CN212300652U - Temperature sensing device - Google Patents

Abstract

The temperature sensing device comprises a first temperature sensing assembly, a second temperature sensing assembly and a signal wire; the first temperature sensing assembly comprises a first pin and a second pin; the second temperature sensing assembly comprises a third pin and a fourth pin; the signal wire comprises a first wire, a second wire and a third wire, and the first wire is connected with a first pin of the first temperature sensing assembly; the second wire is connected with the second pin of the first temperature sensing assembly and the third pin of the second temperature sensing assembly; the third wire is connected with the fourth pin of the second temperature sensing assembly. The utility model provides a temperature sensing device can overcome current temperature sensing device's stress failure problem.

Description

Temperature sensing device

Technical Field

The present invention relates to a temperature sensing device, and more particularly to a temperature sensing device capable of reducing stress.

Background

As shown in fig. 7, the conventional temperature sensing device includes a third temperature sensing chip 71, a fourth temperature sensing chip 72, and a first signal wire 73, where the first signal wire 73 includes a first twisted wire 731, a second twisted wire 732, and a third twisted wire 733, and the tail ends of the first twisted wire 731, the second twisted wire 732, and the third twisted wire 733 exposed out of the insulation sheath are respectively covered and combined by a solder 74 to form a first composite lead 751, a second composite lead 752, and a third composite lead 753, respectively. Support is provided because the first composite lead 751, the second composite lead 752, and the third composite lead 753 are stiff. The third temperature sensing die 71 can be soldered between the first composite lead 751 and the second composite lead 752 through a solder layer, and the fourth temperature sensing die 72 can be soldered between the second composite lead 752 and the third composite lead 753 through a solder layer. The second composite lead 752 serves as a common lead for the third temperature sensing chip 71 and the fourth temperature sensing chip 72. The first temperature sensing element 71 and the second temperature sensing element 72 are used for sensing the ambient temperature, and the first signal wire 73 is used for transmitting the temperature sensing signals generated by the first temperature sensing element 71 and the second temperature sensing element 72.

However, the third temperature sensing chip 71, the fourth temperature sensing chip 72, the first composite lead 751, the second composite lead 752, and the third composite lead 753 are directly connected to each other, and the first composite lead 751, the second composite lead 752, and the third composite lead 753 include tin and have a certain hardness, so that the third temperature sensing chip 71 and the fourth temperature sensing chip 72 directly receive the stress transmitted from the three composite leads, and the third temperature sensing chip 71 and the fourth temperature sensing chip 72 are easily broken and damaged due to the stress. From the viewpoint of manufacturing process, the first twisted wire 731, the second twisted wire 732, and the third twisted wire 733, which are not covered and bonded with the solder 74, are flexible and bendable compared to the first composite lead 751, the second composite lead 752, and the third composite lead 753. In addition, during the process of soldering the third temperature sensing chip 71 to the first composite lead 751 and the second composite lead 752, the first composite lead 751 and the second composite lead 752 may swing in opposite directions, which may cause the third temperature sensing chip 71 to be easily flipped and not easily soldered; the fourth temperature sensing chip 72, the second composite lead 752 and the third composite lead 753 are also not easily soldered.

Disclosure of Invention

The utility model aims to solve the technical problem that a temperature sensing device is provided, overcome current temperature sensing device's stress failure problem, from structural perfect messenger's the device overcome difficult welded problem in the processing manufacturing process.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

the temperature sensing device comprises a first temperature sensing assembly, a second temperature sensing assembly and a signal wire;

the first temperature sensing assembly comprises a first pin and a second pin;

the second temperature sensing assembly comprises a third pin and a fourth pin;

the signal wire comprises a first wire, a second wire and a third wire, and the first wire is connected with a first pin of the first temperature sensing assembly; the second wire is connected with the second pin of the first temperature sensing assembly and the third pin of the second temperature sensing assembly; the third wire is connected with the fourth pin of the second temperature sensing assembly.

