CN112097946B - Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement - Google Patents

Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement Download PDF

Info

Publication number
CN112097946B
CN112097946B CN202010967072.9A CN202010967072A CN112097946B CN 112097946 B CN112097946 B CN 112097946B CN 202010967072 A CN202010967072 A CN 202010967072A CN 112097946 B CN112097946 B CN 112097946B
Authority
CN
China
Prior art keywords
flexible
temperature
pressure sensor
sensor
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010967072.9A
Other languages
Chinese (zh)
Other versions
CN112097946A (en
Inventor
汪家奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalian University of Technology
Original Assignee
Dalian University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalian University of Technology filed Critical Dalian University of Technology
Priority to CN202010967072.9A priority Critical patent/CN112097946B/en
Publication of CN112097946A publication Critical patent/CN112097946A/en
Application granted granted Critical
Publication of CN112097946B publication Critical patent/CN112097946B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Abstract

An integrated flexible temperature and pressure sensor, a preparation method thereof and a system for measuring non-planar temperature belong to the field of sensor design and processing. In order to solve the problem that whether the flexible temperature sensor is well attached to the surface to be measured or not can not be accurately judged in the using process of the flexible temperature sensor, the sensor with the flexible material as the substrate is the essential point, the sensor comprises the flexible temperature sensor and the flexible pressure sensor, the flexible temperature sensor uses metal as a temperature sensitive resistor, the flexible pressure sensor uses a carbon-based material as a sensitive resistor, the flexible temperature sensor and the flexible pressure sensor are integrated through a flexible substrate material, the temperature measuring accuracy can be improved, and the popularization and the use of the flexible temperature sensor are greatly facilitated.

