CN106392371A - Medium-temperature alloy solder thin strap and preparation method - Google Patents
Medium-temperature alloy solder thin strap and preparation method Download PDFInfo
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- CN106392371A CN106392371A CN201610837387.5A CN201610837387A CN106392371A CN 106392371 A CN106392371 A CN 106392371A CN 201610837387 A CN201610837387 A CN 201610837387A CN 106392371 A CN106392371 A CN 106392371A
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- Prior art keywords
- temperature alloy
- alloy solder
- middle temperature
- solder strip
- preparation
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crucibles And Fluidized-Bed Furnaces (AREA)
Abstract
The invention discloses a medium-temperature alloy solder thin strap. The medium-temperature alloy solder thin strap is characterized in that the melting range is 400 to 600 DEG C, and the medium-temperature alloy solder thin strap has good weldability and is compatible with most welding devices and welding technologies. The medium-temperature alloy solder thin strap comprises the following components by weight percent: 68 to 87% of Au, 8 to 21% of Ag, 2.2 to 4.5% of Si, 0.1 to 1.0% of Cu, 0.1 to 0.9% of Ni and 0.3 to 0.8% of Sn. The invention further provides a preparation method of the medium-temperature alloy solder thin strap. According to the preparation method, a quick solidification technology is adopted, and the medium-temperature alloy solder thin strap processed through the preparation method is smaller than 1mm in thickness and has good welding performance.
Description
Technical field
The present invention relates to the technical field of electron device package and alloy composite materials soldering is and in particular to a kind of middle temperature is closed
Gold brazing filler metal strip and preparation method.
Background technology
Many space flight electronic device all adopts the relatively low material of density, the aluminium base heat sink material of such as plated surface Ni.This
A little electronic devices require welding encapsulation, unaffected when being welded about the performance of material in order to ensure electronic device,
Welding temperature is required to have to be lower than the fusing point of aluminium base heat sink material.But the housing of these electronic devices is adopted with the welding of chip more
The eutectic solders such as Au-Si, the Au-Ge being 400 DEG C about with welding temperature, and must to the welded encapsulation of aluminium base heat sink material
660 DEG C must be less than higher than 400 DEG C, principle is welded according to gradient, the fusion temperature of solder needs to control in the range of 400 ~ 600 DEG C
Can effectively be welded.
At present, the middle temperature brazing solder in the range of 400 ~ 600 DEG C for fusion temperature both at home and abroad, also fewer disclosure and
Introduce.
In preparing at present, the common method of temperature alloy solder has lamination composite algorithm, electroplating deposition method and casting rolling method, by
Typically contain brittlement phase in middle temperature alloy solder tissue, this leads to solder alloy to have larger fragility on the whole, according to
Above-mentioned conventional method easily produces the problem of fracture to this middle temperature alloy solder when processing.
Content of the invention
For the deficiencies in the prior art, it is an object of the invention to, provide a kind of middle temperature alloy solder strip, it melts model
Enclose for 400 ~ 600 DEG C, there is good solderability, can be compatible with most welding equipment and welding procedure.In addition, the present invention
Additionally provide the preparation method of this middle temperature alloy solder strip, the middle temperature alloy solder strip that this preparation method processes
Thickness be less than 1mm, there is good welding performance.
The present invention is realized by the following technical programs：
A kind of middle temperature alloy solder strip, its component is by weight percentage：Au 68 ~ 87%, Ag 8 ~ 21%, Si 2.2 ~ 4.5%,
Cu 0.1 ~ 1.0%, Ni 0.1 ~ 0.9%, Sn 0.3 ~ 0.8%.
As a kind of scheme of optimization of the present invention, a kind of middle temperature alloy solder strip, its component is by weight percentage：
Au 76.53%、Ag 19.05%、Si 3.10%、Cu 0.50%、Ni 0.25%、Sn 0.57%.
As a kind of scheme of optimization of the present invention, the melting range of described middle temperature alloy solder strip is 400 ~ 600
℃.
