CN105300872A - Temperature-controllable floating buffering test seat - Google Patents
Temperature-controllable floating buffering test seat Download PDFInfo
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- CN105300872A CN105300872A CN201410330727.6A CN201410330727A CN105300872A CN 105300872 A CN105300872 A CN 105300872A CN 201410330727 A CN201410330727 A CN 201410330727A CN 105300872 A CN105300872 A CN 105300872A
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- China
- Prior art keywords
- temperature control
- coupling surface
- groove
- test bench
- float plate
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Abstract
The invention discloses a temperature-controllable floating buffering test seat which mainly comprises a temperature controlling table, a temperature controlling source and a floating board, wherein each side wall of a groove in the upper surface of the temperature controlling table comprises a first coupling surface; the temperature controlling source is used for heating or cooling the temperature controlling table; the floating board is accommodated in the groove in the temperature controlling table; each side wall of the floating board comprises a second coupling surface; the second coupling surface and the first coupling surface of the groove in the temperature controlling table are coupled with each other, can slide relatively, and are both continuous wavy surfaces; the temperature controlling table is used for heating or cooling the floating board via the first and second coupling surfaces. Therefore, the buffering efficacy of impact absorption is realized due to arrangement of the floating board; through arrangement of the continuous wavy surfaces, the conduction area can be enlarged obviously to greatly improve the conduction efficiency.
Description
Technical field
The present invention about a kind of can the floating buffer test bench of temperature control, espespecially a kind of semiconductor wafer testing seat being applicable to provide high/low temperature to test.
Background technology
Along with the requirement of the weatherability to semiconductor wafer, increasing semiconductor die producer requires that the wafer that dispatches from the factory need through high temperature or low-temperature test, in order to guarantee that wafer can normal operation under the environment of specific high temperature or specific low temperature.
But, the principle that the high temperature of general common semiconductor wafer or low-temperature test use is nothing more than heating up to semiconductor wafer to be measured or lowering the temperature, its common detection mode comprises: pre-burning (Burn-in) is tested, proving installation is placed in a test chamber together with semiconductor wafer to be measured and tests by it, and directly provide high temperature or low temperature environment in test chamber, as Taiwan I384237 patent; In addition, prior art has the mode heating up with crimp head to wafer to be measured or lower the temperature, that is for compressing the crimp head of fixed wafer above wafer to be measured, itself just has the temperature control module heating up or lower the temperature, as No. CN1537217Ath, Chinese publication number; In addition, prior art also to have in test bench and directly to heat up to wafer to be measured with temperature controlled fluid (high-temperature gas) or lower the temperature, as Japanese Unexamined Patent Publication 5-121598.
Moreover also common in prior art have the test bench directly possessing changing device, that is directly wafer to be measured heated up with test bench or lower the temperature and test, as Republic of China I364085 patent.But, the common technique of the test bench of changing device is possessed as aforementioned, itself does not have buffer effect, that is do not have the effect absorbing the impulsive force that wafer picks and places and compression joint mechanism presses down, therefore often there is fetching device in fetching process or compression joint mechanism in compress in process because of off normal or exert a force bad, cause the situation of careless compression failure wafer to be measured.
It can thus be appreciated that possessing function of temperature control and absorb and impact the pooling feature of power, and the more important thing is proving installation or the test bench of the conductive performance that can provide excellent, is industrial community active demand in fact simultaneously.
Summary of the invention
Fundamental purpose of the present invention be provide a kind of can the floating buffer test bench of temperature control, excellent temperature controlled conductive performance can be provided, and the buffer effect absorbing and impact power can be possessed again.
For reaching above-mentioned purpose, the present invention is a kind of can the floating buffer test bench of temperature control, mainly comprises a temperature control platform, a source temperature control and a float plate.Wherein, temperature control platform upper surface offers a groove, and the Fourth Ring of groove week sidewall comprises at least one first coupling surface; Source temperature control heats up or cooling to temperature control platform; Float plate is located in the groove of temperature control platform, and the Fourth Ring of float plate week sidewall comprises at least one second coupling surface, and at least one first coupling surface that at least one second coupling surface of float plate is coupled in the groove of temperature control platform also can Relative sliding.Wherein, at least one first coupling surface and at least one second coupling surface are respectively the continuous wavy surface that can intercouple, and temperature control platform to be heated up to float plate by least one first coupling surface and at least one second coupling surface or lowers the temperature.
Accordingly, the present invention is arranged in the groove of temperature control platform upper surface by by float plate, and the two and utilize can mutually slide, the first coupling surface of being coupled and the second coupling surface form the buffer effect absorbing and press down impulsive force; And, by the setting of continuous wavy surface, significantly can increase the conduction surface of the two contact, and then significantly promote the efficiency of temperature control conduction.
Preferably, first coupling surface of the present invention and the second coupling surface can be respectively can intercouple square-wave-shaped surface, string running surface or the hackly surface that intercouples with acute angle, or the polygonal continuous wavy surface of other geometry that can intercouple all can.Moreover each sidewall of the groove of temperature control platform of the present invention can comprise one first coupling surface, each sidewall of float plate can comprise one second coupling surface.In other words, all sidewalls in Fourth Ring of the groove of temperature control platform of the present invention and the Fourth Ring week sidewall of float plate all can arrange the first coupling surface and the second coupling surface, significantly increase conduction surface by this.
In addition, the present invention can more comprise at least one flexible member, and it can be arranged in the groove of temperature control platform, and one end of at least one flexible member is against the bottom surface of groove, and the other end of at least one flexible member is against the lower surface of float plate.Accordingly, the present invention's buffering that can float plate be provided better by flexible member and reset effect.Wherein, flexible member of the present invention can be spring, rubber or other equivalence elements.In addition, source temperature control of the present invention can be electroluminescent thermal module, electroluminescent cold module or other any device or equipment providing high temperature or low temperature.
Again and, the upper surface of float plate of the present invention can a recessed wafer slot, with plugging for testing wafer, and the carrying out of test.Again, the present invention can more comprise a upper cover plate, and it can be covered in above the groove of temperature control platform, and upper cover plate can offer a through slot, and the wafer slot of float plate is exposed by the through slot of upper cover plate.Accordingly, the present invention can utilize upper cover plate to limit the sliding scale of float plate; Meanwhile, contact float plate by upper cover plate, and upper cover plate can provide other temperature control pathway, therefore the material that upper cover plate also can adopt heat-conduction coefficient good.
Accompanying drawing explanation
Fig. 1 is the exploded view of first embodiment of the invention.
Fig. 2 be first embodiment of the invention analyse and observe decomposing schematic representation.
Fig. 3 be first embodiment of the invention analyse and observe combination schematic diagram.
Fig. 4 is the schematic diagram of the present invention first coupling surface and the second coupling surface second embodiment.
Fig. 5 is the schematic diagram of the present invention first coupling surface and the second coupling surface the 3rd embodiment.
Wherein:
2 temperature control platforms
20 upper surfaces
21 grooves
211 bottom surfaces
210 sidewalls
22 first coupling surfaces
3 float plate
31 sidewalls
32 second coupling surfaces
33 lower surfaces
34 upper surfaces
35 wafer slots
4 source temperature controls
41 electroluminescent thermal module
42 electroluminescent cold modules
5 flexible members
6 upper cover plates
61 through slots
Embodiment
The present invention can before the floating buffer test bench of temperature control be described in detail in the present embodiment, it is important to note that in the following description, similar element represents with identical component symbol.
Please refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is that the present invention can the exploded view of floating buffer test bench first embodiment of temperature control, Fig. 2 be the present invention can temperature control floating buffer test bench first embodiment analyse and observe decomposing schematic representation, Fig. 3 be the present invention can temperature control floating buffer test bench first embodiment analyse and observe combination schematic diagram.
