CN1959875B - Dual welding spots inductor in high frequency packaged by ceramics and its production method - Google Patents
Dual welding spots inductor in high frequency packaged by ceramics and its production method Download PDFInfo
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- CN1959875B CN1959875B CN2006102009716A CN200610200971A CN1959875B CN 1959875 B CN1959875 B CN 1959875B CN 2006102009716 A CN2006102009716 A CN 2006102009716A CN 200610200971 A CN200610200971 A CN 200610200971A CN 1959875 B CN1959875 B CN 1959875B
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- magnetic core
- ceramic substrate
- ceramic
- double lacquered
- high frequency
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Abstract
Method for manufacturing the disclosed inductor in high frequency includes steps: fixing up magnetic core on the ceramic base plate with leading out ends of metal; next, winding double lacquered wires on magnetic core; then, soldering double lacquered wires on leading out ends of metal so as to form duplex soldered points; finally, using ceramic package to enclosure protect to protect double lacquered wires and soldered points. Features are: reasonable design configuration, small size, large value of inductance, and high Q value. Being suitable to electronic products stuck assembled in high density and in mini type. Being reached to astronavigation level, the product possesses high reliability.
Description
Technical field
The present invention relates to a kind of inductor in high frequency and preparation method thereof, particularly a kind of dual welding spots ceramic packaging inductor in high frequency and preparation method thereof.
Background technology
The solder joint of the enamelled wire of general high frequency wire-wound inductor device is single solder joint; the derivation solder side that solder joint and user need is positioned on the same plane; and solder joint exposes in external environment; cause open circuit or short circuit easily; and the epoxy resin that covers on the enamelled wire applies an embedding on enamelled wire, only to the enamelled wire packaging protection.In addition, epoxy resin and enamelled wire are because the coefficient of expansion different, working long hours to make product open circuit or short circuit occur in the environment that colds and heat succeed each other or corrosion and wet environment, causes the inductor poor reliability, and can not satisfy the high-quality requirement of high-quality that contemporary people pursue.
Summary of the invention
The objective of the invention is to: provide a kind of manufacture method and dual welding spots ceramic packaging inductor in high frequency of high frequency wire-wound inductor device, reliability and practicality that the welding method by improving original inductor in high frequency and material, packaged type have improved inductor in high frequency.
The present invention includes: magnetic core (3), double lacquered wire (7) and ceramic substrate (1), double lacquered wire (7) is wrapped on the magnetic core (3), magnetic core (3) is connected on the ceramic substrate (1) that has the metal exit, and the double lacquered wire port is connected the metal exit on the ceramic substrate (1).
On ceramic substrate (1), also be connected with ceramic package (5).
Ceramic substrate (1) and ceramic package (5) be connected to adhesion.
Metal exit on double lacquered wire (7) port and the ceramic substrate (1) be connected to welding.
All faces of metal exit of ceramic substrate (1) all are coated with metal level.
The position that ceramic substrate (1) connects magnetic core (3) can be plane formula and groove type; Magnetic core (3) is circular or square with the connecting portion of ceramic substrate (1).
Magnetic core (3) can be FERRITE CORE or ceramic magnetic core.
Pottery magnetic core and ceramic substrate (1) can be made as one.
Manufacture method of the present invention; be that magnetic core (3) is fixed on the ceramic substrate (1) with metal exit; use double lacquered wire (7) to be wound on the magnetic core (3) then; then double lacquered wire (7) is welded on the metal exit of ceramic substrate (1); form dual welding spots; use ceramic package (5) that product is encapsulated at last, double lacquered wire and solder joint are protected fully.
Compared with prior art, the present invention is bonded in magnetic core on the ceramic substrate again because adopted ceramic substrate to electroplate the back as electrode, has constituted the carrier of whole inductor, ceramic substrate is as welding carrier and conductive carrier, is used for that weld pads, conduction are drawn, product encapsulation etc.Such inductor carrier can solve electrical property, solderability, the mechanical strength of product simultaneously, derivation solder side with solder joint and user's needs effectively spreads out simultaneously, the generation of solder joint Damage and Failure situation appears when avoiding being welded on product on the pcb board, and can the repeated multiple times welding.Double lacquered wire is used in coiling, has reduced the coiling short-circuit conditions, adopts thermocompression bonding to obtain dual welding spots, has improved reliability of products.Adopt ceramic package to seal, ceramic package and ceramic substrate sealing are bonding, dual welding spots and double lacquered wire can be protected, and isolate with external environment, avoid double lacquered wire and dual welding spots to be subjected to the influence of extraneous corrosion or wet environment; Simultaneously, certain space is arranged between ceramic package and the enamelled wire, even product works long hours in the environment that colds and heat succeed each other, also can not cause enamelled wire to disconnect because pottery is different with the temperature coefficient of enamelled wire, cause that inductance lost efficacy, increase the ability of the anti-environment of product to greatest extent, improved reliability of products.The present invention is a SMD surface attaching type high-frequency inductor, and project organization is reasonable, and size is little, and the sense value is big, and the Q value is high, and suitable high density mounts and microminiaturized use for electronic products.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the vertical view of structural representation of the present invention;
Fig. 3 is that ceramic substrate of the present invention is flat structural representation;
Fig. 4 is the vertical view of Fig. 3;
Fig. 5 is that ceramic substrate of the present invention is the structural representation of groove type;
Fig. 6 is the vertical view of Fig. 5;
Fig. 7 is the structural representation of the another kind of groove type of ceramic substrate of the present invention;
Fig. 8 is the vertical view of Fig. 7;
Fig. 9 is that circular magnetic core of the present invention and ceramic substrate are groove type adhesion structure schematic diagram;
Figure 10 is the vertical view of Fig. 9;
Figure 11 is that square core of the present invention and ceramic substrate are flat adhesion structure schematic diagram;
Figure 12 is the vertical view of Figure 11.
