CN105950895B - A kind of manufacture method of the fine silver alloy bonding line of small chip LED encapsulation - Google Patents
A kind of manufacture method of the fine silver alloy bonding line of small chip LED encapsulation Download PDFInfo
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- CN105950895B CN105950895B CN201610293480.4A CN201610293480A CN105950895B CN 105950895 B CN105950895 B CN 105950895B CN 201610293480 A CN201610293480 A CN 201610293480A CN 105950895 B CN105950895 B CN 105950895B
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- 229910001316 Ag alloy Inorganic materials 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000005538 encapsulation Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010946 fine silver Substances 0.000 title claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 80
- 239000000956 alloy Substances 0.000 claims abstract description 80
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 238000005491 wire drawing Methods 0.000 claims abstract description 29
- 230000008569 process Effects 0.000 claims abstract description 23
- 238000003723 Smelting Methods 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 238000009749 continuous casting Methods 0.000 claims abstract description 9
- 239000010944 silver (metal) Substances 0.000 claims description 72
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 42
- 238000001291 vacuum drying Methods 0.000 claims description 30
- 229910052684 Cerium Inorganic materials 0.000 claims description 20
- 229910052582 BN Inorganic materials 0.000 claims description 19
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 19
- 229910052746 lanthanum Inorganic materials 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 10
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 9
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 238000013019 agitation Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007670 refining Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 230000004927 fusion Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052763 palladium Inorganic materials 0.000 description 6
- 229910052774 Proactinium Inorganic materials 0.000 description 4
- 238000007499 fusion processing Methods 0.000 description 4
- 229910000858 La alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000048 melt cooling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241001226615 Asphodelus albus Species 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention discloses a kind of small chip LED encapsulation manufacture method of fine silver alloy bonding line, include the following steps：The smelting of 1 silver alloy bonding line blank and continuous casting：The drawing of 2 silver alloy wires：The intermediate heat-treatment of 3 silver alloy wires：4 are drawn into the silver alloy wire Jing Guo intermediate heat-treatment through wire drawing machine the silver alloy wire of 0.06 0.08mm of diameter.The present invention eliminates the defects of bonding silver wire and other bonding silver alloy wire intensity are low, antioxygenic property is poor by optimized alloy component, and effectively reduces cost.Vibration continuous casting technology is had children outside the state plan by using vacuum melting, improve alloy property, improve alloy uniformity, obtain high-quality alloy wire blank, and the institutional framework of alloy in process is controlled by appropriate intermediate heat-treatment, reduce the stress raisers in wire drawing, one-step optimization wire-drawing die inlet angle of going forward side by side, reduce the broken string in drawing process, it is ensured that fine to be bonded silver alloy wire yield rate.
Description
Technical field
The invention belongs to technical field of semiconductor, relates generally to a kind of small chip LED encapsulation and is closed with fine bonding silver
Gold thread and its manufacture method.
Background technology
Bonding wire plays bringing-out of connection silicon chip electrode and lead frame, and transmits the telecommunications of chip
Number, distribute the heat produced in chip, be the critical material of integrated antenna package.Wire bonding is the minimum spy of semiconductor production
The concentrated reflection of size and maximum output is levied, the former is shown as in the lead spacing that constantly reduces, and the latter is then embodied in and progressively carries
In high production efficiency.Thin space is bonded the line for needing strength and stiffness higher, by no air soldered ball（Free Air
