TWI783247B - temperature sensing device - Google Patents

Abstract

A temperature sensing device includes a first temperature sensing element, a second temperature sensing element and a signal wire, the first temperature sensing element includes a first pin and a second pin, the second temperature sensing element includes a third pin and the fourth pin, the signal wire includes a first wire, a second wire and a third wire, the first wire is connected to the first pin of the first temperature sensing element, and the second wire is connected to the first pin of the first temperature sensing element The second pin is connected to the third pin of the second temperature sensing element, and the third wire is connected to the fourth pin of the second temperature sensing element; the present invention uses these pins as a buffer to absorb stress, effectively avoiding this problem. Each temperature sensing element of the invention is cracked and damaged due to stress, and each temperature sensing element can be an element that passes the test screening, so the present invention has the advantage of high yield.

Description

temperature sensing device

The invention relates to a temperature sensing device, in particular to a temperature sensing device capable of alleviating stress.

Please refer to FIG. 7, the conventional temperature sensing device includes a first temperature sensing chip 71, a second temperature sensing chip 72 and a signal wire 73, the signal wire 73 includes a first twisted wire 731, a second The stranded wire 732 and a third stranded wire 733, the tail ends of the first stranded wire 731, the second stranded wire 732 and the third stranded wire 733 exposed to the insulation are covered and combined by solder 74 respectively to become A first compound lead 751 , a second compound lead 752 and a third compound lead 753 . Because the composite leads 751, 752, 753 have hardness to provide support, the first temperature sensing chip 71 can be soldered and connected between the first composite lead 751 and the second composite lead 752 through the solder layer, and the first composite lead 752 The second temperature sensing chip 72 can be soldered and connected between the second compound lead 752 and the third compound lead 753 through the solder layer, so the second compound lead 752 serves as the first temperature sensing chip 71 and the second compound lead 71. The common lead of the temperature sensing chip 72 . The first temperature sensing element 71 and the second temperature sensing element 72 are used to sense the ambient temperature, and the signal wire 73 is used to transmit the signal generated by the first temperature sensing element 71 and the second temperature sensing element 72 The temperature sensing signal.

However, each of the temperature sensing chips 71, 72 and each of the composite leads 751, 752, 753 is directly connected, and each of the composite leads 751, 752, 753 contains tin and has a certain hardness. In this way, Each of the temperature-sensing chips 71, 72 will directly bear the stress transmitted from the composite leads 751, 752, 753, which may cause the temperature-sensing chips 71, 72 to crack and be damaged due to the stress. In addition, from the point of view of the manufacturing process, compared with the composite lead wires 751, 752, 753, the twisted wires 731, 732, 733 that are not coated and combined with the solder 74 are soft and easy to bend. During the process of soldering a temperature sensing chip 71 on the first compound lead 751 and the second compound lead 752, the first compound lead 751 and the second compound lead 752 may swing in opposite directions, causing the first temperature The sensing chip 71 is easy to turn over and not easy to weld; the second temperature sensing chip 72 , the second compound lead 752 and the third compound lead 753 are also difficult to weld.

In view of this, the main purpose of the present invention is to provide a temperature sensing device to overcome the stress failure problem of the conventional temperature sensing device, and the structural design of the conventional temperature sensing device makes its manufacturing process difficult to solder.

The temperature sensing device of the present invention comprises: A first temperature sensing element, including a first pin and a second pin; a second temperature sensing element, including a third pin and a fourth pin; and A signal cable, including: a first wire connected to the first pin of the first temperature sensing element; a second wire, connecting the second pin of the first temperature sensing element and the third pin of the second temperature sensing element; and A third wire is connected to the fourth pin of the second temperature sensing element.

The present invention comprises following technical effects:

1. Different from the composite leads described in the prior art, the first temperature sensing element and the second temperature sensing element of the present invention are respectively connected to the signal wire through their first to fourth pins. Each of the first to fourth pins is used as a buffer to absorb stress, effectively preventing the temperature sensing elements of the present invention from being cracked and damaged due to stress.

