CN105206538A - Wafer Level Transfer Molding And Apparatus For Performing The Same - Google Patents
Wafer Level Transfer Molding And Apparatus For Performing The Same Download PDFInfo
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- CN105206538A CN105206538A CN201410445854.0A CN201410445854A CN105206538A CN 105206538 A CN105206538 A CN 105206538A CN 201410445854 A CN201410445854 A CN 201410445854A CN 105206538 A CN105206538 A CN 105206538A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.
Description
The cross-application of related application
The application is the part continuation application of the U.S. Patent application (patent application serial number is 13/411,293, and on March 2nd, 2012 submits to, and title is " Wafer-LevelUnderfillandOver-Molding ") of following common transfer.
Technical field
The present invention relates to wafer scale transfer modling and device for carrying out said thereof.
Background technology
In the encapsulation of integrated circuit, usually carry out package-on-package components (such as, component pipe core and package substrate) by flip-chip bond.In order to protect stacking package parts, moulding compound is arranged on around component pipe core.
Traditional molding methods comprises compression molding and transfer modling.Compression molding can be used for post forming (ove-rmolding).Because compression molding can not be used for filling the gap between stacking tube core, so need to distribute bottom filler in the step being different from compression molding.On the other hand, transfer modling can be used for molded underfill thing to be filled between stacking package parts and top.Therefore, transfer modling is used in same step and distributes bottom filler and moulding compound.But due to the uneven distribution of moulding compound, transfer modling can not be used for the packaging part comprising circular wafers.
Summary of the invention
In order to solve problems of the prior art, according to an aspect of the present invention, providing a kind of method, comprising: be placed in by encapsulating structure in encapsulating mold, the end face of the component pipe core in described encapsulating structure contacts the release film in described encapsulating mold; By injection port, be injected into by moulding compound in the inner space of described encapsulating mold, described injection port is positioned at the first side of described encapsulating mold; And during the described moulding compound of injection, be vented by the first exhaust port of described encapsulating mold and the second exhaust port, described first exhaust port has the first flow velocity, and described second exhaust port has the second flow velocity being different from described first flow velocity.
In the above-mentioned methods, described first exhaust port is more farther apart from described injection port than described second exhaust port, and described first flow velocity is higher than described second flow velocity.
In the above-mentioned methods, described first exhaust port and described second exhaust port are all connected to same vacuum environment, and the first size of described first exhaust port is different from the second size of described second exhaust port.
In the above-mentioned methods, also comprise: be positioned at the multiple exhaust ports in described encapsulating mold, wherein, described multiple exhaust port constantly diminishes along with from described multiple exhaust port to the reduction of the respective distance of described injection port.
In the above-mentioned methods, by the exhaust of the first Valve controlling by described first exhaust port, and by the control of the second valve by the exhaust of described second exhaust port, and described first valve and described second valve control described first flow velocity and described second flow velocity respectively.
In the above-mentioned methods, described first exhaust port is more farther apart from described injection port than described second exhaust port, and described first-class speed control is made as and is greater than described second flow velocity by described first valve and described second valve.
In the above-mentioned methods, described first exhaust port and described second exhaust port are connected to same vacuum chamber by described first valve and described second valve respectively.
According to a further aspect in the invention, additionally provide a kind of method, comprising: be placed in by encapsulating structure in the inner space of encapsulating mold, the end face of the component pipe core in described encapsulating structure contacts the release film in described encapsulating mold, wherein, described encapsulating mold comprises: injection port; With the first exhaust port and second exhaust port with different size; Described encapsulating structure and described encapsulating mold are placed in chamber, wherein, each part being positioned at described encapsulating mold outside described inner space being interconnected to described chamber of described first exhaust port and described second exhaust port; Described chamber is vacuumized; And by described injection port, moulding compound is injected in the inner space of described encapsulating mold.
In the above-mentioned methods, also comprise: inner space release film being placed in described encapsulating mold, make the end face of the component pipe core of described encapsulating structure contact described release film.
In the above-mentioned methods, the first size of described first exhaust port is greater than the second size of described second exhaust port, and described first exhaust port is more farther apart from described injection port than described second exhaust port.
In the above-mentioned methods, described encapsulating mold has round-shaped, described first exhaust port and described injection port are positioned at the relative both sides of the diameter of described encapsulating mold, and described first exhaust port has full-size in all exhaust ports of described encapsulating mold.
In the above-mentioned methods, also comprise: after the described moulding compound of injection, described moulding compound is cured; And from described encapsulating mold, remove the packaging part comprising described encapsulating structure and described moulding compound.
