TW201618248A - Wafer level transfer molding and apparatus for performing the same - Google Patents

Abstract

A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

Description

Wafer level transfer molding method and equipment

This disclosure relates to wafer level transfer molding and equipment for wafer level transfer molding.

In a typical integrated circuit package, package components, such as component dies and package substrates, are stacked via flip chip bonding. To protect the stacked package components, a molding compound is placed around the component die.

Conventional molding methods include compression molding and transfer molding. Compression molding can be used for over-molding. Since compression molding cannot be used to fill the gap between the stacked dies, an additional step is required in compression molding to apply the underfill. Transfer molding, on the other hand, can be used to fill a plastic underfill between stacked package components and stacked package components. However, due to the non-uniform flow path of the molding compound, the transfer molding cannot be used on a die or package containing a circular wafer.

Some embodiments of the present disclosure provide a method comprising disposing a package structure in a mold sleeve, a top surface of the element die in the package structure contacting a release film in the mold sleeve; injecting the molding compound through the injection cassette In the inner space of the mold sleeve, the injection raft is on the first side of the mold sleeve; and during the injection of the molding compound, the first vent hole and the second vent hole are ventilated through the mold sleeve, the first a vent has a first flow rate, And the second vent has a second flow rate that is different from the first flow rate.

Some embodiments of the present disclosure provide a method comprising disposing a package structure in an interior space of a mold sleeve, a top surface of the component die of the package structure contacting a release film in the mold sleeve, wherein the mold sleeve is Including an injection port; and a first vent hole and a second vent hole having different sizes; the package structure and the die sleeve are disposed in the chamber, wherein the first vent hole and the second vent hole mutually interleave the internal space a chamber connected to a portion of the outer portion of the mold sleeve; evacuating the chamber; and injecting molding compound into the inner space of the mold sleeve via the injection bowl.

Some embodiments of the present disclosure provide an apparatus including a mold sleeve including a top portion; and an edge ring having an annular shape, wherein the edge ring is below the top portion and coupled to the top portion, and wherein the edge ring system is surrounded An inner space below the top portion; an injection port connected to the inner space of the mold sleeve; and a first vent hole and a second vent hole that are tied to the edge ring, wherein the first vent hole has a first size The second vent has a second size that is different from the first size.

Some embodiments of the present disclosure provide a method comprising disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring system Surrounding the inner space below the top portion; and injecting molding material from the first injection port and the second injection port of the mold sleeve into the inner space, the first injection port and the second injection port having different sizes.

Some embodiments of the present disclosure provide a method comprising disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring Surrounding the interior space below the top; at the first time, dispensing the molding material from the first injection cassette into the interior space, wherein the first injection cassette passes through the top of the mold sleeve; and later than At the second time of the first time, the molding material is dispensed from the second injection cassette into the inner space, wherein the second injection line passes through the top of the mold sleeve, and compared to the first injection That is, the second injection raft is farther away from the center of the top of the mold sleeve.

Some embodiments of the present disclosure provide a method comprising disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring And surrounding the inner space below the top; and injecting molding material into the inner space from the first injection port and the second injection port, wherein the first injection port and the second injection port pass through the mold sleeve The top portion and the molding material are injected through the first injection chamber compared to the second injection chamber.

10‧‧‧Package structure

20‧‧‧ wafer

22‧‧‧ Grain

26‧‧‧ mold sets

26A‧‧‧ top

26B‧‧‧Edge ring

27‧‧‧ release film

126‧‧‧ mold sets

30‧‧‧Injection

32‧‧‧Ventinel

40‧‧‧Distributor

46‧‧‧Molded plastic

52‧‧‧pipe

36‧‧‧vacuum environment

42‧‧‧diameter

44‧‧‧

48‧‧‧Valves

50‧‧‧ chamber

54‧‧‧ Controller

20’‧‧‧Center wafer

38‧‧‧ Center

31, 33‧‧‧ Straight line

23‧‧‧Adhesive

24‧‧‧Surface components

The aspects of the disclosure are best understood by the following detailed description and accompanying drawings. Note that various features are not drawn to scale in accordance with standard implementations of the industry. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

1 is a cross-sectional view illustrating wafer level transfer molding in accordance with some embodiments.

2 is a perspective view illustrating a mold chase in accordance with some embodiments.

3 is a top plan view of a wafer level transfer molding process with vents of different sizes, in accordance with some embodiments.

4 is a top plan view of a wafer level transfer molding process having different open valves connected to different vents, in accordance with other embodiments.

5 through 9 are top views illustrating intermediate steps of a time delayed wafer level transfer molding process in accordance with some embodiments.

Figure 10 is a cross-sectional view illustrating the apparatus in accordance with some embodiments.