2. Through the structural design of the present invention, from the point of view of the manufacturing process, each of the temperature sensing elements of the present invention is connected to the corresponding wires through its pins, so the connection methods of the pins to the wires of the present invention are different In the direct connection method of the chip of the conventional temperature sensing device to the composite lead, naturally there is no problem that the chip of the conventional temperature sensing device is turned over and is not easy to solder. In addition, before connecting each of the temperature sensing elements to the signal wires in the present invention, the test equipment can electrically connect each of the pins of each of the temperature sensing elements to perform related electrical or temperature tests, and then the tester can communicate with the The connection of the signal wires, those who fail the test will be eliminated, so as to achieve the purpose of screening the temperature sensing elements, and further improve the yield rate of the finished product of the temperature sensing device of the present invention.

Please refer to FIG. 1, an embodiment of the temperature sensing device of the present invention includes two temperature sensing elements 10, 20 and a signal wire 30, the two temperature sensing elements 10, 20 are respectively a first temperature sensing element 10 and a signal wire 30. A second temperature sensing element 20, the first temperature sensing element 10 and the second temperature sensing element 20 can be used to sense the ambient temperature, the signal wire 30 is electrically connected to the first temperature sensing element 10 and the second temperature sensing element The second temperature sensing element 20 is used for transmitting the temperature sensing signal generated by the first temperature sensing element 10 and the second temperature sensing element 20 .

For example, the present invention can be applied to thermometers, through the parallel measurement and comparison of the two temperature sensing elements 10, 20 to confirm the temperature, to avoid preventing the error value of one of the temperature sensing elements 10, 20 from causing excessive Measure distortion.

The first temperature sensing element 10 includes two pins, which are respectively a first lead 11 and a second lead 12, the first lead 11 and the second lead 12 are conductive And bendable soft strip, in the embodiment of the present invention, please refer to FIG. 2, the first temperature sensing element 10 may include a first temperature sensing chip 13, the first temperature sensing chip 13 includes Two conductive contacts, in application, for example, one of the conductive contacts can be used for grounding, but not limited to grounding. The two conductive contacts of the first temperature sensing chip 13 are respectively a first conductive contact 131 and a second conductive contact 132, the first conductive contact 131 and the second conductive contact 132 are exposed on the The opposite surfaces of the first temperature sensing chip 13 are separated and opposite to each other, the first pin 11 is connected to the first conductive contact 131 , and the second pin 12 is connected to the second conductive contact 132 . The first temperature sensing element 10 may include a first encapsulation body 14, the first temperature sensing chip 13 is arranged in the first encapsulation body 14, the first encapsulation body 14 may be (but not limited to) components made of resin, Teflon, polyimide (PI) or glass; wherein, the first pin 11 may include an inner end and an outer end, and the inner end of the first pin 11 end is located in the first encapsulation body 14 and connected to the first conductive contact 131, similarly, the second pin 12 may include an inner end and an outer end, and the inner end of the second pin 12 is located at The second conductive contact 132 is connected to the first encapsulation body 14 .

The second temperature sensing element 20 includes two pins, which are respectively a third pin 21 and a fourth pin 22, the third pin 21 and the fourth pin 22 are conductive and bendable Folded soft strips. In the embodiment of the present invention, please refer to FIG. 2, the second temperature sensing element 20 may include a second temperature sensing chip 23, and the second temperature sensing chip 23 includes two conductive contacts. In application, for example For example, one of the conductive contacts can be grounded, but not limited to grounding. The two conductive contacts of the second temperature sensing chip 23 are respectively a third conductive contact 231 and a fourth conductive contact 232, the third conductive contact 231 and the fourth conductive contact 232 are exposed on the The opposite surfaces of the second temperature sensing chip 23 are separated and opposite to each other, the third pin 21 is connected to the third conductive contact 231 , and the fourth pin 22 is connected to the fourth conductive contact 232 . The second temperature sensing element 20 may include a second encapsulation body 24, the second temperature sensing chip 23 is arranged in the second encapsulation body 24, the second encapsulation body 24 may be (but not limited to) components made of resin, Teflon, polyimide (PI) or glass; wherein, the third pin 21 may include an inner end and an outer end, and the inner end of the third pin 21 end is located in the second encapsulation body 24 and connected to the third conductive contact 231, similarly, the fourth pin 22 may include an inner end and an outer end, and the inner end of the fourth pin 22 is located at The second encapsulation body 24 is connected to the fourth conductive contact 232 .

