JP2006275872A - Rotation sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rotation sensor which is composed of a small number of parts and manufactured easily. <P>SOLUTION: In the rotation sensor, a lead 3 is formed on a magnetic IC 1 which converts a magnetic change caused by a rotating object into a signal, in order to take out the signal, and a cable conductor 6 made up by twisting a plurality of conductive wires 5 is connected and fixed to the lead 3. In the cable conductor 6, the plurality of conductive wires 5 are previously welded with each other so as to be unified, and the unified cable conductor 6 is connected and fixed to the lead 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a rotation sensor using magnetism, and more particularly to a rotation sensor that has few parts and is easy to manufacture.

  One of the rotation sensors is a rotation sensor using magnetism. That is, a magnetic IC is allowed to face a rotating object, a magnet that forms a magnetic field passing through the magnetic IC is provided, and a magnetic change caused by the rotation of the object is converted into a signal by the magnetic IC. Can be detected at a later stage to detect information about rotation.

  A cable is used for signal transmission from the magnetic IC to the subsequent stage. For example, when the detected rotation information is to be used for rotation control of an object, a cable is routed from a rotation sensor installed in a non-contact manner to the object to an ECU (electric control unit).

  As shown in FIG. 6, in general, the magnetic IC 61 is formed such that a lead 62 for taking out the signal out of the magnetic IC 61 protrudes from the inside of the magnetic IC 61, while the cable 63 includes a plurality of cables 63. A cable conductor 65 obtained by twisting together the conductor wires 64 is covered with an insulating coating 66. In order to electrically connect and physically fix the cable conductor 65 to the lead 62, conventionally, a member called a connection terminal 67 is caulked to the cable conductor 65, and the connection terminal 67 is soldered to the lead 62. It is attached. This is because when a wire strip that peels off the insulation coating 66 from the cable 63 and exposes the cable conductor 65 is formed, the plurality of conductor strands 64 are separated, and the separated cable conductor 65 is connected to the lead 62. This is because it is difficult to solder.

JP-A-6-94746

  However, in the prior art, an extra member such as the connection terminal 67 is required in addition to the magnetic IC 61 and the cable 63 that should be connected originally, so that the component cost is high.

  Further, from the viewpoint of the connection work, since the connection work of caulking the connection terminal 67 to the cable conductor 65 and the connection work of soldering the connection terminal 67 to the lead 62 are necessary, the manufacturing cost is required. Is high. In addition, since there are two connection locations, a connection failure at each connection location reduces the overall yield.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a rotation sensor that solves the above problems and is easy to manufacture with few parts.

  In order to achieve the above object, the present invention provides a cable conductor in which a lead for taking out a signal is formed on a magnetic IC that converts a magnetic change caused by a rotating object into a signal, and a plurality of conductor wires are twisted together. In the rotation sensor connected to and fixed to the lead, the cable conductor is integrated by previously welding together a plurality of conductor strands, and the integrated cable conductor is connected to the lead and It is fixed.

  The integrated cable conductor may be resistance welded to the lead.

  The integrated cable conductor may be soldered to the lead.

  The present invention exhibits the following excellent effects.

  (1) The number of parts is small, and the manufacturing becomes easy.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows a rotation sensor according to the present invention as seen through from the side. The magnetic IC 1 has a semiconductor chip 2 and leads 3 electrically connected to the semiconductor chip 2 accommodated in a plastic or ceramic package (not shown). The outside of the package is called the outside of the magnetic IC 1. The lead 3 protrudes from the inside of the magnetic IC 1 to the outside.

  In the cable 4, a cable conductor 6 obtained by twisting a plurality of conductor wires 5 is covered with an insulating coating 7 and further covered with a sheath 8. The insulation coating 7 is peeled off to a predetermined distance from the end of the cable 4, the cable conductor 6 is exposed, and the sheath 8 is peeled to a predetermined distance.