The first temperature sensing assembly comprises a first temperature sensing chip, the first temperature sensing chip comprises a first conductive contact and a second conductive contact, a corresponding first pin is connected with the first conductive contact, and a second pin is connected with the second conductive contact; the second temperature sensing assembly comprises a second temperature sensing chip, the second temperature sensing chip comprises a third conductive contact and a fourth conductive contact, a corresponding third pin is connected with the third conductive contact, and the fourth pin is connected with the fourth conductive contact.

The first temperature sensing chip is arranged in the first packaging body; the second temperature sensing chip is arranged in the second packaging body, and the first packaging body and the second packaging body are isolated from each other.

The first temperature sensing chip can select a positive temperature coefficient resistance chip or a negative temperature coefficient resistance chip, and the second temperature sensing chip can select a positive temperature coefficient resistance chip or a negative temperature coefficient resistance chip.

The first wire comprises a first lead and a first insulating wire sheath wrapping the first lead, one end of the first lead is a first connecting section, and the first connecting section is exposed out of the first insulating wire sheath and connected with the outer end of the first pin; the second wire comprises a second lead and a second insulating sheath wrapping the second lead, one end of the second lead is a second connecting section, and the second connecting section is exposed out of the second insulating sheath and is connected with the outer end of the second pin and the outer end of the third pin; the third wire comprises a third conducting wire and a third insulating wire sheath wrapping the third conducting wire, one end part of the third conducting wire is a third connecting section, and the third connecting section is exposed out of the third insulating wire sheath and connected with the outer end of the fourth pin.

The first conducting wire, the second conducting wire and the third conducting wire can be stranded wires or single-core wires.

The first wire and the first pin, the second wire and the second pin, the third pin and the fourth pin are connected through a welding mode or a direct welding mode.

The diameters of the second pin and the third pin are smaller than the diameters of the first pin and the fourth pin.

The first temperature sensing chip and the second temperature sensing chip are adjacent to each other and keep flush, the first temperature sensing chip and the second temperature sensing chip are arranged along a second axial direction, the signal wire extends along the first axial direction, and the first axial direction is perpendicular to the second axial direction.

The first temperature sensing assembly and the second temperature sensing assembly are wrapped by a shell, and the shell is partially overlapped with the first insulating wire sheath, the second insulating wire sheath and the third insulating wire sheath and is connected with the first insulating wire sheath, the second insulating wire sheath and the third insulating wire sheath.

The utility model relates to a temperature sensing device has following technological effect:

1) the first temperature sensing assembly and the second temperature sensing assembly are respectively connected with the signal wire through the first pin, the second pin and the third pin, and the first pin, the second pin and the third pin are used as buffers to absorb stress, so that the temperature sensing assemblies in the device are effectively prevented from being broken and damaged due to the stress.

2) From the view of the manufacturing process, the temperature sensing assembly is connected to the corresponding wires through the pins, the connection mode of the pins to the wires is different from the direct connection mode of the chip of the existing temperature sensing device to the composite lead, and the problem that the chip of the existing temperature sensing device is not easy to weld due to overturning is naturally avoided.

3) Because the temperature sensing subassembly among this device is connected to before the signal wire rod, the pin of each temperature sensing subassembly can be connected to test equipment electricity to carry out relevant electrical property or temperature test, be connected with the signal wire rod again after passing the test, not eliminated through the test promptly, reach the purpose of screening temperature sensing subassembly, and then promote the off-the-shelf qualification rate of this device.

4) And the measured temperature is compared and confirmed by the two temperature sensing assemblies at the same time, so that the measurement distortion caused by the overlarge error value of one temperature sensing assembly is avoided.

5) The first temperature sensing chip and the second temperature sensing chip can be insulated from each other through the first encapsulating body and the second encapsulating body without causing short circuit; the first temperature sensing chip can be firmly jointed with the first pin and the second pin, and the second temperature sensing chip can be firmly jointed with the third pin and the fourth pin. In addition, the first package body can also isolate the first temperature sensing chip and the second temperature sensing chip from the external environment, so that the first temperature sensing chip and the second temperature sensing chip are protected from being influenced by the outside. Such as moisture.