11 and 12 are top and perspective views, respectively, of the apparatus shown in Fig. 10.

13 and 14 respectively illustrate a top view of the device according to other embodiments. Overview map.

Figure 15 illustrates a molded package structure in accordance with some embodiments.

16 is a cross-sectional view illustrating a wafer level transfer molding process in which active components of the element die face the release film, in accordance with some embodiments.

Figure 17 illustrates a molded package structure in which active components of the component die are exposed via the resulting molded package structure, in accordance with some embodiments.

The following disclosure provides many different embodiments or examples for implementing the various features of the present application. Specific examples of components and configurations are described below to simplify the disclosure of the present application. Of course, these are merely examples and are not intended to limit the application. For example, the following description of forming an initial feature on or over a second feature may include forming first and second features of direct contact, and may also include embodiments for forming other features between the first and second features. Thus, the first and second features are not in direct contact. Furthermore, the application may repeat the component symbols and/or letters in different examples. This repetition is for the purpose of simplification and clarification, and is not intended to illustrate the relationship between the various embodiments and/or the structures discussed.

Furthermore, this application may use spatially relative terms such as "below", "below", "lower", "higher", "higher" and the like to describe one of the patterns. The relationship of an element or feature to another element or feature. Spatial relative terms are used to include different orientations in use or in operation, in addition to the orientation of the components described in the drawings. The component can also be rotated to other orientations (rotated 90 degrees or other orientations) and can be interpreted using the spatial relative terms used in this disclosure.

In accordance with various embodiments of the present disclosure, the present disclosure provides apparatus for wafer level transfer molding processes and methods of wafer level transfer molding. This disclosure discusses variations of the embodiments. In the various figures and illustrated embodiments, the same element symbols are used to represent the same elements.

1 is a cross-sectional view illustrating a wafer level transfer molding process in accordance with some embodiments of the present disclosure. Referring to FIG. 1, in the mold sleeve 26, a package structure 10 is provided. The package structure 10 includes a wafer 20 and die 22 bonded to the wafer 20. In some embodiments, wafer 20 is a component wafer that includes a plurality of component wafers including active components (eg, transistors) therein. Component wafer 20 may also include passive components therein, such as resistors, capacitors, inductors, and/or transformers. The wafer 20 also includes a semiconductor substrate (not shown) such as a germanium substrate, a germanium substrate, a germanium carbon substrate, or a III-V compound semiconductor substrate. In other embodiments, wafer 20 is an interposer wafer with no active components therein. In an embodiment where the wafer 20 is an interposer wafer, the wafer 20 may also include a semiconductor substrate. The interposer wafer 20 may or may not include passive components therein, such as resistors, capacitors, inductors, and/or transformers. The top view of the wafer 20 can be circular, for example, as shown in FIG. 2, however the wafer 20 can have other topographic shapes, such as a rectangular shape. The component die 22 can include an active component therein. According to some embodiments, component die 22 includes memory die, such as static random access memory (SRAM) die, dynamic random access memory (DRAM) die, and the like. Alternatively, die 22 can be a package containing stacked dies.

The die sleeve 26 includes a top (cover) 26A which may have a circular shape as seen from a top view (Figs. 2-9). As shown in FIG. 1, a release film 27 made of a flexible material is attached to the inner surface of the die sleeve 26. The top surface of the die 22 is in contact with the bottom surface of the release film 27. Accordingly, there is no space on the top surface of the die 22. According to some embodiments, the release film 27 may also extend to the inner sidewall of the die sleeve 26. On the other hand, the gap between adjacent crystal grains 22 remains unfilled by the release film 27. Accordingly, in the molding process, the subsequently applied molding compound flows through the gap between the adjacent crystal grains 22, and may flow into the gap between the crystal grains 22 and the lower wafer 20, but does not flow to the crystal grains. 22 above. Since the gap between the crystal grains 22 is narrow, the molding compound is prevented from flowing over the crystal grains 22, and a narrow molding material path is formed. This increases the difficulty of the molding process, and thus the schemes shown in Figures 4 to 10 are used in accordance with embodiments of the present disclosure to ensure efficient and uniform molding.

The die sleeve 26 further includes an edge ring 26B (shown in FIG. 2) that surrounds the die 22. Edge ring 26B is attached to the edge of top 26A and extends downwardly from the edge of top 26A. The edge ring 26B surrounds the area under the top portion 26A, which is referred to herein as the interior space of the mold sleeve 26. Accordingly, the die 22 and the release film 27 are tied to the inner space of the die sleeve 26. The die sleeve 26 may be formed of aluminum, stainless steel, ceramic, or the like. The bottom end of the edge ring 26B can contact the top surface of the wafer 20 such that the interior space of the mold sleeve 26 is sealed.

