lead wire, and the bonding pad at the end of the cathode thermocouple film is welded with a cathode lead wire. The method comprises the steps of: S1: manufacturing a substrate; S2: moulding anode and cathode thermocouples; and S3: packaging lead wires. The flexible thin film thermocouple temperature sensor has the advantages of simple structure, fast response speed and wide application scope.

Description

Fexible film thermocouple temperature sensor and preparation method thereof
Technical field
The present invention relates to thermometry, particularly relate to a kind of fexible film thermocouple temperature sensor and preparation method thereof.
Background technology
Temperature sensor is widely used in Aero-Space, Thermal Power Engineering etc., and the application of temperature sensor trends towards the application conditions of response and curved surface thermometric fast.
Traditional temperature sensor forms thermal cross with the welding of both positive and negative polarity thermocouple wire and carries out thermometric, and because thermocouple wire form thermocouple material is block materials, the thickness of its thermocouple contact is thicker, longer to the response time of temperature; Thermopair encapsulation has larger volume later, and encapsulate thermopair is the unyielding material of solid simultaneously, can not adapt to the thermometric requirement of abnormal curved surface.
Summary of the invention
The technical problem to be solved in the present invention overcomes the deficiencies in the prior art, provides that a kind of structure is simple, fast response time, fexible film thermocouple temperature sensor applied widely and preparation method thereof.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of fexible film thermocouple temperature sensor, comprise flexible substrate, on described flexible substrate, plating is provided with positive pole thermopair film and negative pole thermopair film, docking forms membrane junction in one end for described positive pole thermopair film and negative pole thermopair film, pad is connected in the other end, the pad solder being positioned at positive pole thermopair film end has positive wire, and the pad solder being positioned at negative pole thermopair film end has negative wire.
Further improvement as technique scheme:
Described positive pole thermopair film and negative pole thermopair film surface plating have transition bed.
Plating matcoveredn on described transition bed, described protective seam extends the flexible substrate surface covering described positive pole thermopair film and negative pole thermopair thin membrane regions.
Described flexible substrate is polyimide base film.
A preparation method for fexible film thermocouple temperature sensor, comprises the following steps:
S1: make substrate: adopt flexible material to make shaping flexible substrate;
S2: shaping both positive and negative polarity thermopair: adopt thin film preparation process to plate on flexible substrate and establish positive pole thermopair film and negative pole thermopair film, and docking forms membrane junction in one end to make positive pole thermopair film and negative pole thermopair film;
S3: lead packages: be connected a pad respectively with the other end of negative pole thermopair film at positive pole thermopair film, is being positioned at the pad solder positive wire of positive pole thermopair film end, is being positioned at the pad solder negative wire of negative pole thermopair film end.
Further improvement as said method technical scheme:
Described step S1 comprises step by step following:
S1.1: draw materials shaping: get polyimide material and make the flexible substrate being of a size of 5 × 10mm, then precise polished process is carried out to flexible substrate;
S1.2: cleaning: first Ultrasonic Cleaning is carried out to flexible substrate surface, then ion beam bombardment cleaning is carried out to flexible substrate.
When carrying out step S2, adopting ion beam sputtering deposition mode to plate on flexible substrate and establishing positive pole thermopair film and negative pole thermopair film.
First Ultrasonic Cleaning is carried out to the flexible substrate of band both positive and negative polarity thermopair upon step s 2, then carry out subsequent step.
After step s 3, at positive pole thermopair film and negative pole thermopair film surface plating transition bed.
Plating protective seam on transition bed, makes protective seam extend the flexible substrate surface of covering positive pole thermopair film and negative pole thermopair thin membrane regions.
Compared with prior art, the invention has the advantages that:
