CN109632123A - A kind of flexible paste chip temperature sensor - Google Patents
A kind of flexible paste chip temperature sensor Download PDFInfo
- Publication number
- CN109632123A CN109632123A CN201811491777.7A CN201811491777A CN109632123A CN 109632123 A CN109632123 A CN 109632123A CN 201811491777 A CN201811491777 A CN 201811491777A CN 109632123 A CN109632123 A CN 109632123A
- Authority
- CN
- China
- Prior art keywords
- temperature
- temperature sensor
- sensing element
- adhesive
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/20—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of flexible paste chip temperature sensors, including temperature-sensing element, Kapton, adhesive, copper foil and conducting wire, the flexible structure being made of Kapton, adhesive and copper foil is used to accept the conducting wire positioned at the temperature-sensing element of front end temperature measuring area and positioned at end bonding pad, wherein temperature-sensing element and conducting wire realize signal transmission by copper foil.Overall dimension of the present invention is smaller, it is adapted to limited installation space, connection between temperature-sensing element and conducting wire is accepted by flexible structure, under the premise of guaranteeing signal transmission, bending, torsion when installation will not influence bond pad locations at two, it can be to avoid being acted at solder joint by applied stress, to guarantee reliability and the service life of product.
Description
Technical field
The present invention relates to temperature sensor technology fields, and in particular to a kind of new flexible paste chip temperature sensor.
Background technique
Current aircraft field of temperature measurement has measurement needs to the environment temperature field at the positions such as cockpit, hydraulic system, due to this
Class position is usually laid out complexity, limited configurations, and the interface that can carry out mechanical erection is not present in point position and thermometric surface is except flat
It further include the mounting surface situation of the complexity such as curved surface, cylinder outside face, therefore to the volume size of sensor thermometric end and installation side
Formula has stringent limitation, proposes the demand of miniaturization and flexible patch installation, while needing to take into account structural strength and signal
Transmission demand is to guarantee the reliability of product and to the applicability of different control systems.
At present on the market common patch type temperature sensor thermometric end frequently with temperature-sensing element and the conducting wire directly company of welding
The structure type connect, most of that flexible patch installation requirements are unable to satisfy using rigid encapsulating structure, a small amount of flexible package structure,
Due to being difficult to carry out consolidation process at solder joint, when carrying out patch installation, bond pad locations are easily in stress and cause
Fracture defect occurs in use process, reliability is lower.In addition, usually only a kind of output signal of such product and output shape
Formula, replacement need to re-start processing encapsulation, are not easy to quickly change.
Summary of the invention
The present invention provides a kind of flexible paste chip temperature sensor, it is therefore an objective to can satisfy miniaturization and flexible patch installation
Demand has higher structural strength, reliability and longer service life, effectively avoids common failure problems.
In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:
A kind of flexible paste chip temperature sensor, including temperature-sensing element, Kapton, adhesive, copper foil and conducting wire,
The flexible structure being made of Kapton, adhesive and copper foil is used to accept the temperature-sensing element positioned at front end temperature measuring area and position
Conducting wire in end bonding pad, wherein temperature-sensing element and conducting wire realize signal transmission by copper foil.
Preferably, the Kapton uses two panels, is located at upper and lower outermost layer, respectively polyimide base material and poly-
Acid imide cover film, described adhesive also use two panels, are located at upper next outer layer, respectively adhesive substrate and adhesive coverage
Film, copper foil is located at middle layer and is clipped between adhesive substrate and adhesive coverage film, by polyimides cover film, adhesive coverage
Film, copper foil, adhesive substrate, polyimide base material constitute institute by hot pressing compression moulding according to after sequence laying from top to bottom
State flexible structure.
Preferably, there are three square pads for processing on the copper foil, and one of square pads are as interlude pad position
In front end temperature measuring area and for welding temperature-sensing element, the bonding pad that remaining two pads are located at end as both ends pad is used in combination
In welding lead；Accordingly, be respectively equipped on polyimides cover film, adhesive coverage film position and quantity with rectangular weldering
The consistent aperture of disk, tapping keep square pads exposed.
Preferably, the flexible structure is when carrying out hot pressing compacting, and using 150-170 DEG C, pressed component is whole thick
Degree is not more than 0.113mm.
