CN102749157A - Flexible multi-parameter sensor and manufacture method thereof - Google Patents
Flexible multi-parameter sensor and manufacture method thereof Download PDFInfo
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- CN102749157A CN102749157A CN2012102653319A CN201210265331A CN102749157A CN 102749157 A CN102749157 A CN 102749157A CN 2012102653319 A CN2012102653319 A CN 2012102653319A CN 201210265331 A CN201210265331 A CN 201210265331A CN 102749157 A CN102749157 A CN 102749157A
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Abstract
The invention relates to a flexible multi-parameter sensor and a manufacture method thereof and belongs to the technical field of flexible electrons and sensors. The flexible multi-parameter sensor comprises a flexible substrate, and a detection sensitive area is arranged above the flexible substrate. The detection sensitive area comprises a pressure sensitive layer, a humidity sensitive layer and a temperature sensitive layer which are located above the flexible substrate. The humidity sensitive layer covers the pressure sensitive layer, the temperature sensitive layer covers the humidity sensitive layer, and a protection layer covers the temperature sensitive layer. A plurality of contact windows used for detecting external environment humidity are arranged in the detection sensitive area, the contact windows penetrate through the corresponding protection layer and the temperature sensitive layer which are arranged in the detection sensitive layer and stretch to the surface of the humidity sensitive layer. The flexible multi-parameter sensor is simple in structure, capable of being manufactured in batch in a roll-to-roll printing method, capable of detecting pressure and relative humidity and temperature signals, wide in suitable range, convenient to use, safe and reliable.
Description
Technical field
The present invention relates to a kind of sensor and manufacturing approach thereof, especially a kind of flexible multi-parameter sensor and manufacturing approach thereof belong to the technical field of flexible electronic and sensor.
Background technology
The flexible electronic product have light weight, not cracky, light transmission is good, quality is soft, be suitable for irregular surface, low in energy consumption, be easy to extensive manufacturing in batches, characteristics such as with low cost; Products such as flexible display, flexible touch screen, flexible light emitting diode, flexible radio frequency identity label and flexible sensor have been arranged at present both at home and abroad, progressively replaced traditional silica-based electronic product.Wherein, flexible sensor is started late with respect to traditional silicon based sensor, and 1985, people such as P. W. Barth proposed a kind of flexibility temperature sensor based on silicon diode, and this also is the blank of present flexible sensor structure.Subsequently; Along with the development of macromolecule polymer material and micro-nano process technology, the flexible sensor that is used to detect various external environment condition signals just is widely used at consumer electronics, medical electronics, technology of Internet of things, robot bionic technology, military affairs even aerospace field.Yet; Traditional sensor can only be surveyed to certain specific signal; If will survey multiple signal simultaneously, then need in same specific region, use the sensor of multiple different purposes is integrated, not only use loaded down with trivial details; And can't maximally utilise the useful area of product, produce and the cost safeguarded all higher.So exploitation realizes that the multi-parameter sensor of multiple measuring ability becomes the focus of domestic and international research.
Relatively more typical; At home; Electronics research institute of the Chinese Academy of Sciences proposes a kind of multiparameter integrated on rigid substrates (temperature, pressure, humidity) sensor in once; Xi'an Communications University uses similar manufacturing process, produces a kind of multiparameter rigidity sensor that can measure temperature, pressure, humidity and acceleration signal simultaneously, and Hefei Intelligent Machinery Inst., Chinese Academy of Scineces has the patent of invention of independent three-axis force and temperature compliant sensor; HeFei University of Technology once proposed a kind of sense of touch and temperature sensitive two parameter multifunction flexible sensors, and Shanghai micro-system research institute of the Chinese Academy of Sciences once developed a kind of two power flexible touch sensation sensors.In the world, Australian RMIT and proposed in 2000 a kind of can probing ozone, three parameter Multifunction Sensors of humidity and temperature, but be the rigidity sensor; 2003, Univ Michigan-Ann Arbor USA invented a kind of can detecting temperature, the condenser type multi-parameter sensor of pressure, relative humidity, but also be rigid device; 2005, Tokyo Univ Japan proposed a kind of based on transistorized can detection pressure and the multiparameter flexible sensor of temperature; Nearest, 2012, Korea S became equal shop university to utilize the organism transistor equally, on flexible base, board, has made transparent pressure and temperature sensor sensitive device.
Analyzing above-mentioned domestic and international research situation can know, at present in the existing technology that can survey three kinds even more external signals of rigidity sensor field; But in the flexible sensor field; The simple one-parameter sensor of multiple principle is failed active set and is become one and realize that multiparameter surveys; That adopts new structure multiparameter flexible sensor can only survey two kinds of outer signals at most simultaneously; And need to make complicated transistor arrangement and the output signal is carried out de, the inconvenience of not only manufacture craft relative complex, and use.
