CN105300872B - Can temperature control floating buffer test bench - Google Patents
Can temperature control floating buffer test bench Download PDFInfo
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- CN105300872B CN105300872B CN201410330727.6A CN201410330727A CN105300872B CN 105300872 B CN105300872 B CN 105300872B CN 201410330727 A CN201410330727 A CN 201410330727A CN 105300872 B CN105300872 B CN 105300872B
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- coupling surface
- temperature control
- float plate
- test bench
- thermal station
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Abstract
The present invention disclose it is a kind of can temperature control floating buffer test bench, mainly including thermal station, source temperature control and float plate.Wherein, each side wall of the groove of thermal station upper surface includes the first coupling surface, and source temperature control heats up or cooled to thermal station；Float plate is located in the groove of thermal station, and each side wall of float plate includes the second coupling surface, and the second coupling surface of float plate be coupled to the groove of thermal station the first coupling surface and can Relative sliding.Wherein, the first coupling surface and the second coupling surface are respectively continuous wavy surface, and thermal station is heated up or cooled to float plate by first, second coupling surface.Accordingly, the buffer effect of absorption impulsive force is made up of the setting of float plate, and by the setting of continuous wavy surface, conduction surface can be dramatically increased and conduction efficiency is substantially improved.
Description
Technical field
The present invention on it is a kind of can temperature control floating buffer test bench, it is espespecially a kind of be applied to can provide high/low temperature test
Semiconductor wafer testing seat.
Background technology
With the requirement of the weatherability to semiconductor wafer, the chip that increasing semiconductor die producer requires to dispatch from the factory needs
By high temperature or low-temperature test, to ensure that chip can normal operation in the environment of specific high temperature or specific low temperature.
However, the principle that the high temperature or low-temperature test of general common semiconductor chip are used is nothing more than to be measured half
Conductor chip is heated up or cooled, and its common detection mode includes：Pre-burning (Burn-in) is tested, and it connects test device
It is placed in a test chamber and is tested with semiconductor wafer to be measured, and high temperature or low temperature environment is directly provided in test chamber,
Such as No. 384237 patents of Taiwan I；In addition, prior art has in a manner of crimp head heats up or cooled to chip to be measured, that is,
It is used for the crimp head for compressing fixed wafer above chip to be measured, itself just possesses the temperature control module for having heating or cooling, as in
State publication number CN 1,537,217 A；In addition, prior art also have it is directly right with temperature controlled fluid (high-temperature gas) in test bench
Chip to be measured is heated up or cooled, such as Japanese Unexamined Patent Publication 5-121598.
Furthermore it is also common in the prior art to have the test bench for being directly provided with changing device, that is, directly treated with test bench
Survey chip to be heated up or cooled and tested, such as No. 364085 patents of Republic of China's I.However, possesses alternating temperature as foregoing
The common technique of the test bench of device, buffer effect itself is not had, that is, do not have absorption chip and pick and place and press
The effect of impulsive force that connection mechanism pushes, thus often occur fetching device in fetching process or compression joint mechanism during compressing because
Off normal or force are bad, cause the situation of careless compression failure chip to be measured.
It follows that being provided simultaneously with function of temperature control and absorbing the pooling feature of impact power, and can more importantly carry
It is industrial circle active demand in fact for the test device or test bench of excellent conductive performance.
The content of the invention
The main object of the present invention be provide it is a kind of can temperature control floating buffer test bench, excellent temperature can be provided
The conductive performance of control is spent, and and can possesses the buffer effect for absorbing impact power.
To reach above-mentioned purpose, the present invention it is a kind of can temperature control floating buffer test bench, mainly include a thermal station, a temperature
Control source and a float plate.Wherein, thermal station upper surface offers a groove, and four surrounding place side walls of groove include at least one
First coupling surface；Source temperature control heats up or cooled to thermal station；Float plate is located in the groove of thermal station, and the Fourth Ring of float plate
All side walls include at least one second coupling surface, and at least one second coupling surface of float plate is coupled in the groove of thermal station at least
One first coupling surface simultaneously can Relative sliding.Wherein, at least one first coupling surface respectively can be mutual with least one second coupling surface
The continuous wavy surface of coupling, and thermal station by least one first coupling surface and at least one second coupling surface to float plate liter
Temperature or cooling.
Accordingly, the present invention is arranged in the groove of thermal station upper surface by by float plate, and the two and using can be mutual
Slide, the first coupling surface of coupling and the second coupling surface absorb the buffer effect for pushing impulsive force to form；Moreover, by continuous
The setting of wavy surface, can dramatically increase the conduction surface of the two contact, and then the efficiency of temperature control conduction is substantially improved.
It is preferred that the first coupling surface and the second coupling surface of the present invention can be respectively the square-wave-shaped table that can be intercoupled
Face, string running surface or the hackly surface to be intercoupled with acute angle, or the company of other geometry polygons that can be intercoupled
Continuous wavy surface all may be used.Furthermore each side wall of the groove of thermal station of the present invention may include one first coupling surface, float plate
Each side wall may include one second coupling surface.In other words, four surrounding place side walls of the groove of thermal station of the present invention and float plate
Four surrounding place side walls can all set the first coupling surface and the second coupling surface, and conduction surface is thereby significantly increased.