Preferably, to pressed component carry out chemical nickel gold processing, 0.03 μm~0.09 μm of layer gold thickness, nickel layer thickness
2~6 μm, postwelding cleaning, to protect exposed pad to avoid oxidation corrosion.
Preferably, after the temperature-sensing element is soldered to the square pads of temperature measuring area, at the back side of temperature-sensing element and pin
Surface coated with high-temperature-resisting silicon rubber and end bonding pad is bonded with limitting casing, and the conducting wire is soldered to the side of bonding pad
After shape pad, in limitting casing coating filling high-temperature-resisting silicon rubber to limitting casing is contour is wrapped by weld wherein, be for
Play a part of fixed and protect, solder joint is further protected to damage from applied stress
Preferably, the temperature-sensing element selects two kinds of indexing specifications of Pt100 platinum resistance or Pt1000 platinum resistance.
Preferably, the conducting wire selects 2 cores, 3 cores or 4 core shielded cables, with realize respectively temperature sensor two-wire system,
Three-wire system or four-wire system output.
Preferably, the conducting wire is the wire and cable with metallic shield.
The beneficial effects obtained by the present invention are as follows being: outer dimension of the present invention be 30mm × 10mm × 2.2mm (it is long × wide ×
It is high), overall dimension is smaller, is adapted to limited installation space；General thickness is not more than 0.113mm, with excellent flexible
Property and certain intensity, and the temperature being resistant within the scope of -55 DEG C~260 DEG C；Belonging in the 20mm length range of temperature measuring area can
Flexible region is scratched, flexible angular range reaches 0 °~270 °, can be very good to adapt to the special mounting surfaces such as curved surface, cylinder；
Connection between temperature-sensing element and conducting wire is accepted by flexible structure, and under the premise of guaranteeing signal transmission, bending when installation is turned round
Turn to will not influence bond pad locations at two, can to avoid being acted at solder joint by applied stress, thus guarantee product reliability and
Service life；The high-temperature-resisting silicon rubber coated at temperature-sensing element and conducting wire solder joint can play a part of fixed and protect, and further protect
Solder joint is damaged from applied stress；Flexible structure is modularized design, in the case where not changing the part-structure, can be passed through
The temperature-sensing element of different indexing is replaced, realizes the function of change output signal, and can realize two by restringing core number specification
The output function of line system, three-wire system or four-wire system.
The present invention has rational design, structure is simple, safe and reliable, easy to use, practicability is high, has and promotes the use of well
Value.
Detailed description of the invention
Fig. 1 is the main sectional view of flexible paste chip temperature sensor；
Fig. 2 is the top view of flexible paste chip temperature sensor.
In figure: 1- temperature-sensing element, 2-PI Kapton, 3- adhesive, 4- copper foil, 5- limitting casing, 6- high temperature resistant silicon
Rubber, 7- conducting wire.
Specific embodiment
As shown in Figs. 1-2, the present invention provides a kind of new flexible paste chip temperature sensor, temperature sensor main body by
Flexible structure is accepted, and front end is temperature measuring area, including platinum resistance temperature-sensing element 1 experiences thermometric for being directly installed on thermometric surface
Surface temperature；Middle section is transition region, including PI Kapton 2, adhesive 3 and copper foil 4, realizes front end by flexible structure
The undertaking of temperature measuring area and end bonding pad being bent when for installing, reversing transition；End is bonding pad, including limitting casing 5, resistance to
High temperature silicone rubber 6 and conducting wire 7, for being connected and fixed output lead.
