CN105225969A - 一种bga返修植球治具 - Google Patents

一种bga返修植球治具 Download PDF

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CN105225969A
CN105225969A CN201510663237.2A CN201510663237A CN105225969A CN 105225969 A CN105225969 A CN 105225969A CN 201510663237 A CN201510663237 A CN 201510663237A CN 105225969 A CN105225969 A CN 105225969A
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slide block
screw mandrel
bga
pedestal
reprocesses
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CN105225969B (zh
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蒋俊
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Taizhou kejinzhong high tech transfer Co.,Ltd.
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Guilin Weimeiyuan Restaurant Management Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/749—Tools for reworking, e.g. for shaping

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明涉及一种BGA返修植球治具，包括基座、丝杆、第一滑块、第二滑块和转动把手，所述基座顶部设有滑动槽，所述丝杆处于所述滑动槽内，并且所述丝杆的两端延伸到所述基座的外面后分别连接不同的所述转动把手，在所述丝杆上安装有所述第一滑块和第二滑块，在所述第一滑块和所述第二滑块上设有相互对应的定位槽，在所述第一滑块和所述第二滑块上还都设有可以控制所述定位槽大小相互对应的调节螺杆。本发明提供的一种BGA返修植球治具，操作简单快捷，可以提高返修植球的效率。

Description

一种BGA返修植球治具
技术领域
本发明涉及电路板SMT技术领域，具体涉及一种BGA返修植球治具。
背景技术
BGA的全称是BallGridArray(球栅阵列结构的PCB)，它是集成电路采用有机载板的一种封装法。BGA芯片不良若直接报废处理，这样浪费成本，而且不环保。一般厂家都会进行BGA返修，常规的BGA返修步骤包括：1、拆卸BGA；2、去潮处理；3、印刷焊膏；4、清洗焊盘；5、去潮处理；6、印刷焊膏；7、贴装BGA；8、再流焊接；9检验。其中，植球工艺步骤包括：1、去处BGA底部焊盘上的残留焊锡并清洗；2、在BGA底部焊盘上印刷助焊剂；3、选择焊球；4、植球；5、再流焊接；6、焊接。一般植球需要借助治具。
发明内容
综上所述，本发明所要解决的技术问题是提供一种BGA返修植球治具。
本发明解决上述技术问题的技术方案如下：一种BGA返修植球治具，包括基座、丝杆、第一滑块、第二滑块和转动把手，所述基座顶部设有滑动槽，所述丝杆处于所述滑动槽内，并且所述丝杆的两端延伸到所述基座的外面后分别连接不同的所述转动把手，在所述丝杆上安装有所述第一滑块和第二滑块，在所述第一滑块和所述第二滑块上设有相互对应的定位槽,在所述第一滑块和所述第二滑块上还都设有可以控制所述定位槽大小相互对应的调节螺杆。
进一步，在所述基座的地步设有调节所述基座高度的螺钉。
进一步，所述转动把手为橄榄状，并且在所述转动把手的外表面设有增加摩擦力的纹路。
本发明的有益效果是：本发明提供的一种BGA返修植球治具，操作简单快捷，可以提高返修植球的效率。
附图说明
图1为发明的主视视图；
图2为图1的俯视图；
图3为滑块的剖视图。
附图中，各标号所代表的部件列表如下：
1、基座，2、丝杆，3、第一滑块，4、第二滑块，5、转动把手，6、滑动槽，7、定位槽，8、螺钉，9、调节螺杆。
具体实施方式
以下结合附图对本发明的原理和特征进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
如图1和2所示，一种BGA返修植球治具，包括基座1、丝杆2、第一滑块3、第二滑块4和转动把手5，所述基座1顶部设有滑动槽6，所述丝杆2处于所述滑槽内，并且所述丝杆2的两端延伸到所述基座1的外面后分别连接不同的所述转动把手5，所述转动把手5为橄榄状，并且在所述转动把手5的外表面设有增加摩擦力的纹路。在所述丝杆2上安装有所述第一滑块3和第二滑块4，在所述第一滑块3和所述第二滑块4上设有相互对应的定位槽7。在所述第一滑块3和所述第二滑块4上还都设有可以控制所述定位槽7大小相互对应的调节螺杆9，先转动调节螺杆9调节其伸出滑块的长度，再旋转转动把手5通过丝杆2带动第一滑块3和第二滑块4同步移动(同时外移或内移)，向内移动的时候，当调节螺杆9伸出滑块的部分相互抵住，第一滑块3和第二滑块4就会停止相互靠近，以免第一滑块3和第二滑块4继续运行，夹坏定位在定位槽7的IC。基座1上有高度调整钉8，可以根据不同厚度的IC来调整支撑第一滑块3和第二滑块4的定位面与植球钢网间的距离，以适用于不同厚度的IC植球。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (3)

1.一种BGA返修植球治具，其特征在于，包括基座(1)、丝杆(2)、第一滑块(3)、第二滑块(4)和转动把手(5)，所述基座(1)顶部设有滑动槽(6)，所述丝杆(2)处于所述滑动槽(6)内，并且所述丝杆(2)的两端延伸到所述基座(1)的外面后分别连接不同的所述转动把手(5)，在所述丝杆(2)上安装有所述第一滑块(3)和第二滑块(4)，在所述第一滑块(3)和所述第二滑块(4)上设有相互对应的定位槽(7),在所述第一滑块(3)和所述第二滑块(4)上还都设有可以控制所述第一滑块(3)和所述第二滑块(4)形成的所述定位槽(7)大小、且相互对应的调节螺杆(9)。
2.根据权利要求1所述的一种BGA返修植球治具，其特征在于，在所述基座(1)的底部设有调节所述基座(1)高度的螺钉(8)。
3.根据权利要求1或2所述的一种BGA返修植球治具，其特征在于，所述转动把手(5)为橄榄状，并且在所述转动把手(5)的外表面设有增加摩擦力的纹路。
CN201510663237.2A 2015-10-14 2015-10-14 一种bga返修植球治具 Active CN105225969B (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202076240U (zh) * 2011-06-10 2011-12-14 王国华 用于集成电路植球的装置
CN202736643U (zh) * 2012-07-04 2013-02-13 航天科工惯性技术有限公司 平板变压器粘接固定装置
CN103137518A (zh) * 2011-11-25 2013-06-05 陕西子竹电子有限公司 一种可调式bga植珠装置
CN103846522A (zh) * 2012-11-28 2014-06-11 西安晶捷电子技术有限公司 一种bga植珠的可调结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202076240U (zh) * 2011-06-10 2011-12-14 王国华 用于集成电路植球的装置
CN103137518A (zh) * 2011-11-25 2013-06-05 陕西子竹电子有限公司 一种可调式bga植珠装置
CN202736643U (zh) * 2012-07-04 2013-02-13 航天科工惯性技术有限公司 平板变压器粘接固定装置
CN103846522A (zh) * 2012-11-28 2014-06-11 西安晶捷电子技术有限公司 一种bga植珠的可调结构

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