In some embodiments, as shown in FIG. 1, a die sleeve 126 is disposed beneath the die sleeve 26 that is attached to the die sleeve. Die sleeves 26 and 126 can be used in combination to form package 10. In other embodiments, the lower die sleeve 126 is not used. According to other embodiments of the present disclosure, the bottom edge of the edge ring 26B is disposed on an edge portion of the wafer 20. In these embodiments, the lower die sleeve is not used.

Figure 1 further illustrates the injection weir 30 and the vent 32 which are attached to the opposite side of the die sleeve 26. Further, the injection port 30 and the vent hole 32 are attached to the edge ring 26B, and include an opening that connects the inner space of the die sleeve 26 to the outer space of the die sleeve 26. Since FIG. 1 is a cross-sectional view, only a single vent 32 is shown. However, a plurality of venting holes 32 may be provided in the edge ring 26B as shown in FIGS. 2 to 8. The forming dispenser 40 is coupled to the injection cassette 30 and is used to direct a molding compound 46 to the injection cassette 30. The forming dispenser 40 can include a storage tank (not shown) for storing the molding compound 46.

FIG. 2 is a schematic view showing the die sleeve 26. In some embodiments, the vents 32 (including 32-1 to 32-m) have a uniform size, wherein the size can be diameter or length/width, depending on the shape of the vent 32. For example, the vent 32 has a circular opening or an octagonal opening. In other embodiments, the vents 32 have different sizes, and the size of the vents 32 is related to the location of the individual vents 32.

The inner space of the mold sleeve 26 can be evacuated via the vent holes 32. For example, line 52 (Fig. 4) can be coupled to vent 32 and evacuated via line 52. Alternatively, as shown in FIGS. 1 and 3, the entire mold sleeve 26 and the opposite package structure 10 are disposed in a vacuum. In the environment 36, the vacuum environment can be a chamber, and thus all of the vents 32 are used to simultaneously evacuate the interior space of the mold sleeve 26. In the embodiment with vacuum environment 36, there are no tubes connected to individual vents 32. The molding material can be more uniformly applied to the wafer 20 via the vent holes 32 having different sizes.

3 is a top plan view of the mold sleeve 26, the wafer 20, and the die 22, in accordance with some embodiments. As shown in FIG. 3, the die 22 divides the internal space of the die sleeve 26 into a plurality of horizontal and vertical walkways, wherein the molding compound flows through the walkways and the die 22 and the wafer 20 in a subsequent molding process. The gap between them. Injection pockets 30 and vents 32-1 can be on opposite sides of edge ring 26B. The venting opening 32 may be symmetrically disposed on the diameter 42 of the edge ring 26B, wherein the diameter 42 has an injection weir 30 as one of its ends. In some embodiments, the vent 32-1 is located at the other end of the diameter 42. In other embodiments (not shown) of the present disclosure, the other end has no venting opening 32. Conversely, the two vents are symmetrical about the other end of the diameter 42 and are closer to the other end of the diameter 42 than all other vents 32.

As shown in FIG. 3, vent 32 is represented as 32-1 to 32-m, where m is a sequence number, which may be an integer equal to or greater than two. For convenience, vent 32 may refer to vent 32-n, where the integer n is a serial number ranging from 1 to m, as shown in FIG. As the serial number n increases, the distance from the vent 32-n to the injection enthalpy 30 decreases. According to some embodiments, the size/area of each vent having the serial number (n+1) is equal to or less than the size/area of the vent having the serial number n. The vent holes 32-1 to 32-m have smaller and smaller sizes. For example, in some embodiments, the size/area of each vent 32-(n+1) is greater than the size/area of all vents 32-1 through 32-n. Accordingly, among all the sizes of the vent holes 32, the vent holes 32-1 may have the largest dimension W1. The vent 32-m is closest to the injection weir 30, which has the smallest dimension Wm. In some embodiments, the W1/Wm ratio is greater than one and can be greater than about 5.

It can be understood that since the vent hole 32 has the same pressure of the environment 36 and the same pressure of the inner space of the die sleeve 26, the size of the vent hole 32 can be compatible with the gas. The flow rate is directly related. Therefore, as the serial number of the individual vent holes 32 increases, the vent holes 32-1 to 32-m may have smaller and smaller gas flow rates. Again, the vent 32-1 can have the highest flow rate and the air holes 32-m can have a minimum flow rate.

In the embodiment of FIG. 3, the vent 32 may not be directly connected to any of the pumps or valves, and the pressure differential between the vacuum environment 36 and the interior space of the mold sleeve 26 causes aeration via the vent 32. Alternatively, the vacuum environment 36 can be evacuated via the pump 44 (Figs. 1 and 3).