6) And the diameter of a second pin and the diameter of a third pin which are simultaneously connected with the second lead are smaller than the diameter of the first pin and the diameter of the fourth pin. The second pin and the third pin are thinner, which is helpful to reduce the volume of the temperature sensing device of the invention, and the size is greatly reduced compared with other existing structures.

Drawings

The invention will be further explained with reference to the following figures and examples:

fig. 1 is a front view (first type) of the present invention.

Fig. 2 is a partial schematic view of the present invention.

Fig. 3 is a front view (second type) of the present invention.

Fig. 4 is a schematic view of the relative position between the present invention and the target.

Fig. 5 is a front view (third) of the present invention.

FIG. 6 is a schematic view of the process of the present invention.

Fig. 7 is a schematic diagram of a conventional temperature sensing device.

In the figure: the temperature sensing device includes a first temperature sensing element 10, a first lead 11, a second lead 12, a first temperature sensing chip 13, a first conductive contact 131, a second conductive contact 132, a first package 14, a second temperature sensing element 20, a third lead 21, a fourth lead 22, a second temperature sensing chip 23, a third conductive contact 231, a fourth conductive contact 232, a second package 24, a signal wire 30, a first wire 31, a first lead 311, a first insulation sheath 312, a first connection section 313, a second wire 32, a second wire 321, a second insulation sheath 322, a second connection section 323, a third wire 33, a third wire 331, a third insulation sheath 332, a third connection section 333, a first soldering body 41, a second soldering body 42, a third soldering body 43, a target 50, and a housing 60.

Detailed Description

As shown in fig. 1, the temperature sensing device includes a first temperature sensing element 10, a second temperature sensing element 20 and a signal wire 30. The first temperature sensing element 10 and the second temperature sensing element 20 can be used for sensing the ambient temperature. The signal wire 30 is electrically connected to the first temperature sensing element 10 and the second temperature sensing element 20 for transmitting the temperature sensing signals generated by the first temperature sensing element 10 and the second temperature sensing element 20.

For example, the device can be applied to a thermometer, and the measured temperature is compared and confirmed by two temperature sensing assemblies at the same time, so that the measurement distortion caused by the overlarge error value of one temperature sensing assembly is avoided.

As shown in fig. 2, the first temperature sensing element 10 includes two leads, namely a first lead 11 and a second lead 12, and the first lead 11 and the second lead 12 are flexible strips that are conductive and bendable. By arranging the two pins, the two temperature sensing assemblies can be prevented from being directly connected with the signal wire 30, so that the influence of stress on the temperature sensing assemblies can be greatly reduced.

In the present embodiment, specifically, as shown in fig. 2, the first temperature sensing assembly 10 includes a first temperature sensing chip 13, and the first temperature sensing chip 13 includes two conductive contacts. For example, one of the conductive contacts may be grounded, but is not limited to being grounded. Specifically, the two conductive contacts of the first temperature sensing chip 13 are a first conductive contact 131 and a second conductive contact 132, respectively, and the first conductive contact 131 and the second conductive contact 132 are exposed on the opposite surfaces of the first temperature sensing chip 13 and are separated from each other and disposed opposite to each other.

As shown in fig. 2, the first lead 11 may include an inner end and an outer end, and the inner end of the first lead 11 is located in the first package body 14 and connected to the first conductive contact 131. Similarly, the second lead 12 may include an inner end and an outer end, and the inner end of the second lead 12 is located in the first package 14 and connected to the second conductive contact 132.

As shown in fig. 2, the first temperature sensing device 10 may include a first package 14, and the first temperature sensing chip 13 is disposed in the first package 14. The first encapsulation 14 may be a member made of resin, teflon, Polyimide (PI), or glass (the first encapsulation 14 is not limited to the above embodiments, and may be made of other materials).