In the above-mentioned methods, described encapsulating structure comprises: wafer; And multiple tube core, being positioned at above described wafer and being engaged to described wafer, wherein, in the described moulding compound process of injection, described moulding compound flow to the opposite side of described wafer from the side of described wafer.
In the above-mentioned methods, pump and valve is not had to be connected to described first exhaust port and described second exhaust port.
According to another aspect of the invention, additionally provide a kind of device, comprising: encapsulating mold, comprising: top; And edge ring, there is annular shape, wherein, be connected to the edge at described top below the edge that described edge ring is positioned at described top, and described edge ring surrounds the inner space below described top; Injection port, is connected to the inner space of described encapsulating mold; And first exhaust port and the second exhaust port, be positioned at described edge ring place, wherein, described first exhaust port has first size, and described second exhaust port has the second size being different from described first size.
In said apparatus, also comprise: distributor, be connected to described injection port, wherein, described distributor arrangement is be injected in the inner space of described encapsulating mold by moulding material by described injection port.
In said apparatus, also comprise: controller, be connected to described first exhaust port and described second exhaust port, wherein, described controller is configured to open described first exhaust port and described second exhaust port respectively in different time points.
In said apparatus, described first size is greater than described second size, and described first exhaust port is more farther apart from described injection port than described second exhaust port.
In said apparatus, described encapsulating mold has round-shaped, described first exhaust port and described injection port are positioned at the relative both sides of the diameter of described encapsulating mold, and described first exhaust port has full-size in all exhaust ports of described encapsulating mold.
In said apparatus, also comprise: the multiple exhaust ports being positioned at described edge ring place, wherein, the size of described multiple exhaust port constantly diminishes along with from described multiple exhaust port to the reduction of the respective distance of described injection port.
Accompanying drawing explanation
When reading in conjunction with the accompanying drawings, the present invention may be better understood according to the following detailed description.It is emphasized that according to the standard practices in industry, various parts are not drawn to scale.In fact, in order to clearly discuss, can arbitrarily increase or reduce the size of various parts.
Fig. 1 shows the sectional view of the wafer scale transfer modling technique according to some embodiments;
Fig. 2 shows the stereogram of the encapsulating mold according to some embodiments;
Fig. 3 shows the top view of the wafer scale transfer modling technique according to some with the embodiment of the exhaust port of different size;
Fig. 4 shows the top view of the wafer scale transfer modling technique according to embodiment, and wherein, valve is connected to the different different exhaust ports of unfolding mode;
Fig. 5 to Fig. 9 shows the top view in the interstage of the time delay wafer scale transfer modling technique according to some embodiments;
Figure 10 shows the top view of the wafer scale transfer modling technique according to embodiment;
Figure 11 shows the molded encapsulating structure according to some embodiments;
Figure 12 shows the top view of the wafer scale transfer modling technique according to some embodiments, and wherein, the active parts of component pipe core faces release film; And
Figure 13 shows the molded encapsulating structure according to some embodiments, and wherein, the active parts of component pipe core is exposed by the molded encapsulating structure produced.
Embodiment
Following discloses content provides many different embodiments or example, to realize different characteristic of the present invention.The following describe the instantiation of parts and layout to simplify the present invention.Certainly, these be example and and not intended to be limiting the present invention.Such as, in the following description, above second component or on form first component and can comprise the embodiment that first component formed in the mode directly contacted with second component, and also can be included between first component and second component and can form extra parts, thus make the embodiment that first component can not directly contact with second component.In addition, the present invention in various embodiments can repeat reference numerals and/or letter.This repetition is for simplification and clearly object, but himself does not indicate the relation between each discussed embodiment and/or configuration.
In addition, for ease of describing, such as " ... below ", " ... following ", " below ", " in ... top ", the relative space position term such as " top " may be used for describing the relation of an element as shown in the figure or parts and another (or other) element or parts at this.Except the orientation shown in figure, these relative space position terms are intended to comprise device different azimuth in use or operation.Device can otherwise directed (90-degree rotation or in other orientation), and relative space position descriptor can similarly be explained accordingly as used herein.
According to each exemplary embodiment of the present invention, provide a kind of device for wafer scale transfer modling technique and a kind of method implementing wafer scale transfer modling.Discuss the change of embodiment.In each view and illustrative embodiment, similar reference number is used in reference to similar element.