According to some embodiments, for example, since the mold sleeve 26 is disposed in the environment 36 and the vent 32 connects the interior space of the mold sleeve 26 to the environment 36, the molding process includes pumping the gas/air out of the environment 36 via the pump 44. Therefore, when the molding compound 46 (indicated by an arrow) is injected into the inner space of the mold sleeve 26, the vacuum of the inner space causes the molding compound 46 to be pulled forward and fills the gap between the crystal grains 22 and the crystal grains 22 and The gap between the wafers 20. In these embodiments, no pump or valve is directly connected to the vent 32.

As shown in FIG. 3, during the injection of the molding compound 46, since the vent holes 32 have different sizes, the flow of the molding compound 46 is affected. For example, the path of the mold injection 埠 30 to the vent 32-1 is longer than it is to any other vent 32. Therefore, the maximum venting size of the vent 32-1 facilitates faster flow of the molding compound 46 to the vent 32-1 than the other vents 32. The venting holes 32 are designed to allow the molding compound 46 to be evenly distributed to all portions of the inner space of the die sleeve 26, so that the molding compound 46 reaches the inner space of the die sleeve 26 in a more synchronized manner than all of the venting holes 32 having the same size. All parts.

4 through 9 illustrate cross-sectional views of intermediate stages of the forming process and apparatus thereof, in accordance with other embodiments. The materials and the forming methods of the components in these embodiments are substantially the same as those of the same components having the same component symbols as those shown in FIGS. 1 to 3 unless otherwise specified. Therefore, details regarding the materials of the processes and components shown in FIGS. 4 to 9 can be referred to the description of the embodiments shown in FIGS. 1 to 3.

4 illustrates a mold sleeve 26, wafer 20, and die 22 in accordance with other embodiments. Top view. In these embodiments, instead of venting via a shared environment 36 (as shown in FIG. 3), a plurality of valves 48, represented by 48-1 to 48-m, are coupled to the individual vents 32-1 to 32-m. In some embodiments, the vents 32-1 through 32-m have the same size/area. In other embodiments, the vents 32-1 through 32-m can have different sizes and areas, and as the serial number increases, the individual vents 32 can have smaller and smaller dimensions.

In accordance with an embodiment of the present disclosure, vent 32 is coupled to chamber 50 via a valve 48 and line 52, the lines 52 being indicated by line segments. For example, chamber 50 is evacuated via pump 44. Accordingly, chamber 50 has a low pressure, such as less than about 10 torr. The valves 48 are differentially opened to have different opening sizes, and thus the flow of air through the different valves 48 is different. According to some embodiments, as the serial number increases, the opening (or the diameter of the hole, or opening) of the valves 48-1 to 48-m thereof becomes smaller and smaller. In other words, as the serial number increases, the flow rate from the valves 48-1 to 48-m becomes smaller and smaller.

Due to the different flow rates of the valves 48-1 to 48-m, the speed at which the molding compound 46 is pulled out toward the vent 32-1 is greater than the speed at which the molding compound 46 is pulled out to the other vents. Furthermore, from the vent 32-1 to the vent 32-m, the flow rate of the molding compound 46 is getting smaller and smaller to compensate for the shorter and shorter distance from the vent 32 to the injection ram 30. Therefore, the molding compound 46 can be simultaneously filled into different portions of the inner space of the die sleeve 26.

5 through 9 illustrate top views of intermediate stages of forming package structure 10 in accordance with other embodiments. Referring to Figure 5, a plurality of valves 48, indicated at 48-1 through 48-m, are coupled to individual vents 32-1 through 32-n. The vent holes 32-1 to 32-m may have the same size or have different sizes from each other. A plurality of vents 32 are connected to the vacuum chamber 50 via valves 48-1 through 48-m. Valve 48 is also coupled to controller 54 and is controlled by controller 54 which is used to control each valve 48 to open and close at a desired point in time. The electrical connections from controller 54 to valve 48 are as shown at 56.

Referring to Figure 5, a molding compound 46 is injected into the mold sleeve 26. At the first time point T1, the valve 48-1 is opened, and thus the air is vented via the valve 48-1, such as the arrow on the valve 48-1. Show. All other valves 48-2 to 48-m remain closed. The time point T1 can be the same point in time at which the molding compound 46 begins to be injected into the mold sleeve 26. Alternatively, the time point T1 is before or after the point in time at which the molding compound 46 starts to be injected into the die sleeve 26. Accordingly, as shown in FIG. 5, the molding compound 46 mainly flows in a single direction indicated by the arrow 46-1, which is parallel to the direction from the injection port 30 to the vent hole 32-1. At this time, the flow rate of the molding compound 46 flowing to the vent holes other than the vent holes 32-1 is the smallest.