Ball）And the control of heat affected area (Heat Affect Zone) length is being collected on a large scale with meeting the needs of thin space bonding
The technical indicator of para-linkage line proposes increasingly higher demands into circuit and LED encapsulation, and high-performance, ultra-fine bonding line need
The amount of asking increases rapidly, while the continuous improvement of chip density, and the reliability of para-linkage material proposes the requirement bonding line of higher
（It is bonded gold thread, linking copper wire, bonding alloy line etc.）Play bringing-out of connection silicon chip electrode and lead frame,
And transmit the electric signal of chip, distribute the interior heat produced of chip, it is the critical material of integrated antenna package.It is bonded silver wire and key
Silver alloy wire is closed due to its outstanding electric property（Device high-frequency noise can be reduced, reduce great power LED caloric value etc.）, it is good
Good stability and appropriate cost factor, start to be applied in microelectronics Packaging, especially in LED encapsulation.But for fine silver
For line, the problem of being primarily present the following aspects：1）N is not used during Ag line bondings2+H2Gas shield（Cu is bonded
Line uses N in use2+H2Gas shield, cost is higher and there are security risk）, the parameter window in bonding process
Scope is smaller, due to reasons such as thermal conductivity height, oxidation rate height, easily leads to the uneven easily formation of Free Air Ball solidifications
The defects of golf, bulb come to a point, wave ball, influences the first Joint Strength and shape, reduces device yield and reliable
Property；2）Ag line elevated temperature strengths are low, and the probability that fails under hot conditions is higher, can not meet the use of the devices such as great power LED；3）
Ag/Al interfaces are welded under harsh conditions to be easy to produce Ag ion electromigration, are caused Joint Strength to decline and then are influenced the device longevity
Life.For being bonded silver alloy wire, mostly at present is the alloy by adding the elements such as Pd, Au, such silver alloy has good property
Can, can meet the needs of part LED encapsulation, but such silver alloy there are problems that following aspects：1）Due to Au and Pd with
Ag can be with infinitely dissolve, and alloy strength increase is limited after Au and Pd elements are added in Ag, and for small chip LED, its pad
Size is smaller, is usually 40*40um, it is necessary to ultra-fine（Line footpath is 0.012-0.016mm）Bonding wire connects, and this requires bonding
Silver alloy wire has enough bonding strengths, and thus, the silver alloy wire of addition Au and Pd cannot meet wanting for small chip LED encapsulation
Ask；2）After adding Au and Pd in fine silver, since its atomic arrangement mode and atomic radius are similar, alloying element is anti-oxidant to silver
Performance improves limited so that parameter area is smaller in bonding process, causes the reduction of its production efficiency；3）Your gold Au and Pd is
Belong to, considerably increase the cost of bonding silver alloy wire.The addition of Ni elements and rare earth element can effectively improve silver alloy
Intensity, the antioxygenic property and high-temperature stability for improving silver.Further, since small chip LED encapsulation bonding silver alloy wire line footpath
It is thinner（Line footpath is 0.012-0.016mm）, for micro-fine wire processing, the compactness and uniformity of raw material are that influence is micro-
The key of thin wire drawing, the intermediate heat-treatment and wire-drawing die of drawing process are an important factor for influencing micro-fine wire processing.Therefore,
Optimize the component of silver alloy bonding line, improve the intensity and corrosion resistance of silver alloy bonding line, shaken by vacuum melting excusing from death
Dynamic continuous casting technology ensures that silver alloy tissue and performance are consistent, using appropriate intermediate heat-treatment and optimize wire-drawing die inlet angle,
Fine silver alloy wire manufacture method is improved, is of great significance for accelerating application of the silver alloy wire in small chip LED encapsulation.
The content of the invention
It is an object of the invention to provide a kind of small chip LED encapsulation to be bonded silver alloy wire and its manufacture method with fine,
It can solve the shortcomings that existing bonding silver alloy wire, meet the requirement of small chip LED encapsulation.