Summary of the invention
The objective of the invention is to overcome the deficiency that exists in the prior art, a kind of flexible multi-parameter sensor and manufacturing approach thereof are provided, it is simple in structure, and is easily manufactured, and ability detection pressure, relative humidity, temperature signal are applied widely, easy to use, safe and reliable.
According to technical scheme provided by the invention; Said flexible multi-parameter sensor comprises flexible substrate, and the top of said flexible substrate is provided with surveys the sensitizing range; Said detection sensitizing range comprises presser sensor layer, humidity-sensitive layer and the responsive to temperature layer that is positioned at the flexible substrate top; Said humidity-sensitive layer is covered on the presser sensor layer, and the responsive to temperature layer is covered on the humidity-sensitive layer, is coated with protective seam on the responsive to temperature layer; Survey in the sensitizing range and be provided with some contact windows that are used to survey external environment humidity, said contact window connects surveys corresponding protection layer and responsive to temperature layer in the sensitizing range, and extends to the surface of humidity-sensitive layer.
Said flexible substrate is provided with the flexible base, board smooth layer, and the presser sensor layer is arranged on the flexible substrate through the flexible base, board smooth layer.
Said detection sensitizing range comprises first area, second area, the 3rd zone and the 4th zone; First area and the 3rd zone are symmetrical region; Second area and the 4th zone are symmetrical region, and first area, second area, the 3rd zone and the 4th zone connect the back successively and form rectangular-shaped zone; All rectangular zigzag distributed after sensitizing range in first area, second area, the 3rd zone and the 4th zone isolated through isolated groove; Survey presser sensor layer in the sensitizing range, responsive to temperature layer respectively with the detection sensitizing range outside presser sensor layer contact plate, responsive to temperature layer contact plate be connected, said responsive to temperature layer contact plate, presser sensor layer contact plate all are positioned at the top of flexible substrate.
Said detection is provided with the printing lithographic pesudo-structure in the sensitizing range, said printing lithographic pesudo-structure connect protective seam, responsive to temperature layer, humidity-sensitive layer and the presser sensor layer surveyed in the sensitizing range until the surface.
The material of said flexible substrate is polyethylene terephthalate, gather naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gather in vinylphenol, benzocyclobutene, polyethersulfone, photoresist, the silicon rubber one or more.
Said presser sensor layer contact plate and presser sensor layer are same manufacturing layer, and responsive to temperature layer contact plate and responsive to temperature layer are same manufacturing layer.
A kind of manufacturing approach of flexible multi-parameter sensor, said flexible multi-parameter sensor manufacturing approach comprises the steps:
A, flexible substrate is provided, and on flexible substrate, sets gradually presser sensor layer, humidity-sensitive layer, responsive to temperature layer and printing lithographic glue-line;
B, utilize technology graphical and corrosion; Successively printing lithographic glue-line, responsive to temperature layer, humidity-sensitive layer and presser sensor layer are carried out graphical treatment; On flexible substrate, to form required detection sensitizing range and protective seam; Said detection sensitizing range comprises some contact windows that are used to survey external environment humidity, and said contact window connects surveys corresponding protection layer and responsive to temperature layer in the sensitizing range, until the surface of humidity-sensitive layer.
Among the said step b, comprise the steps:
B1, utilize the printing lithographic template that the printing lithographic glue-line is carried out the UV Printing photoetching, in the printing lithographic glue-line, to form three-dimensional structure as following etching process mask;
B2, peel off the printing lithographic template; Printing lithographic glue-line to above-mentioned formation three-dimensional structure carries out anisotropic etch; And presser sensor layer, humidity-sensitive layer, responsive to temperature layer corroded successively; Above flexible substrate, to form isolated groove, said isolated groove connects printing lithographic glue-line, responsive to temperature layer, humidity-sensitive layer and presser sensor layer, and extends to the surface of flexible substrate;
B3, above-mentioned printing lithographic glue-line is carried out anisotropic etch once more, remove printing lithographic glue-line, responsive to temperature layer and the humidity-sensitive layer of respective regions on the presser sensor layer, to form presser sensor layer contact plate;
B4, above-mentioned printing lithographic glue-line is carried out anisotropic etch for the third time, remove the printing lithographic glue-line and the responsive to temperature layer of respective regions on the humidity-sensitive layer, on humidity-sensitive layer, to be formed for contacting the contact window of external environment;
B5, above-mentioned printing lithographic glue-line is carried out anisotropic etch the 4th time, remove the printing lithographic glue-line of respective regions on the responsive to temperature layer, with formation temperature sensitive layer contact plate, printing lithographic glue-line corresponding on the responsive to temperature layer forms protective seam.