As shown in fig. 2, the second temperature sensing element 20 includes two pins, a third pin 21 and a fourth pin 22. The third lead 21 and the fourth lead 22 are flexible strips that are electrically conductive and bendable.

In the present embodiment, as shown in fig. 2, the second temperature sensing assembly 20 includes a second temperature sensing chip 23, and the second temperature sensing chip 23 includes two conductive contacts. For example, one of the conductive contacts may be grounded, but is not limited to being grounded. Specifically, the two conductive contacts of the second temperature sensing chip 23 are a third conductive contact 231 and a fourth conductive contact 232, respectively, and the third conductive contact 231 and the fourth conductive contact 232 are exposed on the opposite surfaces of the second temperature sensing chip 23 and are separated from each other and disposed oppositely.

As shown in fig. 2, correspondingly, the third lead 21 may include an inner end and an outer end, and the inner end of the third lead 21 is located in the second encapsulant 24 and connected to the third conductive contact 231. Similarly, the fourth lead 22 may include an inner end and an outer end, and the inner end of the fourth lead 22 is located in the second encapsulant 24 and connected to the fourth conductive contact 232.

As shown in fig. 2, the second temperature sensing assembly 20 may include a second package body 24, and the second temperature sensing chip 23 is disposed in the second package body 24. The second encapsulant 24 may be a member made of resin, teflon, Polyimide (PI), or glass, for example (the first encapsulant is not limited to the above embodiments, and may be made of other materials).

In the above device, the first and second package bodies 14 and 24 can insulate the first and second temperature sensing chips 13 and 23 from each other without causing short circuit; the bonding of the first temperature sensing chip 13 to the first and second leads 11 and 12 and the bonding of the second temperature sensing chip 23 to the third and fourth leads 21 and 22 can be also secured. In addition, the first and second encapsulation bodies 14 and 24 may further isolate the first and second temperature sensing chips 13 and 23 from the external environment, so as to protect the first and second temperature sensing chips 13 and 23 from the external environment. Such as moisture.

In the above device, the first temperature sensing chip 13 can be selected from one of a positive temperature coefficient resistor chip and a negative temperature coefficient resistor chip. Similarly, the second temperature sensing chip 23 can also be selected from one of a positive temperature coefficient resistor chip and a negative temperature coefficient resistor chip. In the present device, different combinations can be implemented.

For example, the first temperature sensing chip 13 and the second temperature sensing chip 23 can be both positive temperature coefficient resistor chips.

Alternatively, the first temperature sensing chip 13 and the second temperature sensing chip 23 may be both negative temperature coefficient resistor chips.

Alternatively, the first temperature sensing chip 13 is a positive temperature coefficient resistor chip, and the second temperature sensing chip 23 is a negative temperature coefficient resistor chip.

Alternatively, the first temperature sensing chip 13 is a negative temperature coefficient resistor chip, and the second temperature sensing chip 23 is a positive temperature coefficient resistor chip.

As shown in fig. 1, the signal wire 30 includes a plurality of wires including a first wire 31, a second wire 32, and a third wire 33.

As shown in fig. 1, a first wire 31 is connected to the first pin 11 of the first temperature sensing assembly 10.

As shown in fig. 1, the second wire 32 is connected to the second pin 12 of the first temperature sensing element 10 and the third pin 21 of the second temperature sensing element 20.

As shown in FIG. 1, a third wire 33 is connected to the fourth pin 22 of the second temperature sensing assembly 20.

In the embodiment of the present device, as shown in fig. 1, the first wire 31 includes a first conductive wire 311 and a first insulating sheath 312 covering the first conductive wire 311. One end of the first conductive wire 311 is a first connection section 313, and the first connection section 313 is exposed out of the first insulation sheath 312 and connected to the outer end of the first lead 11 of the first temperature sensing assembly 10.