For this reason, the present invention provides following technical solution：A kind of small chip LED encapsulation fine bonding silver alloy wire and its system
Method is made, is included the following steps：（1）The smelting of silver alloy bonding line blank and continuous casting：A. Ag/Ni intermediate alloys are manufactured：By matter
The Ni layerings for measuring the Ag and mass fraction 10% of fraction 90% are put into vacuum drying oven boron nitride crucible, and the burner hearth of vacuum drying oven is taken out very
Sky, vacuum are higher than 3.0 × 10-2After Pa, start to warm up to 1450-1850 DEG C, fusion process vacuum is higher than 5 × 10-2Pa,
Then 10-20 minute are stood, after Ag/Ni alloys melt completely and molten metal change is limpid, by boron nitride tube to Ag/Ni alloys
Ar is filled with liquid to stir 5-10 minutes, and then alloy is poured into water cooling mold and is cooled down, obtains Ag/Ni intermediate alloys；B. make
Make Ag/Ce, Ag/La intermediate alloy：The Ag of mass fraction 95% is put into vacuum drying oven graphite crucible, by the Ce of mass fraction 5%
Or La is put into vacuum drying oven Feeding box, the burner hearth of vacuum drying oven is vacuumized, vacuum is higher than 3.0 × 10-2After Pa, Ar is filled with extremely
0.1-0.5Mpa, is then evacuated to vacuum higher than 3.0 × 10 again-2After Pa, start to warm up, treat that temperature rises to 600-800
After DEG C, stopping vacuumizes and Ar is filled with into vacuum drying oven to 0.1-0.5MPa；Then proceed to be warming up to 1150-1250 DEG C, treat silver
After melting and silvering solution become limpid completely, Ce or La are added in crucible by mobile Feeding box, and into g/Ce, Ag/La aluminium alloy
It is filled with Ar to stir 5-10 minutes, then alloy melt is cooled down, obtains Ag/Ce, Ag/La excellent intermediate alloy；C. in vacuum smelting
After Ag/Ni intermediate alloys, Ag/Ce intermediate alloys, Ag/La intermediate alloys, Ag are weighed calculating in following ratios in furnace, wherein
Nickel（Ni）For 3-5wt%；Cerium（Ce）For 0.3-0.5 wt%；Lanthanum（La）For 0.3-0.5 wt%, silver is surplus, and cerium in silver alloy
（Ce）And lanthanum（La）Mass fraction it is identical, be mixed to join in vacuum smelting furnace, be evacuated to 6.0 × 10-1More than Pa, starts
Heating, after temperature rises to 600-800 DEG C, stopping vacuumizes and Ar is filled with into vacuum smelting furnace to 0.1-0.5MPa；Then
1250-1450 DEG C is continuously heating to, after alloy melts completely, Ar is filled with into silver alloy liquid and is stirred 5-10 minutes, by alloy
Melt cooling, obtains silver alloy blank；D. silver alloy blank is added in vacuum melting electromagnetic agitation alloy conticaster crucible,
Crucible is boron nitride crucible, is evacuated to 6.0 × 10-1More than Pa, starts to warm up to 1250-1450 DEG C, treats that alloy melts completely,
Stirred 10-15 minutes using boron nitride stirring rod, after then refining stands 10-15 minutes, be filled with high-purity Ar to 1.05MPa-
1.1MPa, starts to use intermittent mode cast 8-12mm silver alloy bars；（2）The drawing of silver alloy bar：By above-mentioned diameter 8-12mm
Silver alloy bar be drawn into the silver alloy wire of a diameter of 1.0-1.5mm by wire drawing machine, drawing process is drawn using unidirectional；（3）
The intermediate heat-treatment of silver alloy wire：The silver alloy wire of diameter 1.0-1.5mm is subjected to intermediate heat-treatment in tube furnace, is heat-treated
Process uses inert gas or N2Gas shield, heat treatment temperature are 550-750 DEG C, and heat treatment time is 2-5 minutes；（4）Will
Silver alloy wire by intermediate heat-treatment is drawn into the silver alloy wire of diameter 0.06-0.08mm through wire drawing machine, then will be a diameter of
The silver alloy wire of 0.06-0.08mm passes through wire drawing machine continuous drawing into a diameter of 0.03-0.05mm filaments, then in fine drawing
It is final to obtain the fine silver alloy bonding lines of diameter 0.012-0.018mm by multiple tracks drawing on silk machine, in drawing process, wire rod
Deformation rate is 5%-7%.
Further, the water cooling mold material of the cast Ag/Ni alloys is fine copper.
Further, electromagnetic agitation mechanism is installed on the crystallizer of the conticaster；Silver-colored billon bar traction uses
Intermittent traction, hauling speed are 50-300mm/ minutes, pull-in time 1-5 second, idle hours 1-5 second.
Yet further, when the silver alloy shank diameter is more than 1.0-1.5mm, drawn in drawing process using one way system
System, and drawing speed is 10-20m/ minutes.
Again further, in the silver alloy wire pulling process, the inlet angle of wire-drawing die is 11 ° -14 °.