A kind of similar techniques scheme, a kind of manufacturing approach of flexible multi-parameter sensor, the manufacturing approach of said flexible multi-parameter sensor comprises the steps:
S1, flexible substrate is provided; And required presser sensor layer material is set on flexible substrate; Optionally shelter and etching presser sensor layer material; On flexible substrate, to form presser sensor layer, isolated groove and presser sensor layer contact plate, said presser sensor layer contact plate is connected with the presser sensor layer;
S2, the humidity sensitive layer material is set on the presser sensor layer, optionally shelters and etching humidity sensitive layer material, remove the humidity sensitive layer material on the presser sensor layer contact plate, to form and the corresponding to humidity-sensitive layer of presser sensor layer shape;
S3, the responsive to temperature layer material is set on above-mentioned humidity-sensitive layer, optionally shelters and etching temperature sensitive layer material, with the contact window of formation temperature sensitive layer and some perforation responsive to temperature layers;
S4, on the said temperature sensitive layer, apply photoresist layer, optionally shelter and the etching photoresist layer, exposing contact window and required responsive to temperature layer contact plate, and the layer that is protected.
Among the said step s1, after flexible substrate is provided, on flexible substrate, apply and curing flexible base, board smooth layer, the presser sensor layer is formed on the flexible base, board smooth layer.
Advantage of the present invention:
1, the structure of a kind of flexible multi-parameter sensor of proposing of the present invention is the flexible structure of detection pressure, relative humidity, these three parameters of temperature simultaneously; What pressure was surveyed utilization is thin-film micro strainometer principle; What relative humidity was surveyed utilization is that dielectric medium causes the different principle of capacitance in different humidity environment medium dielectric constant microwave medium difference in the plane-parallel capacitor structure; What temperature was surveyed utilization is the principle of sheet resistance formula thermometer; Three kinds of sensitive materials form simple plane-parallel capacitor structure, and implementation method is simple.
2, the present invention proposes a kind of structure of flexible multi-parameter sensor, and pressure, relative humidity and temperature parameter are measured respectively by different sensing units, need not the output signal is carried out de; Different according to the sensitive material that uses, the measuring unit of a certain signal also possibly have response to other signals, and this extra response can compensate and proofread and correct with the feedback of other signals of opposing, thereby promotes measuring accuracy.
3, a kind of structure of flexible multi-parameter sensor is proposed among the present invention; Not only can use traditional CMOS processing line to make; And compatible volume to volume typography line; Can realize the production in enormous quantities that repeatability is very high, thus the performance uniformity coefficient of boost device, and the manufacturing cost of reduction flexible sensor.
Description of drawings
Fig. 1 is the vertical view of flexible multi-parameter sensor of the present invention.
Fig. 2 ~ Fig. 6 is the practical implementation processing step cut-open view of the embodiment of the invention 1, wherein:
Fig. 2 carries out the cut-open view of UV Printing photoetching for the present invention utilizes the printing lithographic template.
Fig. 3 obtains the cut-open view behind the isolated groove for the present invention.
Fig. 4 obtains the cut-open view behind the presser sensor layer contact plate for the present invention.
Fig. 5 obtains the cut-open view behind the contact window for the present invention.
Fig. 6 obtains the cut-open view behind responsive to temperature layer contact plate and the protective seam for the present invention.
Fig. 7 ~ Figure 11 is the practical implementation technology cut-open view of the embodiment of the invention 2, wherein:
Fig. 7 is the cut-open view of the present invention after the flexible base, board smooth layer is set on the flexible substrate.
Fig. 8 is that the present invention is at the cut-open view that is provided with on the flexible base, board smooth layer after presser sensor layer and etching obtain isolated groove and presser sensor layer contact plate.
Fig. 9 obtains the cut-open view after the humidity-sensitive layer for the present invention.
Figure 10 obtains the cut-open view behind the responsive to temperature layer for the present invention.
Figure 11 obtains the cut-open view behind responsive to temperature layer contact plate and the protective seam for the present invention.
Description of reference numerals: 1-printing lithographic glue-line, 2-humidity-sensitive layer, 3-printing lithographic pesudo-structure, 4-flexible base, board smooth layer, 5-responsive to temperature layer, 6-presser sensor layer, 7-flexible substrate, 8-printing lithographic template, 9-contact window, 10-isolated groove, 11-responsive to temperature layer contact plate, 12-presser sensor layer contact plate, 13-protective seam, 14-first area, 15-second area, 16-the 3rd zone and 17-the 4th zone.
Embodiment
Below in conjunction with concrete accompanying drawing and embodiment the present invention is described further.