As a kind of scheme of optimization of the present invention, the thickness of described middle temperature alloy solder strip is less than 1mm.
The invention also discloses the preparation method of this middle temperature alloy solder strip, specifically include following steps：
（1）Take above-mentioned component by weight percentage, the Au that the raw material of alloy compositions is 99.99% using purity, purity is
99.99% Ag, monocrystalline silicon and pure nickel, are 10 in vacuum-3Melting in the Medium frequency induction vacuum drying oven of pa, component fusing is laggard
Row is sufficiently stirred for, and is poured into copper mold cooling, obtains ingot casting；The carrier of Medium frequency induction vacuum drying oven melting is graphite crucible.
（2）Ingot casting is put in single roller quick solidification apparatus, carries out secondary smelting under the protection of inert gas, through too fast
Fast solidifying process prepares middle temperature alloy solder strip.
Single roller quick solidification apparatus described in step 1 include argon bottle, pressure gauge, accurate barostat, temperature control box, change
Frequency device, motor, copper roller, nozzle, crucible, heater, nozzle switch, stainless steel shaft.
As the optimization further of the preparation method of the middle temperature alloy solder strip of the present invention, described rapid solidification work
Skill, its specific technological parameter is：
Degree of superheat 70k,
Roll surface speed 18 ~ 20m/s,
Injection pressure 0.05Mpa,
90 ° of spray angle,
Nozzle to roll surface spacing 6mm,
Jet size 0.3mm × 20mm；
Described inert gas is argon gas.
Researcher exists respectively in analysis two binary system phase diagrams of Au-Si and Ag-Si, two binary systems of Au-Si and Ag-Si
363 DEG C and 840 DEG C there are binary eutectics reaction L → α (Au)+β (Si) and L → α (Ag)+β (Si), and Au-Ag binary system is by shape
Become infinitely dissolve body L → α (AuAg).Then, Au-Ag-Si tri- is will to form the single argument line of a generation eutectic reaction.Also
To say, with the change of alloying component, its eutectic reaction temperature continuously can be changed between 363 ~ 840 DEG C it is established that
Carry out the middle temperature solder system of Au-Ag-Si.In addition, researcher finds under study for action, add in this middle temperature alloy solder strip
Plus micro Ni can significantly improve the cross flow of welding filler metal and the intensity of welding point.
Based on above-mentioned technical scheme, the technique effect that the present invention has is：
（1）The middle temperature alloy solder strip that the present invention provides, its fusion range is 400 ~ 600 DEG C, has excellent non-oxidizability
With solderable, brazing filler metal, gradient welding can be carried out, can be compatible with full with existing welding equipment and welding procedure
The application requirement of the middle temperature welded encapsulation of foot.
（2）The preparation method of the middle temperature alloy solder strip that the present invention provides, using fast solidification technology, can prepare thickness
The solder strip less than 1mm for the degree, strip microstructure uniformly continuous and processing characteristics are good, and strip also has good stream
Dynamic property and wetability, weld strength is high.
Brief description
Fig. 1 is the structural representation of single roller quick solidification apparatus of preparation method of the present invention.
Specific embodiment
Understand, the invention will be further described with reference to specific embodiment for the ease of those skilled in the art,
The content that embodiment refers to not delimit the scope of the invention.
As shown in figure 1, the present invention illustrates to the single roller quick solidification apparatus 100 in preparation method, it includes following
Assembly：Argon bottle 1, pressure gauge 2, accurate barostat 3, temperature control box 4, frequency converter 5, motor 6, copper roller 7, nozzle 8, crucible
9th, heater 10, nozzle switch 11 and stainless steel shaft 12.
Embodiment 1
Au 76.53%, Ag 19.05%, Si 3.10%, Cu 0.50%, Ni 0.25% and Sn 0.57% are placed in vacuum for 10-3Carry out melting, the carrier of Medium frequency induction vacuum drying oven melting is graphite crucible, after component fusing in the Medium frequency induction vacuum drying oven of pa
It is sufficiently stirred for, and is poured into copper mold being cooled down, obtain ingot casting；Ingot casting is put in single roller quick solidification apparatus, in indifferent gas
Carry out secondary smelting under the protection of body, prepare middle temperature alloy solder strip through fast solidification technology.