In addition, the present invention also provides a kind of manufacturer with the small chip LED encapsulation with fine bonding silver alloy wire
The fine bonding silver alloy wire of small chip LED encapsulation of method manufacture, each Ingredients Weight percentage of silver alloy bonding wire material contain
Amount is：Ni 3-5wt%, Ce 0.3-0.5wt%, La 0.3-0.5wt%, Ag surpluses, and Ce with La mass fractions are identical.
The small chip LED that small chip LED encapsulation of the present invention is manufactured with the manufacture method of fine bonding silver alloy wire
The fine bonding silver alloy wire of encapsulation, bonding silver wire and other bonding silver alloy wire intensity are eliminated by optimized alloy component
Low, the defects of antioxygenic property is poor, and effectively reduce cost.Vibration continuous casting technology is had children outside the state plan by using vacuum melting, is improved
Alloy property, improves alloy uniformity, obtains high-quality alloy wire blank, and by the control of appropriate intermediate heat-treatment plus
The institutional framework of alloy during work, the stress raisers in reduction wire drawing, one-step optimization wire-drawing die inlet angle of going forward side by side,
Reduce the broken string in drawing process, it is ensured that fine to be bonded silver alloy wire yield rate.
Embodiment
Embodiment one：
The manufacture method of fine bonding silver alloy bonding line is as follows：
（1）The smelting of silver alloy bonding line blank and continuous casting：A. Ag/Ni intermediate alloys are manufactured：By the Ag of mass fraction 90%
Ni layerings with mass fraction 10% are put into vacuum drying oven boron nitride crucible, the burner hearth of vacuum drying oven are vacuumized, vacuum is higher than
3.0×10-2After Pa, start to warm up to 1450 DEG C, fusion process vacuum is higher than 3.0 × 10-2Pa, then stands 10 minutes, treats
After the melting completely of Ag/Ni alloys and molten metal becomes limpid, Ar is filled with into Ag/Ni aluminium alloys by boron nitride tube and is stirred 5 minutes,
Then alloy is poured into water cooling mold and cooled down, obtain Ag/Ni intermediate alloys；B. Ag/Ce, Ag/La intermediate alloy are manufactured：
The Ag of mass fraction 95% is put into vacuum drying oven graphite crucible, the Ce of mass fraction 5% or La are put into vacuum drying oven Feeding box,
The burner hearth of vacuum drying oven is vacuumized, vacuum is higher than 3.0 × 10-2After Pa, Ar to 0.1Mpa is filled with, is then evacuated to again true
Reciprocal of duty cycle is higher than 3.0 × 10-2After Pa, start to warm up, after temperature rises to 600 DEG C, stopping vacuumizes and Ar is filled with into vacuum drying oven
To 0.1MPa；Then proceed to be warming up to 1150 DEG C, after silver-colored melting completely and silvering solution become limpid, mobile Feeding box adds Ce or La
Enter into crucible, and rock crucible and stir 5 minutes, then by alloy melt furnace cooling, obtain among Ag/Ce, Ag/La alloy
Alloy；C. in vacuum smelting furnace by Ag/Ni intermediate alloys, Ag/Ce intermediate alloys, Ag/La intermediate alloys, Ag in following ratios
Weigh after calculating, wherein nickel（Ni）For 3wt%；Cerium（Ce）For 0.3wt%；Lanthanum（La）For 0.3 wt%, silver is surplus, and silver alloy
Middle cerium（Ce）And lanthanum（La）Mass fraction it is identical, be mixed to join in vacuum smelting furnace, be evacuated to 5.0 × 10-1More than Pa,
Start to warm up, after temperature rises to 600 DEG C, stopping vacuumizes and Ar is filled with into vacuum smelting furnace to 0.1MPa；Then proceed to
1250 DEG C are warming up to, after alloy melts completely, Ar is filled with into silver alloy liquid and is stirred 5 minutes, alloy melt is cooled down, is obtained
Silver alloy blank；D. silver alloy blank is added in vacuum melting electromagnetic agitation alloy conticaster crucible, crucible is boron nitride
Crucible, is evacuated to 5.0 × 10-1More than Pa, starts to warm up to 1250 DEG C, treats that alloy melts completely, using boron nitride stirring rod
Stirring 10 minutes, after then refining stands 15 minutes, is filled with high-purity Ar to 1.05MPa, starts using intermittent mode cast 8mm silver
Rod of metal alloy；
（2）The drawing of silver alloy bar：The silver alloy bar of above-mentioned diameter 8mm is drawn into a diameter of 1.0mm by wire drawing machine
Silver alloy wire, drawing process drawn using unidirectional；（3）The intermediate heat-treatment of silver alloy wire：By the silver alloy wire of diameter 1.0mm
Intermediate heat-treatment is carried out in tube furnace, heat treatment process uses N2Gas shield, heat treatment temperature is 550 DEG C, during heat treatment
Between be 5 minutes；（4）Silver alloy wire Jing Guo intermediate heat-treatment is drawn into the silver alloy wire of diameter 0.06mm through wire drawing machine, so
The silver alloy wire of a diameter of 0.06mm is passed through into wire drawing machine continuous drawing into a diameter of 0.03mm filaments afterwards, then in fine drawing
It is final to obtain the fine silver alloy bonding lines of diameter 0.012mm by multiple tracks drawing on silk machine, in drawing process, wire rod deformation rate
For 5%, die entrance angle is 11 °.