As shown in FIG., the present embodiment the floating buffer test bench of temperature control can mainly comprise temperature control platform 2, float plate 3, source temperature control 4, four flexible members 5 and a upper cover plate 6.Wherein, the upper surface 20 of temperature control platform 2 offers a groove 21, and the Fourth Ring of groove 21 week sidewall 210 is all provided with the first coupling surface 22, and the first coupling surface 22 is continuous wavy surface, and what adopt in the present embodiment is square-wave-shaped surface.
In addition, float plate 3 is located in the groove 21 of temperature control platform 2, and the Fourth Ring of float plate 3 week sidewall 31 is all provided with the second coupling surface 32, and the first coupling surface 22 that the second coupling surface 32 of float plate 3 is the grooves 21 being coupled in temperature control platform 2 also can Relative sliding.But the second coupling surface 32 is continuous wavy surface, the present embodiment is the square-wave-shaped surface adopted equally.In addition, the recessed wafer slot 35 of upper surface 34 of float plate 3, it plugs for testing wafer, and tests.
Moreover as shown in Figure 2 have source temperature control 4, it is mainly responsible for heating up to temperature control platform 2 or lowering the temperature, and the present embodiment adopts electroluminescent thermal module 41 and an electroluminescent cold module 42, therefore effect that the present embodiment can possess intensification simultaneously and lower the temperature.Accordingly, the present embodiment is heated up by source temperature control 4 pairs of temperature control platforms 2 or is lowered the temperature, and temperature control platform 2 is conducted by the contact between the first coupling surface 22 and the second coupling surface 32 and heats up to float plate 3 or lower the temperature.Wherein, by first coupling surface 22 on continuous square-wave-shaped surface and the setting of the second coupling surface 32, significantly can increase the conduction surface of the two contact, and then significantly promote the efficiency of temperature control conduction.
In addition, as shown in FIG., four flexible members 5 are separately positioned in the groove 21 of temperature control platform 2.Wherein, one end of each flexible member 5 is against the bottom surface 211 of groove 21, and the other end is against the lower surface 33 of float plate 3.Accordingly, the buffering that float plate 3 can be provided better by flexible member 5 and reset effect.But the flexible member 5 that the present embodiment adopts is spring, but flexible member of the present invention 5 is not limited to spring, and other such as rubber or other equivalence elements are all applicable.
Again, upper cover plate 6 as illustrated in the drawing, it is covered in above the groove 21 of temperature control platform 2, and upper cover plate 6 offers a through slot 61, and the wafer slot 35 of float plate 3 is exposed by the through slot 61 of upper cover plate 6.Accordingly, the present embodiment can utilize upper cover plate 6 to limit the lifting carriage scope of float plate 3; Meanwhile, contact the upper surface of float plate 3 by upper cover plate 6, and upper cover plate 6 also can provide other temperature control pathway simultaneously, increase conduction efficiency, therefore the material that upper cover plate 6 also can adopt heat-conduction coefficient good.
Please refer to the schematic diagram that Fig. 4 and Fig. 5, Fig. 4 are the present invention first coupling surface 22 and the second coupling surface 32 second embodiment, Fig. 5 is the schematic diagram of the present invention first coupling surface 22 and the second coupling surface 32 the 3rd embodiment.Second embodiment and the 3rd embodiment and above-mentioned first embodiment Main Differences are that the shape that the first coupling surface 22 and the second coupling surface 32 adopt is different.Wherein, the second embodiment as shown in Figure 4, its first coupling surface 22 and the second coupling surface 32 are respectively the string running surface that can intercouple; The second embodiment as shown in Figure 4, its first coupling surface 22 and the second coupling surface 32 are respectively the hackly surface intercoupled with acute angle.Certainly, the present invention first coupling surface 22 and the second coupling surface 32 are not limited with above-mentioned three embodiments, and the polygonal continuous wavy surface of other geometry that can intercouple also can.