The middle temperature alloy solder strip that the present invention prepares, its thickness is 0.79mm, and fusion range is 452 ~ 478 DEG C,
Meet the requirement that middle temperature welded encapsulation temperature range is 400 ~ 600 DEG C, there is excellent non-oxidizability and solderable, brazing filler metal,
Good cross flow and wetability are had on nickel coating and fine copper, welding point has enough intensity.
Embodiment 2
Au 77.45%, Ag 18.26%, Si 3.13%, Cu 0.48%, Ni 0.23% and Sn 0.55% are placed in vacuum for 10-3Carry out melting, the carrier of Medium frequency induction vacuum drying oven melting is graphite crucible, after component fusing in the Medium frequency induction vacuum drying oven of pa
It is sufficiently stirred for, and is poured into copper mold being cooled down, obtain ingot casting；Ingot casting is put in single roller quick solidification apparatus, in indifferent gas
Carry out secondary smelting under the protection of body, prepare middle temperature alloy solder strip through fast solidification technology.
The middle temperature alloy solder strip that the present invention prepares, its thickness is 0.84mm, and fusion range is 455 ~ 476 DEG C,
Meet the requirement that middle temperature welded encapsulation temperature range is 400 ~ 600 DEG C, there is excellent non-oxidizability and solderable, brazing filler metal,
Good cross flow and wetability are had on nickel coating and fine copper, welding point has enough intensity.
Embodiment 3
By Au 78.21%, Ag 17.43%, Si 3.15 %, Cu 0.47 %, Ni 0.22% and Sn 0.52% be placed in vacuum and be
10-3Carry out melting, the carrier of Medium frequency induction vacuum drying oven melting is graphite crucible, and component melts in the Medium frequency induction vacuum drying oven of pa
After be sufficiently stirred for, and be poured into copper mold and cooled down, obtain ingot casting；Ingot casting is put in single roller quick solidification apparatus, in inertia
Carry out secondary smelting under the protection of gas, prepare middle temperature alloy solder strip through fast solidification technology.
The middle temperature alloy solder strip that the present invention prepares, its thickness is 0.89mm, and fusion range is 458 ~ 498 DEG C,
Meet the requirement that middle temperature welded encapsulation temperature range is 400 ~ 600 DEG C, there is excellent non-oxidizability and solderable, brazing filler metal,
Good cross flow and wetability are had on nickel coating and fine copper, welding point has enough intensity.
Embodiment 4
Au 79.14%, Ag 16.53%, Si 3.18%, Cu 0.45%, Ni 0.20% and Sn 0.50% are placed in vacuum for 10-3Carry out melting, the carrier of Medium frequency induction vacuum drying oven melting is graphite crucible, after component fusing in the Medium frequency induction vacuum drying oven of pa
It is sufficiently stirred for, and is poured into copper mold being cooled down, obtain ingot casting；Ingot casting is put in single roller quick solidification apparatus, in indifferent gas
Carry out secondary smelting under the protection of body, prepare middle temperature alloy solder strip through fast solidification technology.
The middle temperature alloy solder strip that the present invention prepares, its thickness is 0.86mm, and fusion range is 453 ~ 488 DEG C,
Meet the requirement that middle temperature welded encapsulation temperature range is 400 ~ 600 DEG C, there is excellent non-oxidizability and solderable, brazing filler metal,
Good cross flow and wetability are had on nickel coating and fine copper, welding point has enough intensity.
The foregoing is only presently preferred embodiments of the present invention it is impossible to be considered the practical range for limiting the present invention.All
The impartial change made according to the present patent application scope and improvement etc., all should still belong within protection scope of the present invention.
Claims (6)
1. a kind of middle temperature alloy solder strip it is characterised in that its component by weight percentage：Au 68 ~ 87%, Ag 8 ~
21%, Si 2.2 ~ 4.5%, Cu 0.1 ~ 1.0%, Ni 0.1 ~ 0.9%, Sn 0.3 ~ 0.8%.