  In the form of FIG. 1, the cable conductor 6 is gathered to a size that can be welded to the lead 3 by previously welding a plurality of conductor wires 5 to each other by ultrasonic welding. The cable conductor 6 is connected and fixed to the lead by resistance welding. Here, the cable 4 and the magnetic IC 1 are connected in a straight line by overlapping the cable conductor 6 and the lead 3 in the longitudinal direction of each other.

  The cable 4 and the magnetic IC 1 are covered with a resin mold 9.

  The integration procedure will be described in detail. As shown in FIG. 2A, in the state where the sheath 8 is peeled and the insulating coating 7 appears, the insulating coating is provided at a predetermined distance from the end of the cable conductor 6. 7 is cut, and the cut insulating covering piece 7a is moved toward the terminal. At this time, the movement stops when the insulating covering piece 7a does not come off from the end of the cable conductor 6. Thereby, the cable conductor 6 is exposed between the insulating coating 7 and the insulating coating piece 7a. The cable conductor 6 is not yet integrated because only the plurality of conductor strands 5 are twisted together. However, since the terminal is covered with the insulating covering piece 7a, the conductor strands 5 are not scattered. Absent.

  Next, as shown in FIG. 2B, by applying ultrasonic waves to the exposed plurality of conductor wires 5 from ultrasonic welding means (not shown), the plurality of conductor wires 5. Are integrated with each other. At the time of this welding, the cross-sectional shape of the circular cable conductor 6 is formed into a square by a forming means (not shown). At this time, the molding dimension is adjusted so that the contact area between the cable conductor 6 and the lead 3 becomes a desired contact area.

  Next, as shown in FIG. 2 (c), the integrated cable conductor 6 is cut in front of the insulating coating piece 7a to thereby form the insulating coating piece 7a and the unwelded conductor element contained therein. Line 5 is removed. Thereby, the cable conductor 6 in which the cross section is square and collected together is obtained.

  It is easy to resistance-weld the cable conductors 6 bundled together in this way to the leads 3 as shown in FIG. The resistance welding conditions should be selected together with the contact area, and should be selected so as to obtain a tensile strength that can withstand a pressure more than twice the pressure applied during the subsequent molding.

  According to this embodiment, since an extra member called a connection terminal is not required, component costs are saved. Further, from the viewpoint of connection work, manufacturing cost is saved because it is one step of resistance welding work. Since there is only one connection point, connection failures are reduced and the overall yield is improved.

  In the above embodiment, the cable conductor 6 is resistance welded to the lead 3, but may be connected and fixed by soldering. The soldering conditions should be selected together with the contact area, and should be selected so as to obtain a tensile strength that can withstand a pressure more than twice the pressure applied during subsequent molding.

  Next, another embodiment will be described.

  In the form of FIG. 3, unlike the form of FIG. 1, the cable conductor 6 is solder-formed. Since the other members are the same as those used in the embodiment of FIG. 1, the description thereof will be omitted, and details of solder forming will be described.

  As shown in FIG. 3, the cable conductor 6 is exposed from the insulating coating 7 and protrudes in an arch shape before connecting to the lead 3, and returns to the extension line of the original cable conductor 6 when contacting the lead 3. Has been formed.

  The integration and forming procedures will be described in detail. As shown in FIG. 4A, in the state where the sheath 8 is peeled and the insulating coating 7 appears, at a predetermined distance from the end of the cable conductor 6. The insulating coating 7 is cut, and the cut insulating coating piece 7a is moved toward the terminal. At this time, the movement stops when the insulating covering piece 7a does not come off from the end of the cable conductor 6. Thereby, the cable conductor 6 is exposed between the insulating coating 7 and the insulating coating piece 7a. The cable conductor 6 is not yet integrated because only the plurality of conductor strands 5 are twisted together. However, since the terminal is covered with the insulating covering piece 7a, the conductor strands 5 are not scattered. Absent.

  Next, as shown in FIG. 4B, the exposed cable conductor 6 is immersed in a solder bath to integrate the plurality of conductor strands 5. At this time, the cable conductors 6 are gathered so that the cable conductors 6 can be welded to the leads 3.