Fexible film thermocouple temperature sensor of the present invention, more traditional thermocouple wire form temperature sensor, present invention employs film preparation mode to plate on flexible substrate and establish positive pole thermopair film and negative pole thermopair film, namely the thickness of positive pole thermopair film and negative pole thermopair film is very little, the membrane junction thickness that its docking is formed is also naturally very little, there is the function of quick response temperature change, substantially increase the accuracy of this temperature sensor; And in this structure, have employed the carrier of flexible substrate as both positive and negative polarity thermopair film, it no longer needs the solid clamshell encapsulating thermopair, has the function adapting to abnormal curved surface thermometric environment, substantially increases the scope of application of temperature sensor.The preparation method of fexible film thermocouple temperature sensor of the present invention, adopt the method, galvanic couple is made to be the film galvanic couple that thickness is very little, namely the membrane junction thickness of positive pole thermopair film and negative pole thermopair film docking formation is also very little, there is the function of quick response temperature change, substantially increase the accuracy of this temperature sensor; And, utilize flexible material to make the carrier of shaping flexible substrate as positive pole thermopair film and negative pole thermopair film, there is the function adapting to abnormal curved surface thermometric environment, substantially increase the scope of application of temperature sensor.
Accompanying drawing explanation
Fig. 1 is the structural representation of fexible film thermocouple temperature sensor of the present invention.
Fig. 2 is the structural representation (band lead-in wire) of fexible film thermocouple temperature sensor of the present invention.
Fig. 3 is the end construction schematic diagram of fexible film thermocouple temperature sensor of the present invention.
Fig. 4 is the schematic flow sheet of preparation method of the present invention.
Fig. 5 is the schematic flow sheet making substrate in preparation method of the present invention.
In figure, each label represents:
1, flexible substrate; 2, positive pole thermopair film; 3, negative pole thermopair film; 4, membrane junction; 5, pad; 6, positive wire; 7, negative wire; 8, transition bed; 9, protective seam.
Embodiment
Below with reference to Figure of description and specific embodiment, the present invention is described in further details.
Fig. 1 to Fig. 3 shows a kind of embodiment of fexible film thermocouple temperature sensor of the present invention, comprise flexible substrate 1, on flexible substrate 1, plating is provided with positive pole thermopair film 2 and negative pole thermopair film 3, docking forms membrane junction 4 in one end for positive pole thermopair film 2 and negative pole thermopair film 3, pad 5 is connected in the other end, the pad 5 being positioned at positive pole thermopair film 2 end is welded with positive wire 6, and the pad 5 being positioned at negative pole thermopair film 3 end is welded with negative wire 7.More traditional thermocouple wire form temperature sensor, present invention employs film preparation mode to plate on flexible substrate 1 and establish positive pole thermopair film 2 and negative pole thermopair film 3, namely the thickness of positive pole thermopair film 2 and negative pole thermopair film 3 is very little, membrane junction 4 thickness that its docking is formed is also naturally very little, there is the function of quick response temperature change, substantially increase the accuracy of this temperature sensor; And in this structure, have employed the carrier of flexible substrate 1 as both positive and negative polarity thermopair film, it no longer needs the solid clamshell encapsulating thermopair, has the function adapting to abnormal curved surface thermometric environment, substantially increases the scope of application of temperature sensor.
In the present embodiment, flexible substrate 1 is polyimide base film.In this structure, adopt flexible flexible polyimide material as flexible substrate 1, make flexible substrate 1 possess flexible, can the function of deformation, the thermometric environment of abnormal curved surface can be adapted to, its structure is simple, design ingenious.
In the present embodiment, positive pole thermopair film 2 is nickel-chromium thin film, and negative pole thermopair film 3 is nisiloy film, thus forms K type thermopair, and the thickness of thermocouple film is only 1 μm, substantially increases the accuracy of this temperature sensor.
In other embodiments, both positive and negative polarity thermopair film can be T-shaped thermocouple material, the R type thermocouple material of platinum rhodium 13-platinum, the S type thermocouple material of platinum rhodium 10-platinum, the Type B thermocouple material of platinum rhodium 30-platinum rhodium 6 of copper-copper nickel.Concrete selection exports according to the service condition of temperature sensor and signal and requires to determine.