In addition, the present invention can further include an at least flexible member, it may be disposed in the groove of thermal station, and an at least bullet
One end of property element is against the bottom surface of groove, and at least other end of a flexible member is against the lower surface of float plate.Accordingly, originally
Invention can provide float plate by flexible member and more preferably buffer and reset effect.Wherein, flexible member of the invention can be
Spring, rubber or other equivalence elements.In addition, the present invention source temperature control can be electroluminescent thermal module, electroluminescent chill group or other
Any device or equipment that high temperature or low temperature are provided.
Again and, the upper surface of float plate of the present invention can a recessed wafer slot, with plugging for test chip, and survey
The progress of examination.Also, the present invention can further include a upper cover plate, it can be covered in above the groove of thermal station, and upper cover plate can open up
There is a through slot, and the wafer slot of float plate is exposed by the through slot of upper cover plate.Accordingly, the present invention can utilize upper cover plate
To limit the sliding scale of float plate；Meanwhile float plate is contacted by upper cover plate, and upper cover plate can provide other temperature control and pass
Approach is led, therefore upper cover plate can also use the good material of the coefficient of heat conduction.
Brief description of the drawings
Fig. 1 is the exploded view of first embodiment of the invention.
Fig. 2 is the section view decomposing schematic representation of first embodiment of the invention.
Fig. 3 is the section view combination diagram of first embodiment of the invention.
Fig. 4 is the first coupling surface of the invention and the schematic diagram of the second coupling surface second embodiment.
Fig. 5 is the first coupling surface of the invention and the schematic diagram of the second coupling surface 3rd embodiment.
Wherein：
2 thermal stations
20 upper surfaces
21 grooves
211 bottom surfaces
210 side walls
22 first coupling surfaces
3 float plates
31 side walls
32 second coupling surfaces
33 lower surfaces
34 upper surfaces
35 wafer slots
4 source temperature controls
41 electroluminescent thermal modules
42 electroluminescent chill groups
5 flexible members
6 upper cover plates
61 through slots
Embodiment
The present invention can temperature control floating buffer test bench be described in detail in the present embodiment before, to be paid special attention to
It is that in the following description, similar element will be represented with identical component symbol.
Please refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 be the present invention can temperature control floating buffer test bench first embodiment
Exploded view, Fig. 2 be the present invention can temperature control floating buffer test bench first embodiment section view decomposing schematic representation, Fig. 3 is this
Invention can temperature control floating buffer test bench first embodiment section view combination diagram.
As shown in FIG., the present embodiment can temperature control floating buffer test bench mainly include a thermal station 2, a float plate 3,
One upper cover plate 6 of flexible member 5 and one of source temperature control 4, four.Wherein, the upper surface 20 of thermal station 2 offers a groove 21, and
Four surrounding place side walls 210 of groove 21 are all provided with the first coupling surface 22, and the first coupling surface 22 is continuous wavy surface, this reality
It is square-wave-shaped surface to apply employed in example.
In addition, float plate 3 is located in the groove 21 of thermal station 2, and four surrounding place side walls 31 of float plate 3 are all provided with
Two coupling surfaces 32, and the second coupling surface 32 of float plate 3 be coupled to the groove 21 of thermal station 2 the first coupling surface 22 and can phase
To sliding.However, the second coupling surface 32 is continuous wavy surface, the present embodiment is equally the square-wave-shaped surface used.In addition,
The recessed wafer slot 35 in upper surface 34 of float plate 3, it is plugged for test chip, and is tested.
Furthermore as shown in Figure 2 to have source temperature control 4, it is mainly responsible for that thermal station 2 is heated up or cooled, and this implementation
Example uses an electroluminescent 41 and one electroluminescent chill group 42 of thermal module, therefore the present embodiment can be provided simultaneously with the work(for heating up and cooling
Effect.Accordingly, the present embodiment is heated up or cooled to thermal station 2 by source temperature control 4, and thermal station 2 again by the first coupling surface 22 with
Contact between second coupling surface 32 is conducted and float plate 3 is heated up or cooled.Wherein, first coupling on continuous square-wave-shaped surface is passed through
The setting of the coupling surface 32 of conjunction face 22 and second, can dramatically increase the conduction surface of the two contact, and then temperature control conduction is substantially improved
Efficiency.
In addition, as shown in FIG., four flexible members 5 are separately positioned in the groove 21 of thermal station 2.Wherein, each bullet
One end of property element 5 is against the bottom surface 211 of groove 21, and the other end is against the lower surface 33 of float plate 3.Accordingly, can be by bullet
Property element 5 and float plate 3 is provided and more preferably buffers and reset effect.However, flexible member 5 is bullet used by the present embodiment
Spring, but the flexible member 5 of the present invention is not limited to spring, other such as rubber or other equivalence elements are all applicable.