Referring to Figure 6, at a second time point T2, which is after the first time point T1, valve 48-2 is open. Valve 48-1 remains open so that air is simultaneously vented via valves 48-1 and 48-2, as indicated by the arrows on valves 48-1 and 48-2. Valves 48-1 and 48-2 can be controlled such that the flow rate of vent 32-1 is equal to, greater than, or less than the flow rate of vent 32-2. All other valves 48-3 to 48-m remain closed. Accordingly, as shown in Fig. 6, the molding compound 46 mainly flows into the directions indicated by the arrows 46-1 and 46-2. At this time, the flow rate of the molding compound 46 flowing to the vent holes other than the vent holes 32-1 and 31-2 is the smallest. The various factors that affect the time difference between time points T1 and T2 include, but are not limited to, the viscosity of the molding compound 46, the size of the gap between the grains 22, the size of the valve 48, and the power of the pump 44.

Next, as shown in Fig. 7, at the third time point T3, after the second time point T2, the valve 48-3 is opened. Valves 48-1 and 48-2 remain open, so air is vented via valves 48-1, 48-2 and 48-3, as indicated by the arrows on valves 48-1, 48-2 and 48-3. Valves 48-1, 48-2 and 48-3 can be controlled such that the flow rate of vent 32-1 is equal to, greater than, or less than the flow rate of vent 32-2 and/or 32-3. All other valves 48 except valves 48-1, 48-2 and 48-3 remain closed. Accordingly, as shown in Fig. 7, the molding compound 46 mainly flows into the directions indicated by the arrows 46-1, 46-2, and 46-3. At this time, the flow rate of the molding compound 46 flowing to the vent holes 32 other than the vent holes 32-1, 32-2 and 32-3 is the smallest. The various factors that affect the time difference between time points T2 and T3 include, but are not limited to, the viscosity of the molding compound 46, the gap size between the grains 22, the size of the valve 48, and the power of the pump 44. Therefore, the best time difference (T3-T2) can be found experimentally.

In a subsequent step, valves 48-4 through 48-m are sequentially opened, and each valve 48 is opened after the opening time of the valve having the smaller serial number. For example, referring to Fig. 8, at time point T4, which is after time point T3, valve 48-4 is opened. When the valve 48-m is opened, the valve 48 is continuously opened until the time point Tm, as shown in FIG. At this time, the molding compound 46 may not completely fill the internal space of the mold sleeve 26. After time point Tm, all of the valves 48-1 through 48-m remain open and the molding compound 46 continues to be injected until the molding compound 46 completely fills the mold sleeve 26 (possibly including the gap between the die 22 and the wafer 20) .

The hysteresis of each time point T2 to Tm is controlled by the controller 54 with respect to its advanced time point, wherein the optimum time points T1 to Tm can be found experimentally, and as long as the formed package structure and the type of the molding compound remain unchanged Change, you can use the same form of product.

Figure 10 is a cross-sectional view illustrating the apparatus in accordance with other embodiments of the present disclosure. In these embodiments, the injection pockets 30 are not disposed on the sides of the mold sleeve 26, but rather on the top 26 of the mold sleeve 26. The vent holes 32 are distributed on the edge ring 26B and are evenly distributed, so that the vent holes 32 have a uniform spacing from each other. Moreover, in these embodiments, the release film 27 contacts the top surface of the die 22 such that the molding compound flows through the gap between the die 22 and the gap between the die 22 and the wafer 20, but does not flow to the crystal. Above the grain 22.

As shown in Fig. 10, in order to introduce the molding compound 46 into the mold sleeve 26, the center wafer 20' in the wafer 20 is not joined to the upper die 22, so that a space for molding the plastic is introduced into the mold sleeve 26. Further, the die sleeve 26 can be disposed in a vacuum environment 36 that is coupled to the pump 44 for evacuating the vacuum environment 36.

Figure 11 is a plan view showing the apparatus shown in Figure 10. In some embodiments, the top shape of the die sleeve 26 is similar to the top view shape of the wafer 20. The top of the die sleeve 26 can be circular and have a center 38 that can also be substantially aligned with the center of the wafer 20. Additionally, the die sleeve 26 can include a plurality of injection turns represented by 30-1 through 30-n, where the integer n can be any suitable number. In the description of the present disclosure, the injection 埠 30 closer to the center 38 refers to the internal hemorrhoid. The injection 埠30, which is farther away from the center 38, refers to the external hemorrhoid. It can be understood that the words "inside" and "outside" are relative to each other. For example, the injection crucible 30-2 is an outer crucible compared to the injection crucible 30-1, and the injecting crucible 30-2 is an inner crucible as compared to the injection crucible 30-3. The injection enthalpy 30-1 is closest to the center and thus refers herein to the center 埠 30-1. The implanted 埠 30-n is closest to the edge of the die sleeve 26 and thus refers herein to the edge 埠.