Fig. 1 shows the sectional view of the wafer scale transfer modling technique according to some embodiments of the present invention.With reference to figure 1, encapsulating structure 10 is placed in encapsulating mold 26.Encapsulating structure 10 comprises wafer 20 and is engaged to the tube core 22 of wafer 20.In certain embodiments, wafer 20 is device wafers, and device wafers comprises multiple device chip, and device chip comprises active device (such as, transistor).Passive device (such as, resistor, capacitor, inductor and/or transformer) also can be comprised in device wafers 20.Wafer 20 also comprises Semiconductor substrate (not shown), such as, and silicon substrate, silicon-Germanium substrate, silicon-carbon substrate or iii-v compound semiconductor substrate.In an alternative embodiment, wafer 20 is the interpolation wafers wherein not comprising active device.That in the embodiment of interpolation wafer, wafer 20 also can comprise Semiconductor substrate at wafer 20.Can comprise in interpolation wafer 20 or can not passive device be comprised, such as, resistor, capacitor, inductor and/or transformer.Such as, as shown in Figure 2, the top view of wafer 20 can be circular, but wafer 20 can have other top view shapes of such as rectangle.Active device can be comprised in component pipe core 22.According to some embodiments, component pipe core 22 comprises memory dice, such as, and static RAM (SRAM) tube core, dynamic random access memory (DRAM) tube core etc.Alternatively, tube core 22 can be the packaging part comprising stacking tube core.
Encapsulating mold 26 comprises top (lid) 26A can with circular top view shape (Fig. 2 to Fig. 9).As shown in Figure 1, the release film 27 be made up of flexible material is attached to the inner surface of encapsulating mold 26.The end face of tube core 22 contacts with the bottom surface of release film 27.Therefore, the end face of tube core 22 do not have leaving space.According to some embodiments, release film 27 also may extend to the madial wall of encapsulating mold 26.On the other hand, the gap between adjacent tube core 22 keeps not filled by release film 27.Therefore, in moulding technology, the moulding compound distributed subsequently flows through the gap between adjacent tube core 22, and may flow in the gap between tube core 22 and the wafer 20 of below, but does not flow above tube core 22.Because the gap between tube core 22 is narrow, so do not allow moulding compound to flow above tube core 22 cause narrow moulding compound path.This causes the difficulty of moulding technology to increase, and therefore, according to embodiments of the invention, uses the scheme shown in Fig. 4 to Figure 10 to guarantee effectively and uniform molding.
Encapsulating mold 26 also comprises the edge ring 26B (also with reference to figure 2) surrounding tube core 22.Edge ring 26B be connected to top 26A edge and from the edge of top 26A to downward-extension.Edge ring 26B is around the region below the 26A of top, and this region is hereinafter referred to as the inner space of encapsulating mold 26.Therefore, tube core 22 and release film 27 are arranged in the inner space of encapsulating mold 26.Encapsulating mold 26 can be formed by aluminium, stainless steel or pottery etc.The bottom of edge ring 26B can contact with the end face of wafer 20, thus the inner space of sealed enclosure mould 26.
As shown in Figure 1, in certain embodiments, encapsulating mold 126 (for lower encapsulating mold) is placed in the below of encapsulating mold 26.The encapsulating mold 26 and 126 that uses capable of being combined carrys out molded package element 10.In an alternative embodiment, lower encapsulating mold 126 is not used.According to an alternative embodiment of the invention, the feather edge of edge ring 26B is placed on the marginal portion of wafer 20.In these embodiments, lower encapsulating mold is not used.
Fig. 1 also show molding injection port 30 and exhaust port 32, and they are positioned at the relative both sides of encapsulating mold 26.In addition, molding injection port 30 and exhaust port 32 to be positioned on edge ring 26B and to comprise the opening inner space of encapsulating mold 26 being connected to the space outerpace being positioned at encapsulating mold 26 outside.Because Fig. 1 is sectional view, so show single exhaust port 32.But as shown in Fig. 2 to Fig. 8, multiple exhaust port 32 can be placed on edge ring 26B.Molding distributor (moldingdispenser) 40 is connected to molding injection port 30 and is configured to moulding material 46 to conduct to molding injection port 30.Molding distributor 40 can comprise accumulator tank (not shown) to store moulding material 46.
Fig. 2 shows the stereogram of encapsulating mold 26.In certain embodiments, exhaust port 32 (comprising 32-1 to 32-m) has uniform size, wherein, depends on the shape of exhaust port 32, and size can be diameter or length/width.Such as, exhaust port 32 has circular open or octagon opening.In an alternative embodiment, exhaust port 32 is of different sizes, and the size of exhaust port 32 is relevant with the relevant position at corresponding exhaust port 32 place.