Embodiment two：
The manufacture method of fine silver billon bonding line is as follows：
（1）The smelting of silver alloy bonding line blank and continuous casting：A. Ag/Ni intermediate alloys are manufactured：By the Ag of mass fraction 90%
Ni layerings with mass fraction 10% are put into vacuum drying oven boron nitride crucible, the burner hearth of vacuum drying oven are vacuumized, vacuum is higher than
3.0×10-2After Pa, start to warm up to 1650 DEG C, fusion process vacuum is higher than 3.0 × 10-2Pa, then stands 15 minutes, treats
After the melting completely of Ag/Ni alloys and molten metal becomes limpid, Ar is filled with into Ag/Ni aluminium alloys by boron nitride tube and is stirred 8 minutes,
Then alloy is poured into water cooling mold and cooled down, obtain Ag/Ni intermediate alloys；B. Ag/Ce, Ag/La intermediate alloy are manufactured：
The Ag of mass fraction 95% is put into vacuum drying oven graphite crucible, the Ce of mass fraction 5% or La are put into vacuum drying oven Feeding box,
The burner hearth of vacuum drying oven is vacuumized, vacuum is higher than 3.0 × 10-2After Pa, Ar to 0.3Mpa is filled with, is then evacuated to again true
Reciprocal of duty cycle is higher than 3.0 × 10-2After Pa, start to warm up, after temperature rises to 700 DEG C, stopping vacuumizes and Ar is filled with into vacuum drying oven
To 0.3MPa；Then proceed to be warming up to 1200 DEG C, after silver-colored melting completely and silvering solution become limpid, mobile Feeding box adds Ce or La
Enter into crucible, and rock crucible and stir 8 minutes, then by alloy melt furnace cooling, obtain among Ag/Ce, Ag/La alloy
Alloy；C. in vacuum smelting furnace by Ag/Ni intermediate alloys, Ag/Ce intermediate alloys, Ag/La intermediate alloys, Ag in following ratios
Weigh after calculating, wherein nickel（Ni）For 4wt%；Cerium（Ce）For 0.4wt%；Lanthanum（La）For 0.4 wt%, silver is surplus, and silver alloy
Middle cerium（Ce）And lanthanum（La）Mass fraction it is identical, be mixed to join in vacuum smelting furnace, be evacuated to 5.0 × 10-1More than Pa,
Start to warm up, after temperature rises to 700 DEG C, stopping vacuumizes and Ar is filled with into vacuum smelting furnace to 0.3MPa；Then proceed to
1350 DEG C are warming up to, after alloy melts completely, Ar is filled with into silver alloy liquid and is stirred 8 minutes, alloy melt is cooled down, is obtained
Silver alloy blank；D. silver alloy blank is added in vacuum melting electromagnetic agitation alloy conticaster crucible, crucible is boron nitride
Crucible, is evacuated to 5.0 × 10-1More than Pa, starts to warm up to 1350 DEG C, treats that alloy melts completely, using boron nitride stirring rod
Stirring 12 minutes, after then refining stands 18 minutes, is filled with high-purity Ar to 1.07MPa, starts to use intermittent mode cast 10mm
Silver alloy bar；
（2）The drawing of silver alloy bar：The silver alloy bar of above-mentioned diameter 10mm is drawn into by wire drawing machine a diameter of
The silver alloy wire of 1.2mm, drawing process are drawn using unidirectional；（3）The intermediate heat-treatment of silver alloy wire：By the silver of diameter 1.2mm
Alloy wire carries out intermediate heat-treatment in tube furnace, and heat treatment process is protected using inert gas Ar, heat treatment temperature 650
DEG C, heat treatment time is 4 minutes；（4）Silver alloy wire Jing Guo intermediate heat-treatment is drawn into diameter 0.07mm's through wire drawing machine
Silver alloy wire, then by the silver alloy wire of a diameter of 0.07mm by wire drawing machine continuous drawing into a diameter of 0.04mm filaments,
It is final to obtain the fine silver alloy bonding lines of diameter 0.016mm again on fine wire drawing machine by multiple tracks drawing, in drawing process,
Wire rod deformation rate is 6%, and die entrance angle is 13 °
Embodiment three：