As shown in fig. 1, the second wire 32 includes a second conductive wire 321 and a second insulating sheath 322 covering the second conductive wire 321. One end of the second conductive wire 321 is a second connection section 323, and the second connection section 323 is exposed out of the second insulation sheath 322 and connected to the outer end of the second pin 12 of the first temperature sensing element 10 and the outer end of the third pin 21 of the second temperature sensing element 20.

As shown in fig. 1, the third wire 33 includes a third conductive wire 331 and a third insulating sheath 332 covering the third conductive wire 331, wherein an end of the third conductive wire 331 is a third connection section 333, and the third connection section 333 is exposed from the third insulating sheath 332 and connected to an outer end of the fourth pin 22 of the second temperature sensing assembly 20.

As shown in fig. 1, the first wire 31, the second wire 32 and the third wire 33 may be flat cables and are arranged side by side, and the second insulating sheath 322 is connected between the first insulating sheath 312 and the third insulating sheath 332 side by side. The present device is not limited to the configuration of the aforementioned flat cable.

In addition, the first conductive wire 311, the second conductive wire 321, and the third conductive wire 331 may be stranded wires as shown in fig. 1, or in other embodiments, three conductive wires may be single-core wires, and when the first conductive wire 311, the second conductive wire 321, and the third conductive wire 331 are single-core wires, the temperature sensor can be applied to a smaller-sized temperature sensing chip, and the temperature response time can be optimized.

As for the connection structure between each lead and each corresponding lead, as shown in fig. 1, the first type may connect the first connection section 313 and the outer end of the first lead 11 to each other by the first soldering body 41 by soldering means; the second connecting section 323 is connected with the outer ends of the second pins 12 and the outer ends of the third pins 21 through second welding bodies 42; the third connection segment 333 and the outer end of the fourth lead 22 are connected to each other by the third soldering body 43.

The first, second and third soldering bodies 41, 42 and 43 may be solder, but not limited to solder.

As for the connection structure between each lead and each corresponding lead, as shown in fig. 3, the second type can fuse the first connection section 313 and the outer end of the first lead 11 into a whole by direct fusion; the second connecting section 323, the outer end of the second pin 12 and the outer end of the third pin 21 are fused into a whole; the third connection section 333 and the outer end of the fourth pin 22 are fused with each other.

That is, the device can connect the first conductive line 311, the second conductive line 321, and the third conductive line 331 to the corresponding leads by soldering or direct welding to form an integral structure.

The thicknesses of the first lead 11, the second lead 12, the third lead 21 and the fourth lead 22 may be the same, different or partially the same. For example, the diameters of the second pin 12 and the third pin 21, which are both connected to the second conductive line 321, are smaller than the diameters of the first pin 11 and the fourth pin 22. That is, the second pin 12 and the third pin 21 are thinner, which is helpful to reduce the volume of the temperature sensing device of the present invention.

To ensure the consistency of the sensing signals generated by the first temperature sensing chip 13 and the second temperature sensing chip 23, as shown in fig. 4, the first temperature sensing chip 13 and the second temperature sensing chip 23 are disposed adjacent to each other. The signal wire 30 extends along a first axial direction, and the first temperature sensing chip 13 and the second temperature sensing chip 23 are arranged along a second axial direction; the first axis is perpendicular to the second axis.

For example, the first axis is the Y axis and the second axis is the X axis. In this way, the positions of the first temperature sensing chip 13 and the second temperature sensing chip 23 are aligned and are flush with each other on the straight line L (the straight line L is parallel to the X axis direction), if the position of the target 50 is in front of the first temperature sensing chip 13 and the second temperature sensing chip 23 along the first axis direction, the relative distance D1 between the first temperature sensing chip 13 and the target 50 is equal to the relative distance D2 between the second temperature sensing chip 23 and the target 50, so that the thermal time constants of the first temperature sensing chip 13 and the second temperature sensing chip 23 relative to the target 50 are the same, thereby ensuring consistency of the sensing signals generated by the first temperature sensing chip 13 and the second temperature sensing chip 23 and effectively avoiding temperature sensing errors caused by position differences.