In some embodiments, the injection cassette 30 is substantially aligned with the line 31 that intersects the center of the top 26A of the circular die sleeve 26. Molding compound 46 (Fig. 10) is injected into mold sleeve 26 via a plurality of injection rams 30 which flow to the edges of mold sleeve 26. In some embodiments, the dimension W1' of the center turn 30-1 can be a diameter or a length/width that is greater than the dimension Wn' of the edge turns 30-n. W1'/Wn' may be greater than 1, and may also be greater than about 5. The injection turns 30-1 to 30-n may also have smaller and smaller dimensions, and each outer turn may be smaller in size than the inner turn. Accordingly, the molding compound 46 injected through the injection crucible 30 closer to the edge of the mold sleeve 26 is more than the molding compound 46 injected into the center 38 via the injection crucible 30. The portion of the molding compound 46 injected through the center weir 30-1 needs to be moved a long distance (and filled with a larger space) than the portion of the molding compound 46 injected through the edge weir 30-n. Accordingly, by designing the injection crucibles 30 having different sizes, portions of the molding compound 46 injected through the different injection crucibles 30 can flow to the edges of the mold sleeve 26 substantially simultaneously (in the direction of the arrow shown in FIG. 11). Therefore, the possibility that the molding compound 46 forms a void is lowered.

In some exemplary embodiments, the molding compound 46 may be simultaneously injected via the crucible 30. In other embodiments, the molding compound 46 is injected from different injection ports 30 at different times. In some exemplary embodiments, the center turn 30-1 begins to inject molding compound 46 while the other injection ports 30 are delayed in injection relative to their inner bores. At a time after all of the implants 30 have begun to be implanted, the edge turns 30-n can begin to implant. In some exemplary embodiments, the time at which the edge 埠 30-n begins to implant is greater than the time delay at which the center 埠 30-1 begins to implant is greater than about 70 seconds.

10 and 11 also illustrate a forming dispenser 40 that is coupled to the injection bowl 30 and that is used to introduce the molding compound 46 to the injection bowl 30. Forming dispenser 40 includes a controller 41, which is used to control the injection time via different injection ports 30.

Figure 12 is a schematic view showing the structure shown in Figures 10 and 11. In some embodiments, the vents 32 (including 32-1 to 32-m) have a uniform size, wherein the dimensions may be diameter or length/width, depending on the shape of the vent 32. In other embodiments, the vents 32 have different sizes depending on where the individual vents 32 are located. For example, the vent 32-1 is the farthest from the injection weir 30 and also the farthest from the line 31 aligned with the injection weir 30. Among all the sizes of the vent holes 32, the vent holes 32-1 may have a maximum size W1. The vent 32-m closest to the injection port 30 and the straight line 31 may have the smallest dimension Wm. The vent holes 32-1 to 32-m have smaller and smaller sizes. In some embodiments, the ratio of W1/Wm can be greater than one or greater than about 5. The inner space of the mold sleeve 26 can be evacuated via the vent holes 32. For example, a conduit (not shown) can be coupled to the vent 32 and can be evacuated via the conduit. Alternatively, as shown in FIG. 10, the entire mold sleeve 26 can be disposed in a vacuum environment 36 such that all of the vents 32 are used to simultaneously evacuate the interior space of the mold sleeve 26. In embodiments having a vacuum environment 36, no tubing connected to the individual vents 32 is required. The molding compound 46 can be more evenly distributed over the entire wafer 20 by the vent holes 32 of different sizes.

13 and 14 illustrate top and bottom views, respectively, of a device for wafer level forming, in accordance with other embodiments. Unless otherwise stated, the materials and processes in the embodiments are substantially the same as those in the embodiment shown in FIGS. 10 to 12. The details of the embodiment shown in Figures 13 and 14 are discussed in the embodiments of Figures 10 through 12. Referring to Figure 13, a plurality of implants 30-1 through 30-m may be distributed and aligned with lines 31 and 33, which are perpendicular to each other. Both lines 31 and 33 can pass through the center 38 of the die sleeve 26. By the same embodiment of Figures 10 through 12, the size of the injection weir 30 closer to the center 38 can be greater than the size of the injection weir 30 that is further from the center 38. Furthermore, injection of the molding compound 46 via the injection port 30 can be performed earlier than injection of the molding compound 46 via the opposite outer injection port 30.