Flexible structure is mainly made of Kapton 2, adhesive 3 and copper foil 4, wherein 2 thickness of Kapton
It is 25 μm, totally 2, is divided into polyimide base material and polyimides cover film, polyimides cover film surface needs opening square hole, opens
Hole site is as shown in Fig. 2, temperature measuring area 2, bonding pad 4；Adhesive 3 has 20 μm and 25 μm of two kinds of thickness, totally 2, same to divide
For adhesive substrate and adhesive coverage film, adhesive coverage film also needs to do aperture processing, position and quantity and polyamides is sub-
Amine cover film is consistent；Copper thickness is 18 μm, totally 2,3 square pads is machined on copper foil, as shown in Fig. 2, being located at
Both ends (C, D and E, F) and interlude (A, B) are connected two-by-two between pad.Adhesive substrate is covered on polyimide base material
On, then by 2 copper foils 4, position of center line is symmetrically attached on adhesive substrate as shown in Figure 2, and wherein interlude pad, which is located at, surveys
Warm area, both ends pad is located at bonding pad, then adhesive coverage film and polyimides cover film are successively covered on copper foil 4, protects
It is consistent with copper foil pad locations to demonstrate,prove position of opening, and keeps pad exposed, finally using 160 DEG C of hot pressing compactings of high temperature, cooling and solidifying
The bonding of PI Kapton 2 and copper foil 4 is completed afterwards, and component general thickness is not more than 0.113mm.Chemical nickel is carried out to component
Gold processing 0.03 μm~0.09 μm of layer gold thickness, 2~6 μm of nickel layer thickness, is welded with protecting exposed pad to avoid oxidation corrosion
After clean.Limitting casing is finally bonded in the surface of component bonding pad with high-temperature plastic, completes the assembly of flexible structure component.
According to output signal demand, platinum resistance temperature-sensing element 1 selects two kinds of indexing specifications of PT100 or PT1000, determines member
After part specification, platinum resistance temperature-sensing element 1 pin length to 2~3mm is trimmed, arranging pin extremely can thermometric shown in hookup 2 simultaneously
Area pad A, B weld 1 pin of platinum resistance temperature-sensing element with electric iron at pad using high temperature scolding tin, and postwelding inspection should not deposit
In burr, rosin joint situation.High-temperature-resisting silicon rubber is modulated, is coated at 1 back side of platinum resistance temperature-sensing element and pin, room temperature is solid
Change 8h.
According to output form needs, the specification of conducting wire 7 is selected.When needing two-wire system to export, the shielding of 2 cores is selected
Cable strips the sheath and shielded layer at 7 both ends of conducting wire, exposes 2 cable core conductors and insulating layer, and the loading of 7 one end of conducting wire is connected
It connects in area's limitting casing, close to flexible structure assembly surface, using high temperature scolding tin with 7 line of electric iron welding lead at pad D, E
Core conductor；When needing three-wire system to export, 3 core shielded cables are selected, 7 treatment process of conducting wire is same as above, is being welded using high temperature scolding tin
7 cable core conductor of electric iron welding lead is used at disk C, D, E；When needing four-wire system to export, 4 core shielded cables are selected, at conducting wire 7
Science and engineering skill is same as above, using high temperature scolding tin with 7 cable core conductor of electric iron welding lead at pad C, D, E, F.After the completion of welding, adjust
High-temperature-resisting silicon rubber processed, in limitting casing coating filling high-temperature-resisting silicon rubber to limitting casing it is contour, make 7 cable core conductor of conducting wire and
Insulating layer is not exposed, normal temperature cure 8h, i.e. completion sensor general assembly.
Claims (10)
1. a kind of flexible paste chip temperature sensor, it is characterised in that: including temperature-sensing element (1), Kapton (2), glue
Mixture (3), copper foil (4) and conducting wire (7), the flexible structure being made of Kapton (2), adhesive (3) and copper foil (4) are used
In accepting the temperature-sensing element (1) for being located at front end temperature measuring area and positioned at the conducting wire (7) of end bonding pad, wherein temperature-sensing element (1) and
Conducting wire (7) realizes signal transmission by copper foil (4).
2. a kind of flexible paste chip temperature sensor as described in claim 1, it is characterised in that: the Kapton
(2) two panels is used, upper and lower outermost layer, respectively polyimide base material and polyimides cover film, described adhesive (3) are located at
Using two panels, it is located at upper next outer layer, respectively adhesive substrate and adhesive coverage film, copper foil (4) is clipped in positioned at middle layer
Between adhesive substrate and adhesive coverage film, by polyimides cover film, adhesive coverage film, copper foil (4), adhesive base
Material, polyimide base material constitute the flexible structure by hot pressing compression moulding according to after sequence laying from top to bottom.
3. a kind of flexible paste chip temperature sensor as claimed in claim 1 or 2, it is characterised in that: add on the copper foil (4)
There are three square pads, one of square pads to be located at the temperature measuring area of front end as interlude pad and be used to weld temperature-sensitive for work
Element (1), remaining two pads are located at the bonding pad of end as both ends pad and are used for welding lead (7)；Accordingly, poly-
Position and quantity are respectively equipped on acid imide cover film, adhesive coverage film with the consistent aperture of square pads, tapping makes
Square pads are exposed.