Above-described embodiment is citing for convenience of description only, and the interest field that the present invention advocates from should being as the criterion with described in claims, but not is only limitted to above-described embodiment.
Claims (10)
1. can the floating buffer test bench of temperature control, it is characterized in that, comprising:
One temperature control platform, its upper surface offers a groove, and the Fourth Ring week sidewall of this groove comprises at least one first coupling surface;
One source temperature control, it heats up or cooling to this temperature control platform; And
One float plate, it is located in this groove of this temperature control platform, the Fourth Ring week sidewall of this float plate comprises at least one second coupling surface, this at least one second coupling surface system of this float plate be coupled in this groove of this temperature control platform this at least one first coupling surface and can Relative sliding;
Wherein, this at least one first coupling surface and this at least one second coupling surface are respectively the continuous wavy surface that can intercouple, and this temperature control platform is heated up to this float plate by this at least one first coupling surface and this at least one second coupling surface or lowered the temperature.
2. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, this at least one first coupling surface and this at least one second coupling surface are respectively the square-wave-shaped surface that can intercouple.
3. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, this at least one first coupling surface and this at least one second coupling surface are respectively the string running surface that can intercouple.
4. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, this at least one first coupling surface and this at least one second coupling surface are respectively the hackly surface that can intercouple with acute angle.
5. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: it more comprises at least one flexible member, it is arranged in this groove of this temperature control platform, one end of this at least one flexible member against the bottom surface of this groove, this at least one flexible member the other end against the lower surface of this float plate.
6. according to claim 5 can the floating buffer test bench of temperature control, it is characterized in that: wherein, this at least one flexible member is a spring.
7. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, the recessed wafer slot of upper surface of this float plate.
8. according to claim 7 can the floating buffer test bench of temperature control, it is characterized in that: it more comprises a upper cover plate, it is covered in above this groove of this temperature control platform, and this upper cover plate offers a through slot, and this wafer slot of this float plate is exposed by this through slot of this upper cover plate.
9. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, this source temperature control to be selected from following group at least one: an electroluminescent thermal module and an electroluminescent cold module.
10. according to claim 1 can the floating buffer test bench of temperature control, it is characterized in that: wherein, each sidewall of this groove of this temperature control platform comprises this first coupling surface, and each sidewall of this float plate comprises this second coupling surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330727.6A CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330727.6A CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
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| Publication Number | Publication Date |
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| CN105300872A true CN105300872A (en) | 2016-02-03 |
| CN105300872B CN105300872B (en) | 2018-04-06 |
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| CN201410330727.6A Active CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479105A (en) * | 2003-07-18 | 2004-03-03 | 威盛电子股份有限公司 | Lockable pressure controlled frame of electron element testing socket |
| JP2005069938A (en) * | 2003-08-26 | 2005-03-17 | Risou Keisoku Kk | Testing arrangement of electronic component |
| CN201007722Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with flexible buffering heat conduction foundation |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN202904406U (en) * | 2012-10-18 | 2013-04-24 | 宜硕科技(上海)有限公司 | Temperature control device used for chip testing |
-
2014
- 2014-07-11 CN CN201410330727.6A patent/CN105300872B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479105A (en) * | 2003-07-18 | 2004-03-03 | 威盛电子股份有限公司 | Lockable pressure controlled frame of electron element testing socket |
| JP2005069938A (en) * | 2003-08-26 | 2005-03-17 | Risou Keisoku Kk | Testing arrangement of electronic component |
| CN201007722Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with flexible buffering heat conduction foundation |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN202904406U (en) * | 2012-10-18 | 2013-04-24 | 宜硕科技(上海)有限公司 | Temperature control device used for chip testing |
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| Publication number | Publication date |
|---|---|
| CN105300872B (en) | 2018-04-06 |
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