The manufacture method of fine silver billon bonding line is as follows：
（1）The smelting of silver alloy bonding line blank and continuous casting：A. Ag/Ni intermediate alloys are manufactured：By the Ag of mass fraction 90%
Ni layerings with mass fraction 10% are put into vacuum drying oven boron nitride crucible, the burner hearth of vacuum drying oven are vacuumized, vacuum is higher than
3.0×10-2After Pa, start to warm up to 1850 DEG C, fusion process vacuum is higher than 3.0 × 10-2Pa, then stands 20 minutes, treats
After the melting completely of Ag/Ni alloys and molten metal become limpid, Ar is filled with into Ag/Ni aluminium alloys by boron nitride tube and stirs 10 points
Alloy, is then poured into water cooling mold and cools down by clock, obtains Ag/Ni intermediate alloys；B. manufacture among Ag/Ce, Ag/La and close
Gold：The Ag of mass fraction 95% is put into vacuum drying oven graphite crucible, the Ce of mass fraction 5% or La are put into vacuum drying oven Feeding box
In, the burner hearth of vacuum drying oven is vacuumized, vacuum is higher than 3.0 × 10-2After Pa, Ar to 0.5Mpa is filled with, is then vacuumized again
It is higher than 3.0 × 10 to vacuum-2After Pa, start to warm up, after temperature rises to 800 DEG C, stopping is vacuumized and filled into vacuum drying oven
Enter Ar to 0.5MPa；Then proceed to be warming up to 1250 DEG C, melted completely and after silvering solution becomes limpid after silver-colored, mobile Feeding box by Ce or
La is added in crucible, and is rocked crucible and stirred 10 minutes, then by alloy melt furnace cooling, obtains Ag/Ce, Ag/La conjunction
Golden intermediate alloy；C. Ag/Ni intermediate alloys, Ag/Ce intermediate alloys, Ag/La intermediate alloys, Ag are pressed in vacuum smelting furnace
State after ratio weighs and calculate, wherein nickel（Ni）For 5wt%；Cerium（Ce）For 0.5 wt%；Lanthanum（La）For 0.5 wt%, silver is surplus, and
Cerium in silver alloy（Ce）And lanthanum（La）Mass fraction it is identical, be mixed to join in vacuum smelting furnace, be evacuated to 5.0 × 10- 1More than Pa, starts to warm up, and after temperature rises to 800 DEG C, stopping vacuumizes and Ar is filled with into vacuum smelting furnace to 0.5MPa；
Then proceed to be warming up to 1450 DEG C, after alloy melts completely, Ar is filled with into silver alloy liquid and is stirred 10 minutes, by alloy melt
Cooling, obtains silver alloy blank；D. silver alloy blank is added in vacuum melting electromagnetic agitation alloy conticaster crucible, crucible
For boron nitride crucible, 5.0 × 10 are evacuated to-1More than Pa, starts to warm up to 1450 DEG C, treats that alloy melts completely, using nitridation
Boron stirring rod stirs 15 minutes, and then refining is stood after twenty minutes, is filled with high-purity Ar to 1.1MPa, starts to draw using intermittent mode
Cast 12mm silver alloy bars；（2）The drawing of silver alloy bar：The silver alloy bar of above-mentioned diameter 12mm is drawn into directly by wire drawing machine
Footpath is the silver alloy wire of 1.5mm, and drawing process is drawn using unidirectional；（3）The intermediate heat-treatment of silver alloy wire：By straight 1.5mm's
Silver alloy wire carries out intermediate heat-treatment in tube furnace, and heat treatment process uses N2Gas shield, heat treatment temperature are 750 DEG C,
Heat treatment time is 2 minutes；（4）Silver alloy wire Jing Guo intermediate heat-treatment is drawn into the silver of diameter 0.08mm through wire drawing machine
Alloy wire, then passes through wire drawing machine continuous drawing into a diameter of 0.05mm filaments by the silver alloy wire of a diameter of 0.08mm, then
It is final to obtain the fine silver alloy bonding lines of diameter 0.018mm by multiple tracks drawing on fine wire drawing machine, in drawing process, line
Material deformation rate is 7%, and die entrance angle is 14 °.
