CN105183084A - Layout and manufacturing method of computer mainboard - Google Patents
Layout and manufacturing method of computer mainboard Download PDFInfo
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- CN105183084A CN105183084A CN201510575450.8A CN201510575450A CN105183084A CN 105183084 A CN105183084 A CN 105183084A CN 201510575450 A CN201510575450 A CN 201510575450A CN 105183084 A CN105183084 A CN 105183084A
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Abstract
The invention relates to a computer mainboard, in particular to a layout and manufacturing method of the computer mainboard. The mainboard comprises a substrate and a bonding layer fixed on the substrate, the upper portion of the bonding layer is fixedly provided with a connecting layer, and the bonding layer is connected between the upper portion of the substrate and the lower portion of the connecting layer; a conductive circuit layer is immersed on the connecting layer and coated with an ink layer, a terminal is fixed on the conductive circuit layer, and a soldering tin layer is arranged on the terminal; the surface of the mainboard is provided with a central processing unit, an embedded multimedia card, memories, a power management integrated circuit, a wireless receiver and Bluetooth. The computer mainboard at least has the advantages of being high in heat conductivity, efficient in heat dissipation, capable of improving the service life of all the elements and convenient to product and manufacture.
Description
Technical field
The present invention relates to computer main board, be specifically related to a kind of layout and method for making of computer main board.
Background technology
Mainboard (English: MotherboardMainboard is called for short Mobo), also known as motherboard, system board, logic card, motherboard, base plate etc., is the center or the main circuit board that form Complex Electronic Systems Based such as robot calculator.Typical mainboard can provide a series of abutment, for processor, video card, sonic-effect card, hard disk, storer, to device engagement such as external equipment.They directly insert relevant slot usually, or use connection.
In prior art, application number: 201310019056.7, the applying date: 2013.01.19, application title: a kind of heat abstractor of notebook computer, this heat abstractor utilizes cold-producing medium to come for laptop radiating.Cold-producing medium in the present invention is the liquid of boiling point between 50 ~ 65 DEG C, and it is loaded into the airtight fluid reservoir be positioned on main board for notebook computer, is connected to drain pipe and liquid back pipe in these fluid reservoir both sides; From the other end of drain pipe to the liquid back pipe other end, be connected with the heat exchanger plates treating heat dissipation element, steam transmitting pipe and outer gelled heat interchanger that notebook computer is settled on top in turn.Use the present invention, can save the radiator fan in nearly all notebook computer, because apparatus of the present invention do not need electric power, do not have the reason of mechanical motion and gear train, therefore possess substantially can not impaired advantage.
How right, notebook computer dispels the heat, and outside mode of installing heat abstractor can be adopted to solve, and how to dispel the heat to the inside of notebook computer, be but the technical bottleneck of those skilled in the art.
How to design a kind of layout and method for making of computer main board, high efficiency and heat radiation can be carried out to the inside of notebook computer, become the technical matters that we are badly in need of solving.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, and a kind of layout and method for making of computer main board are provided.
The object of the invention is to have come by following technical solution, a kind of layout of computer main board, described mainboard comprises substrate and is fixed on the tack coat of base upper portion, the top of tack coat is fixed with articulamentum, tack coat is connected between base upper portion and articulamentum bottom, articulamentum immerses and has conductive circuit layer, conductive circuit layer is coated with ink layer, conductive circuit layer is fixed with terminal, terminal is provided with soldering-tin layer, the surface of mainboard is welded with central processing unit, embedded multi-media card, storer, power management integrated circuit, wireless receiver and bluetooth.
Described substrate adopts polyimide resin to make, and the bottom of substrate is fixed with heat-conducting layer, and heat-conducting layer adopts boron nitride material to make.
Described central processing unit is fixedly welded on the terminal in mainboard centre position, and wherein, embedded multi-media card, storer, power management integrated circuit, wireless receiver and bluetooth are arranged along central processing unit and be welded on mainboard.
Described embedded multi-media card is located at the left side of central processing unit, and embedded multi-media card is fixedly welded on the centre position, left side of mainboard.
Described storer is provided with multiple, the equally spaced following side being arranged in central processing unit of storer
Described power management integrated circuit is fixedly welded on the limit, left side of mainboard, on the left of mainboard, limit is fixed with power contact, and power contact is electrically connected by limit on the left of mainboard and power management integrated circuit.
Described wireless receiver and bluetooth are fixedly welded on the upper edge place of mainboard.
The right edge of described mainboard is fixed with multiple slot.
A method for making for computer main board, comprises the following steps;
There is provided a substrate for providing overall support for mainboard, substrate is tabular;
One tack coat is provided, tack coat is coated with or spreads the upper face of cloth in substrate;
There is provided an articulamentum, articulamentum is by bonding fixing between tack coat and the upper surface of substrate;
Articulamentum is provided with conductive circuit layer, and conductive circuit layer is fixedly immersed in articulamentum on the surface by the mode of being conflicted by high pressure;
The surface of conductive circuit layer is coated with resistant to elevated temperatures ink layer and in conductive circuit layer, is welded to connect the terminal of metal;
Fusion welding tin layers on metal terminal.
The present invention compared with prior art, has following obvious advantage and effect:
1, reasonable in design, connection is tight, stability is high;
2, selection is convenient, is convenient to manufacture, and is easy to universal;
3, thermal conductivity is strong, and high efficiency and heat radiation, improves the life-span of each element;
4, the thickness of mainboard is thin and length and width are narrower, is easy to install;
5, high temperature resistant, the strength of materials is higher, sturdy and durable.
Accompanying drawing explanation
Fig. 1 is the layout of the mainboard in the present invention;
Fig. 2 is the mounting structure figure of mainboard in the present invention;
Fig. 3 is the sectional view of the mainboard in the present invention;
In figure, mainboard 1, substrate 11, heat-conducting layer 111, tack coat 12, articulamentum 13, conductive circuit layer 14, ink layer 15, terminal 16, soldering-tin layer 17, central processing unit 21, embedded multi-media card 22, storer 23, power management integrated circuit 24, power contact 241, wireless receiver 25, bluetooth 26, slot 27, A are the drain pan of notebook computer.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be described in detail: as shown in fig. 1, the layout of a kind of computer main board of the present invention, described mainboard 1 comprises substrate 11 and is fixed on the tack coat 12 on substrate 11 top, the top of tack coat 12 is fixed with articulamentum 13, tack coat 12 is connected between substrate 11 top and articulamentum 13 bottom, articulamentum 13 immerses and has conductive circuit layer 14, conductive circuit layer 14 is coated with ink layer 15, conductive circuit layer 14 is fixed with terminal 16, terminal 16 is provided with soldering-tin layer 17, the surface of mainboard 1 is welded with central processing unit 21, embedded multi-media card 22, storer 23, power management integrated circuit 24, wireless receiver 25 and bluetooth 26, at least there is thermal conductivity strong, high efficiency and heat radiation, improve the life-span of each element, be convenient to the effect manufactured.
Mainboard 1 is arranged in the drain pan A of notebook computer, various components and parts are fixedly welded on respectively on the surface of mainboard 1, utilize the thermal diffusivity of mainboard 1, improve the radiating effect of each components and parts, be wherein main heater element by central processing unit 21, effectively dispelled the heat in the centre position that central processing unit 21 is fixed on mainboard 1.
Mainboard 1 by heat conduction extremely whole mainboard 1, thus improves the radiating efficiency of mainboard 1.
Shown in Fig. 1 ~ Fig. 3, a kind of layout of computer main board, described mainboard 1 comprises substrate 11 and is fixed on the tack coat 12 on substrate 11 top, and tack coat 12 is for being coated on high temperature resistant glue on mainboard 1 and double faced adhesive tape, and wherein high temperature resistant glue can adopt organic high-temp glue or inorganic high-temp glue.
Wherein, silicone based glue, phenolic resin glue, urea-formaldehyde resin adhesive, heatproof epoxy glue, polyimide glue etc.This kind of glue can have softer, elastic, or toughness, or hard rigidity.Organic high-temp glue generally can add functional filler, gives its insulation, heat conduction, magnetic conduction, fire prevention, the function such as fire-retardant.In the epoxy glue of heatproof, high temperature resistant epoxy glue-joint strength is quite high, and the resistance to effect run up is fine, and ageing-resistant excellence, effect is very outstanding.Inorganic high-temp glue: inorganic high-temperature resistant glue heatproof can reach 1800 DEG C, can use for a long time in fire, break the worldwide technological puzzle of a high-temperature-resistant adhesive heatproof below 1300 DEG C, high temperature resistant inorganic bonding agent is a kind of high temperature resistant inorganic nanocomposite binders utilizing inorganic nano material to make through polycondensation reaction, by the screening to composition proportion and preparation technology parameter, to obtain cementing agent be pH value is neutral suspension/dispersion, not only cohesive force is strong and to metallic matrix non-corrosiveness, and good adhesive property and corrosion resistivity can be kept under high temperature again, long service life.Inorganic oxide copper high-temperature-resistant adhesive is easy to use; can be used for the directly bonding of exotic material; coating can directly the high temperature matrix surface spraying of 400-1000 DEG C; while moisture evaporation; coating can stick to matrix surface instantaneously; the high temperature resistant protective finish even compact formed, thermal shock resistance is good, and protection effect is remarkable.