Description

Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement
Technical Field
The invention belongs to the field of sensor design and processing, and relates to a preparation method of an integrated flexible temperature and pressure sensor.
Background
The flexible temperature sensor is widely used for measuring non-planar surfaces such as curved surfaces, human tissues and the like, and has the advantages of good adhesion and accurate measurement. The flexible temperature sensor needs to be in good contact with a measured surface in the using process, external force is usually applied (including methods such as using adhesive tape for adhering and the like), but the temperature sensor is often separated from the measured curved surface along with the weakening of the external force or the movement of the measured curved surface, which is a great problem in the use of the temperature sensor, and therefore how to judge whether the contact is good becomes a problem which needs to be solved urgently.
Disclosure of Invention
In order to solve the problem that whether the temperature sensor is well attached to the surface to be measured or not can not be accurately judged in the using process of the flexible temperature sensor, the preparation method of the integrated flexible temperature and pressure sensor is provided, and comprises the following steps:
(1) coating a substrate material prepolymer on a carrier and curing;
(2) coating photoresist on a substrate material and patterning to form a surface;
(3) depositing an adhesion layer/metal on the surface to form a sample;
(4) removing the photoresist and the adhesive layer/metal on the photoresist from the sample, and forming a patterned metal resistor and a lead electrode by the residual metal to form a temperature sensor;
(5) coating a prepolymer which is the same as the substrate material on the metal resistor and the lead electrode, and curing to form an insulating layer as a substrate material film for subsequent processing;
(6) growing electrodes of the pressure sensor at two ends of the substrate material film;
(7) drying the conductive carbon-based slurry to form a film-shaped force sensitive resistor, and installing the force sensitive resistor between the electrodes of the two pressure sensors;
(8) the film-shaped force sensitive resistor is bonded with the electrodes of the two pressure sensors through conductive adhesive;
(9) coating a prepolymer which is the same as the substrate material on the film-shaped force-sensitive resistor and the electrode of the pressure sensor, curing to form a surface insulating layer film and simultaneously using the surface insulating layer film as a protective layer film;
(10) etching the surface insulating layer film, and partially or completely exposing the electrode of the temperature sensor and the electrode of the pressure sensor;
(11) the integrated film-like temperature sensor and pressure sensor are peeled from the carrier to form an integrated flexible temperature and pressure sensor.
The invention also relates to an integrated flexible temperature and pressure sensor obtained by the preparation method.
The invention also relates to an integrated flexible temperature and pressure sensor, which is a sensor taking a flexible material as a substrate and comprises a flexible temperature sensor and a flexible pressure sensor, wherein the flexible temperature sensor takes metal as a temperature sensitive resistor, the flexible pressure sensor takes a carbon-based material as a sensitive resistor, and the flexible temperature sensor and the flexible pressure sensor are integrated through a flexible substrate material.
The invention also relates to a system for measuring the non-planar temperature by using the flexible sensor, which comprises the integrated flexible temperature and pressure sensor and a controller; when the flexible temperature sensor measures the non-planar temperature, the pressure information of the integrated flexible temperature and pressure sensor and the surface to be measured is acquired in real time through the flexible pressure sensor integrated with the flexible substrate material of the flexible temperature sensor, whether the integrated flexible temperature and pressure sensor is well attached to the surface to be measured is judged according to the pressure acquisition information, the acquired data of the temperature sensor is abandoned when the integrated flexible temperature and pressure sensor is judged not to be well attached to the non-planar surface, and the information that the temperature sensor is not well attached to the surface to be measured is sent.
Compared with the prior art, the invention has the following beneficial effects:
(1) the integrated flexible temperature and pressure sensor is based on silicon micromachining technology, is easy to realize through the traditional MEMS technology, and has good manufacturability.
(2) Utilize pressure sensor to monitor temperature sensor and the laminating condition on the surface that awaits measuring, can improve temperature measurement's accuracy, very big the using widely of flexible temperature sensor that does benefit to.
Drawings
FIG. 1 is a schematic diagram of a sensor structure.
FIG. 2 is a schematic diagram of the attachment of a flexible temperature sensor to a surface to be measured during use.
FIG. 3 is a schematic view of the processing steps of the sensor, wherein (a) to (h) represent the processing steps, and (i) represents the material name.
Fig. 4 is a pressure calibration graph of the sensor.
Fig. 5 temperature calibration graph of the sensor.
1. Pressure sensor, 2 temperature sensor, 3 flexible substrate, 4 gap.
Detailed Description
The flexible temperature sensor is widely used for measuring non-flat surfaces such as curved surfaces, human tissues and the like. During measurement, the pressure of the temperature sensor and the contact surface is measured by the flexible pressure sensor to judge whether the sensor is in good contact with a non-plane or not, and then the temperature is measured, so that the accuracy of temperature measurement can be ensured to a greater extent. According to the invention, the flexible pressure sensor is integrally introduced on the basis of the flexible temperature sensor, and the contact condition of the temperature sensor and the surface to be measured is monitored by using the flexible pressure sensor, so that the temperature measurement is more accurate.
Fig. 1 is a schematic structure of an integrated flexible temperature and pressure sensor, which includes a flexible substrate represented by polyimide, a temperature sensor using metal as a sensitive resistor, and a pressure sensor using a carbon-based material as a sensitive resistor. The substrate material may also be one of PDMS or PMMA.