As shown in fig. 5, the present apparatus may further include a housing 60, wherein the housing 60 completely covers the first temperature sensing element 10 and the second temperature sensing element 20. The ends of the first insulating sheath 312, the second insulating sheath 322, and the third insulating sheath 332 may be located in the housing 60. That is, the housing 60 is partially overlapped with the first, second, and third insulating covers 312, 322, and 332 and connected to each other. Therefore, water or vapor can be effectively prevented from invading, and the waterproof effect is achieved.

The housing 60 may be a plastic member, a metal member, or an epoxy member. When the housing 60 is a metal member, a dispensing operation can be performed on the inner wall surface of the housing 60 and the space between the two temperature sensing elements (the first temperature sensing element 10 and the second temperature sensing element 20) and the wires (the first wire 311, the second wire 321, and the third wire 331) covered by the housing 60 to fill in the insulating paste, thereby avoiding short circuit.

The outer case 60 may have a rectangular column shape, a cylindrical shape, or a tear-drop shape.

The process of the present invention is briefly described below with reference to fig. 6 to assist in describing the structural features of the present invention.

Step 1), cutting feet: the pins of the first temperature sensing component 10 and the second temperature sensing component 20 are cut to appropriate lengths.

Step 2), line cutting: the signal wire 30 is stripped to expose the first, second, and third conductors 311, 321, 331 partially.

Step 3), connection: the bonding of the first temperature sensing element 10, the second temperature sensing element 20 and the signal wire 30 is accomplished by soldering means (e.g., soldering iron) or direct welding means (e.g., current welding or laser welding) as described above.

Step 4), packaging: the housing 60 is provided by inserting, dispensing, or coating, and finally forms the temperature sensing device.

Step 5), testing: and carrying out related electrical property or temperature test to ensure that the finished product meets the practical requirements.

Wherein, before step 3) is carried out, also can detect the temperature sensing subassembly earlier, eliminate the temperature sensing subassembly that detects for the defective products, and connect the temperature sensing subassembly that passes through the detection, and then promote the finished product yield.

In summary, the first temperature sensing element 10 and the second temperature sensing element 20 are respectively connected to the signal wire 30 through two equal pins, and four equal pins (the first pin 11, the second pin 12, the third pin 21, and the fourth pin 22) are flexible and soft, so for the first temperature sensing chip 13 and the second temperature sensing chip 23, the stress transmitted from the signal wire 30 is absorbed by the four equal pins, and therefore the four equal pins are used as buffers, and the first temperature sensing chip 13 and the second temperature sensing chip 23 are effectively prevented from being broken and damaged due to the stress.

As shown in fig. 7, the two conventional temperature sensing chips are connected to the composite leads by solder layers, and the conventional temperature sensing device includes four solder layers as a whole (i.e., the solder layer between the third temperature sensing chip 71 and the first composite lead 751, the solder layer between the third temperature sensing chip 71 and the second composite lead 752, the solder layer between the fourth temperature sensing chip 72 and the second composite lead 752, and the solder layer between the fourth temperature sensing chip 72 and the third composite lead 753).

Compared with the structure of the conventional temperature sensing device shown in fig. 7, the diameter of four equal pins (the first pin 11, the second pin 12, the third pin 21 and the fourth pin 22) of the device shown in fig. 1 can be smaller than the diameter of three equal wires (the first wire 311, the second wire 321 and the third wire 331), and the connection mode of the pins to the wires of the device is different from the direct connection mode of the chip to the composite wire of the conventional temperature sensing device, so that the width of the device is shorter, and the size is effectively reduced.