  Next, as shown in FIG. 4 (c), the integrated cable conductor 6 is cut in front of the insulating coating piece 7a to thereby form the insulating coating piece 7a and the unwelded conductor element contained therein. Line 5 is removed. Thereafter, a part of the cable conductor 6 is formed into an arch shape by a forming means (not shown).

  It is easy to solder the cable conductors 6 bundled together in this way to the leads 3 as shown in FIG. The contact area between the cable conductor 6 and the lead 3 may be selected so as to obtain a tensile strength that can withstand a pressure more than twice the pressure applied during subsequent molding.

  In this embodiment, since the cable conductor 6 is formed, this portion absorbs stress.

  FIG. 5 shows a rotation sensor according to the present invention used for detecting the rotation of a gear. As shown in the figure, the rotation sensor includes a magnetic IC 1 that faces the gear 51 that is a magnetic body from the outside in the radial direction, a magnet 52 that faces the gear 51 from behind the magnetic IC 1, and a magnetic IC 1 to an ECU (not shown). It consists of a cable 4 for signal transmission, a holder 53 that holds the magnetic IC 1 and the tip of the cable 4, and a molded body 54 that covers and protects the holder 53 and a part of the cable 4.

  The magnetic IC 1 has two or more leads 3, and the cable 4 has a sufficient number of cable conductors 6 for the number of leads. The cable conductors 6 are each covered with an insulating coating 7, and the outer periphery thereof is collectively covered with a sheath 8.

  The cable conductor 6 with the insulation coating 7 exposed from the sheath 8 is bent at a right angle by an appropriate bending radius, and the exposed cable conductor 6 is extended so as to be in line with the lead 3. Details of the connection between the cable conductor 6 and the lead 3 are as described with reference to FIGS.

  The mold body 54 extends perpendicularly from the head portion 55, a head portion 55 that covers from the magnetic IC 1 to the straight portion of the insulating coating 7, an elbow portion 56 that covers from the bent portion of the insulating coating 7 to a part of the sheath 8, and The bush portion 57 is integrally formed by resin molding.

  In this rotation sensor, when the gear 51 rotates, the magnetic field passing through the magnetic IC 1 varies according to the unevenness of the gear 51. For this reason, the magnetic IC 1 outputs a signal that changes according to the unevenness of the gear 51, and the signal is transmitted to the ECU via the cable 4. The ECU detects that the unevenness of the gear 51 has passed in front of the magnetic IC 1 from the change of the signal, and refers to the number of teeth known in advance, and information on the rotation of the gear 51 such as the rotation speed, the rotation angle, and the number of rotations. Is detected.

  The present invention is not limited to the rotation sensor, and can be widely applied to devices that connect an IC and a cable.

It is a side perspective view of the rotation sensor which shows one Embodiment of this invention. (A)-(c) is a perspective view which shows a part of procedure which manufactures the rotation sensor of FIG. It is a side perspective view of the rotation sensor which shows one Embodiment of this invention. (A)-(c) is a perspective view which shows a part of procedure which manufactures the rotation sensor of FIG. It is a side perspective view of the rotation sensor which shows one Embodiment of this invention. It is a side perspective view of the conventional rotation sensor.

Explanation of symbols

1 Magnetic IC
2 Semiconductor chip 3 Lead 4 Cable 5 Conductor wire 6 Cable conductor 7 Insulation coating 8 Sheath

Claims (3)

  A magnetic IC that converts a magnetic change caused by a rotating object into a signal is provided with a lead for taking out the signal, and a cable conductor obtained by twisting a plurality of conductor strands is connected and fixed to the lead. In the sensor, the cable conductor is integrated by previously welding a plurality of conductor strands, and the integrated cable conductor is connected and fixed to the lead. .   The rotation sensor according to claim 1, wherein the integrated cable conductor is resistance-welded to the lead. 2. The rotation sensor according to claim 1, wherein the integrated cable conductor is soldered to the lead.

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