FIG. 2 shows that the flexible temperature sensor is separated from the surface to be measured or can not be in close contact with the surface to be measured when in use, and based on the situation, the invention provides the processing steps of the sensor, and the integrated flexible temperature and pressure sensor is obtained by the preparation method. As shown in fig. 3, the preparation method comprises:
firstly, as shown in fig. 3 (a), a layer of Polyimide (PI) prepolymer is coated on a carrier silicon wafer or a glass wafer and cured at a stepped temperature to form a polyimide film with a thickness of 45-55 micrometers, preferably 50 micrometers.
② as shown in figure 3 (b), a metal pattern is formed on the Polyimide (PI) by lift-off process, in a preferred scheme, the metal is platinum, and the metal can also be gold. Specifically, the lift-off process comprises the steps of firstly coating photoresist on Polyimide (PI) and patterning, then depositing 20/200nm Ti/Pt to form a sample, wherein Ti is used as an adhesion layer, Pt is used as a temperature sensitive layer, finally soaking the sample in an acetone solution to remove the photoresist and the Ti/Pt on the photoresist, and the residual Pt forms a patterned Pt resistor and a lead electrode to form the temperature sensor.
And thirdly, as shown in (c) of fig. 3, coating Polyimide (PI) with the thickness of 1.8-2.2 microns on the Pt resistor and the lead electrode to form a polyimide film as a protective layer, and finishing the manufacturing of the temperature sensor, wherein the thickness of the polyimide film is preferably 2 microns.
Fourthly, as shown in (d) of fig. 3, a method of combining chemical ion exchange and ink-jet printing is adopted, silver electrodes with the thickness of 500 nanometers to 5 micrometers grow on two ends of the polyimide film to be used as electrodes of the pressure sensor, and lead wires are configured;
preparing conductive material slurry, drying to form a film to be used as the force sensitive resistor, wherein the material for preparing the conductive material slurry comprises at least one of graphite particles, carbon nano tubes and graphene; as shown in fig. 3 (e), a film-like force sensor is bonded to the silver electrodes by a conductive silver paste, and a preferable film-like force sensor is located between the two silver electrodes.
Sixthly, as shown in (f) of fig. 3, Polyimide (PI) with the thickness of 1.8-2.2 microns is coated on the film-shaped force sensitive resistor and the silver electrode which are bonded together to form a polyimide film as a protective layer, and the manufacturing of the pressure sensor is completed; preferably, the polyimide film thickness is 2 microns.
And (c) as shown in fig. 3 (g), the polyimide film is etched to be divided, and the electrodes of the temperature sensor and the pressure sensor are partially or entirely exposed, preferably partially exposed.
As shown in fig. 3 (h), the film-like integrated temperature sensor and pressure sensor are peeled off from the carrier silicon wafer to form an integrated flexible temperature and pressure sensor.
The calibration of the temperature sensor and the pressure sensor is shown in fig. 5, the measuring range of the pressure sensor is 0-35 KPa, and the measuring range of the temperature sensor is 0-250 ℃.
In one embodiment, the difference from the above embodiment is that the Polyimide (PI) is replaced with PDMS or PMMA.
The integrated flexible temperature and pressure sensor prepared by the above embodiment specifically is a sensor using a flexible material as a substrate, and includes a flexible temperature sensor and a flexible pressure sensor, the flexible temperature sensor uses metal as a temperature sensitive resistor, the flexible pressure sensor uses a carbon-based material as a sensitive resistor, and the flexible temperature sensor and the flexible pressure sensor are integrated through a flexible substrate material.
The integrated flexible temperature and pressure sensor is used for non-planar temperature acquisition, and the system for measuring the non-planar temperature by using the flexible sensor comprises the integrated flexible temperature and pressure sensor and a controller; when the flexible temperature sensor measures the non-planar temperature, the pressure information of the integrated flexible temperature and pressure sensor and the surface to be measured is acquired in real time through the flexible pressure sensor integrated with the flexible substrate material of the flexible temperature sensor, whether the integrated flexible temperature and pressure sensor is well attached to the surface to be measured is judged according to the pressure acquisition information, the acquired data of the temperature sensor is abandoned when the integrated flexible temperature and pressure sensor is judged not to be well attached to the non-planar surface, and the information that the temperature sensor is not well attached to the surface to be measured is sent.
Through pressure information, a method of setting a threshold value or looking up a table is used, whether a gap exists between the sensor and the surface to be measured in the attaching mode can be determined, when the pressure of a certain area is determined to be obviously lower than the pressure of other areas, or when a certain local area is determined to be obviously lower than the average value of the pressure of the whole area, the current area is definitely not well attached, or through looking up the table, a gap reflected by current pressure information through the looking up method can be definitely determined, the collected data of the temperature sensor is abandoned when the current area is not well attached, and information that the temperature sensor is not well attached to the surface to be measured is sent out.
The integrated flexible temperature and pressure sensor is mainly used for measuring curved surfaces of machinery, human bodies and the like. The bonding degree between the sensor and the curved surface to be measured is monitored by the pressure sensor, so that the measurement result of the temperature sensor is more accurate. By using the prepared integrated flexible temperature and pressure measurement sensor, the pressure sensor collects pressure information of the temperature sensor and the surface to be measured in real time while the temperature sensor measures, and judges whether the temperature sensor is well attached to the surface to be measured based on the collected information.
The above description is only for the purpose of creating a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the inventive concept of the present invention within the technical scope of the present invention.