As shown in Figure 1: the vertical view that forms flexible multi-parameter sensor for the present invention.The flexible multi-parameter sensor of the present invention is gaging pressure, relative humidity and temperature signal simultaneously; In order to realize above-mentioned functions; The present invention includes flexible substrate 7, the top of said flexible substrate 7 is provided with flexible base, board smooth layer 4, and flexible base, board smooth layer 4 tops are provided with surveys the sensitizing range; Said detection sensitizing range comprises presser sensor layer 6, humidity-sensitive layer 2 and the responsive to temperature layer 5 that is positioned at flexible base, board smooth layer 4 tops; Said humidity-sensitive layer 2 is covered on the presser sensor layer 6, and responsive to temperature layer 5 is covered on the humidity-sensitive layer 2, is coated with protective seam 13 on the responsive to temperature layer 5; Survey in the sensitizing range and be provided with some contact windows 9 that are used to survey external environment humidity, said contact window 9 connects surveys corresponding protection layer 13 and responsive to temperature layer 5 in the sensitizing range, and extends to the surface of humidity-sensitive layer 2.Through being set, flexible base, board smooth layer 4 obtains presser sensor layer 6, humidity-sensitive layer 2 and responsive to temperature layer 5 better on the flexible substrate 7.
In the embodiment of the invention; Said detection sensitizing range comprises first area 14, second area 15, the 16 and the 4th zone 17, the 3rd zone; First area 14 and the 3rd zone 16 are symmetrical region; Second area 15 and the 4th zone 17 are symmetrical region, and first area 14, second area 15, the 16 and the 4th zone 17, the 3rd zone connect the back successively and form rectangular-shaped zone; All rectangular zigzag distributed after sensitizing range in first area 14, second area 15, the 16 and the 4th zone 17, the 3rd zone isolated through isolated groove 10; Survey presser sensor layer 6 in the sensitizing range, responsive to temperature layer 5 respectively with the detection sensitizing range outside presser sensor layer contact plate 12, responsive to temperature layer contact plate 11 be connected, said responsive to temperature layer contact plate 11, presser sensor layer contact plate 12 all are positioned at the top of flexible substrate 7 and flexible base, board smooth layer 4.Responsive to temperature layer contact plate 11 is same manufacturing layer with responsive to temperature layer 5, and presser sensor layer contact plate 12 is same manufacturing layer with presser sensor layer 6.Presser sensor layer 6 in the first area 14 is connected with one of them presser sensor layer contact plate 12; The 4th presser sensor layer 6 of zone in 17 is connected with another presser sensor layer contact plate 12 wherein, to form two connection electrode with the 6 outside connection of presser sensor layer; In like manner; Responsive to temperature layer 5 is connected with one of them responsive to temperature layer contact plate 11 in the first area 14; The 4th responsive to temperature layer 5 of zone in 17 is connected with another responsive to temperature layer contact plate 11 wherein; To form two electrodes that outwards connect; Responsive to temperature layer 5 in second area 15, the 3rd zone 16 and first area 14, the interior responsive to temperature layer 5 corresponding connection in the 4th zone 17, the type of attachment of presser sensor layer 6 is identical with responsive to temperature layer 5, and responsive to temperature layer 5, presser sensor layer 6 and the shape of humidity-sensitive layer 2 above flexible substrate 7 are consistent.
Through surveying the structure that the sensitizing range is divided into first area 14, second area 15, the 16 and the 4th zone 17, the 3rd zone; And the formation symmetry is rectangular-shaped; Form the jagged distributed architecture of rectangle through isolated groove 10 in each zone, can increase the sensitivity of measurement, improve the precision that detects.Can isolate surveying sensitizing range and non-sensitive district through isolated groove 10.
Said detection is provided with printing lithographic pesudo-structure 3 in the sensitizing range, and protective seam 13, responsive to temperature layer 5, humidity-sensitive layer 2 and the presser sensor layer 6 in the said printing lithographic pesudo-structure 3 perforation detection sensitizing ranges is until the surface of flexible base, board smooth layer 4.Said printing lithographic pesudo-structure 3 is structurally not influential to multi-parameter sensor, and just technology formation needs, and personnel are known by the present technique field, no longer detail here.
The material of said flexible substrate 7 is polyethylene terephthalate, gather naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gather in vinylphenol, benzocyclobutene, polyethersulfone, photoresist, the silicon rubber one or more; The thickness of flexible substrate 7 is 5 microns to 2 millimeters.
Said presser sensor layer 6 is the thin-film micro strain gauge structure that parallel rectangle jaggies bar forms; As the bottom electrode of plane-parallel capacitor, the material of presser sensor layer 6 is the combination of gold, platinum, aluminium, constantan Magno, Karma nickel-cadmium, palladium evanohm or the above-mentioned material of conduction; The thickness of presser sensor layer 6 is 10 nanometers to 10 micron, in the serrate lines of microstrain meter, and long 20 microns to 2 centimetres of each sawtooth, wide 2 microns to 200 microns, 2 microns to 200 microns of jaggy pitch.