Embodiment
Embodiments of the invention: as illustrated in fig. 1 and 2, at first magnetic core 3 usefulness bonding agents 2 are fixed on the ceramic substrate 1 with metal exit, all faces of the two ends of ceramic substrate 1 are all electroplated, form the coat of metal 6, be preferably gold-plated or zinc-plated, like this 1 one-tenth of ceramic substrate simple but very practical conducting structure.Use double lacquered wire 4 to be wound on the magnetic core 3, again exit is adopted thermocompression bonding to be welded on the coat of metal 6 of ceramic substrate 1, obtain dual welding spots 7, the coat of metal 6, the derivation solder side that the solder joint and the user of double lacquered wire 4 can be needed effectively spreads out, the solder joint damage appears when avoiding being welded on product on the pcb board, the generation of failure conditions, seal ceramic package 5 and the bonding drug 2 of ceramic substrate 1 usefulness bonding, can particularly dual welding spots 7 and double lacquered wire 4 all get up with ceramic package 5 seal protections with magnetic core 3, isolate with external environment, avoid double lacquered wire 4 and dual welding spots 7 to be subjected to the influence of extraneous corrosion and wet environment; Simultaneously, between ceramic package 5 and the double lacquered wire 4 certain space is arranged,, also can not cause double lacquered wire 4 disconnections because pottery is different with the temperature coefficient of double lacquered wire 4 and cause that inductance lost efficacy even product works long hours in the environment that colds and heat succeed each other.Increase the ability of the anti-environment of product to greatest extent, improved reliability of products.
The position that ceramic substrate 1 connects magnetic core 3 can be flat (as Fig. 3 and Fig. 4), groove type (as Fig. 5, Fig. 6, Fig. 7 and Fig. 8) or other formula of deriving.Magnetic core 3 end faces that are connected on the ceramic substrate 1 can be for circular or square, (as Fig. 9, Figure 10, Figure 11 and Figure 12).Cover on ceramic substrate 1, the structure that is used for encapsulating the ceramic package 5 of magnetic core 3, double lacquered wire 4 and dual welding spots 7 can be square, round or other derivative type.Magnetic core 3 can be that iron oxidation magnetic core or ceramic magnetic core are made, and it can fabrication and processing be one also that ceramic magnetic core and ceramic substrate 1 can be adhesion.
Claims (2)
1. dual welding spots ceramic packaging inductor in high frequency, it is characterized in that: comprising: magnetic core (3), double lacquered wire (7) and ceramic substrate (1), double lacquered wire (7) is wrapped on the magnetic core (3), magnetic core (3) is connected on the ceramic substrate (1) that has the metal exit, and the double lacquered wire port is connected the metal exit on the ceramic substrate (1); On ceramic substrate (1), also be connected with ceramic package (5); Ceramic substrate (1) and ceramic package (5) be connected to adhesion; Metal exit on double lacquered wire (7) port and the ceramic substrate (1) be connected to welding; All faces of metal exit of ceramic substrate (1) all are coated with metal level; The position that ceramic substrate (1) connects magnetic core (3) is plane formula and groove type; Magnetic core (3) is circular or square with the connecting portion of ceramic substrate (1); Magnetic core (3) is ceramic magnetic core; Pottery magnetic core and ceramic substrate (1) are made as one.
2. the manufacture method of a dual welding spots ceramic packaging inductor in high frequency as claimed in claim 1; it is characterized in that: this method is that magnetic core (3) is fixed on the ceramic substrate (1) with metal exit; use double lacquered wire (7) to be wound on the magnetic core (3) then; then double lacquered wire (7) is welded on the metal exit of ceramic substrate (1); form dual welding spots; use ceramic package (5) that product is encapsulated at last, double lacquered wire and solder joint are protected fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006102009716A CN1959875B (en) | 2006-10-09 | 2006-10-09 | Dual welding spots inductor in high frequency packaged by ceramics and its production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006102009716A CN1959875B (en) | 2006-10-09 | 2006-10-09 | Dual welding spots inductor in high frequency packaged by ceramics and its production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1959875A CN1959875A (en) | 2007-05-09 |
| CN1959875B true CN1959875B (en) | 2011-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006102009716A Expired - Fee Related CN1959875B (en) | 2006-10-09 | 2006-10-09 | Dual welding spots inductor in high frequency packaged by ceramics and its production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1959875B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102867614A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Wafer inductor with preformed shell and manufacturing method of wafer inductor |
| CN109192457A (en) * | 2018-09-25 | 2019-01-11 | 合肥瀚鹏新能源有限公司 | A kind of ceramics wire-wound inductor |
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2006
- 2006-10-09 CN CN2006102009716A patent/CN1959875B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1959875A (en) | 2007-05-09 |
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Granted publication date: 20110427 Termination date: 20171009 |