4. a kind of flexible paste chip temperature sensor as claimed in claim 2, it is characterised in that: the flexible structure is carrying out
When hot pressing is suppressed, using 150-170 DEG C, pressed component integral thickness is not more than 0.113mm.
5. a kind of flexible paste chip temperature sensor as claimed in claim 4, it is characterised in that: carried out to pressed component
Chemical nickel gold processing, 0.03 μm~0.09 μm of layer gold thickness, 2~6 μm of nickel layer thickness, postwelding cleaning.
6. a kind of flexible paste chip temperature sensor as claimed in claim 3, it is characterised in that: temperature-sensing element (1) weldering
After being connected to the square pads of temperature measuring area, high-temperature-resisting silicon rubber is coated at the back side of temperature-sensing element (1) and pin.
7. a kind of flexible paste chip temperature sensor according to claim 3 claim, it is characterised in that: end connection
The surface in area is bonded with limitting casing (5), after the conducting wire (7) is soldered to the square pads of bonding pad, the coating in limitting casing (5)
Filling high-temperature-resisting silicon rubber (6) to limitting casing (5) is contour is wrapped by weld wherein.
8. a kind of flexible paste chip temperature sensor as described in claim 1, it is characterised in that: temperature-sensing element (1) choosing
With two kinds of indexing specifications of Pt100 platinum resistance or Pt1000 platinum resistance.
9. a kind of flexible paste chip temperature sensor as described in claim 1, it is characterised in that: the conducting wire (7) selects 2
Core, 3 cores or 4 core shielded cables, to realize two-wire system, three-wire system or the four-wire system output of temperature sensor respectively.
10. a kind of flexible paste chip temperature sensor described in claim according to claim 1, it is characterised in that: described to lead
Line (7) is the wire and cable with metallic shield.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811491777.7A CN109632123A (en) | 2018-12-07 | 2018-12-07 | A kind of flexible paste chip temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811491777.7A CN109632123A (en) | 2018-12-07 | 2018-12-07 | A kind of flexible paste chip temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109632123A true CN109632123A (en) | 2019-04-16 |
Family
ID=66071721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811491777.7A Pending CN109632123A (en) | 2018-12-07 | 2018-12-07 | A kind of flexible paste chip temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109632123A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110987217A (en) * | 2019-11-27 | 2020-04-10 | 苏州长风航空电子有限公司 | Temperature measurement clothes and temperature sensor |
| CN111239527A (en) * | 2020-03-02 | 2020-06-05 | 嘉兴学院 | Human body simulator for reliability detection of patch type flexible electronic monitoring equipment |
| CN111504490A (en) * | 2020-03-30 | 2020-08-07 | 东华大学 | Flexible thermal resistance temperature sensor and preparation and application thereof |
| CN112097946A (en) * | 2020-09-15 | 2020-12-18 | 大连理工大学 | Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement |
| WO2022241646A1 (en) * | 2021-05-18 | 2022-11-24 | 深圳麦克韦尔科技有限公司 | Atomizing assembly, atomizer and atomizing apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0868699A (en) * | 1994-08-30 | 1996-03-12 | Mitsubishi Materials Corp | Thermister sensor |
| CN101133306A (en) * | 2004-02-27 | 2008-02-27 | 西门子公司 | Temperature sensor and arrangement for regulating the climate in the interior of a motor vehicle |
| CN103282754A (en) * | 2011-01-07 | 2013-09-04 | 株式会社村田制作所 | Temperature sensor and structure having temperature sensor attached thereto |
| CN103542955A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Temperature inductor for lithium ion batteries |
| CN204014273U (en) * | 2014-06-05 | 2014-12-10 | 惠州市桑莱士光电有限公司 | A kind of flexible camera wiring board |
| CN205946322U (en) * | 2016-08-05 | 2017-02-08 | 硕诺科技（深圳）有限公司 | An FPC structure |
| CN107727261A (en) * | 2016-08-12 | 2018-02-23 | 泰科电子(上海)有限公司 | Temperature measurement component and electric equipment |