In the present embodiment, positive pole thermopair film 2 and negative pole thermopair film 3 plated surface are covered with transition bed 8, plating matcoveredn 9 on transition bed 8, and protective seam 9 extends flexible substrate 1 surface covering positive pole thermopair film 2 and negative pole thermopair film 3 region.This transition bed 8 is Ta 2o 5layer, it is in order to the protective seam 9 of extenuating follow-up preparation and flexible substrate 1 and the lattice parameter of both positive and negative polarity thermopair film and the mismatch of thermal expansivity, and the thickness of transition bed is about 200nm; This protective seam 9 is SiO 2protective seam, ensure that stability and the reliability of positive pole thermopair film 2 and negative pole thermopair film 3 and this regional flexibility substrate 1.
Fig. 4 to Fig. 5 shows a kind of embodiment of the preparation method of fexible film thermocouple temperature sensor of the present invention, comprises the following steps:
S1: make substrate: adopt flexible material to make shaping flexible substrate 1;
S2: shaping both positive and negative polarity thermopair: adopt thin film preparation process to plate on flexible substrate 1 and establish positive pole thermopair film 2 and negative pole thermopair film 3, and docking forms membrane junction 4 in one end to make positive pole thermopair film 2 and negative pole thermopair film 3;
S3: lead packages: be connected a pad 5 respectively with the other end of negative pole thermopair film 3 at positive pole thermopair film 2, welds positive wire 6 at the pad 5 being positioned at positive pole thermopair film 2 end, is positioned at the pad 5 of negative pole thermopair film 3 end and welds negative wire 7.
Adopt the method, galvanic couple is made to be the film galvanic couple that thickness is very little, namely membrane junction 4 thickness of positive pole thermopair film 2 and negative pole thermopair film 3 docking formation is also very little, has the function of quick response temperature change, substantially increases the accuracy of this temperature sensor; And, utilize flexible material to make the carrier of shaping flexible substrate 1 as positive pole thermopair film 2 and negative pole thermopair film 3, there is the function adapting to abnormal curved surface thermometric environment, substantially increase the scope of application of temperature sensor.
In the present embodiment, step S1 comprises step by step following:
S1.1: draw materials shaping: get polyimide material and make the flexible substrate 1 being of a size of 5 × 10mm, then precise polished process is carried out to flexible substrate 1;
S1.2: cleaning: first ultrasonic cleaning is carried out to flexible substrate 1 surface, then ion beam bombardment cleaning is carried out to flexible substrate 1.
Adopting this step S1.1 and S1.2, make the making of flexible substrate 1 more specification, clean and tidy and health, is the shaping carrying basis provided of follow-up both positive and negative polarity thermopair.
In the present embodiment, when carrying out step S2, adopting ion beam sputtering deposition mode to plate on flexible substrate 1 and establishing positive pole thermopair film 2 and negative pole thermopair film 3.Establish positive pole thermopair film 2 and negative pole thermopair film 3 by the plating that hockets of the technique of photoetching and ion beam sputtering deposition, it is easy to operate, accurate.
In other embodiments, also can adopt magnetron sputtering, the technique of electron beam evaporation and chemical vapor deposition also can plate and establish positive pole thermopair film 2 and negative pole thermopair film 3.
In the present embodiment, first Ultrasonic Cleaning is carried out to the flexible substrate 1 of band both positive and negative polarity thermopair upon step s 2, then carry out subsequent step.Ensure that the cleaning of the flexible substrate 1 of band both positive and negative polarity thermopair, be convenient to the carrying out of subsequent step.
In the present embodiment, after step s 3, at positive pole thermopair film 2 and negative pole thermopair film 3 coating surface transition bed 8.Plating protective seam 9 on transition bed 8, makes protective seam 9 extend flexible substrate 1 surface in covering positive pole thermopair film 2 and negative pole thermopair film 3 region.This transition bed 8 is Ta 2o 5layer, it is in order to the protective seam 9 of extenuating follow-up preparation and flexible substrate 1 and the lattice parameter of both positive and negative polarity thermopair film and the mismatch of thermal expansivity, and the thickness of transition bed is about 200nm; This protective seam 9 is SiO 2protective seam, ensure that stability and the reliability of positive pole thermopair film 2 and negative pole thermopair film 3 and this regional flexibility substrate 1.
Although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention.Any those of ordinary skill in the art, when not departing from technical solution of the present invention scope, can utilize the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or being revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to the technology of the present invention essence to any simple modification made for any of the above embodiments, equivalent variations and modification, all should drop in the scope of technical solution of the present invention protection.

