CN105316499A - Preparation method of bonded gold-silver alloy - Google Patents
Preparation method of bonded gold-silver alloy Download PDFInfo
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- CN105316499A CN105316499A CN201410336739.XA CN201410336739A CN105316499A CN 105316499 A CN105316499 A CN 105316499A CN 201410336739 A CN201410336739 A CN 201410336739A CN 105316499 A CN105316499 A CN 105316499A
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Abstract
The invention relates to a preparation method of a bonded gold-silver alloy, and belongs to the technical field of bonded wire processing technology. A bonded gold-silver alloy wire is composed of the following metals in percentage by weight: 20 to 30% of silver, 5 to 1000 ppm of palladium, 5 to 1000 ppm of calcium, 5 to 1000 ppm of beryllium, 5 to 1000 ppm of cerium, and the balance being gold. The preparation method comprises the following steps: (1) preparing raw materials; (2) melting alloy ingots; (3) pulling and casting alloy rods; (4) pulling wires; (5) annealing; (6) coiling; (7) packaging. The provided bonded gold-silver alloy wire preparation method has the advantages of reasonable and standard design and simple operation. The produced bonded gold-silver alloy wire has a strong electro-conductive performance, stable chemical performances, good antioxidant property, flowability, and plasticity, and high breaking force and elongation. Moreover, the price of the wire is moderate, and the wire can completely meet the requirements of the industries such as semiconductor encapsulation, LED illumination, and the like.
Description
Technical field
The present invention relates to a kind of preparation method of bonding electrum, belong to bonding wire technology field.
Background technology
Bonding wire be semiconducter device and unicircuit assembling time, for making the micro-wire internal lead realizing electrical connection in the I/O bonding point of chip internal circuit and lead frame between point of contact.As bonding internal lead, it should have following performance to bonding wire: specific conductivity is high, conductive capability is strong, strong with the bonding force of conductor material, stable chemical performance, can not form harmful intermetallic compound, plasticity-is good, is easy to welding, and can certain shape be kept, there is the tensile strength and elongation etc. of regulation.At present bonding wire mainly contain spun gold, aluminium silicon silk, copper wire and B alloy wire etc., wherein spun gold is widely used in IC internal lead because of its excellent performance.But there is the problem of the following aspects in bonding gold wire in wire bonding:
1, Au2Al intermetallic compound easily produces KirkendallVoid when bonding, make bonding place produce cavity, resistance sharply increases, and destroys ohm connection of unicircuit, electroconductibility havoc or generation crack, easily cause device solder joint to throw off at this and lost efficacy;
2, the poor heat resistance of spun gold, during ball bonding, the spun gold near soldered ball forms recrystallized structure owing to being heated, if spun gold meeting really up to the mark causes ball neck warpage; During soldered ball heating, spun gold coarse grainsization can cause ball neck to rupture;
3, spun gold also easily causes collapse a phenomenon and conditions of streaking, has had a strong impact on the quality of bonding;
4, spun gold is expensive, has broken through 360 yuan/gram at present, causes packaging cost too high, and the maximum challenge of current semicon industry how to control and reduces costs.
For LED illumination product, it has the advantage of energy-conservation, life-span long, environmental protection, but the inefficacy of LED single tube can shine into very large puzzlement to whole LED illumination product, and LED single tube inside is linked by bonding wire to form, and therefore the inefficacy of LED single tube mostly is bonding problems.
For reducing packaging cost, adapt to the needs of LED bonding, bonding filamentary silver, bonding gold-silver alloy wire are seasonable and give birth to.In non-ferrous metal, the conductivity of silver is best, but the use of fine silver silk also exists very large challenge is exactly balling-up instability, oxidizable, thinks in the industry and can promote from gold-silver alloy wire transition.Electrum has good oxidation-resistance, mobility and castibility, and plasticity is good, is easily processed into wire rod and sheet material.Report, gold-silver alloy wire owing to testing-interfacial corrosion the problem that breaks down under high humidity environment, hinder the scope of its application, by adding the Pd of 5%, this problem can be solved, relative proof gold silk reduces cost, but too increases cost undoubtedly for common gold-silver alloy wire, therefore needs to carry out common key alloy silver
The exploration of B alloy wire preparation technology.
Because its physical and mechanical properties index of bonding gold-silver alloy wire is equivalent or be better than bonding gold wire, and greatly can reduce product cost, become effective substitute of bonding gold wire gradually, bonding gold-silver alloy wire has following performance characteristics:
The gold-silver alloy wire of all size used in the cost wire bonding of 1, bonding gold-silver alloy wire, its cost is the highest can reduce by 40%.