| CN108917970A (en) * | 2018-05-18 | 2018-11-30 | 江苏华宁电子系统工程有限公司 | A kind of the filming collecting transmitter and method of temperature signal |
-
2018
- 2018-12-07 CN CN201811491777.7A patent/CN109632123A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0868699A (en) * | 1994-08-30 | 1996-03-12 | Mitsubishi Materials Corp | Thermister sensor |
| CN101133306A (en) * | 2004-02-27 | 2008-02-27 | 西门子公司 | Temperature sensor and arrangement for regulating the climate in the interior of a motor vehicle |
| CN103282754A (en) * | 2011-01-07 | 2013-09-04 | 株式会社村田制作所 | Temperature sensor and structure having temperature sensor attached thereto |
| CN103542955A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Temperature inductor for lithium ion batteries |
| CN204014273U (en) * | 2014-06-05 | 2014-12-10 | 惠州市桑莱士光电有限公司 | A kind of flexible camera wiring board |
| CN205946322U (en) * | 2016-08-05 | 2017-02-08 | 硕诺科技（深圳）有限公司 | An FPC structure |
| CN107727261A (en) * | 2016-08-12 | 2018-02-23 | 泰科电子(上海)有限公司 | Temperature measurement component and electric equipment |
| CN108917970A (en) * | 2018-05-18 | 2018-11-30 | 江苏华宁电子系统工程有限公司 | A kind of the filming collecting transmitter and method of temperature signal |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110987217A (en) * | 2019-11-27 | 2020-04-10 | 苏州长风航空电子有限公司 | Temperature measurement clothes and temperature sensor |
| CN111239527A (en) * | 2020-03-02 | 2020-06-05 | 嘉兴学院 | Human body simulator for reliability detection of patch type flexible electronic monitoring equipment |
| CN111239527B (en) * | 2020-03-02 | 2022-05-10 | 嘉兴学院 | Human body simulator for reliability detection of patch type flexible electronic monitoring equipment |
| CN111504490A (en) * | 2020-03-30 | 2020-08-07 | 东华大学 | Flexible thermal resistance temperature sensor and preparation and application thereof |
| CN112097946A (en) * | 2020-09-15 | 2020-12-18 | 大连理工大学 | Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement |
| CN112097946B (en) * | 2020-09-15 | 2021-09-28 | 大连理工大学 | Integrated flexible temperature and pressure sensor, method for making same, and system for non-planar temperature measurement |
| WO2022241646A1 (en) * | 2021-05-18 | 2022-11-24 | 深圳麦克韦尔科技有限公司 | Atomizing assembly, atomizer and atomizing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109632123A (en) | A kind of flexible paste chip temperature sensor | |
| US7740403B2 (en) | High-temperature sensor | |
| CN102347296A (en) | Ceramic chip assembly | |
| KR101038755B1 (en) | Ceramic Chip Assembly | |
| CN1172352A (en) | Temp sensor with measuring resistance device | |
| JP4121665B2 (en) | Semiconductor substrate bonding method | |
| JP4897964B2 (en) | Current detector | |
| WO2012171320A1 (en) | A new contact smart card packaging method | |
| CN106052545A (en) | Quick wiring device for strain gauge on steel surface and strain measurement method | |
| CN102339811A (en) | Circuit board with COB (Chip On Board) packaged power device | |
| CN102748184B (en) | Engine starting gear | |
| CN210723447U (en) | Packaging and electrical transfer device | |
| US20230326839A1 (en) | Electronic component package | |
| JP2016186922A (en) | Water stop structure of wiring harness | |
| US10879151B2 (en) | Semiconductor package with liquid metal conductors | |
| CN101866889B (en) | Substrate-free chip packaging and manufacturing method thereof | |
| CN211929174U (en) | Thermal protection type piezoresistor | |
| US20220283040A1 (en) | Sensor Element and Method for Manufacturing a Sensor Element | |
| JP3875848B2 (en) | Temperature sensor | |
| TWI783247B (en) | temperature sensing device | |
| CN1959875B (en) | Dual welding spots inductor in high frequency packaged by ceramics and its production method | |
| CN117281496B (en) | Pressure sensor assembly and intracranial pressure monitor | |
| CN117281497B (en) | Intracranial pressure monitoring probe and intracranial pressure monitor | |
| CN212300652U (en) | Temperature sensing device | |
| CN101389939A (en) | Resistance thermometer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |
|
| RJ01 | Rejection of invention patent application after publication |