CN105304528A - BGA repair reballing tool - Google Patents
BGA repair reballing tool Download PDFInfo
- Publication number
- CN105304528A CN105304528A CN201510612970.1A CN201510612970A CN105304528A CN 105304528 A CN105304528 A CN 105304528A CN 201510612970 A CN201510612970 A CN 201510612970A CN 105304528 A CN105304528 A CN 105304528A
- Authority
- CN
- China
- Prior art keywords
- slide block
- pedestal
- bga
- tool
- screw mandrel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a BGA repair reballing tool comprising a pedestal, a lead screw, a first slide block, a second slide block and rotating handles. The top part of the pedestal is provided with a slide slot. The lead screw is arranged in the slide slot, and the two ends of the lead screw extend to the outside of the pedestal and then are respectively connected with different rotating handles. The lead screw is provided with the first slide block and the second slide block. The first slide block and the second slide block are provided with mutually corresponding positioning slots. The BGA repair reballing tool is easy and rapid in operation so that repair reballing efficiency can be enhanced.
Description
Technical field
The present invention relates to circuit board SMT technical field, be specifically related to a kind of BGA and reprocess and plant ball tool.
Background technology
The full name of BGA is BallGridArray (PCB of ball grid array structure), and it is a kind of package method that integrated circuit adopts organic support plate.If bga chip is bad directly scrap process, such cost of idleness, and not environmentally.General producer all can carry out BGA and reprocess, and conventional BGA reprocesses step and comprises: 1, dismantle BGA; 2, dehumidify; 3, Printing Paste; 4, pad is cleaned; 5, dehumidify; 6, Printing Paste; 7, BGA is mounted; 8, reflow welding connects; 9 inspections.Wherein, plant ball processing step to comprise: the residue solder 1, in place to go BGA bottom land also cleans; 2, print fluxing in BGA bottom land; 3, soldered ball is selected; 4, ball is planted; 5, reflow welding connects; 6, weld.Generally plant ball to need by tool.
Summary of the invention
In sum, technical problem to be solved by this invention is to provide a kind of BGA and reprocesses and plant ball tool.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of BGA reprocesses and plants ball tool, comprise pedestal, screw mandrel, the first slide block, the second slide block and swing handle, described pedestal top is provided with sliding tray, described screw mandrel is in described chute, and the two ends of described screw mandrel connect different described swing handles respectively after extending to the outside of described pedestal, described screw mandrel is provided with described first slide block and the second slide block, described first slide block and described second slide block are provided with mutually corresponding location notch.
Further, the screw regulating described base height is provided with in the stage of described pedestal.
Further, described swing handle is olive-shaped, and is provided with the lines increasing frictional force at the outer surface of described swing handle.
The invention has the beneficial effects as follows: a kind of BGA provided by the invention reprocesses and plants ball tool, simple and quick, can improve the efficiency of reprocessing and planting ball.
Accompanying drawing explanation
Fig. 1 is master's view of invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the cutaway view of slide block.
In accompanying drawing, the list of parts representated by each label is as follows:
1, pedestal, 2, screw mandrel, the 3, first slide block, the 4, second slide block, 5, swing handle, 6, sliding tray, 7, location notch, 8, screw.
Embodiment
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As illustrated in fig. 1 and 2, a kind of BGA reprocesses and plants ball tool, comprise pedestal 1, screw mandrel 2, first slide block 3, second slide block 4 and swing handle 5, described pedestal 1 top is provided with sliding tray 6, described screw mandrel 2 is in described chute, and the two ends of described screw mandrel 2 connect different described swing handles 5 after extending to the outside of described pedestal 1 respectively, described swing handle 5 is olive-shaped, and is provided with the lines increasing frictional force at the outer surface of described swing handle 5.Described screw mandrel 2 is provided with described first slide block 3 and the second slide block 4, described first slide block 3 and described second slide block 4 are provided with mutually corresponding location notch 7.Rotary motion handle 5 by screw mandrel 2 drive the first slide block 3 and the second slide block 4 synchronizing moving (simultaneously outer move or in move) so that being positioned in location notch 7 of different size IC.Pedestal 1 has Height Adjustment follow closely 8, the locating surface that can adjust support first slide block 3 and the second slide block 4 according to the IC of different-thickness and the distance of planting between ball steel mesh, plant ball with the IC being applicable to different-thickness.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a BGA reprocesses and plants ball tool, it is characterized in that, comprise pedestal (1), screw mandrel (2), first slide block (3), second slide block (4) and swing handle (5), described pedestal (1) top is provided with sliding tray (6), described screw mandrel (2) is in described chute, and connect different described swing handles (5) after the two ends of described screw mandrel (2) extend to the outside of described pedestal (1) respectively, described screw mandrel (2) is provided with described first slide block (3) and the second slide block (4), described first slide block (3) and described second slide block (4) are provided with mutually corresponding location notch (7).
2. a kind of BGA according to claim 1 reprocesses and plants ball tool, it is characterized in that, is provided with the screw (8) regulating described pedestal (1) height in the bottom of described pedestal (1).
3. a kind of BGA according to claim 1 and 2 reprocesses and plants ball tool, it is characterized in that, described swing handle (5) for olive-shaped, and is provided with the lines increasing frictional force at the outer surface of described swing handle (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510612970.1A CN105304528A (en) | 2015-09-23 | 2015-09-23 | BGA repair reballing tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510612970.1A CN105304528A (en) | 2015-09-23 | 2015-09-23 | BGA repair reballing tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105304528A true CN105304528A (en) | 2016-02-03 |
Family
ID=55201608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510612970.1A Pending CN105304528A (en) | 2015-09-23 | 2015-09-23 | BGA repair reballing tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105304528A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101097874A (en) * | 2007-06-21 | 2008-01-02 | 华为技术有限公司 | Ball planting device and method for ball grid array packaging chip |
| JP2009238908A (en) * | 2008-03-26 | 2009-10-15 | Fujitsu Ltd | Method of repairing semiconductor device, semiconductor device, and substrate for semiconductor device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| CN103137518A (en) * | 2011-11-25 | 2013-06-05 | 陕西子竹电子有限公司 | Adjustable BGA (ball grid array) reballing device |
-
2015
- 2015-09-23 CN CN201510612970.1A patent/CN105304528A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101097874A (en) * | 2007-06-21 | 2008-01-02 | 华为技术有限公司 | Ball planting device and method for ball grid array packaging chip |
| JP2009238908A (en) * | 2008-03-26 | 2009-10-15 | Fujitsu Ltd | Method of repairing semiconductor device, semiconductor device, and substrate for semiconductor device |
| CN103137518A (en) * | 2011-11-25 | 2013-06-05 | 陕西子竹电子有限公司 | Adjustable BGA (ball grid array) reballing device |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160203 |