2, the mechanical property of the mechanical property bonding wire of bonding gold-silver alloy wire, namely the breaking force of silk and the quality of elongation to wire bonding play a crucial role, and the silk with higher breaking force and better elongation is more conducive to bonding.High breaking force can make silk resist certain mechanical stress, and good elongation makes the one-tenth arc of bonding wire when routing bonding good, and consistence is good, without collapsing a phenomenon, thus improves the reliability of semiconducter device.
Bonding gold-silver alloy wire has excellent mechanical property compared with the spun gold (99.99%) of same specification, and it has high elongation and breaking force, can obtain excellent ball neck intensity and higher camber line stability like this in mold pressing and closed process.
3, the electric property of the electric property packaged material of bonding gold-silver alloy wire directly determines the performance index of chip, along with chip frequency improves constantly, has higher requirement to the electrical property of the conductor material in encapsulation.Silver resistivity resistivity in all metals is minimum, and conductivity is optimum.The conductive capability of gold is inferior to silver, and adding of gold can increase resistivity undoubtedly, but golden chemical property is highly stable, not oxidizable, is easily combined with pad.
4, the thermal property of bonding gold-silver alloy wire
Along with the raising of chip density and reducing of volume, the heat radiation in chip manufacturing proces is the important content that design and processes is considered.The thermal diffusivity of silver is better than gold, and both combinations also can reach certain radiating effect.
5, the at present shortcoming that exists of bonding gold-silver alloy wire and technology difference
1) silver proportion is in the alloy little, can not affect the antioxidant property of alloy.If but this kind of B alloy wire is exposed in high humidity environment for a long time and there will be oxidative phenomena.
2) although gold and silver element can dissolve each other at any composition, if think, melting obtains the alloy pig of uniform composition, needs through repeatedly melting acquisition.If uneven components, by the bonding performance of the mechanical property and later stage that directly affect B alloy wire.
3) by adding 5%Pd in the alloy, the interfacial corrosion problem under high humidity environment can be solved, but add cost undoubtedly.Also having report to point out can be directly gold-plated or gold-plated again on the basis of B alloy wire on the basis of bonding filamentary silver, and this has all related to electroplating technology problem, too increases facility investment and technological specification problem undoubtedly.
Summary of the invention
The object of the invention is to the deficiency solving the existence of above-mentioned prior art, provide a kind of and there is good oxidation-resistance, mobility and plasticity-, there is higher breaking force and better elongation, and the preparation method of the bonding gold-silver alloy wire of moderate cost.
For achieving the above object, the present invention is by the following technical solutions:
Bonding gold-silver alloy wire of the present invention, is made up of the metallic substance of following weight ratio: silver (Ag) 20-30%, and palladium (Pd), calcium (Ca), beryllium (Be) and cerium (Ce) are 5-1000ppm, and all the other content are gold (Au).
The preparation method of bonding gold-silver alloy wire of the present invention comprises the following steps:
1), get the raw materials ready: take various starting material by required weight;
Purity is 99.999wt% gold, and purity is 99.99wt% silver, and commercially available purity is the palladium of 99.97wt%
0.04wt%-0.1wt%, commercially available calcium grain 0.40wt%-0.80wt%, commercially available beryllium 0.40wt%-0.80wt%, commercially available cerium 0.40wt%-0.80wt%.
2), alloy pig melting
According to Au-Ag alloy phase diagram, determine alloy melting temp, consider that silver is oxidizable, therefore adopt high frequency furnace vacuum protection, vacuum tightness is 0.1 × 10-3Pa, smelting temperature 1050-1250 DEG C, repeatedly melting, obtains the alloy pig of uniform composition.
A, to feed intake: silver is wrapped in goldleaf the crucible putting into stove;
B, vacuum melting: build bell and vacuumize, start heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute;
C, furnace cooling: stop heating, the alloy furnace cooling of fusing to room temperature, then repeats b step, 2-3 time;
D, cast alloy pig: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min, obtain alloy pig.
3), cast alloy bar:
Adopt vertical continuous casting furnace, the basis of dore bullion bar is added trace alloying element, and to be drawn into diameter be 5-10
The alloy bar of mm.