And the coincidence identical of said humidity-sensitive layer 2 with presser sensor layer 6 shape; As the medium of plane-parallel capacitor, the material of humidity-sensitive layer 2 is the manganese tungsten ore, boron phosphate, tin oxide, zinc paste, indium oxide, perovskite composite oxides, the high molecular polymer based on polyelectrolyte, polyacetylene, polyphenyl, the polyaniline that mix of aluminium oxide, titanium dioxide, monox, spinel complex oxide, lithium chloride, gather to diine benzene, polyphenyl acid alkynes propyl ester, to the combination of diethynylbenzene-propargyl alcohol, phenylacetylene-propargyl alcohol, polyimide, polymethylmethacrylate, cellulose acetate-butyrate, polyvinyl acetate, polyethylene terephthalate, polyethersulfone, polysulfone resin, benzocyclobutene, hexamethyl two silicon azane or above-mentioned material; The thickness of humidity-sensitive layer 2 is 200 nanometers to 200 micron.
Said responsive to temperature layer 5 and presser sensor layer 6, humidity-sensitive layer 2 shapes are identical and overlap; And do the contact window 9 that humidity-sensitive layer contacts with environment on its serrate lines; The shape of contact window 9, size and number coring demand and different; Form sheet resistance formula thermometer, as the top electrode of plane-parallel capacitor; The material of responsive to temperature layer 5 is the combination of platinum, gold, copper, nickel, silver, tungsten or above-mentioned material; The thickness of responsive to temperature layer 5 is 10 nanometers to 10 micron.
Said protective seam 13 has identical shape and coincidence with responsive to temperature layer 5, and the responsive to temperature layer material is based on polyethylene terephthalate, gathers naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gathers the combination to vinylphenol, benzocyclobutene, polyethersulfone, photoresist, silicon rubber or above-mentioned material; The thickness of protective seam 13 is 200 nanometers to 2 millimeter.
Through two kinds of preparation technologies that form structures of the present invention of embodiment 1 and embodiment 2 difference, wherein, embodiment 1 prepares for adopting typography below, and embodiment 2 is for to obtain through the manufacturing of ultraviolet carving technology.
Embodiment 1
Like Fig. 2 ~ shown in Figure 6: the technology of the flexible multi-parameter sensor for preparing in the present embodiment comprises the steps, is specially:
Step 1, a side of the flexible substrate 7 of naphthalenedicarboxylic acid second diester is carried out following material stacks step successively in gathering of 125 micron thick: 5 microns SU-8 of spin coating, 3005 photoresist flexible base, board smooth layers 4 and solidify, the humidity-sensitive layer 2 of the golden presser sensor layer 6 of sputter 100 nanometers, spin coating 800 nanometer benzocyclobutenes (CYCLOTENE 3000) and solidify, the platinum responsive to temperature layer 5 of sputter 50 nanometers, evenly spray the UV Printing photoresist 1 of 475 nanometers based on polymethylmethacrylate; And use quartz glass printing lithographic template 8 to carry out the UV Printing photoetching, in printing lithographic glue 1, form the mask of three-dimensional structure as following etching process; As shown in Figure 2, promptly in the present embodiment, the material selection of presser sensor layer 6 is golden, the material selection platinum of responsive to temperature layer 5, and printing lithographic template 8 is according to required structure preparation, and personnel are known by the present technique field, no longer detail here; After carrying out printing lithographic through printing lithographic template 8, can effectively form follow-up required isolated groove 10 and contact window 9;
Step 2, peel off printing lithographic template 8; Carry out the anisotropic etch of the 1st printing lithographic glue 1, expose the figure of the isolated groove 10 of isolating device, herein materials all in the bing is carried out selective corrosion successively; Form the isolated groove 10 of isolating device, as shown in Figure 3; It is consistent to form the shape of surveying the sensitizing range profile among shape and Fig. 1 of isolated groove 10 here; Promptly form the isolated groove 10 in first area 14, second area 15, the 16 and the 4th zone 17, the 3rd zone simultaneously; Isolated groove 10 is the rectangle zigzag in each zone, the jagged parameter of rectangle as stated;
Step 3, carry out the anisotropic etch of the 2nd printing lithographic glue 1; The figure that exposes presser sensor layer contact plate 12; Herein humidity sensitive material in the bing and temperature-sensitive material are carried out selective corrosion, form the presser sensor layer contact plate 12 of presser sensor layer 6, as shown in Figure 4; Can obtain thus, presser sensor layer contact plate 12 is same manufacturing layer with presser sensor layer 6, and presser sensor layer contact plate 12 is positioned to be surveyed outside the sensitizing range, is used for presser sensor layer 6 is outwards drawn;
Step 4, carry out the anisotropic etch of the 3rd printing lithographic glue 1; The figure that exposes the contact window 9 of humidity-sensitive layer and external environment; Herein the humidity sensitive material in the bing is carried out selective corrosion; In responsive to temperature layer 5, form the window 9 that humidity-sensitive layer 2 contacts with external environment, as shown in Figure 5;
Step 5, carry out the anisotropic etch of the 4th printing lithographic glue 1, the electricity contact plate 11 of formation temperature sensitive layer 5, the structure of whole flexible sensor completes immediately, and 1 protective seam 13 as this sensor of remaining printing lithographic glue is as shown in Figure 6.