Claims (4)

1. The preparation method of the integrated flexible temperature and pressure sensor is characterized by comprising the following steps of:
(1) coating a substrate material prepolymer on a carrier and curing;
(2) coating photoresist on a substrate material and patterning to form a surface;
(3) depositing an adhesion layer/metal on the surface to form a sample;
(4) removing the photoresist and the adhesive layer/metal on the photoresist from the sample, and forming a patterned metal resistor and a lead electrode by the residual metal to form a temperature sensor;
(5) coating a prepolymer which is the same as the substrate material on the metal resistor and the lead electrode, and curing to form an insulating layer as a substrate material film for subsequent processing;
(6) growing electrodes of the pressure sensor at two ends of the substrate material film;
(7) drying the conductive carbon-based slurry to form a film-shaped force sensitive resistor, and installing the force sensitive resistor between the electrodes of the two pressure sensors;
(8) the film-shaped force sensitive resistor is bonded with the electrodes of the two pressure sensors through conductive adhesive;
(9) coating a prepolymer which is the same as the substrate material on the film-shaped force-sensitive resistor and the electrode of the pressure sensor, and curing to form a surface insulating layer film which is used as a surface protective layer film;
(10) etching the surface insulating layer film, and partially or completely exposing the electrode of the temperature sensor and the electrode of the pressure sensor;
(11) the integrated film-like temperature sensor and pressure sensor are peeled from the carrier to form an integrated flexible temperature and pressure sensor.
2. An integrated flexible temperature and pressure sensor obtained by the method of manufacture of claim 1.
3. The integrated flexible temperature and pressure sensor is prepared by the preparation method of claim 1, takes a flexible material as a substrate, and comprises a flexible temperature sensor and a flexible pressure sensor, wherein the flexible temperature sensor takes metal as a temperature sensitive resistor, the flexible pressure sensor takes a carbon-based material as a sensitive resistor, and the flexible temperature sensor and the flexible pressure sensor are integrated through a flexible substrate material.
4. A system for non-planar temperature measurement of a flexible sensor comprising the integrated flexible temperature and pressure sensor of claim 3 and a controller, wherein the integrated flexible temperature and pressure sensor is prepared according to the preparation method of claim 1; when the flexible temperature sensor measures the non-planar temperature, the pressure information of the integrated flexible temperature and pressure sensor and the surface to be measured is acquired in real time through the flexible pressure sensor integrated with the flexible substrate material of the flexible temperature sensor, whether the integrated flexible temperature and pressure sensor is well attached to the surface to be measured is judged according to the pressure acquisition information, the acquired data of the temperature sensor is abandoned when the integrated flexible temperature and pressure sensor is judged not to be well attached to the non-planar surface, and the information that the temperature sensor is not well attached to the surface to be measured is sent.
CN202010967072.9A 2020-09-15 2020-09-15 Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement Active CN112097946B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010967072.9A CN112097946B (en) 2020-09-15 2020-09-15 Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010967072.9A CN112097946B (en) 2020-09-15 2020-09-15 Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement

Publications (2)

Publication Number Publication Date
CN112097946A CN112097946A (en) 2020-12-18
CN112097946B true CN112097946B (en) 2021-09-28

Family

ID=73758733

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010967072.9A Active CN112097946B (en) 2020-09-15 2020-09-15 Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement

Country Status (1)

Country Link
CN (1) CN112097946B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115014592A (en) * 2021-03-05 2022-09-06 中国科学院上海硅酸盐研究所 Flexible dual-function electronic skin and preparation method thereof
CN113091811A (en) * 2021-03-31 2021-07-09 电子科技大学 Flexible temperature and pressure integrated sensor and preparation method and application thereof

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149387A (en) * 1991-05-06 1992-09-22 Administrator Of The National Aeronautics And Space Administration Flush mounting of thin film sensors
WO1996008701A1 (en) * 1994-09-12 1996-03-21 International Business Machines Corporation Electromechanical transducer
WO2005001422A2 (en) * 2003-06-06 2005-01-06 The Board Of Trustees Of The University Of Illinois Sensor chip and apparatus for tactile and/or flow
CN101082523A (en) * 2007-06-27 2007-12-05 中国科学院上海微系统与信息技术研究所 Method for making flexibility temperature sensor
CN102175362A (en) * 2011-03-07 2011-09-07 合肥工业大学 Multifunctional flexible touch sensor
CN102749157A (en) * 2012-07-27 2012-10-24 江苏物联网研究发展中心 Flexible multi-parameter sensor and manufacture method thereof
CN205426373U (en) * 2015-05-26 2016-08-03 黄伟聪 Sensor and flexibility of using this sensor surface fabric that generates heat based on flexible parent metal
CN205728241U (en) * 2016-06-24 2016-11-30 成都电科创品机器人科技有限公司 Intelligence belt
CN106895924A (en) * 2015-12-21 2017-06-27 中国电力科学研究院 A kind of flexible temperature and pressure transmitter
CN206836879U (en) * 2016-11-17 2018-01-05 歌尔科技有限公司 A kind of wearable device
CN109009026A (en) * 2018-08-13 2018-12-18 脱浩东 A kind of brassiere of more flexible sensors composition for breast cancer monitoring
CN109632123A (en) * 2018-12-07 2019-04-16 苏州长风航空电子有限公司 A kind of flexible paste chip temperature sensor
CN109781315A (en) * 2019-02-02 2019-05-21 五邑大学 A kind of novel touch sensor
CN110426060A (en) * 2019-08-28 2019-11-08 中国科学技术大学 Multifunction flexible sensing material and the preparation method and application thereof
CN111006801A (en) * 2019-12-17 2020-04-14 华中科技大学 Flexible variable-mode sensor for physiological information monitoring, application and preparation method