In the foregoing, the first encapsulating body 14 and the second encapsulating body 24 can insulate the two temperature sensing chips 13, 23 from each other without causing a short circuit, and can also firmly connect the two temperature sensing chips 13, 23 to each other. The bonding of the pins 11, 12, 21, 22 can also isolate the two temperature sensing chips 13, 23 from the external environment to provide protection, such as preventing the two temperature sensing chips 13, 23 from being affected by moisture .

The first temperature sensing chip 13 can be selected from one of positive temperature coefficient resistance chip (PTC thermistor) and negative temperature coefficient resistance chip (NTC thermistor). Similarly, the second temperature sensing chip 23 can also be selected from One of the positive temperature coefficient resistor chip and the negative temperature coefficient resistor chip, so different combinations can be implemented. For example, the first temperature sensing chip 13 and the second temperature sensing chip 23 can both be positive temperature coefficient resistor chips; or, the first temperature sensing chip 13 and the second temperature sensing chip 23 can both be It is a resistance wafer with a negative temperature coefficient; or, the first temperature sensing wafer 13 is a resistance wafer with a positive temperature coefficient, and the second temperature sensing wafer 23 is a resistance wafer with a negative temperature coefficient; or, the first temperature sensing wafer 13 is a resistance wafer with a negative temperature coefficient. Negative temperature coefficient resistor chip, the second temperature sensing chip 23 is a positive temperature coefficient resistor chip.

Please refer to FIG. 1, the signal wire 30 includes a plurality of wires, the plurality of wires includes a first wire 31, a second wire 32 and a third wire 33, the first wire 31 is connected to the first temperature sensing element 10 The first pin 11, the second wire 32 connects the second pin 12 of the first temperature sensing element 10 with the third pin 21 of the second temperature sensing element 20, the third wire 33 Connect to the fourth pin 22 of the second temperature sensing element 20 .

In the embodiment of the present invention, as shown in FIG. 1, the first electric wire 31 includes a first wire 311 and a first insulating sheath 312 covering the first wire 311, and one end of the first wire 311 is A first connection section 313, the first connection section 313 is exposed on the first insulating sheath 312 and connected to the outer end of the first pin 11 of the first temperature sensing element 10; the second wire 32 includes A second wire 321 and a second insulating sheath 322 covering the second wire 321, one end of the second wire 321 is a second connection section 323, and the second connection section 323 is exposed on the second insulation Wire sheath 322 and connect the outer end of the second pin 12 of the first temperature sensing element 10 and the outer end of the third pin 21 of the second temperature sensing element 20; the third wire 33 It includes a third wire 331 and a third insulating sheath 332 covering the third wire 331. One end of the third wire 331 is a third connection section 333, and the third connection section 333 is exposed on the third wire. The insulating wire sheath 332 is connected to the outer end of the fourth pin 22 of the second temperature sensing element 20 . Wherein, please refer to FIG. 1, the first electric wire 31, the second electric wire 32 and the third electric wire 33 can be arranged side by side to form a row of wires, and the second insulated wire sheath 322 can be connected to the first insulated wire in parallel. Between the sheath 312 and the third insulated wire sheath 332 , but not limited to the structure of the aforementioned wiring. In addition, these wires 311, 321, 331 can be twisted wires as shown in FIG. When 321 and 331 are single-core wires, they can be applied to smaller-sized temperature sensing chips to optimize the temperature response time.

Regarding the connection structure of each of the wires 311, 321, 331 and the corresponding pins 11, 12, 21, 22, please refer to FIG. The first connecting section 313 and the outer end of the first pin 11 are connected to each other through a first soldering body 41; the second connecting section 323, the outer end of the second pin 12 and the third pin 21 The outer ends of the pins 22 are connected to each other through a second soldering body 42 ; the third connecting section 333 and the outer end of the fourth pin 22 are connected to each other through a third soldering body 43 . Wherein, the first soldering body 41 , the second soldering body 42 and the third soldering body 43 can be solder, but not limited to solder. Please also refer to FIG. 3 , in another embodiment of the present invention, the first connection section 313 and the outer end of the first pin 11 can be fused to each other by means of direct welding instead of through the welding body. Integral, the second connection section 323, the outer end of the second pin 12 and the outer end of the third pin 21 can be fused into one with each other, the third connection section 333 and the fourth pin 22 The outer ends may be fused into one piece with each other. Therefore, the present invention can form a connection structure between each of the wires 311 , 321 , 331 and the corresponding pins 11 , 12 , 21 , 22 through the aforementioned welding means or direct welding means.

The thickness of the first to the fourth pins 11, 12, 21, 22 may be the same, different from each other or partly different from each other, for example, the same as the second pin connected to the second wire 321 12 and the third pin 21 are smaller in diameter than the first pin 11 and the fourth pin 22, that is, the second pin 12 and the third pin 21 are thinner, which can help to reduce The volume of the temperature sensing device of the present invention.

In order to ensure the consistency of the sensing signals generated by the first temperature sensing chip 13 and the second temperature sensing chip 23, as shown in FIG. 4, the first temperature sensing chip 13 and the second temperature sensing chip 23 are The chips 23 are arranged adjacent to each other, wherein the signal wire 30 extends along a first axis, and the first temperature sensing chip 13 and the second temperature sensing chip 23 are arranged along a second axis; The first axis is perpendicular to the second axis, for example, the first axis is the Y axis and the second axis is the X axis. In this way, the positions of the first temperature-sensing chip 13 and the second temperature-sensing chip 23 are aligned on a straight line L and are flush (the straight line L is parallel to the X axis). If the position of an object 50 is along the In front of the first temperature sensing chip 13 and the second temperature sensing chip 23 in the first axis, the relative distance D1 between the first temperature sensing chip 13 and the target 50 is equivalent to the second temperature The relative distance D2 between the sensing chip 23 and the target object 50 makes the thermal time constant (thermal time constant) of the first temperature sensing chip 13 and the second temperature sensing chip 23 relative to the target object 50 the same, ensuring The consistency of the sensing signals generated by the first temperature sensing chip 13 and the second temperature sensing chip 23 effectively avoids temperature sensing errors caused by positional differences.

Please refer to FIG. 5 , an embodiment of the present invention may further include a casing 60, the casing 60 completely covers the first temperature sensing element 10 and the second temperature sensing element 20, wherein the first insulating wire sheath 312 , The ends of the second insulated wire sheath 322 and the third insulated wire sheath 332 can be located in the casing 60, in other words, the casing 60 and each of the insulated wire sheaths 312, 322, 332 are partially overlapped and connected to each other, which can effectively Prevent water or water vapor from intruding and achieve waterproof effect. Wherein, the casing 60 can be a plastic component, a metal component or an epoxy resin component, wherein, when the casing 60 is a metal component, the temperature sensing can be performed on the inner wall surface of the casing 60 and the two temperature sensors covered by the casing 60. The spaces between the components 10, 20 and the wires 311, 321, 331 are dispensed with insulating glue to avoid short circuits. The shape of the shell 60 can be a rectangular column, a cylinder or a tear drop.