As can be seen from the above table, fine silver alloy wire and its manufacture method of being bonded of low radian LED encapsulation of the invention
Silver alloy wire can use in ultralow radian LED encapsulation, disclosure satisfy that the requirement of low radian LED encapsulation, and the silver alloy wire
And its manufacture method can draw the fine silver alloy wire rod of long length, disclosure satisfy that industrial production demand.
Claims (3)
- A kind of 1. manufacture method of the fine silver alloy bonding line of small chip LED encapsulation, it is characterised in that：Include the following steps：（1）The smelting of silver alloy bonding line blank and continuous casting：A. Ag/Ni intermediate alloys are manufactured：The Ni of the Ag of mass fraction 90% and mass fraction 10% layerings are put into the nitrogen of vacuum drying oven Change in boron crucible, and the boron nitride crucible lid of middle perforate is placed on crucible, the burner hearth of vacuum drying oven is vacuumized, vacuum is high In 3.0 × 10-2After Pa, start to warm up to 1450-1850 DEG C, wherein heating rate is 20-40 DEG C/min during less than 800 DEG C, temperature Heating rate be 30-50 DEG C/min when degree is higher than 800 DEG C, and vacuum is higher than 3.0 × 10 in fusion process-2Pa, then stands 10- 20 minutes, after Ag/Ni alloys melt completely and molten metal becomes limpid, Ar is filled with into Ag/Ni aluminium alloys by boron nitride tube Alloy, is then poured into water cooling mold and cools down, obtain Ag/Ni intermediate alloys by stirring 5-10 minutes；B. Ag/Ce and Ag/La intermediate alloys are manufactured：The Ag of mass fraction 90% is put into the graphite crucible of vacuum drying oven, by quality The Ce or La of fraction 10% are put into the Feeding box of vacuum drying oven, and the burner hearth of vacuum drying oven is vacuumized, and vacuum is higher than 3.0 × 10-2Pa Afterwards, Ar to 0.1-0.5MPa is filled with, is then evacuated to vacuum again higher than 3.0 × 10-2After Pa, start to warm up, treat temperature After rising to 400-600 DEG C, stopping vacuumizes and Ar is filled with into vacuum drying oven to 0.1-0.5MPa；Then proceed to be warming up to 1150- 1250 DEG C, after silver-colored melting completely and silvering solution become limpid, Ce or La are added in crucible by mobile Feeding box, and are rocked crucible and stirred Mix 5-10 minutes, then by alloy melt furnace cooling, obtain Ag/Ce or Ag/La excellent intermediate alloys；Using identical method Manufacture the another kind in Ag/Ce and Ag/La intermediate alloys；C. in vacuum smelting furnace by Ag/Ni intermediate alloys, Ag/Ce intermediate alloys, Ag/La intermediate alloys, Ag in following ratios Weigh after calculating, wherein nickel（Ni）For 3-5wt%；Cerium（Ce）For 0.5-1.0 wt%；Lanthanum（La）For 0.5-1.0 wt%, silver is remaining Amount, and wherein cerium（Ce）And lanthanum（La）Mass fraction it is identical, be mixed to join in vacuum smelting furnace, be evacuated to 5.0 × 10- 1More than Pa, starts to warm up, and after temperature rises to 600-800 DEG C, stopping vacuumizes and Ar is filled with into vacuum smelting furnace to 0.1- 0.5MPa；Then proceed to be warming up to 1250-1450 DEG C, after alloy melts completely, Ar stirrings 5-10 is filled with into silver alloy liquid Minute, alloy melt is cooled down, obtains silver alloy blank；D. silver alloy blank being added