Claims (10)

1. a fexible film thermocouple temperature sensor, it is characterized in that: comprise flexible substrate (1), the upper plating of described flexible substrate (1) is provided with positive pole thermopair film (2) and negative pole thermopair film (3), docking forms membrane junction (4) in one end for described positive pole thermopair film (2) and negative pole thermopair film (3), pad (5) is connected in the other end, the pad (5) being positioned at positive pole thermopair film (2) end is welded with positive wire (6), the pad (5) being positioned at negative pole thermopair film (3) end is welded with negative wire (7).
2. fexible film thermocouple temperature sensor according to claim 1, is characterized in that: described positive pole thermopair film (2) and negative pole thermopair film (3) plated surface are covered with transition bed (8).
3. fexible film thermocouple temperature sensor according to claim 2; it is characterized in that: the upper plating matcoveredn (9) of described transition bed (8), described protective seam (9) extends flexible substrate (1) surface covering described positive pole thermopair film (2) and negative pole thermopair film (3) region.
4. fexible film thermocouple temperature sensor according to any one of claim 1 to 3, is characterized in that: described flexible substrate (1) is polyimide base film.
5. a preparation method for fexible film thermocouple temperature sensor, is characterized in that: comprise the following steps:
S1: make substrate: adopt flexible material to make shaping flexible substrate (1);
S2: shaping both positive and negative polarity thermopair: adopt thin film preparation process to establish positive pole thermopair film (2) and negative pole thermopair film (3) in the upper plating of flexible substrate (1), and docking forms membrane junction (4) in one end to make positive pole thermopair film (2) and negative pole thermopair film (3);
S3: lead packages: be connected a pad (5) respectively at positive pole thermopair film (2) and the other end of negative pole thermopair film (3), is being positioned at the pad (5) welding positive wire (6) of positive pole thermopair film (2) end, is being positioned at the pad (5) welding negative wire (7) of negative pole thermopair film (3) end.
6. the preparation method of fexible film thermocouple temperature sensor according to claim 5, is characterized in that: described step S1 comprises step by step following:
S1.1: draw materials shaping: get polyimide material and make the flexible substrate (1) being of a size of 5 × 10mm, then precise polished process is carried out to flexible substrate (1);
S1.2: cleaning: first Ultrasonic Cleaning is carried out to flexible substrate (1) surface, then ion beam bombardment cleaning is carried out to flexible substrate (1).
7. the preparation method of fexible film thermocouple temperature sensor according to claim 6, it is characterized in that: when carrying out step S2, adopting ion beam sputtering deposition mode to establish positive pole thermopair film (2) and negative pole thermopair film (3) in the upper plating of flexible substrate (1).
8. the preparation method of fexible film thermocouple temperature sensor according to claim 7, is characterized in that: first carry out Ultrasonic Cleaning to the flexible substrate (1) of band both positive and negative polarity thermopair upon step s 2, then carry out subsequent step.
9. the preparation method of the fexible film thermocouple temperature sensor according to any one of claim 5 to 8, it is characterized in that: after step s 3, at positive pole thermopair film (2) and negative pole thermopair film (3) coating surface transition bed (8).
10. the preparation method of fexible film thermocouple temperature sensor according to claim 9; it is characterized in that: at the upper plating protective seam (9) of transition bed (8), make protective seam (9) extend flexible substrate (1) surface in covering positive pole thermopair film (2) and negative pole thermopair film (3) region.
CN201510727789.5A 2015-10-30 2015-10-30 Flexible thin film thermocouple temperature sensor and preparation method thereof Pending CN105318983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510727789.5A CN105318983A (en) 2015-10-30 2015-10-30 Flexible thin film thermocouple temperature sensor and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510727789.5A CN105318983A (en) 2015-10-30 2015-10-30 Flexible thin film thermocouple temperature sensor and preparation method thereof