The top of tack coat 12 is fixed with articulamentum 13, wherein, articulamentum 13 adopts resin material to make, wherein, resin material adopts thermoset resin, and thermoset resin after hardening, due to intermolecular cross-linking, form reticulate texture, therefore rigidity is large, hardness is high, heatproof is high, nonflammable, product size good stability, but property is crisp.Thus most thermoset resin is before being shaped to goods, all adds various reinforcing material, as wood powder, mineral powder, fiber or textile etc. make it strengthen, makes reinforced plastic.In thermoset resin, add reinforcing material and other adjuvants, as hardening agent, colorant, lubricant etc., thermosetting plastics can be made, have in powdery, granular, what have is made bulk, sheet, is referred to as moulding compound.The job operation that thermosetting plastics is conventional has mold pressing, lamination, transfer molding, casting etc., and some kind also can be used for injection moulding.The multiplex polycondensation of thermoset resin (see polymerization) method is produced.Conventional thermoset resin has phenolics, Lauxite, melamine formaldehyde resin, epoxy resin, unsaturated polyester, polyurethane, polyimide, organic siliconresin etc.Wherein, the Si-O key of organic siliconresin has higher bond energy (363kJ/mol), so more stable, thermotolerance and resistance to elevated temperatures are all very high.Its thermal stability scope can reach 200 ~ 250 DEG C in general, meets the temperature requirements of mainboard 1.
Utilize tack coat 12 by fastening the linking together in substrate 11 top and articulamentum 13 bottom, form stable mainboard 1 structure.
Articulamentum 13 immerses and has conductive circuit layer 14, conductive circuit layer 14 adopts Copper Foil or silver foil.Copper Foil is a kind of cloudy matter electrolysis material, be deposited in one deck on articulamentum 13 thin, continuous print metal forming, it is as the electric conductor of mainboard 1.Copper Foil is easily bonded on the articulamentum 13 of insulation, adopts and carries out surface corrosion formation circuit patterns to Copper Foil.Copper Foil has low surperficial oxygen species, can adhere to and various different substrate materials, and as metal, insulating material etc., have wider temperature usable range.Be mainly used in electromagnetic screen and antistatic, copper-foil conducting electricity be placed in substrate surface, metal substrate combining, there is excellent conduction, and the effect of electromagnetic screen is provided.Can be divided into: self-adhesion Copper Foil, twoly lead Copper Foil, singly lead Copper Foil etc.Electron level Copper Foil (purity more than 99.7%, thickness 5um-105um) is the basic material of electronics industry, is conducive to direct selection, is convenient to popularize.
Silver foil, utilizes the silver bullion of tabular, is carried out rolling extension by silver foil, is utilizing chemical corrosion, and silver foil corrosion is formed circuit patterns.In the application, adopt silver foil to be fabricated to conductive circuit layer 14, conductive circuit layer 14 has higher electric conductivity, and signal transmission is very fast.
Conductive circuit layer 14 is coated with ink layer 15, ink layer 15 adopts the mode of serigraphy or flexible printing, by high temperature resistant Ink Application or be printed in conductive circuit layer 14,
High temperature resistant ink composition contained by it: mainly with polyvinyl chloride (PVC) and phthalate composition, mixes polyvinyl chloride and phthalic ester, colouring stabilizer, stabilizing agent, thickening agent and forms heat-set ink.High temperature resistant ink, utilizes its thermosetting, strengthens the support effect of ink layer 15, and the high temperature resistant ink adopting organic material to produce, can carry out realizing higher insulation effect.