Wherein, the process conditions of ultraviolet imprint lithography are: impression pressure is 7500 handkerchiefs, and temperature conditions is 21 degrees centigrade of room temperatures, and ultraviolet dosage is 80 milli Jiao/square centimeters, and the process time is 3 seconds.Etching process is specially: using oxygen gas plasma is that 1.3 handkerchiefs and temperature are to carry out selective corrosion in 60 degrees centigrade the chamber to printing lithographic glue 1 at pressure; Use potassium iodide-iodine water (1:1) solution that the gold of presser sensor layer 6 is carried out selective corrosion for 21 degrees centigrade in room temperature; The Primary Stripper A of use Dow company carries out selective corrosion to the benzocyclobutene (CYCLOTENE 3000) of humidity-sensitive layer 2 at 95 degrees centigrade, uses hydrochloric acid-nitric acid (8:1) solution to carry out selective corrosion for the platinum of responsive to temperature layer 5 at 70 degrees centigrade.
Using oxygen gas plasma printing lithographic glue 1 to be carried out in the technology of anisotropic corrosion, use the real-time detection of laser film thickness measuring carrying out printing lithographic glue thickness, so that confirm the terminal point of each corrosion.
Embodiment 2
Shown in figure 11; Similar in the present embodiment among the structure of related flexible multi-parameter sensor and the embodiment 1; And except that protective seam 13, select identical materials for use, but present embodiment introduces a kind of employing ultraviolet carving technology and makes above-mentioned flexible multi-parameter sensor method, specific as follows:
Step t1, apply the photoresist flexible base, board smooth layer 4 of 5 microns SU-8 3005 and solidify in the side to the flexible substrate 7 of naphthalenedicarboxylic acid second diester of gathering of 125 micron thick, as shown in Figure 7;
Step t2, on flexible base, board smooth layer 4, use gold that sputtering method deposits 100 nanometer thickness as presser sensor layer 6; Use the method for ultraviolet lithography that presser sensor layer 6 is carried out graphically; Make its formation comprise the structure of device isolation groove 10 and presser sensor layer contact plate 12 figures, as shown in Figure 8;
Step t3, the humidity-sensitive layer 2 that on presser sensor layer 6, applies 800 nanometer benzocyclobutenes (CYCLOTENE 3000) and curing; Use the method for ultraviolet lithography that it is carried out graphically; To remove the material above presser sensor layer contact plate 12, as shown in Figure 9;
Step t4, on the humidity-sensitive layer 2 of benzocyclobutene (CYCLOTENE 3000), use platinum that sputtering method deposits 50 nanometer thickness as TEMPERATURE FORCE sensitive layer 5; Use the method for ultraviolet lithography that it is carried out graphically; Make its formation comprise the structure of the contact window 9 of humidity-sensitive layer and external environment, shown in figure 10;
Step t5, on the responsive to temperature layer, apply 2 microns SU-8 2002 photoresists and use the technology of ultraviolet lithography to make the structure of the contact window 9 of electricity contact plate 11 and humidity-sensitive layer and external environment that can Exposure Temperature sensitive layer 5, as the protective seam 13 of resulting devices.
Like Fig. 1, Fig. 6 with shown in Figure 11: presser sensor layer 6, responsive to temperature layer 5 and humidity-sensitive layer 2 have identical outline figure, and rectangular sawtooth lines wriggle on flexible base, board 7, form common two dimensional surface thin-film micro strainometer shape; In the responsive to temperature layer 5 of metal platinum, done contact window 9, so that humidity-sensitive layer 2 contacts with external environment.Simultaneously, two pole plates up and down of presser sensor layer 6 and responsive to temperature layer 5 formation plane-parallel capacitor structure, humidity-sensitive layer 2 is as the dielectric medium of capacitor.
When this sensor of outer bound pair applies pressure straight down; This pressure can make the presser sensor layer 6 of gold produce strains and cause the variation of resistance value; Though the more traditional silicon materials of strain constant of gold are lower; But with respect to the traditional silicon material very low Young modulus is arranged all owing to gather the flexible substrate 7 to naphthalenedicarboxylic acid second diester, the flexible base, board smooth layer 4 of SU-8 and the UV Printing photoresist 1 of polymethylmethacrylate; So the sensitivity and the traditional silicon strainometer that adopt gold thin film and the thin-film micro strainometer of high molecular polymer composition be in same level, the size of being exerted pressure is extrapolated in the measurement of presser sensor layer 6 strain of gold thin film thereby can use; Simultaneously and since the responsive to temperature layer 5 made of metal platinum equally to external world the applied pressure signal can produce strain, this extra response can be used for the response of the presser sensor layer 6 of gold is compensated and proofreaies and correct, and improves the precision of this measuring unit.
When measuring the relative humidity of external environment; Hydrone is absorbed by the humidity-sensitive layer 2 of benzocyclobutene through the contact window 9 in the responsive to temperature layer 5; Thereby cause the relative dielectric constant of humidity-sensitive layer 2 to change; So this capacity of parallel plate capacitor value changes than original state, the capacitance of this variation is detected the rh value that just can extrapolate in the external environment.
When ambient temperature changed, the variation of resistance value can take place in the responsive to temperature layer 5 that is positioned at the metal platinum film at sensor top, so temperature signal is converted into the electric signal that is easy to measure; Simultaneously and since the presser sensor layer 6 made of metallic gold also to external world variation of temperature have the response on the resistance value, this extra response can be used for the response of platinum responsive to temperature layer 5 is compensated and proofreaies and correct, and improves the measuring accuracy of this unit.
The structure of a kind of flexible multi-parameter sensor that the present invention proposes is the flexible structure of detection pressure, relative humidity, these three parameters of temperature simultaneously; What pressure was surveyed utilization is thin-film micro strainometer principle; What relative humidity was surveyed utilization is that dielectric medium causes the different principle of capacitance in different humidity environment medium dielectric constant microwave medium difference in the plane-parallel capacitor structure; What temperature was surveyed utilization is the principle of sheet resistance formula thermometer; Three kinds of sensitive materials form simple plane-parallel capacitor structure, and implementation method is simple.
The present invention proposes a kind of structure of flexible multi-parameter sensor, and pressure, relative humidity and temperature parameter are measured respectively by different sensing units, need not the output signal is carried out de; Different according to the sensitive material that uses, the measuring unit of a certain signal also possibly have response to other signals, and this extra response can compensate and proofread and correct with the feedback of other signals of opposing, thereby promotes measuring accuracy.
A kind of structure of flexible multi-parameter sensor is proposed among the present invention; Not only can use traditional CMOS processing line to make; And compatible volume to volume typography line; Can realize the production in enormous quantities that repeatability is very high, thus the performance uniformity coefficient of boost device, and the manufacturing cost of reduction flexible sensor.
This embodiment can be used for structure of the present invention and manufacture process are described, but enforcement of the present invention never only limits to this embodiment.In the scope that does not break away from the present invention and appended claim, various replacements, variation and modification all are possible.Therefore, protection scope of the present invention is not limited to embodiment and the disclosed content of accompanying drawing.
Claims (10)
1. flexible multi-parameter sensor; It is characterized in that: comprise flexible substrate (7); The top of said flexible substrate (7) is provided with surveys the sensitizing range, and said detection sensitizing range comprises presser sensor layer (6), humidity-sensitive layer (2) and the responsive to temperature layer (5) that is positioned at flexible substrate (7) top, and said humidity-sensitive layer (2) is covered on the presser sensor layer (6); Responsive to temperature layer (5) is covered on the humidity-sensitive layer (2), is coated with protective seam (13) on the responsive to temperature layer (5); Survey in the sensitizing range and be provided with some contact windows (9) that are used to survey external environment humidity, said contact window (9) connects surveys corresponding protection layer (13) and responsive to temperature layer (5) in the sensitizing range, and extends to the surface of humidity-sensitive layer (2).
2. flexible multi-parameter sensor according to claim 1 is characterized in that: said flexible substrate (7) is provided with flexible base, board smooth layer (4), and presser sensor layer (6) is arranged on the flexible substrate (7) through flexible base, board smooth layer (4).
3. flexible multi-parameter sensor according to claim 1; It is characterized in that: said detection sensitizing range comprises first area (14), second area (15), the 3rd zone (16) and the 4th zone (17); First area (14) is a symmetrical region with the 3rd zone (16); Second area (15) is a symmetrical region with the 4th zone (17), and first area (14), second area (15), the 3rd zone (16) and the 4th zone (17) connect the back successively and form rectangular-shaped zone; All rectangular zigzag distributed after sensitizing range in first area (14), second area (15), the 3rd zone (16) and the 4th zone (17) isolated through isolated groove (10); Survey presser sensor layer (6) in the sensitizing range, responsive to temperature layer (5) respectively with the detection sensitizing range outside presser sensor layer contact plate (12), responsive to temperature layer contact plate (11) be connected, said responsive to temperature layer contact plate (11), presser sensor layer contact plate (12) all are positioned at the top of flexible substrate (7).
4. flexible multi-parameter sensor according to claim 1; It is characterized in that: be provided with printing lithographic pesudo-structure (3) in the said detection sensitizing range, said printing lithographic pesudo-structure (3) connect to survey in the sensitizing range protective seam (13), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6) until the surface.