By exhaust port 32, the inner space of encapsulating mold 26 inside can produce vacuum.Such as, pipeline 52 (Fig. 4) can be connected to exhaust port 32, and implements to vacuumize by pipeline 52.Alternatively, as shown in figures 1 and 3, whole encapsulating mold 26 and corresponding encapsulating structure 10 can be placed in the vacuum environment 36 that can be chamber, make all exhaust ports 32 for vacuumizing the inner space of encapsulating mold 26 simultaneously.In the embodiment that vacuum environment 36 is provided, can not be connected to the pipeline of independent exhaust port 32.By having the exhaust port 32 of different size, moulding material 46 can more be uniformly distributed on whole wafer 20.
Fig. 3 shows the top view of encapsulating mold 26, wafer 20 and tube core 22 according to some embodiments.As shown in Figure 3, the inner space of encapsulating mold 26 is divided into the band (street) of multiple horizontal and vertical by tube core 22, and wherein, in follow-up moulding technology, moulding compound flows through band and the gap between tube core 22 and wafer 20.Molding injection port 30 can be positioned on the relative both sides of edge ring 26B with exhaust port 32-1.The diameter 42 that exhaust port 32 can be symmetrical in edge ring 26B is arranged, and wherein, diameter 42 is using molding injection port 30 as the one end in its two ends.In certain embodiments, exhaust port 32-1 is positioned at the other end place of diameter 42.In optional embodiment of the present invention (not shown), there is no exhaust port 32 at other end place.On the contrary, two exhaust ports are symmetrical relative to the other end of diameter 42 and than other all exhaust ports 32 all closer to the other end of diameter 42.
As shown in Figure 3, exhaust port 32 is denoted as 32-1 to 32-m, and wherein, m is the sequence number that can be the arbitrary integer being equal to or greater than 2.As shown in Figure 3, for convenience, exhaust port 32 can be called as exhaust port 32-n, and wherein, Integer n is sequence number and between 1 to m.Along with the increase of sequence number n, exhaust port 32-n reduces to the distance of molding injection port 30.According to some embodiments, the size/area with each exhaust port of sequence number (n+1) is equal to or less than the size/area of the exhaust port with sequence number n.Exhaust port 32-1 to 32-m can have the size constantly diminished.Such as, in certain embodiments, the size/area of each exhaust port 32-(n+1) is less than the size/area of exhaust port 32-1.Therefore, exhaust port 32-1 can have full-size W1 in the overall dimension of exhaust port 32.Exhaust port 32-m closest to molding injection port 30 can have minimum dimension Wm.In certain embodiments, the ratio of W1/Wm is greater than 1 and can be greater than about 5.
Should be understood that because exhaust port 32 shares identical pressure with the inner space of environment 36 and encapsulating mold 26, so the size of exhaust port 32 can be directly related with the flow velocity of the gas flowing through exhaust port 32.Therefore, along with the increase of the sequence number of corresponding exhaust port 32, exhaust port 32-1 to 32-m can have the gas flow rate constantly diminished.In addition, exhaust port 32-1 can have peak flow rate (PFR), and exhaust port 32-m can have lowest speed.
In the embodiments of figure 3, exhaust port 32 can not be connected directly to any pump or valve, and causes the exhaust by exhaust port 32 by the pressure differential between vacuum environment 36 and the inner space of encapsulating mold 26.On the other hand, by pump 44 (Fig. 1 and Fig. 3), vacuum environment 36 is vacuumized.
According to some embodiments, because encapsulating mold 26 is placed in environment 36, and the inner space of encapsulating mold 26 is connected to environment 36 by exhaust port 32, is pumped (such as, by pump 44) by gas/air so moulding technology comprises from environment 36.Therefore, when being injected in the inner space of encapsulating mold 26 by moulding compound 46 (representing with arrow), the vacuum in inner space pulls forward moulding compound 46 and the gap of filling between tube core 22 and the gap between tube core 22 and wafer 20.In these embodiments, pump or valve is not had to be connected directly to exhaust port 32.
Also as shown in Figure 3, in the injection period of moulding compound 46, because exhaust port 32 is of different sizes, so the flowing of moulding compound 46 is affected.Such as, all longer than the path to other any exhaust ports 32 from the path of molding injection port 30 to exhaust port 32-1.Therefore, the maximum exhaust size of exhaust port 32-1 helps moulding compound 46 to flow to exhaust port 32-1 all quickly than flowing to other exhaust ports 32.The design of exhaust port 32 makes moulding compound 46 be distributed in all parts of the inner space of encapsulating mold 26 equably, thus if all there is compared to all exhaust ports 32 situation of same size, moulding compound 46 more synchronous mode can arrive the totality space of encapsulating mold 26.