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149387A (en) * 1991-05-06 1992-09-22 Administrator Of The National Aeronautics And Space Administration Flush mounting of thin film sensors
WO1996008701A1 (en) * 1994-09-12 1996-03-21 International Business Machines Corporation Electromechanical transducer
WO2005001422A2 (en) * 2003-06-06 2005-01-06 The Board Of Trustees Of The University Of Illinois Sensor chip and apparatus for tactile and/or flow
CN101082523A (en) * 2007-06-27 2007-12-05 中国科学院上海微系统与信息技术研究所 Method for making flexibility temperature sensor
CN102175362A (en) * 2011-03-07 2011-09-07 合肥工业大学 Multifunctional flexible touch sensor
CN102749157A (en) * 2012-07-27 2012-10-24 江苏物联网研究发展中心 Flexible multi-parameter sensor and manufacture method thereof
CN205426373U (en) * 2015-05-26 2016-08-03 黄伟聪 Sensor and flexibility of using this sensor surface fabric that generates heat based on flexible parent metal
CN106895924A (en) * 2015-12-21 2017-06-27 中国电力科学研究院 A kind of flexible temperature and pressure transmitter
CN205728241U (en) * 2016-06-24 2016-11-30 成都电科创品机器人科技有限公司 Intelligence belt
CN206836879U (en) * 2016-11-17 2018-01-05 歌尔科技有限公司 A kind of wearable device
CN109009026A (en) * 2018-08-13 2018-12-18 脱浩东 A kind of brassiere of more flexible sensors composition for breast cancer monitoring
CN109632123A (en) * 2018-12-07 2019-04-16 苏州长风航空电子有限公司 A kind of flexible paste chip temperature sensor
CN109781315A (en) * 2019-02-02 2019-05-21 五邑大学 A kind of novel touch sensor
CN110426060A (en) * 2019-08-28 2019-11-08 中国科学技术大学 Multifunction flexible sensing material and the preparation method and application thereof
CN111006801A (en) * 2019-12-17 2020-04-14 华中科技大学 Flexible variable-mode sensor for physiological information monitoring, application and preparation method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Transparent and Flexible Mayan-Pyramid-based Pressure Sensor using Facile-Transferred Indium tin Oxide for Bimodal Sensor Applications;Minhyun Jung 等;《Scientific Reports》;20191001(第9期);1-11 *
柔性温度压力仿生皮肤的模块化设计与实现;郭小辉 等;《机器人》;20150731;第37卷(第4期);493-498 *

Also Published As

Publication number Publication date
CN112097946A (en) 2020-12-18

Similar Documents

Publication Publication Date Title
CN112097946B (en) Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement
CN108318161B (en) Wearable pressure sensor and manufacturing method thereof
CN110063724B (en) Flexible bioelectrode and preparation method thereof
CN109259891B (en) Electronic skin for measuring pressure and preparation method thereof
CN101950644B (en) Manufacturing method of flexible heat-sensitive thin film resistor array
US8739390B2 (en) Method for microcontact printing of MEMS
Maddipatla et al. A polyimide based force sensor fabricated using additive screen-printing process for flexible electronics
CN110701992B (en) Method for manufacturing capacitive strain sensor by taking sandpaper surface microstructure as template
CN109770866B (en) Preparation method of high-sensitivity electronic skin
CN111693189B (en) Novel flexible force-sensitive sensor and preparation method thereof
CN102639993A (en) Rapid response relative humidity sensor using anodic aluminum oxide film
CN110849508B (en) Flexible pressure sensor based on discrete contact structure and preparation method thereof
CN112429700A (en) Preparation method of flexible pressure sensor with pressure-sensitive structure
Dong et al. A flexible flow sensor for detecting airflow velocity and incident angle
Yi et al. An inkjet-printed strain sensor with a carbon-silverpolyimide topology
Ruoqin et al. Miura-ori Microstructure Enhanced Flexible Piezoresistive Pressure Sensor for Human Physiological Signal Monitoring
CN110470703B (en) Capacitive humidity sensor based on arched structure and preparation method and application thereof
DE102010038847A1 (en) Pressure sensor e.g. semiconductor pressure sensor has central cavity that is formed by etching in silicon membrane support, and is extended to measuring diaphragm
KR101356730B1 (en) Piezoresistive-type Touch Panel and Manufacturing Method Thereof
CN113551791B (en) Resistance type strain sensor capable of being rapidly prepared and preparation method thereof
CN114544046B (en) Method for manufacturing pressure sensor
CN113834418B (en) Flexible strain sensor with adjustable Poisson ratio
CN113819836B (en) Multi-material paper-cut structure extensible strain sensor and preparation method thereof
Kakati et al. Nano-structured gold strain gauge arrays on PDMS for highly sensitive nems pressure sensor skin
Hu et al. Design of Capacitive Pressure Sensors Integrated with Anisotropic Wedge Microstructure Based Dielectric Layer

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant