CN105229475B - 传感器单元、传感器模块的铠装体、电子设备和移动体 - Google Patents
传感器单元、传感器模块的铠装体、电子设备和移动体 Download PDFInfo
- Publication number
- CN105229475B CN105229475B CN201480015353.7A CN201480015353A CN105229475B CN 105229475 B CN105229475 B CN 105229475B CN 201480015353 A CN201480015353 A CN 201480015353A CN 105229475 B CN105229475 B CN 105229475B
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- Prior art keywords
- face
- sensor
- sensor module
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Links
- 238000001514 detection method Methods 0.000 claims description 57
- 230000007613 environmental effect Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
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- 238000010168 coupling process Methods 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- 238000005549 size reduction Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-053258 | 2013-03-15 | ||
| JP2013053258A JP6136402B2 (ja) | 2013-03-15 | 2013-03-15 | センサーユニット、電子機器、および移動体 |
| PCT/JP2014/001283 WO2014141657A1 (en) | 2013-03-15 | 2014-03-07 | Sensor unit, armor body for sensor module, electronic device, and moving object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105229475A CN105229475A (zh) | 2016-01-06 |
| CN105229475B true CN105229475B (zh) | 2018-01-09 |
Family
ID=51536336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480015353.7A Active CN105229475B (zh) | 2013-03-15 | 2014-03-07 | 传感器单元、传感器模块的铠装体、电子设备和移动体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9952071B2 (enExample) |
| JP (1) | JP6136402B2 (enExample) |
| CN (1) | CN105229475B (enExample) |
| WO (1) | WO2014141657A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10401380B2 (en) * | 2014-05-22 | 2019-09-03 | The Trustees Of The University Of Pennsylvania | Wearable system for accelerometer-based detection and classification of firearm use |
| EP3401645A3 (en) * | 2017-04-19 | 2019-01-23 | Richard Kozdras | System for mounting sensors |
| JP2020071074A (ja) * | 2018-10-29 | 2020-05-07 | セイコーエプソン株式会社 | センサーユニット、電子機器および移動体 |
| KR200496425Y1 (ko) * | 2021-03-31 | 2023-01-27 | 주식회사 씨에스 | 산업 설비를 대상으로 하는 진동센서모듈 |
| CN114397477B (zh) * | 2021-11-18 | 2022-10-04 | 中国科学院西安光学精密机械研究所 | 基于挠性玻璃质支撑元件的多普勒差分干涉仪的制备方法 |
| JP7760959B2 (ja) * | 2022-05-30 | 2025-10-28 | 住友電装株式会社 | 成形部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001183387A (ja) * | 1999-12-22 | 2001-07-06 | Matsushita Electric Works Ltd | 加速度センサ |
| US20070101812A1 (en) * | 2005-11-10 | 2007-05-10 | Honeywell International, Inc. | Miniature package for translation of sensor sense axis |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH078775U (ja) * | 1993-07-09 | 1995-02-07 | 株式会社ユニシアジェックス | 加速度センサ |
| JPH1151964A (ja) * | 1997-08-07 | 1999-02-26 | Miyota Co Ltd | 加速度センサ |
| US6534711B1 (en) * | 1998-04-14 | 2003-03-18 | The Goodyear Tire & Rubber Company | Encapsulation package and method of packaging an electronic circuit module |
| US6262520B1 (en) * | 1999-09-15 | 2001-07-17 | Bei Technologies, Inc. | Inertial rate sensor tuning fork |
| JP4701505B2 (ja) * | 2001-01-29 | 2011-06-15 | パナソニック株式会社 | 慣性トランスデューサ |
| JP2002372473A (ja) * | 2001-04-12 | 2002-12-26 | Fuji Electric Co Ltd | 半導体センサ収納容器およびその製造方法、並びに半導体センサ装置 |
| JPWO2003017364A1 (ja) * | 2001-08-17 | 2004-12-09 | シチズン時計株式会社 | 電子装置及びその製造方法 |
| JP4222147B2 (ja) * | 2002-10-23 | 2009-02-12 | セイコーエプソン株式会社 | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
| US8100010B2 (en) * | 2008-04-14 | 2012-01-24 | Honeywell International Inc. | Method and system for forming an electronic assembly having inertial sensors mounted thereto |
| JP5536994B2 (ja) * | 2008-06-30 | 2014-07-02 | 株式会社東芝 | 慣性センサ及び慣性検出装置 |
| JP5935244B2 (ja) * | 2011-05-31 | 2016-06-15 | セイコーエプソン株式会社 | モジュールおよび電子機器 |
| JP5821289B2 (ja) * | 2011-05-31 | 2015-11-24 | セイコーエプソン株式会社 | 保持部材、モジュールおよび電子機器 |
| JP5919662B2 (ja) * | 2011-07-11 | 2016-05-18 | セイコーエプソン株式会社 | 電子デバイスおよび電子機器 |
| JP5845672B2 (ja) | 2011-07-13 | 2016-01-20 | セイコーエプソン株式会社 | センサーデバイスおよび電子機器 |
| JP2013019826A (ja) | 2011-07-13 | 2013-01-31 | Seiko Epson Corp | 回路基板、センサーモジュールおよび電子機器 |
| JP2013211507A (ja) * | 2011-08-08 | 2013-10-10 | Rohm Co Ltd | フォトインタラプタ、フォトインタラプタの製造方法、およびフォトインタラプタの実装構造 |
| US9209121B2 (en) * | 2013-02-01 | 2015-12-08 | Analog Devices, Inc. | Double-sided package |
| JP6192324B2 (ja) * | 2013-03-21 | 2017-09-06 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
| US9804084B2 (en) * | 2013-11-11 | 2017-10-31 | Amphenol Thermometrics, Inc. | Optical gas sensor |
| US9612146B2 (en) * | 2014-02-07 | 2017-04-04 | Honeywell International, Inc. | Airflow sensor with dust reduction |
| DE102015106373B4 (de) * | 2015-04-24 | 2023-03-02 | Infineon Technologies Ag | Photoakustisches gassensormodul mit lichtemittereinheit und einer detektoreinheit |
-
2013
- 2013-03-15 JP JP2013053258A patent/JP6136402B2/ja active Active
-
2014
- 2014-03-07 WO PCT/JP2014/001283 patent/WO2014141657A1/en not_active Ceased
- 2014-03-07 CN CN201480015353.7A patent/CN105229475B/zh active Active
- 2014-03-07 US US14/774,598 patent/US9952071B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001183387A (ja) * | 1999-12-22 | 2001-07-06 | Matsushita Electric Works Ltd | 加速度センサ |
| US20070101812A1 (en) * | 2005-11-10 | 2007-05-10 | Honeywell International, Inc. | Miniature package for translation of sensor sense axis |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6136402B2 (ja) | 2017-05-31 |
| US20160025525A1 (en) | 2016-01-28 |
| US9952071B2 (en) | 2018-04-24 |
| WO2014141657A1 (en) | 2014-09-18 |
| CN105229475A (zh) | 2016-01-06 |
| JP2014178248A (ja) | 2014-09-25 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |