CN105263273A - Method for processing false soft-hard circuit board - Google Patents
Method for processing false soft-hard circuit board Download PDFInfo
- Publication number
- CN105263273A CN105263273A CN201510704132.7A CN201510704132A CN105263273A CN 105263273 A CN105263273 A CN 105263273A CN 201510704132 A CN201510704132 A CN 201510704132A CN 105263273 A CN105263273 A CN 105263273A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board
- wiring board
- carried out
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to a method for processing a false soft-hard circuit board, comprising the steps as follows: a, cutting a substrate (8) according to the dimension required by the design; b, transferring the pattern of a circuit board (12) after electroplating; c, after pattern electroplating, putting a circuit board (9) after chemical pattern electroplating in a tinned wire (18) for tinning; d, applying solvent to the outer layer; and e, carrying out resistance welding and surface treatment of the circuit board (9) which is proved to be qualified in inspection. The method is characterized in that steps are machined on the circuit board (9) after resistance welding and surface treatment: first, the circuit board (9) is evenly attached to the working table of a milling machine (19), and then, soft board areas (4) between hard board areas (1) and a hard board connecting strip (5) is grooved by a three-blade milling cutter, and bottom corners (11) and sharp corners (10) should be 90 degrees in processing. The processing cost of the false soft-hard circuit board is reduced greatly, the production cycle is short, the efficiency is high, and the quality of the product is good.
Description
Technical field
The invention belongs to the processing method of electric appliance circuits plate, particularly a kind of processing method of false flexible and hard combined circuit board.
Background technology
False soft and hard combined printing circuit board is exactly that hardboard (rigid plate) forms with soft board pressing, the advantage of this printed wiring board be lightweight, free space is large, collapsible and do not affect signal and make defeated performance.Existing processing method flexible board area uses pressing mode that hardboard and soft board are pressed into Rigid Flex.The shortcomings such as the weak point of this compression method is that cost is high, and the production cycle is long, and scrappage is high.
Summary of the invention
The object of the invention is to overcome above-mentioned technical deficiency, provide a kind of and adopt gong step-wise manner, beyond wiring board, spread large area copper sheet to reach the processing method of the false flexible and hard combined circuit board of soft board toughness.
The technical scheme that technical solution problem of the present invention adopts is: a kind of processing method of false flexible and hard combined circuit board, comprises the following steps:
A. by the size cutting substrate of designing requirement, substrate bores circuit plate hole with drilling machine on request; Then the substrate having bored circuit plate hole is put into electroless copper plating line and enter heavy copper; Put into electric plating of whole board line after heavy copper completes again to electroplate;
B. Graphic transitions is carried out to the wiring board electroplated: by designing requirement, circuit board pattern is drawn the film, adopt exposure to transfer in developing line after drawing the film and develop; Circuit board after development is put into graphic plating line and is carried out graphic plating;
C. after graphic plating, to chemical graphs plating wiring board 9 be put into carry out in tinned wire 18 zinc-plated;
D. outer solvent: the table copper solvent beyond chemical graphs circuit board figure is shown copper and removes, removing the tin on figure with moving back tin liquid medicine, completing the making of wiring board; And carry out check-up;
E. the wiring board of passed examination is carried out welding resistance and surface treatment; It is characterized in that, gong ladder is carried out to welding resistance and surface-treated wiring board: wiring board is fitted on the work top of milling machine by first-selection equably, with three blade milling cutters, grooving processing is carried out to the flexible board area between hardboard district and hardboard intercell connector, add and will guarantee that base angle and wedge angle are 90 degree man-hour.
The invention has the beneficial effects as follows: this invention reduces the processing cost of false flexible and hard combined circuit board greatly, with short production cycle, and efficiency is high, good product quality.
Accompanying drawing explanation
Fig. 1 is the front view of the processing method of false flexible and hard combined circuit board;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the processing method FB(flow block) of false flexible and hard combined circuit board.
In figure: 1-hardboard district; 2-conducting circuit; The upper part pad of 3-; 4-flexible board area; 5-hardboard intercell connector; 6-surface of circuit board line layer; 7-wiring board base plate line layer; 8-substrate; 9-wiring board; 10-wedge angle; 11-base angle; 12-circuit plate hole; 13-drilling machine; 14-electroless copper plating line; 15-electric plating of whole board line; 16-developing line; 17-graphics circuitry line; 18-tinned wire; 19-milling machine.