The manufacturing process of the present invention is briefly described below to assist in explaining the structural features of the present invention. Please refer to FIG. 6 , the step of "cutting the feet" is to cut the pins of each of the temperature sensing elements 10, 20 to an appropriate length; 321, 331 are exposed; the "connection" step is to combine each of the temperature sensing elements 10, 20 and the signal wire through the aforementioned welding means (such as soldering iron welding) or direct welding means (such as electric current welding or laser welding) 30. In the "encapsulation" step, the casing 60 as mentioned above can be provided through socket, glue-point encapsulation or coating to form an embodiment of the temperature sensing device of the present invention. Finally, carry out relevant electrical or temperature tests, and those who pass the test are the finished products for use. Among them, before the "connection" step, the temperature sensing elements can be tested first, and the temperature sensing elements detected as defective products can be eliminated, and the temperature sensing elements that pass the inspection can be connected, thereby improving the yield rate of finished products.

In summary, the first temperature sensing element 10 and the second temperature sensing element 20 are respectively connected to the signal wire 30 through the pins 11, 12, 21, 22, and the pins 11, 12, 21, 22 are bendable and soft. For the first temperature sensing chip 13 and the second temperature sensing chip 23, the stress transmitted from the signal wire 30 is absorbed by the pins 11, 12, 21 , 22 absorb, so the pins 11 , 12 , 21 , 22 are used as a buffer to effectively prevent the first temperature sensing chip 13 and the second temperature sensing chip 23 from cracking and being damaged due to stress.

On the other hand, since each of the temperature sensing chips 71, 72 and each of the composite leads 751, 752, 753 in FIG. The solder layer between the chip 71 and the first compound lead 751, the solder layer between the first temperature sensing chip 71 and the second compound lead 752, the solder between the second temperature sensing chip 72 and the second compound lead 752 layer, and the solder layer between the second temperature sensing chip 72 and the third composite lead 753), the width of the conventional temperature sensing device shown in FIG. 7 cannot be further restricted, so its volume miniaturization is limited . Comparing the present invention with the structure of the conventional temperature sensing device shown in FIG. 7, as shown in FIG. diameter, and the connection mode of the pin to the wire of the present invention is different from the direct connection mode of the chip to the composite lead wire of the conventional temperature sensing device, so the width of the temperature sensing device of the present invention is shorter, which contributes to effective volume miniaturization.

10: The first temperature sensing element 11: The first pin 12: Second pin 13: The first temperature sensing chip 131: the first conductive contact 132: the second conductive contact 14: The first encapsulation body 20: Second temperature sensing element 21: The third pin 22: The fourth pin 23: Second temperature sensing chip 231: the third conductive contact 232: the fourth conductive contact 24: Second encapsulation body 30: Signal wire 31: First wire 311: first wire 312: the first insulating sheath 313: The first connection segment 32: Second wire 321: second wire 322: Second insulation sheath 323: The second connection segment 33: The third wire 331: The third wire 332: The third insulating sheath 333: The third connection segment 41: The first welded body 42: Second welding body 43: The third welding body 50: Target 60: shell 71: the first temperature sensing chip 72: Second temperature sensing chip 73:Signal wire 731: the first stranded wire 732: Second stranded wire 733: The third strand 74: Solder 751: First Composite Lead 752: second composite lead 753: The third composite lead

Fig. 1: A schematic plan view of an embodiment of the temperature sensing device of the present invention. FIG. 2 : a schematic partial cross-sectional view of the first temperature sensing element and the second temperature sensing element in the present invention. FIG. 3 : a schematic plan view of another embodiment of the temperature sensing device of the present invention. FIG. 4 : A schematic plan view of the relative position of the temperature sensing device of the present invention and an object. FIG. 5 : A schematic plan view of another embodiment of the temperature sensing device of the present invention. Fig. 6: Schematic diagram of the process flow of the temperature sensing device of the present invention. Fig. 7: A schematic plan view of a conventional temperature sensing device.