Fig. 4 to Fig. 9 shows the sectional view according to the interstage in the formation moulding technology of embodiment and corresponding device.Unless otherwise stated, the material of parts in these embodiments is identical with formation method with the material of their like (indicating with similar reference number in the embodiment of these parts shown in Fig. 1 to Fig. 3) in fact with formation method.Therefore, can find in the discussion to the embodiment shown in Fig. 1 to Fig. 3 about the technique of the parts shown in Fig. 4 to Fig. 9 and the details of material.
Fig. 4 shows the top view of encapsulating mold 26, wafer 20 and tube core 22 according to embodiment.In these embodiments, not that the environment 36 (as in Fig. 3) by sharing is vented, but the multiple valves 48 being denoted as 48-1 to 48-m are connected to corresponding exhaust port 32-1 to 32-m.In certain embodiments, exhaust port 32-1 to 32-m has identical size/area.In an alternative embodiment, exhaust port 32-1 to 32-m is of different sizes and area, and along with the increase of sequence number, corresponding exhaust port 32 can have the size constantly diminished.
According to embodiments of the invention, exhaust port 32 is connected to chamber 50 by corresponding valve 48 and pipeline 52, wherein, represents some pipelines 52 with lines.Such as, by pump 44, chamber 50 is vacuumized.Therefore, chamber 50 has low pressure (such as, lower than about 10 holders).Valve 48 is differentially opened to have different opening sizes, thus different through the air-flow of different valve 48.According to some embodiments, along with the increase of sequence number, the opening of corresponding valve 48-1 to 48-m (or the bore of opening or diameter) constantly diminishes.In other words, along with the increase of sequence number, the flow velocity of corresponding valve 48-1 to 48-m constantly diminishes.
Due to the different flow velocity of valve 48-1 to 48-m, moulding compound 46 on the direction towards exhaust port 32-1 than being pulled faster on the direction of other exhaust ports.In addition, from exhaust port 32-1 to exhaust port 32-m, the flow velocity of moulding compound 46 constantly diminishes to make up the distance constantly diminished from corresponding exhaust port 32 to molding injection port 30.Therefore, can at one time moulding compound 46 be filled in the different piece of the inner space of encapsulating mold 26.
Fig. 5 to Fig. 9 shows the top view in the interstage in molded package structure 10 according to embodiment.With reference to figure 5, the multiple valves 48 being denoted as 48-1 to 48-m are connected to corresponding exhaust port 32-1 to 32-m.Exhaust port 32-1 to 32-m can have identical size maybe can have size different from each other.Multiple exhaust port 32 is connected to vacuum chamber 50 by valve 48-1 to 48-m.Valve 48 is also connected to controller 54 and controls by it, and controller 54 is configured to control each valve 48 to open and close at the time point expected.56 are depicted as from the electrical connector of controller 54 to valve 48.
With reference to figure 5, moulding compound 46 is injected in encapsulating mold 26.At very first time point T1 place, valve 48-1 opens, and air is discharged by valve 48-1, as shown in arrow drawn on valve 48-1.Other all valve 48-2 to 48-m keep closing.Time point T1 can be the same time point starting to be injected by moulding compound 46 in encapsulating mold 26.Alternatively, time point T1 leads or lag the time point in starting to be injected into by moulding compound 46 in encapsulating mold 26.Therefore, as shown in Figure 5, moulding compound 46 mainly flows in the one direction marked with arrow 46-1, and this direction is parallel to the direction pointing to exhaust port 32-1 from molding injection port 30.Now, the moulding compound 46 flowing to the exhaust port except exhaust port 32-1 is minimum.
With reference to figure 6, the second time point T2 place after very first time point T1, valve 48-2 opens.Valve 48-1 still stays open, and air is discharged by valve 48-1 and 48-2 simultaneously, as shown in arrow drawn on valve 48-1 and 48-1.Controllable valve door 48-1 and 48-2, makes the flow velocity of exhaust port 32-1 identical with the flow velocity of exhaust port 32-2, or is greater than or less than the flow velocity of exhaust port 32-2.Other all valve 48-3 to 48-m keep closing.Therefore, as shown in Figure 6, moulding compound 46 mainly flows on the direction marked with arrow 46-1 and 46-2.Now, the moulding compound 46 flowing to the exhaust port except exhaust port 32-1 and 32-2 is minimum.Time difference between time point T1 and T2, these factors included but not limited to the power of the size in gap, the size of valve 48 and pump 44 between the viscosity of moulding compound 46, tube core 22 by the impact of various factors.
Next, as shown in Figure 7, the 3rd time point T3 place after the second time point T2, valve 48-3 opens.Valve 48-1 and 48-2 still stays open, and air is discharged, as shown in arrow drawn on valve 48-1,48-2 and 48-3 by valve 48-1,48-2 and 48-3.Controllable valve door 48-1,48-2 and 48-3, make the flow velocity of exhaust port 32-1 identical with the flow velocity of exhaust port 32-2 and/or 32-3, or be greater than or less than the flow velocity of exhaust port 32-2 and/or 32-3.Other all valves 48 except valve 48-1,48-2 and 48-3 keep closing.Therefore, as shown in Figure 7, moulding compound 46 mainly flows on the direction marked with arrow 46-1,46-2 and 46-3.Now, the moulding compound 46 flowing to the exhaust port 32 except exhaust port 32-1,32-2 and 32-3 is minimum.Time difference between time point T2 and T3 is subject to the impact of Different factor, and these factors comprise the power of the size in gap, the size of valve 48 and pump 44 between the viscosity of moulding compound 46, tube core 22.Therefore, optimal time difference (T3-T2) is found by experiment.
In a subsequent step, valve 48-4 to 48-m opens successively, and wherein, each valve 48 is opened after the opening time of valve with less sequence number.Such as, with reference to figure 8, the time point T4 place after the 3rd time point T3, valve 48-4 opens.As shown in Figure 9, open valve 48 successively, until time point Tm when valve 48-m opens.Now, moulding compound 46 may not fill the inner space of encapsulating mold 26 completely.After time point Tm, all valve 48-1 to 48-m stay open, and continue to inject moulding compound 46, until encapsulating mold 26 (may comprise the gap between tube core 22 and wafer 20) filled completely by moulding compound 46.
Each time point in time point T2 to Tm is relative to the delayed control being subject to controller 54 of the time point before it, wherein, optimal time point T1 to Tm is found by experiment, as long as and the molded design of encapsulating structure and the type of moulding compound remain unchanged, optimal time point T1 to Tm can be used for the product of same type.
Figure 10 shows the moulding technology according to embodiment of the present invention.In these embodiments, different from the situation that molding injection port 30 is positioned at the side of encapsulating mold 26, molding injection port 30 is positioned on the top 26A of encapsulating mold 26.Exhaust port 32 is distributed on edge ring 26B, and can be uniformly distributed, and makes exhaust port 32 have uniform interval each other.In addition, in these embodiments, release film 27 contacts the end face of tube core 22, and therefore, moulding compound flows through the gap between tube core 22 and the gap between tube core 22 and wafer 20, but does not flow through the top of tube core 22.
As shown in Figure 10, in order to allow to introduce in encapsulating mold 26 by moulding compound 46, the center dies 20 ' in wafer 20 does not engage with tube core 22 above, therefore, is formed and makes moulding compound 46 be conducted into space in encapsulating mold 26.In addition, encapsulating mold 26 can be placed in vacuum environment 36, and vacuum environment 36 is connected to pump 44 to be discharged from vacuum environment 36 by air.
After there is the molding implantation step as shown in Fig. 3, Fig. 4, Fig. 9 or Figure 10, the inner space of encapsulating mold 26 filled completely by moulding compound 46.Next, curing process is implemented to solidify moulding compound 46.According to the type of moulding compound 46, by ultraviolet (UV) solidification, hot curing, infrared ray cured etc. implement solidification.After solidification, from encapsulating mold, molded encapsulating structure 10 is taken out.As shown in figure 11, in the structure produced, moulding compound 46 fills the gap between tube core 22 and the gap may filled between tube core 22 and wafer 20.Expose the end face of tube core 22, do not have moulding compound to cover tube core 22.
Figure 12 and Figure 13 shows the joint of the encapsulating structure 10 according to embodiment.In these embodiments, joint is composite wafer by tube core 22.Tube core 22 is bonded to wafer 20, and in these embodiments, wafer 20 is carrier.Carrier 20 can be the non-semiconductor carrier of silicon carrier or such as glass carrier or ceramic carrier.When wafer 20 is Silicon Wafers, it can be the blank wafer wherein not forming circuit.Tube core 22 is bonded to carrier 20 by adhesive 23.
In fig. 12, encapsulating structure 10 is placed in the inner space of encapsulating mold 26, and tube core 22 faces up and contacts with release film 27.Tube core 22 comprises the active surface parts 24 facing release film 27.Surface elements 24 can comprise metal pad, metal column, solder areas and/or distribution again line etc., and they can expose and contact with release film 27.Next, adopt the substantially identical method discussed with Fig. 2 to Fig. 9 to implement moulding technology.After the molding process, release film 27 and encapsulating mold 26 is removed.
Figure 13 shows the composite wafer of generation, and it comprises encapsulating structure 10 and moulding compound 46.In the composite wafer produced, their active parts exposes by tube core 22.Therefore, can implement to composite wafer the additional technical steps such as forming fan-out distribution again line (not shown).