Figure 14 is a schematic diagram showing the apparatus of Figure 13; In some embodiments, the vents 32 have a uniform size. In other embodiments, the vents 32 have different sizes. For example, the vent 32 - 1 that is furthest from the injection 埠 30 and the straight lines 31 and 33 may have the largest size, and the vent 32 - m closest to the injection 埠 30 and the straight lines 31 and 33 may have the smallest size.

After the injection step shown in Figures 3, 4, 9 or 10 occurs, the molding compound 46 completely fills the interior space of the mold sleeve 26. Next, a hardening process is performed to cure the molding compound 46. In the form of a molded plastic 46, it can be hardened by ultraviolet (UV) hardening, thermal hardening, infrared hardening, or the like. After hardening, the formed package structure 10 is removed from the mold sleeve 26. In the resulting structure, as shown in FIG. 15, the molding compound 46 fills the gap between the grains 22 and may fill the gap between the die 22 and the wafer 20. The top surface of the die 22 is exposed and the molding compound does not cover the die 22.

16 and 17 illustrate the joining of the package structure 10 in accordance with other embodiments. In these embodiments, the die 22 is to be bonded to form a composite wafer. The die 22 is attached to the wafer 20, which is the carrier in these embodiments. The carrier 20 can be a tantalum carrier or a non-semiconductor carrier such as a glass carrier or a ceramic carrier. When the wafer 20 is a germanium wafer, it may also be a blank carrier in which no circuit is formed. Adhesive 23 attaches die 22 to carrier 20.

In FIG. 16, the package structure 10 is disposed in the inner space of the die sleeve 26 with the die 22 facing upward and contacting the release film 27. The die 22 includes an active surface assembly 24 that faces the release film 27. Surface component 24 can include a metal pad, a metal post, a pad, a redistribution, and/or the like that can expose and contact release film 27. Next, the molding process is carried out using substantially the same method as shown in FIGS. 2 to 9. After the molding process, the release film 27 and the mold sleeve 26 are removed.

Figure 17 illustrates the resulting composite wafer comprising package structure 10 and molding compound 46. In the resulting composite wafer, die 22 has exposed active components. Accordingly, on the composite wafer, other process steps can be performed, such as forming fan-out rewiring (not shown).

The disclosed embodiments have some advantageous features. In an embodiment of the present disclosure, a transfer molding process is used to release the top surface of the die of the film contact molded package structure. In the resulting molded package, the top surface of the die of the component is exposed without the need for a polishing process to expose the top surface of the die 22 . In addition, the molding compound fills the gap between the die 22 and the wafer 20, thus eliminating the need for additional underfill filling steps. The molding compound uniformly fills the mold sleeve, thereby improving the efficiency of the molding process.

In accordance with some embodiments of the present disclosure, a method includes disposing a package structure in a mold sleeve, the top surface of the component die in the package structure contacting the release film in the mold sleeve. The molding compound is injected into the inner space of the mold sleeve through the injection crucible, which is attached to one side of the mold sleeve. In the process of injecting the molding compound, the venting step is performed through the first vent hole and the second vent hole of the die sleeve. The first vent has a first flow rate and the second vent has a second flow rate different than the first flow rate.

In accordance with other embodiments of the present disclosure, a method includes disposing a package structure into an interior space of a mold sleeve, the top surface of the component die in the package structure contacting a release film in the mold sleeve. The mold sleeve includes an injection port, and a first vent hole and a second vent hole having different sizes. The method further includes disposing the package structure and the mold sleeve in the chamber, wherein the first venting aperture and the second venting aperture each interconnect the interior space to a portion of the chamber outside the mold sleeve. The chamber is vacuumed. The molding compound is injected into the inner space of the mold sleeve through the injection crucible.

According to other embodiments of the present disclosure, the mold sleeve includes a top portion and an edge ring having an annular shape with the edge ring attached below and attached to the edge of the top portion. The edge ring encloses the inner space below the top. The injection tether is connected to the inner space of the mold sleeve. The first vent and the second vent are tied to the edge ring, wherein the first vent has a first size and the second vent has a second size different from the first size.

According to an embodiment, the die sleeve comprises a top portion and an edge ring having an annular shape. Below the edge ring and attached to the edge of the top. The edge ring contains a vent. The edge ring further surrounds the interior space below the top of the mold sleeve. Multiple injection tethers connected to the mold Set of interior spaces. A plurality of injection tethers are substantially aligned with a line passing through the center of the top of the die set. A plurality of injection ports have different sizes.