Also, upper cover plate 6 as illustrated in the drawing, it is covered in the top of groove 21 of thermal station 2, and upper cover plate 6 offers one
Through slot 61, and the wafer slot 35 of float plate 3 is exposed by the through slot 61 of upper cover plate 6.Accordingly, the present embodiment is available
Upper cover plate 6 limits the lifting carriage scope of float plate 3；Meanwhile the upper surface of float plate 3 is contacted by upper cover plate 6, and on
Cover plate 6 can also provide other temperature control pathway simultaneously, and to increase conduction efficiency, therefore upper cover plate 6 can also use heat transfer system
The good material of number.
Please refer to Fig. 4 and Fig. 5, Fig. 4 is the first coupling surface 22 of the invention and the second embodiment of the second coupling surface 32
Schematic diagram, Fig. 5 are the first coupling surface 22 of the invention and the schematic diagram of the 3rd embodiment of the second coupling surface 32.Second embodiment and
There is shape used by three embodiments are the first coupling surface 22 and the second coupling surface 32 with above-mentioned first embodiment Main Differences
Institute is different.Wherein, second embodiment as shown in Figure 4, its first coupling surface 22 is respectively with the second coupling surface 32 can phase mutual coupling
The string running surface of conjunction；Second embodiment as shown in Figure 4, its coupling surface 32 of the first coupling surface 22 and second are respectively with acute angle
The hackly surface to intercouple.Certainly, the first coupling surface 22 of the invention is not implemented with the second coupling surface 32 with above three
Example is limited, and the continuous wavy surface for the geometry polygon that other can intercouple also may be used.
Above-described embodiment is illustrated only for conveniently explanation, and the interest field that the present invention is advocated should be wanted with right certainly
Ask and be defined described in book, rather than be only limitted to above-described embodiment.
Claims (9)
1. it is a kind of can temperature control floating buffer test bench, it is characterised in that including：
One thermal station, its upper surface offer a groove, and four surrounding place side walls of the groove include at least one first coupling surface；
One source temperature control, it is that the thermal station is heated up or cooled；And
One float plate, it is located in the groove of the thermal station, and four surrounding place side walls of the float plate include at least one second coupling
Conjunction face, at least one second coupling surface system of the float plate are coupled at least one first coupling surface of the groove of the thermal station
And can Relative sliding；
Wherein, the continuous wavy table that at least one first coupling surface can respectively intercouple with least one second coupling surface
Face, the thermal station are heated up or cooled to the float plate by least one first coupling surface and at least one second coupling surface；
An at least flexible member is further included, it is arranged in the groove of the thermal station, and one end of an at least flexible member is supported
By the bottom surface of the groove, the other end of an at least flexible member is against the lower surface of the float plate.
2. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, this at least one first
The square-wave-shaped surface that coupling surface can respectively intercouple with least one second coupling surface.
3. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, this at least one first
The string running surface that coupling surface can respectively intercouple with least one second coupling surface.
4. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, this at least one first
The hackly surface that coupling surface can respectively be intercoupled with least one second coupling surface with acute angle.
5. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, at least one elasticity
Element is a spring.
6. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, the float plate is upper
The recessed wafer slot in surface.
7. it is according to claim 6 can temperature control floating buffer test bench, it is characterised in that：It further includes a upper cover plate,
It is covered in above the groove of the thermal station, and the upper cover plate offers a through slot, and the wafer slot of the float plate passes through
The through slot of the upper cover plate and expose.
8. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, the source temperature control is selected from
At least one in following group：One electroluminescent thermal module and an electroluminescent chill group.
9. it is according to claim 1 can temperature control floating buffer test bench, it is characterised in that：Wherein, the thermal station should
Each side wall of groove includes first coupling surface, and each side wall of the float plate includes second coupling surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330727.6A CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330727.6A CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105300872A CN105300872A (en) | 2016-02-03 |
| CN105300872B true CN105300872B (en) | 2018-04-06 |
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| CN201410330727.6A Active CN105300872B (en) | 2014-07-11 | 2014-07-11 | Can temperature control floating buffer test bench |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479105A (en) * | 2003-07-18 | 2004-03-03 | 威盛电子股份有限公司 | Lockable pressure controlled frame of electron element testing socket |
| JP2005069938A (en) * | 2003-08-26 | 2005-03-17 | Risou Keisoku Kk | Testing arrangement of electronic component |
| CN201007722Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with flexible buffering heat conduction foundation |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN202904406U (en) * | 2012-10-18 | 2013-04-24 | 宜硕科技(上海)有限公司 | Temperature control device used for chip testing |
-
2014
- 2014-07-11 CN CN201410330727.6A patent/CN105300872B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1479105A (en) * | 2003-07-18 | 2004-03-03 | 威盛电子股份有限公司 | Lockable pressure controlled frame of electron element testing socket |
| JP2005069938A (en) * | 2003-08-26 | 2005-03-17 | Risou Keisoku Kk | Testing arrangement of electronic component |
| CN201007722Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with flexible buffering heat conduction foundation |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN202904406U (en) * | 2012-10-18 | 2013-04-24 | 宜硕科技(上海)有限公司 | Temperature control device used for chip testing |
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| Publication number | Publication date |
|---|---|
| CN105300872A (en) | 2016-02-03 |
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