Publications (1)

Publication Number Publication Date
CN105318983A true CN105318983A (en) 2016-02-10

Family

ID=55246864

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510727789.5A Pending CN105318983A (en) 2015-10-30 2015-10-30 Flexible thin film thermocouple temperature sensor and preparation method thereof

Country Status (1)

Country Link
CN (1) CN105318983A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105806503A (en) * 2016-04-20 2016-07-27 中国科学院工程热物理研究所 Multipoint film thermocouple structure for fluid dynamic temperature measurement
CN106124079A (en) * 2016-09-20 2016-11-16 中国航空工业集团公司北京长城计量测试技术研究所 Fexible film thermocouple
CN106197718A (en) * 2016-08-31 2016-12-07 北京埃德万斯离子束技术研究所股份有限公司 A kind of film temperature sensor and preparation method
CN106595886A (en) * 2016-10-31 2017-04-26 惠州市德赛西威汽车电子股份有限公司 Sheet-shaped thermocouple temperature measuring paster and temperature measuring method
CN106595894A (en) * 2016-12-19 2017-04-26 美的集团股份有限公司 Thin film thermocouple and temperature sensing device equipped with thin film thermocouple
CN109211428A (en) * 2018-08-21 2019-01-15 北京印刷学院 temperature sensor and preparation method
CN109781287A (en) * 2019-03-04 2019-05-21 西安交通大学 A kind of fexible film thermocouple temperature sensor with high spatial resolution
CN110501085A (en) * 2018-12-11 2019-11-26 中国航空工业集团公司北京长城计量测试技术研究所 A kind of thermal barrier coating heat-proof quality measurement method based on film thermometric
CN110954230A (en) * 2019-11-27 2020-04-03 东华大学 Flexible thermocouple temperature sensor and preparation method thereof
CN112229533A (en) * 2020-09-29 2021-01-15 西安交通大学 Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof
CN112729580A (en) * 2020-12-23 2021-04-30 西安交通大学 Flexible temperature sensor and preparation method thereof
CN113008399A (en) * 2021-01-26 2021-06-22 松诺盟科技有限公司 High-temperature corrosion-resistant thermocouple and processing method thereof
CN114459624A (en) * 2022-01-24 2022-05-10 清华大学 Embedded film thermocouple and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149027A (en) * 1979-05-10 1980-11-20 Aisin Seiki Co Ltd Thin film thermometer and its production
CN1796951A (en) * 2004-12-22 2006-07-05 中国科学院合肥智能机械研究所 Flexible array of temperature sensor, and preparation method
CN101290240A (en) * 2008-04-18 2008-10-22 杭州精诚光电子有限公司 Flexible thin film Ni resistance sensor and method for making same
CN102749157A (en) * 2012-07-27 2012-10-24 江苏物联网研究发展中心 Flexible multi-parameter sensor and manufacture method thereof
CN204286623U (en) * 2014-11-19 2015-04-22 中国电子科技集团公司第四十八研究所 A kind of film temperature sensor measured for quick response temperature
CN205157074U (en) * 2015-10-30 2016-04-13 中国电子科技集团公司第四十八研究所 Flexible thin film thermocouple temperature sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149027A (en) * 1979-05-10 1980-11-20 Aisin Seiki Co Ltd Thin film thermometer and its production
CN1796951A (en) * 2004-12-22 2006-07-05 中国科学院合肥智能机械研究所 Flexible array of temperature sensor, and preparation method
CN101290240A (en) * 2008-04-18 2008-10-22 杭州精诚光电子有限公司 Flexible thin film Ni resistance sensor and method for making same
CN102749157A (en) * 2012-07-27 2012-10-24 江苏物联网研究发展中心 Flexible multi-parameter sensor and manufacture method thereof
CN204286623U (en) * 2014-11-19 2015-04-22 中国电子科技集团公司第四十八研究所 A kind of film temperature sensor measured for quick response temperature
CN205157074U (en) * 2015-10-30 2016-04-13 中国电子科技集团公司第四十八研究所 Flexible thin film thermocouple temperature sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
应根裕: "《平板显示技术》", 31 December 2002 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105806503A (en) * 2016-04-20 2016-07-27 中国科学院工程热物理研究所 Multipoint film thermocouple structure for fluid dynamic temperature measurement
CN106197718A (en) * 2016-08-31 2016-12-07 北京埃德万斯离子束技术研究所股份有限公司 A kind of film temperature sensor and preparation method
CN106197718B (en) * 2016-08-31 2019-08-27 北京埃德万斯离子束技术研究所股份有限公司 A kind of film temperature sensor and preparation method
CN106124079A (en) * 2016-09-20 2016-11-16 中国航空工业集团公司北京长城计量测试技术研究所 Fexible film thermocouple
CN106595886A (en) * 2016-10-31 2017-04-26 惠州市德赛西威汽车电子股份有限公司 Sheet-shaped thermocouple temperature measuring paster and temperature measuring method
CN106595894A (en) * 2016-12-19 2017-04-26 美的集团股份有限公司 Thin film thermocouple and temperature sensing device equipped with thin film thermocouple
CN109211428A (en) * 2018-08-21 2019-01-15 北京印刷学院 temperature sensor and preparation method
CN110501085A (en) * 2018-12-11 2019-11-26 中国航空工业集团公司北京长城计量测试技术研究所 A kind of thermal barrier coating heat-proof quality measurement method based on film thermometric
CN109781287A (en) * 2019-03-04 2019-05-21 西安交通大学 A kind of fexible film thermocouple temperature sensor with high spatial resolution
CN110954230A (en) * 2019-11-27 2020-04-03 东华大学 Flexible thermocouple temperature sensor and preparation method thereof
CN112229533A (en) * 2020-09-29 2021-01-15 西安交通大学 Deformation-resistant flexible temperature sensor for temperature detection and preparation method thereof
CN112729580A (en) * 2020-12-23 2021-04-30 西安交通大学 Flexible temperature sensor and preparation method thereof
CN113008399A (en) * 2021-01-26 2021-06-22 松诺盟科技有限公司 High-temperature corrosion-resistant thermocouple and processing method thereof
CN114459624A (en) * 2022-01-24 2022-05-10 清华大学 Embedded film thermocouple and preparation method thereof