According to other embodiments, the die set includes a top having a rounded edge and an edge ring attached to the rounded edge of the top. The top and edge loops of the sleeve define the internal space. A plurality of venting holes pass through the edge ring of the die sleeve, wherein the plurality of venting holes have different sizes. The center injection tether is passed through the top of the mold sleeve and connected to the inner space of the mold sleeve. The center injecting the tether is substantially aligned with the center of the top of the die.

According to other embodiments, a method includes providing a mold sleeve including a top and an edge ring that is below the top and connected to the top. The edge ring encloses the interior space below the top. Set the package structure in the internal space. The package structure includes a wafer and a plurality of dies bonded to the wafer. At the first time, the molding material begins to be injected into the interior space from the first injection port, which passes through the top of the mold sleeve. At a second time after the first time, the molding material begins to be injected into the interior space from the second injection crucible, which passes through the top of the mold sleeve. The second injection raft is relatively farther from the center of the top of the mold sleeve than the first injection enthalpy.

The foregoing description summarizes the features of some embodiments, and those skilled in the art can understand the aspects of the disclosure. Those skilled in the art will appreciate that the present disclosure can be readily utilized as a basis for designing or modifying other processes and structures to achieve the same objectives and/or the same advantages as the present application. It should be understood by those skilled in the art that the present invention is not limited to the spirit and scope of the disclosure, and various changes, substitutions and changes can be made without departing from the spirit and scope of the disclosure.

10‧‧‧Package structure

20‧‧‧ wafer

22‧‧‧ Grain

26‧‧‧ mold sets

26A‧‧‧ top

26B‧‧‧Edge ring

27‧‧‧ release film

126‧‧‧ mold sets

30‧‧‧Injection

32‧‧‧Ventinel

40‧‧‧Distributor

36‧‧‧vacuum environment

44‧‧‧

Claims (10)

A method comprising: disposing a package structure in a die sleeve, wherein a top surface of the component die in the package structure contacts a release film in the die sleeve; and molding the molding compound into the inner space of the die sleeve via the injection flaw The injection raft is on the first side of the mold sleeve; and during the injection of the molding compound, the first vent hole has a first flow rate through the first vent hole of the mold sleeve and the second vent hole And the second vent has a second flow rate that is different from the first flow rate. The method of claim 1, wherein the first vent is farther from the injection raft than the second vent, and wherein the first flow rate is greater than the second flow rate. The method of claim 1, wherein the first venting aperture and the second venting aperture are both connected to the same vacuum environment, and wherein the first venting aperture has a first dimension different from the second venting aperture Second size. A method comprising: disposing a package structure in an inner space of a mold sleeve, a top surface of the element die of the package structure contacting a release film in the mold sleeve, wherein the mold sleeve comprises: an injection cassette; a first vent hole and a second vent hole of different sizes; the package structure and the die sleeve are disposed in the cavity, wherein the first vent hole and the second vent hole interconnect the internal space to the outside of the die sleeve a portion of the chamber; evacuating the chamber; and injecting molding compound into the interior space of the mold sleeve via the injection bowl. An apparatus includes: a mold sleeve comprising: a top portion; and an edge ring having an annular shape, wherein the edge ring is below the top portion and connected to the top portion, and wherein the edge ring system surrounds an inner space below the top portion; and an injection port that is coupled to the mold sleeve An inner space; and a first vent hole and a second vent hole that are tied to the edge ring, wherein the first vent hole has a first size, the second vent hole has a second size, the second size is different The first size. A method comprising: disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring system surrounds the interior portion below the top portion And filling the molding material from the first injection 埠 and the second injection 该 of the mold sleeve into the internal space, the first injection 埠 and the second injection 埠 having different sizes. The method of claim 8, wherein the molding material is first injected into the inner space from the first injection port, and then injected into the inner space from the second injection port. The method of claim 8, wherein the first injection cassette is closer to a center of the top of the mold sleeve than the second injection cassette, and more than the second injection cassette The molding material is injected through the first injection enthalpy. A method comprising: disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring system surrounds the lower portion of the top portion An interior space; at a first time, dispensing a molding material from the first injection cassette into the interior space, wherein the first injection cassette passes through the top of the mold sleeve; and at a second time later than the first time Time, start to distribute the molding from the second injection Material into the interior space, wherein the second injection raft passes through the top of the mold sleeve, and the second injection raft is located further away from the center of the top of the mold sleeve than the first injection ram. A method comprising: disposing a package structure in an interior space of a mold sleeve, the mold sleeve including a top portion, and an edge ring below the top portion and coupled to the top portion, wherein the edge ring system surrounds the top portion The interior space; and injecting molding material from the first injection cassette and the second injection cassette into the internal space, wherein the first injection cassette and the second injection cassette pass through the top of the mold sleeve, and A plurality of the molding material is injected through the first injection enthalpy via the second injection enthalpy.