in the crucible of vacuum melting electromagnetic agitation alloy conticaster, crucible is boron nitride crucible, It is evacuated to 5.0 × 10-1More than Pa, starts to warm up to 1250-1450 DEG C, treats that alloy melts completely, using boron nitride stirring rod Stirring 10-15 minutes, after then refining stands 15-20 minutes, is filled with high-purity Ar to 1.05-1.1MPa, starts to use interval side Formula cast, forms the silver alloy bar of a diameter of 8-12mm；（2）The drawing of silver alloy wire：The silver alloy bar of above-mentioned a diameter of 8-12mm is drawn into the silver alloy wire of a diameter of 1.0-1.5mm by wire drawing machine, Drawing process is drawn using unidirectional；（3）The intermediate heat-treatment of silver alloy wire：The silver alloy wire of diameter 1.0-1.5mm is subjected to intermediate heat-treatment in tube furnace, heat treatment process uses inert gas Or N2Gas shield, heat treatment temperature are 550-750 DEG C, and heat treatment time is 2-5 minutes；（4）Silver alloy wire Jing Guo intermediate heat-treatment is drawn into the silver alloy wire of diameter 0.06-0.08mm through wire drawing machine, so Afterwards by the silver alloy wire of a diameter of 0.06-0.08mm by wire drawing machine continuous drawing into a diameter of 0.03-0.05mm filaments, It is final to obtain the fine silver alloy bonding lines of diameter 0.012-0.018mm, wire drawing again by multiple tracks drawing on fine wire drawing machine During, wire rod deformation rate is 5%-7%；Electromagnetic agitation mechanism is installed on the crystallizer of the conticaster；Silver-colored billon bar is led Draw using intermittent traction, hauling speed is 30-300mm/ minutes, pull-in time 1-5 second, idle hours 1-5 second；The silver closes In gold thread pulling process, the inlet angle of wire-drawing die is 11 ° -14 °.
- 2. the manufacture method of the fine silver alloy bonding line of small chip LED encapsulation according to claim 1, its feature exist In：The water cooling mold material of the cast Ag/Ni alloys is fine copper.
- 3. manufactured using the small chip LED encapsulation described in claim 1 or 2 with the manufacture method of fine silver alloy bonding line small The fine silver alloy bonding line of chip LED encapsulation, it is characterised in that：Each Ingredients Weight percentage of the silver alloy bonding wire material Content is：Ni 3-5wt%, Ce 0.5-1.0wt%, La 0.5-1.0wt%, Ag surpluses, and Ce with La mass fractions are identical.
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| CN104353696A (en) * | 2014-10-10 | 2015-02-18 | 河南优克电子材料有限公司 | Manufacturing method for fine copper-silver alloy wires |
| CN104388861A (en) * | 2014-10-10 | 2015-03-04 | 河南理工大学 | Manufacturing method of fine silver-gold alloy bonding line for polycrystalline serial LED |
| CN105393343A (en) * | 2014-01-31 | 2016-03-09 | 大自达电线株式会社 | Wire bonding and method for producing same |
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| CN105393343A (en) * | 2014-01-31 | 2016-03-09 | 大自达电线株式会社 | Wire bonding and method for producing same |
| CN104353696A (en) * | 2014-10-10 | 2015-02-18 | 河南优克电子材料有限公司 | Manufacturing method for fine copper-silver alloy wires |
| CN104388861A (en) * | 2014-10-10 | 2015-03-04 | 河南理工大学 | Manufacturing method of fine silver-gold alloy bonding line for polycrystalline serial LED |
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