10: The first temperature sensing element

11: The first pin

12: Second pin

14: The first encapsulation body

20: Second temperature sensing element

21: The third pin

22: The fourth pin

24: Second encapsulation body

30: Signal wire

31: First wire

311: first wire

312: the first insulating sheath

313: The first connection segment

32: Second wire

321: second wire

322: Second insulation sheath

323: The second connection segment

33: The third wire

331: The third wire

332: The third insulating sheath

333: The third connection segment

41: The first welded body

42: Second welding body

43: The third welding body

Claims (11)

A temperature sensing device including a first temperature sensing element including a first pin and a second pin; a second temperature sensing element including a third pin and a fourth pin; and A signal wire, including a first wire, a second wire and a third wire, wherein the connection structure between the signal wire and the first temperature sensing element and the second temperature sensing element is selected from the following two One: The first wire is connected to the first pin of the first temperature sensing element through a first soldering body; the second wire is connected to the second lead of the first temperature sensing element through a second soldering body pin and the third pin of the second temperature sensing element; the third wire is connected to the fourth pin of the second temperature sensing element through a third welding body; and the first wire is welded to the first The first pin of the temperature sensing element; the second wire is welded to the second pin of the first temperature sensing element and the third pin of the second temperature sensing element; the third wire is welded to the The fourth pin of the second temperature sensing element. The temperature sensing device according to claim 1, wherein the first wire includes a first wire and a first insulating sheath covering the first wire, and one end of the first wire is a first connection segment, the first connecting segment is exposed on the first insulating wire sheath and connected to the first pin of the first temperature sensing element; the second wire includes a second wire and a first wire covering the second wire Two insulated wire sheaths, one end of the second wire is a second connection section, the second connection section is exposed on the second insulated wire sheath and connects the second pin of the first temperature sensing element and the first temperature sensing element The third pin of the second temperature sensing element; the third wire includes a third wire and a third insulating sheath covering the third wire, and one end of the third wire is a third connecting section, The third connection section is exposed on the third insulating wire and connected to the fourth pin of the second temperature sensing element. The temperature sensing device as described in claim 2, wherein the first wire, the second wire and the third wire of the signal wire are arranged in a row, and the second insulating wires are connected in parallel Between the first insulated wire sheath and the third insulated wire sheath. The temperature sensing device as described in claim 1, wherein the first temperature sensing element includes a first temperature sensing chip, and the first temperature sensing chip includes a first conductive contact and a second conductive contact Point, the first pin is connected to the first conductive contact, the second pin is connected to the second conductive contact; the second temperature sensing element includes a second temperature sensing chip, the second temperature The sensing chip includes a third conductive contact and a fourth conductive contact, the third pin is connected to the third conductive contact, and the fourth pin is connected to the fourth conductive contact. The temperature sensing device according to claim 4, wherein the first temperature sensing element comprises a first encapsulation body, the first temperature sensing chip is arranged in the first encapsulation body, and the first pin An inner end of the pin is located in the first package and connected to the first conductive contact, an inner end of the second pin is located in the first package and connected to the second conductive contact; the second temperature sensor The measuring element includes a second encapsulation body, the second temperature sensing chip is disposed in the second encapsulation body, an inner end of the third pin is located in the second encapsulation body and connected to the third conductive contact , an inner end of the fourth pin is located in the second encapsulation and connected to the fourth conductive contact. The temperature sensing device according to claim 4 or 5, wherein the first temperature sensing chip and the second temperature sensing chip are arranged adjacent to each other. The temperature sensing device according to claim 6, wherein the signal wire extends along a first axis, and the first temperature sensing chip and the second temperature sensing chip are arranged along a second axis; The first axis is perpendicular to the second axis. The temperature sensing device as claimed in claim 1 further comprises a casing, the casing completely covers the first temperature sensing element and the second temperature sensing element. The temperature sensing device according to claim 2, further comprising a casing, the casing completely covers the first temperature sensing element and the second temperature sensing element, and the first insulating wire sheath, the second insulating The wire sheath and the end of the third insulated wire sheath are located in the shell. The temperature sensing device according to claim 4 or 5, wherein the first temperature sensing chip is selected from one of a positive temperature coefficient resistance chip and a negative temperature coefficient resistance chip; the second temperature sensing chip is selected from One of positive temperature coefficient resistor chip and negative temperature coefficient resistor chip. The temperature sensing device according to any one of claims 1 to 5, 8 and 9, wherein the diameter of the second pin and the third pin is smaller than that of the first pin and the fourth pin diameter.

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