A, take the palladium sheet 0.04%-0.1% that commercially available purity is 99.97wt% by weight percentage, commercially available calcium grain 0.40%-0.80%, commercially available beryllium sheet 0.40%-0.80%, commercially available cerium 0.40%-0.80%;
B, feeding intake: by step 2) dore bullion bar that obtains is placed in the large crucible in stove;
C, vacuum melting: build bell and vacuumize, start heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, dore bullion bar metal melts completely, maintains this temperature, refining 10-20 minute;
Open monkey unsettled in stove again, palladium, calcium, cerium are put into the unsettled monkey of stove, and stir for several times, 20-30 time, maintain this temperature, refining 10-20 minute;
E, cast alloy bar: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min, obtains ganoid alloy bar.
4), wire drawing: the alloy bar good by cast, through drawing process, is drawn into client's desired product size.
A, rough: mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: mould unit elongation 9-18%, drawing speed 60-180m/min;
C, carefully to draw: mould unit elongation 4-15%, drawing speed 180-480m/min;
D, ultra-finely to draw: mould unit elongation 4-9%, drawing speed 180-480m/min.
5), anneal:
Annealing temperature is 500-600 DEG C, winding tension 3-15g, take-up speed 100-200rpm.
6), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm.
7), pack:
Bonding gold-silver alloy wire after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
Bonding gold-silver alloy wire preparation method provided by the present invention, technological design is reasonable, specification, easy and simple to handle, the bonding gold-silver alloy wire conductive capability produced is strong, stable chemical performance, has good oxidation-resistance, mobility and plasticity-, has higher breaking force and better elongation, and moderate, the requirement of semiconductor packaging industry, LED illumination technology para-linkage gold-silver alloy wire performance can be met completely.
Embodiment
Below provide the specific embodiment of the present invention, be used for being further described formation of the present invention.
Embodiment 1
The present embodiment bonding gold-silver alloy wire, is made up of the metallic substance of following weight ratio: silver (Ag) 30wt%, palladium (Pd) 500ppm, calcium (Ca) 40ppm, cerium (Ce) 20ppm, beryllium (Be) 8ppm, all the other content are Au.
Its preparation method comprises the following steps:
1), get the raw materials ready: take various starting material by required weight
Taking purity is 99.999wt% gold 3.50-3.505kg, and purity is 99.99wt% silver 1.495-1.50kg, and purity is the palladium sheet 250g of 99.97wt%, commercially available calcium grain 50g, commercially available cerium 25g, commercially available beryllium sheet 12.5g.
2), alloy pig melting
Equipment used: high vacuum melting furnace:
Jin Heyin is put into the crucible of stove, silver is wrapped in goldleaf.Build bell to vacuumize, start heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute.Furnace cooling, repeats melting 2-3 time.Stopping vacuumizes, applying argon gas, pressure 0.01-0.05Pa, adopts continuous drawing casting method, and speed 20-60mm/min obtains KA7 alloy pig 4.997kg.
3), cast alloy bar:
Equipment used: vertical continuous casting smelting furnace
By step 2) dore bullion bar that obtains is placed in the large crucible in stove, builds bell and vacuumize, and starts heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, dore bullion bar metal melts completely, maintains this temperature, refining 10-20 minute.Open monkey unsettled in stove again, palladium 250g, calcium 50g, cerium 25g and beryllium 12.5g are put into the unsettled monkey of stove, and stir 20-30 time, maintain this temperature, refining 10-20 minute.Stopping vacuumizes, applying argon gas, pressure 0.01-0.05Pa, adopts continuous drawing casting method, speed 20-60mm/min, and obtaining diameter is the ganoid alloy bar of 8 ± 1mm.
4), wire drawing:
Be the alloy bar of 8 ± 1mm by diameter, through drawing process, product be drawn into client's desired size, micron order.
A, rough: →, mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: →, mould unit elongation 9-18%, drawing speed 60-180m/min;
C, carefully to draw: →, mould unit elongation 4-15%, drawing speed 180-480m/min;
D, ultra-finely to draw: →, mould unit elongation 4-9%, drawing speed 180-480m/min.
5), anneal:
Annealing temperature is 500-600 DEG C, winding tension 3-15g, take-up speed 100-200rpm.
6), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm.
7), pack:
Bonding gold-silver alloy wire after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
Embodiment 2
The present embodiment difference from Example 1 is:
Get the raw materials ready: silver (Ag) 20wt%, palladium (Pd) 500ppm, calcium (Ca) 40ppm, cerium (Ce) 20ppm, beryllium (Be) 8ppm, all the other content are Au.