Embodiment
Embodiment, with reference to accompanying drawing, a kind of processing method of false flexible and hard combined circuit board, comprises the following steps:
A. by the size cutting substrate 8 of designing requirement, circuit plate hole 12 is bored with drilling machine 13 on request on the substrate 8; Then the substrate 8 having bored circuit plate hole 12 is put into electroless copper plating line 14 and enter heavy copper; Put into electric plating of whole board line 15 after heavy copper completes again to electroplate;
B. Graphic transitions is carried out to the wiring board 12 electroplated: by designing requirement, circuit board pattern is drawn the film, adopt exposure to transfer in developing line 16 after drawing the film and develop; Circuit board 9 after development is put into graphic plating line and is carried out graphic plating;
C. after graphic plating, to chemical graphs plating wiring board 9 be put into carry out in tinned wire 18 zinc-plated;
D. outer solvent: the table copper solvent beyond chemical graphs circuit board 9 figure is shown copper and removes, removing the tin on figure with moving back tin liquid medicine, completing the making of wiring board 9; And carry out check-up;
E. the wiring board 9 of passed examination is carried out welding resistance and surface treatment; It is characterized in that, gong ladder is carried out to welding resistance and surface-treated wiring board 9: wiring board 9 is fitted on the work top of milling machine 19 by first-selection equably, with three blade milling cutters, grooving processing is carried out to the flexible board area 4 between hardboard district 1 and hardboard intercell connector 5, add and will guarantee that base angle 11 and wedge angle 10 are 90 degree man-hour.
Finished product wiring board 9 top and the bottom are flexible board area 4 between hardboard district of hardboard district 1, Liang Ge 1, are provided with intercell connector 5 between flexible board area 4; Hardboard district 1 is provided with conducting circuit 2, on part pad3 and circuit plate hole 12; Being wiring board base plate line layer 7 below finished product wiring board 9, is surface of circuit board line layer 6 above, and centre is substrate 8.
Claims (1)
1. a processing method for false flexible and hard combined circuit board, comprises the following steps:
A. by the size cutting substrate (8) of designing requirement, substrate (8) is used on request drilling machine (13) bore circuit plate hole (12); Then the substrate (8) having bored circuit plate hole (12) is put into electroless copper plating line (14) and enter heavy copper; Put into electric plating of whole board line (15) after heavy copper completes again to electroplate;
B. Graphic transitions is carried out to the wiring board electroplated (12): by designing requirement, circuit board pattern is drawn the film, adopt exposure to transfer in developing line (16) after drawing the film and develop; Circuit board (9) after development is put into graphic plating line and is carried out graphic plating;
C. after graphic plating, to chemical graphs plating wiring board (9) be put into carry out in tinned wire (18) zinc-plated;
D. outer solvent: the table copper solvent beyond chemical graphs circuit board (9) figure is shown copper and removes, removing the tin on figure with moving back tin liquid medicine, completing the making of wiring board (9); And carry out check-up;
E. the wiring board (9) of passed examination is carried out welding resistance and surface treatment; It is characterized in that, gong ladder is carried out to welding resistance and surface-treated wiring board (9): wiring board (9) is fitted on the work top of milling machine (19) by first-selection equably, with three blade milling cutters, grooving processing is carried out to the flexible board area (4) between hardboard district (1) and hardboard intercell connector (5), add and will guarantee that base angle (11) and wedge angle (10) are 90 degree man-hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510704132.7A CN105263273A (en) | 2015-10-27 | 2015-10-27 | Method for processing false soft-hard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510704132.7A CN105263273A (en) | 2015-10-27 | 2015-10-27 | Method for processing false soft-hard circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105263273A true CN105263273A (en) | 2016-01-20 |
Family
ID=55102728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510704132.7A Pending CN105263273A (en) | 2015-10-27 | 2015-10-27 | Method for processing false soft-hard circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105263273A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152209A (en) * | 2018-09-03 | 2019-01-04 | 江门荣信电路板有限公司 | The integrally formed soft or hard combination PCB circuit board of one kind and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201935848U (en) * | 2010-12-03 | 2011-08-17 | 深圳市崇达电路技术股份有限公司 | Flexibility testing tool for pseudo softness-hardness combined plate |
| CN202667761U (en) * | 2012-04-11 | 2013-01-16 | 常州市桦辉永祥金属制品有限公司 | Three-edge milling cutter |
| CN104540316A (en) * | 2014-12-10 | 2015-04-22 | 江门崇达电路技术有限公司 | Pseudo soft-rigid circuit board made of full-rigid materials and manufacturing method thereof |
-
2015
- 2015-10-27 CN CN201510704132.7A patent/CN105263273A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201935848U (en) * | 2010-12-03 | 2011-08-17 | 深圳市崇达电路技术股份有限公司 | Flexibility testing tool for pseudo softness-hardness combined plate |
| CN202667761U (en) * | 2012-04-11 | 2013-01-16 | 常州市桦辉永祥金属制品有限公司 | Three-edge milling cutter |
| CN104540316A (en) * | 2014-12-10 | 2015-04-22 | 江门崇达电路技术有限公司 | Pseudo soft-rigid circuit board made of full-rigid materials and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152209A (en) * | 2018-09-03 | 2019-01-04 | 江门荣信电路板有限公司 | The integrally formed soft or hard combination PCB circuit board of one kind and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160120 |
|
| WD01 | Invention patent application deemed withdrawn after publication |