Claims (10)

1. Temperature sensing device, its characterized in that: comprises a first temperature sensing component (10), a second temperature sensing component (20) and a signal wire (30);

the first temperature sensing assembly (10) comprises a first pin (11) and a second pin (12);

the second temperature sensing component (20) comprises a third pin (21) and a fourth pin (22);

the signal wire (30) comprises a first wire (31), a second wire (32) and a third wire (33), wherein the first wire (31) is connected with the first pin (11) of the first temperature sensing assembly (10); the second wire (32) is connected with the second pin (12) of the first temperature sensing assembly (10) and the third pin (21) of the second temperature sensing assembly (20); the third wire (33) is connected to the fourth pin (22) of the second temperature sensing assembly (20).

2. The temperature sensing device of claim 1, wherein: the first temperature sensing assembly (10) comprises a first temperature sensing chip (13), the first temperature sensing chip (13) comprises a first conductive contact (131) and a second conductive contact (132), the corresponding first pin (11) is connected with the first conductive contact (131), and the second pin (12) is connected with the second conductive contact (132); the second temperature sensing assembly (20) comprises a second temperature sensing chip (23), the second temperature sensing chip (23) comprises a third conductive contact (231) and a fourth conductive contact (232), the corresponding third pin (21) is connected with the third conductive contact (231), and the fourth pin (22) is connected with the fourth conductive contact (232).

3. The temperature sensing device of claim 2, wherein: the first temperature sensing chip (13) is arranged in the first packaging body (14); the second temperature sensing chip (23) is arranged in the second packaging body (24), and the first packaging body (14) and the second packaging body (24) are isolated from each other.

4. The temperature sensing device of claim 2, wherein: the first temperature sensing chip (13) can select a positive temperature coefficient resistance chip or a negative temperature coefficient resistance chip, and the second temperature sensing chip (23) can select a positive temperature coefficient resistance chip or a negative temperature coefficient resistance chip.

5. The temperature sensing device of claim 1, wherein: the first wire (31) comprises a first conducting wire (311) and a first insulating sheath (312) covering the first conducting wire (311), one end part of the first conducting wire (311) is a first connecting section (313), and the first connecting section (313) is exposed out of the first insulating sheath (312) and is connected with the outer end of the first pin (11); the second wire (32) comprises a second lead (321) and a second insulating sheath (322) covering the second lead (321), one end part of the second lead (321) is a second connecting section (323), and the second connecting section (323) is exposed out of the second insulating sheath (322) and is connected with the outer end of the second pin (12) and the outer end of the third pin (21); the third wire (33) comprises a third conducting wire (331) and a third insulating sheath (332) wrapping the third conducting wire (331), one end part of the third conducting wire (331) is a third connecting section (333), and the third connecting section (333) is exposed out of the third insulating sheath (332) and is connected with the outer end of the fourth pin (22).

6. The temperature sensing device of claim 5, wherein: the first conducting wire (311), the second conducting wire (321) and the third conducting wire (331) can be stranded wires or single-core wires.

7. The temperature sensing device according to claim 1 or 5, wherein: the connection between the first wire (31) and the first pin (11), between the second wire (32) and the second pin (12) and the third pin (21), and between the third wire (33) and the fourth pin (22) is completed through a welding mode or a direct welding mode.

8. The temperature sensing device of claim 1, wherein: the diameters of the second pin (12) and the third pin (21) are smaller than the diameters of the first pin (11) and the fourth pin (22).

9. The temperature sensing device of claim 2, wherein: the first temperature sensing chip (13) and the second temperature sensing chip (23) are adjacent to each other and are kept flush with each other, the first temperature sensing chip (13) and the second temperature sensing chip (23) are arranged along a second axial direction, the signal wire (30) extends along the first axial direction, and the first axial direction is perpendicular to the second axial direction.

10. The temperature sensing device of claim 5, wherein: the first temperature sensing assembly (10) and the second temperature sensing assembly (20) are wrapped by a shell (60), and the shell (60), the first insulating wire skin (312), the second insulating wire skin (322) and the third insulating wire skin (332) are partially overlapped and connected with each other.

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