5. flexible multi-parameter sensor according to claim 1 is characterized in that: the material of said flexible substrate (7) is polyethylene terephthalate, gather naphthalenedicarboxylic acid second diester, polyetheretherketone, dimethyl silicone polymer, tygon, polystyrene, polypropylene, polyimide, epoxy resin, polymethylmethacrylate, Parylene, gather in vinylphenol, benzocyclobutene, polyethersulfone, photoresist, the silicon rubber one or more.
6. flexible multi-parameter sensor according to claim 3 is characterized in that: said presser sensor layer contact plate (12) is same manufacturing layer with presser sensor layer (6), and responsive to temperature layer contact plate (11) is same manufacturing layer with responsive to temperature layer (5).
7. the manufacturing approach of a flexible multi-parameter sensor is characterized in that, said flexible multi-parameter sensor manufacturing approach comprises the steps:
(a), flexible substrate (7) is provided, and on flexible substrate (7), set gradually presser sensor layer (6), humidity-sensitive layer (2), responsive to temperature layer (5) and printing lithographic glue-line (1);
(b), utilize technology graphical and corrosion; Successively printing lithographic glue-line (1), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6) are carried out graphical treatment; Form required detection sensitizing range and protective seam (13) to go up in flexible substrate (7); Said detection sensitizing range comprises some contact windows (9) that are used to survey external environment humidity; Said contact window (9) connects surveys corresponding protection layer (13) and responsive to temperature layer (5) in the sensitizing range, the surface until humidity-sensitive layer (2).
8. the manufacturing approach of flexible multi-parameter sensor according to claim 7 is characterized in that, in the said step (b), comprises the steps:
(b1), utilize printing lithographic template (8) that printing lithographic glue-line (1) is carried out the UV Printing photoetching, in printing lithographic glue-line (1), to form three-dimensional structure as following etching process mask;
(b2), peel off printing lithographic template (8); Printing lithographic glue-line (1) to above-mentioned formation three-dimensional structure carries out anisotropic etch; And presser sensor layer (6), humidity-sensitive layer (2), responsive to temperature layer (5) corroded successively; Top with in flexible substrate (7) forms isolated groove (10); Said isolated groove (10) connects printing lithographic glue-line (1), responsive to temperature layer (5), humidity-sensitive layer (2) and presser sensor layer (6), and extends to the surface of flexible substrate (7);
(b3), above-mentioned printing lithographic glue-line (1) is carried out anisotropic etch once more; Remove presser sensor layer (6) and go up printing lithographic glue-line (1), responsive to temperature layer (5) and the humidity-sensitive layer (2) of respective regions, to form presser sensor layer contact plate (12);
(b4), above-mentioned printing lithographic glue-line (1) is carried out anisotropic etch for the third time; Remove printing lithographic glue-line (1) and responsive to temperature layer (5) that humidity-sensitive layer (2) goes up respective regions, on humidity-sensitive layer (2), to be formed for contacting the contact window (9) of external environment;
(b5), above-mentioned printing lithographic glue-line (1) is carried out anisotropic etch the 4th time; Remove responsive to temperature layer (5) and go up the printing lithographic glue-line (1) of respective regions; With formation temperature sensitive layer contact plate (11), responsive to temperature layer (5) is gone up corresponding printing lithographic glue-line (1) and is formed protective seam (13).
9. the manufacturing approach of a flexible multi-parameter sensor is characterized in that, the manufacturing approach of said flexible multi-parameter sensor comprises the steps:
(s1), flexible substrate (7) is provided; And required presser sensor layer material is set on flexible substrate (7); Optionally shelter and etching presser sensor layer material; Form presser sensor layer (6), isolated groove (10) and presser sensor layer contact plate (12) to go up in flexible substrate (7), said presser sensor layer contact plate (12) is connected with presser sensor layer (6);
(s2), on presser sensor layer (6), the humidity sensitive layer material is set; Optionally shelter and etching humidity sensitive layer material; Remove the humidity sensitive layer material on the presser sensor layer contact plate (12), to form and the corresponding to humidity-sensitive layer of presser sensor layer (6) shape (2);
(s3), on above-mentioned humidity-sensitive layer (2), the responsive to temperature layer material is set, optionally shelter and etching temperature sensitive layer material, with the contact window (9) of formation temperature sensitive layer (5) and some perforation responsive to temperature layers (5);
(s4), go up to apply photoresist layer, optionally shelter and the etching photoresist layer at said temperature sensitive layer (5), exposing contact window (9) and required responsive to temperature layer contact plate (11), and the layer (13) that is protected.
10. the manufacturing approach of flexible multi-parameter sensor according to claim 9; It is characterized in that: in the said step (s1); After flexible substrate (7) is provided; Go up coating and solidify flexible base, board smooth layer (4) in flexible substrate (7), presser sensor layer (6) is formed on the flexible base, board smooth layer (4).
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