Similar Documents

Publication Publication Date Title
CN105318983A (en) Flexible thin film thermocouple temperature sensor and preparation method thereof
CN205157074U (en) Flexible thin film thermocouple temperature sensor
CN100378921C (en) Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
JP5333529B2 (en) Mold package manufacturing method
CN101499511B (en) LED chip with temperature sensing component and manufacturing method thereof
CN102192792B (en) Film thermistor sensor
JP2014528646A (en) Method for forming a connection portion used for bonding with a large diameter wire or strip between a metal molded body and a power semiconductor
CN204286623U (en) A kind of film temperature sensor measured for quick response temperature
CN105575926A (en) Semiconductor device having a stress-compensated chip electrode
CN104236787B (en) MEMS differential pressure pick-ups chip and preparation method
TW200822315A (en) Sensor type semiconductor package and fabrication method thereof
JP2009277949A (en) Semiconductor device and method of manufacturing the same
CN102842398B (en) A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof
CN105675917B (en) A kind of hot type air velocity transducer and its packaging method
JP2015502035A (en) Quad flat no lead (QFN) package structure and manufacturing method thereof
JP5560468B2 (en) Thin film thermistor sensor and manufacturing method thereof
CN101807532B (en) Ultra-thin chip inversely packaging method and packaged body
CN106684119A (en) Chip packaging structure and preparation method thereof
CN104636793A (en) Intelligent card and method for manufacturing same
US8900926B2 (en) Chip package method
CN207675355U (en) Miniaturized flat pressure sensor
TWI359481B (en) Sensor semiconductor package and method thereof
JPS5825242A (en) Manufacture of semiconductor
KR102612215B1 (en) Gas sensing module and sensing device
TWI646641B (en) Waterproof package module and waterproof packaging process

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20160210