2. middle temperature alloy solder strip according to claim 1 it is characterised in that its component by weight percentage：Au
76.53%、Ag 19.05%、Si 3.10%、Cu 0.50%、Ni 0.25%、Sn 0.57%.
3. middle temperature alloy solder strip according to claim 1 and 2 is it is characterised in that described middle temperature alloy solder is thin
The melting range of band is 400 ~ 600 DEG C.
4. middle temperature alloy solder strip according to claim 1 and 2 is it is characterised in that described middle temperature alloy solder is thin
The thickness of band is less than 1mm.
5. a kind of preparation method of middle as claimed in claim 1 temperature alloy solder strip is it is characterised in that specifically include following
Step：
（1）Take the component by weight percentage described in claim 1, be in vacuum 10-3Pa Medium frequency induction vacuum drying oven
Middle melting, is sufficiently stirred for after component fusing, is poured into copper mold cooling, obtains ingot casting；
（2）Ingot casting is put in single roller quick solidification apparatus, carries out secondary smelting under the protection of inert gas, through fast rapid hardening
Gu technique prepares middle temperature alloy solder strip；
The carrier of described Medium frequency induction vacuum drying oven melting is graphite crucible.
6. the preparation method of middle temperature alloy solder strip according to claim 5 is it is characterised in that described rapid solidification
Technique, its specific technological parameter is：
Degree of superheat 70k,
Roll surface speed 18 ~ 20m/s,
Injection pressure 0.05Mpa,
90 ° of spray angle,
Nozzle to roll surface spacing 6mm,
Jet size 0.3mm × 20mm；
Described inert gas is argon gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610837387.5A CN106392371A (en) | 2016-09-21 | 2016-09-21 | Medium-temperature alloy solder thin strap and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610837387.5A CN106392371A (en) | 2016-09-21 | 2016-09-21 | Medium-temperature alloy solder thin strap and preparation method |
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| Publication Number | Publication Date |
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| CN106392371A true CN106392371A (en) | 2017-02-15 |
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ID=57997071
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610837387.5A Pending CN106392371A (en) | 2016-09-21 | 2016-09-21 | Medium-temperature alloy solder thin strap and preparation method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234371A (en) * | 2017-06-07 | 2017-10-10 | 贵研铂业股份有限公司 | A kind of preparation method for the AuSn20 solders for improving brazing property |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN114526642A (en) * | 2022-01-21 | 2022-05-24 | 中国电子科技集团公司第四十三研究所 | Method for manufacturing simple impact sheet assembly |
| CN114769934A (en) * | 2022-05-20 | 2022-07-22 | 哈尔滨理工大学 | High-retention-rate multi-size particle reinforced low-temperature composite brazing filler metal and preparation method thereof |
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| CN101176956A (en) * | 2007-12-07 | 2008-05-14 | 中南大学 | Intermediate temperature sealing-in solder |
| CN102489896A (en) * | 2011-12-18 | 2012-06-13 | 湖南科技大学 | Medium-temperature brazing ribbon for brazing metal-based composite packaging material, as well as preparation method and brazing method thereof |
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|---|---|---|---|---|
| CN101176956A (en) * | 2007-12-07 | 2008-05-14 | 中南大学 | Intermediate temperature sealing-in solder |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234371A (en) * | 2017-06-07 | 2017-10-10 | 贵研铂业股份有限公司 | A kind of preparation method for the AuSn20 solders for improving brazing property |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN114526642A (en) * | 2022-01-21 | 2022-05-24 | 中国电子科技集团公司第四十三研究所 | Method for manufacturing simple impact sheet assembly |
| CN114769934A (en) * | 2022-05-20 | 2022-07-22 | 哈尔滨理工大学 | High-retention-rate multi-size particle reinforced low-temperature composite brazing filler metal and preparation method thereof |
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Application publication date: 20170215 |
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