Embodiments of the invention have some favorable characteristics.In an embodiment of the present invention, use transfer modling method, the end face of the tube core of the encapsulating structure that release film contact is molded.In the molded packaging part produced, the end face of component pipe core exposes and does not need to implement grinding technics to expose the end face of component pipe core 22.In addition, the gap between tube core 22 and wafer 20 filled by moulding compound, therefore, do not need extra underfill step.Moulding compound fills encapsulating mold equably, and improves the efficiency of moulding technology.
According to some embodiments of the present invention, a kind of method comprises and is placed in encapsulating mold by encapsulating structure, the release film in the end face contact encapsulating mold of the component pipe core in encapsulating structure.Be injected in the inner space of encapsulating mold by injection port by moulding compound, injection port is positioned at the side of encapsulating mold.In the injection period of moulding compound, by the first exhaust port and the second exhaust port enforcement steps of exhausting of encapsulating mold.First exhaust port has the first flow velocity, and the second exhaust port has the second flow velocity being different from the first flow velocity.
According to an alternative embodiment of the invention, a kind of method comprises and is placed in the inner space of encapsulating mold by encapsulating structure, the release film in the end face contact encapsulating mold of the component pipe core in encapsulating structure.Encapsulating mold comprises injection port and has the first exhaust port and second exhaust port of different size.The method also comprises encapsulating structure and encapsulating mold is placed in chamber, wherein, and each part being positioned at encapsulating mold outside inner space being interconnected to chamber of the first exhaust port and the second exhaust port.Chamber is vacuumized.By injection port, moulding compound is injected in the inner space of encapsulating mold.
According to another embodiment of the present invention, a kind of encapsulating mold comprises top and ringwise edge ring, wherein, is connected to the edge at top below the edge that edge ring is positioned at top.Edge ring surrounds the inner space below top.Injection port is connected to the inner space of encapsulating mold.First exhaust port and the second exhaust port are positioned at edge ring place, and wherein, the first exhaust port has first size, and the second exhaust port has the second size being different from first size.
The feature that foregoing has outlined several embodiment makes those skilled in the art better can understand each aspect of the present invention.It should be appreciated by those skilled in the art, they easily can use and design based on the present invention or change for realizing the object identical with the embodiment that the present invention introduces and/or obtaining other techniques and the structure of identical beneficial effect.Those skilled in the art should also be appreciated that this equivalent constructions does not deviate from the spirit and scope of the present invention, and when not deviating from the spirit and scope of the present invention, at this, they can make a variety of changes, replace and revise.
Claims (10)
1. a method, comprising:
Be placed in by encapsulating structure in encapsulating mold, the end face of the component pipe core in described encapsulating structure contacts the release film in described encapsulating mold;
By injection port, be injected into by moulding compound in the inner space of described encapsulating mold, described injection port is positioned at the first side of described encapsulating mold; And
During the described moulding compound of injection, be vented by the first exhaust port of described encapsulating mold and the second exhaust port, described first exhaust port has the first flow velocity, and described second exhaust port has the second flow velocity being different from described first flow velocity.
2. method according to claim 1, wherein, described first exhaust port is more farther apart from described injection port than described second exhaust port, and described first flow velocity is higher than described second flow velocity.
3. method according to claim 1, wherein, described first exhaust port and described second exhaust port are all connected to same vacuum environment, and the first size of described first exhaust port is different from the second size of described second exhaust port.
4. method according to claim 1, also comprises: be positioned at the multiple exhaust ports in described encapsulating mold, and wherein, described multiple exhaust port constantly diminishes along with from described multiple exhaust port to the reduction of the respective distance of described injection port.
5. method according to claim 1, wherein, by the exhaust of the first Valve controlling by described first exhaust port, and by the control of the second valve by the exhaust of described second exhaust port, and described first valve and described second valve control described first flow velocity and described second flow velocity respectively.
6. method according to claim 5, wherein, described first exhaust port is more farther apart from described injection port than described second exhaust port, and described first-class speed control is made as and is greater than described second flow velocity by described first valve and described second valve.
7. method according to claim 5, wherein, described first exhaust port and described second exhaust port are connected to same vacuum chamber by described first valve and described second valve respectively.
8. a method, comprising:
Be placed in by encapsulating structure in the inner space of encapsulating mold, the end face of the component pipe core in described encapsulating structure contacts the release film in described encapsulating mold, and wherein, described encapsulating mold comprises:
Injection port; With
There is the first exhaust port and second exhaust port of different size;
Described encapsulating structure and described encapsulating mold are placed in chamber, wherein, each part being positioned at described encapsulating mold outside described inner space being interconnected to described chamber of described first exhaust port and described second exhaust port;
Described chamber is vacuumized; And
By described injection port, moulding compound is injected in the inner space of described encapsulating mold.