Subsequent technique is all with embodiment 1, and the bonding gold-silver alloy wire model name of the present embodiment is KA8.
More than in formula, cerium (Ce), the acting in conjunction of calcium (Ca) and beryllium (Be) is the physical strength improving alloy in the mode of solution strengthening.In addition: cerium (Ce) improves the fatigue resistance of material; Calcium (Ca) improves ductility and the weldability of material; Beryllium (Be) improves radian, for the particular requirement of LED bonding wire.
More than show and describe ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. a preparation method for bonding electrum, is characterized in that:
Bonding gold-silver alloy wire, is made up of the metallic substance of following weight ratio: silver-colored 20-30%, and palladium, calcium, beryllium and cerium are 5-1000ppm, and all the other content are gold; The preparation method of above-mentioned bonding gold-silver alloy wire, comprises the following steps:
1), get the raw materials ready: take various starting material by required weight;
2), alloy pig melting: according to Au-Ag alloy phase diagram, determine KA7, KA8 alloy melting temp, adopt the repeatedly melting of high frequency furnace vacuum protection, obtain the alloy pig of uniform composition; Alloy pig melting comprises following operation:
A, to feed intake: silver is wrapped in goldleaf the crucible putting into stove;
B, vacuum melting: build bell and vacuumize, start heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, metal melts completely, maintains this temperature, refining 10-20 minute;
C, furnace cooling: then stop heating, the gold and silver furnace cooling of fusing to room temperature, then repeats b step, 2-3 time;
D, cast alloy pig: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min;
3), cast alloy bar:
Adopt vertical continuous casting furnace, the basis of dore bullion bar is added trace alloying element and is drawn into the alloy bar that diameter is 5-10mm;
4), wire drawing: the alloy bar good by cast, through drawing process, is drawn into client's desired product size;
5), anneal:
Annealing temperature is 500-600 DEG C, winding tension 3-15g, take-up speed 100-200rpm;
6), coiling:
Winding tension is 3-30g, and threading speed is 500-750rpm;
7), pack:
Bonding gold-silver alloy wire after coiling is put into packing box with holes, puts into siccative, and adopt vacuum machine to carry out encapsulation process.
2., according to a kind of described in claim 1 preparation method of bonding electrum, it is characterized in that described step 3) cast alloy bar comprises following operation:
A, take the palladium sheet 0.045%-0.050% that commercially available purity is 99.97wt% by weight percentage, commercially available calcium grain 0.43%-0.53%, commercially available beryllium sheet 0.43%-0.53%, commercially available cerium 0.43%-0.53%;
B, feeding intake: by step 2) dore bullion bar that obtains is placed in the large crucible in stove;
C, vacuum melting: build bell and vacuumize, start heating when vacuum tightness in stove reaches 0.1 × 10-3Pa, when in-furnace temperature reaches 1050-1250 DEG C, dore bullion bar metal melts completely, maintains this temperature, refining 10-20 minute; Open monkey unsettled in stove again, palladium, calcium, cerium are put into the unsettled monkey of stove, and stir 20-30 time, maintain this temperature, refining 10-20 minute;
E, cast alloy bar: stop vacuumizing, applying argon gas, pressure 0.01-0.05Pa, adopt continuous drawing casting method, speed 20-60mm/min, obtains ganoid alloy bar.
3. according to a kind of described in claim 1 preparation method of bonding electrum, it is characterized in that described step 4) wire drawing comprises following operation: a, rough: mould unit elongation 7-18%, drawing speed 6-22m/min;
B, in draw: mould unit elongation 9-18%, drawing speed 60-180m/min;
C, carefully to draw: mould unit elongation 4-15%, drawing speed 180-480m/min;
D, ultra-finely to draw: mould unit elongation 4-9%, drawing speed 180-480m/min.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011516A (en) * | 2016-05-31 | 2016-10-12 | 河北德田半导体材料有限公司 | Alloy-doped gold bonding wire and cryogenic-treatment preparation method thereof |
-
2014
- 2014-07-16 CN CN201410336739.XA patent/CN105316499A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106011516A (en) * | 2016-05-31 | 2016-10-12 | 河北德田半导体材料有限公司 | Alloy-doped gold bonding wire and cryogenic-treatment preparation method thereof |
| CN106011516B (en) * | 2016-05-31 | 2018-01-23 | 河北德田半导体材料有限公司 | One kind doping billon bonding wire and its subzero treatment preparation method |
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