9. method according to claim 8, also comprises: inner space release film being placed in described encapsulating mold, makes the end face of the component pipe core of described encapsulating structure contact described release film.
10. a device, comprising:
Encapsulating mold, comprising:
Top; With
Edge ring, has annular shape, wherein, be connected to the edge at described top, and described edge ring surrounds the inner space below described top below the edge that described edge ring is positioned at described top;
Injection port, is connected to the inner space of described encapsulating mold; And
First exhaust port and the second exhaust port, be positioned at described edge ring place, and wherein, described first exhaust port has first size, and described second exhaust port has the second size being different from described first size.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/302,728 | 2014-06-12 | ||
| US14/302,728 US9802349B2 (en) | 2012-03-02 | 2014-06-12 | Wafer level transfer molding and apparatus for performing the same |
Publications (2)
| Publication Number | Publication Date |
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| CN105206538A true CN105206538A (en) | 2015-12-30 |
| CN105206538B CN105206538B (en) | 2018-03-09 |
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| CN201410445854.0A Active CN105206538B (en) | 2014-06-12 | 2014-09-03 | Wafer scale transfer modling and its implementation |
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| KR (1) | KR101773236B1 (en) |
| CN (1) | CN105206538B (en) |
| DE (1) | DE102014109286B4 (en) |
| TW (1) | TWI601246B (en) |
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| KR102344896B1 (en) * | 2021-05-31 | 2021-12-30 | 씰테크 주식회사 | Method of forming underfill, method of manufacturing semiconductor package using the same, and release film for underfill process |
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| US5540576A (en) * | 1992-12-22 | 1996-07-30 | Toyoda Gosei Co., Ltd. | Apparatus having a vacuum chamber for producing moldings |
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| JP2000040773A (en) * | 1998-07-23 | 2000-02-08 | Sony Corp | Resin-sealed semiconductor device and manufacture thereof |
| US6770236B2 (en) * | 2000-08-22 | 2004-08-03 | Apic Yamada Corp. | Method of resin molding |
| JP3859457B2 (en) * | 2001-03-27 | 2006-12-20 | 沖電気工業株式会社 | Manufacturing method of semiconductor device |
| JP2003243435A (en) * | 2002-02-14 | 2003-08-29 | Hitachi Ltd | Manufacturing method for semiconductor integrated circuit apparatus |
| US7915089B2 (en) | 2007-04-10 | 2011-03-29 | Infineon Technologies Ag | Encapsulation method |
| US9601434B2 (en) * | 2010-12-10 | 2017-03-21 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure |
| JP5699735B2 (en) * | 2011-03-25 | 2015-04-15 | 日本電気株式会社 | Injection molding apparatus and injection molding method |
| US8951037B2 (en) * | 2012-03-02 | 2015-02-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer-level underfill and over-molding |
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2014
- 2014-07-02 DE DE102014109286.4A patent/DE102014109286B4/en active Active
- 2014-09-03 CN CN201410445854.0A patent/CN105206538B/en active Active
- 2014-12-26 KR KR1020140190970A patent/KR101773236B1/en active IP Right Grant
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- 2015-06-12 TW TW104119035A patent/TWI601246B/en active
Patent Citations (5)
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|---|---|---|---|---|
| US3108339A (en) * | 1959-05-20 | 1963-10-29 | Harry R Bucy | Die casting mold breather |
| US5540576A (en) * | 1992-12-22 | 1996-07-30 | Toyoda Gosei Co., Ltd. | Apparatus having a vacuum chamber for producing moldings |
| US6245595B1 (en) * | 1999-07-22 | 2001-06-12 | National Semiconductor Corporation | Techniques for wafer level molding of underfill encapsulant |
| US20070235897A1 (en) * | 2006-04-10 | 2007-10-11 | Infineon Technologies Ag | Mold apparatus and method |
| CN102005440A (en) * | 2009-08-26 | 2011-04-06 | 台湾积体电路制造股份有限公司 | Integrated circuit structure and forming method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014109286B4 (en) | 2019-01-10 |
| TW201618248A (en) | 2016-05-16 |
| DE102014109286A8 (en) | 2016-03-31 |
| KR20150143265A (en) | 2015-12-23 |
| TWI601246B (en) | 2017-10-01 |
| KR101773236B1 (en) | 2017-09-12 |
| DE102014109286A1 (en) | 2015-12-31 |
| CN105206538B (en) | 2018-03-09 |
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