Conductive circuit layer 14 is fixed with terminal 16, terminal 16 can be the terminal of the metal of hollow cylinder, wherein, terminal 16 can be single hole, diplopore, socket, hook etc., adopt, copper is silver-plated, copper is zinc-plated, copper, aluminium, the materials such as iron make, the single hole terminal that wherein terminal 16 adopts copper silver-plated has higher Signal transmissions, and several single hole terminals are arranged in pin shape.
Terminal 16 is provided with soldering-tin layer 17, and soldering-tin layer 17 adopts scolding tin to be coated on terminal 16 or in the hole of terminal 16, utilizes the scolding tin of droplet-like, is welded by scolding tin, and terminal 16 fixing in conductive circuit layer 14 welds together with each components and parts by scolding tin.
Namely utilize each terminal 16 on mainboard 1 surface, utilize welding that the components and parts such as central processing unit 21, embedded multi-media card 22, storer 23, power management integrated circuit 24, wireless receiver 25 and bluetooth 26 are welded on mainboard 1 on the surface.
Described substrate 11 adopts polyimide resin to make, polyimide is one of high-molecular organic material of combination property the best, high temperature resistantly reach more than 400 DEG C, Long-Time Service temperature range-200 ~ 300 DEG C, without sharp melting point, high insulating property, 103 hertz of lower specific inductive capacity 4.0, dielectric loss only 0.004 ~ 0.007, belong to F to H class F insulating material F wherein, polyimide adopts, condensation polymer type aromatic polyimide, and condensation polymer type aromatic polyimide is reacted by aromatic diamine and aromatic dianhydride, aromatic tetracarboxylic acid or aromatic tetracarboxylic acid's dialkyl and obtained.Because the synthetic reaction of condensation polymer type polyimide is carried out in the such as sprotic solvent of the higher boiling such as dimethyl formamide, 1-METHYLPYRROLIDONE, and composite polyimide material normally adopts prepreg moulding process, it is clean that the sprotic solvent of these higher boilings prepared very difficult volatilization in kapton polyimide journey at prepreg, also there is volatile matter to release in polyamic acid cyclisation (imidization) period simultaneously, this produces hole with regard to easy in composite product, is difficult to the compound substance obtaining high-quality, do not have hole.
The bottom of substrate 11 is fixed with heat-conducting layer 111, and block heat-conducting layer 111 adopts boron nitride material to make.By heat-conducting layer 111, the heat in mainboard 1 is carried out heat conduction, thus realize the heat radiation to mainboard 1.Boron nitride has chemical resistance of concrete character, not by mineral acid and water erosion.Compression strenght is 170MPa.High-temperature stability is fine, resistance to heat shocks is fine, intensity is very high, very high expansion coefficient is lower, the very large insulativity of resistivity is higher, corrosion-resistant for coefficient of heat conductivity, can microwave or thoroughly infrared ray thoroughly.
Described central processing unit 21 is fixedly welded on the terminal in mainboard 1 centre position, and wherein, embedded multi-media card 22, storer 23, power management integrated circuit 24, wireless receiver 25 and bluetooth 26 are arranged along central processing unit 21 and be welded on mainboard 1.
The central processing unit 21 in mainboard 1 pair of centre position dispels the heat efficiently.Utilize the element that other heat radiations around central processing unit 21 are lower, the heat of central processing unit 21 is distributed.
Described embedded multi-media card 22 is located at the left side of central processing unit 21, and embedded multi-media card 22 is fixedly welded on the centre position, left side of mainboard 1.Soaking is carried out to the left side of central processing unit 21.
Described storer 23 is provided with multiple, adopts 4 storeies 23, utilizes the equally spaced following side being arranged in central processing unit 21 of storer 23, gives out heat uniformly.
Described power management integrated circuit 24 is fixedly welded on the limit, left side of mainboard 1, on the left of mainboard 1, limit is fixed with power contact 241, and power contact 241 is electrically connected by limit on the left of mainboard 1 and power management integrated circuit 24.
By power contact 241 and battery terminal contact that is block or sheet, conduct electricity.Utilize the duty of power management integrated circuit 24 pairs of batteries to control, avoid the electricity being supplied to central processing unit 21 larger.
Described wireless receiver 25 and bluetooth 26 are fixedly welded on the upper edge place of mainboard 1.Effectively can avoid the interference of signal, improve and wireless receiver 25 and bluetooth 26 accessed or the efficiency of release signal.
The right edge of described mainboard 1 is fixed with multiple slot 27.Wherein, slot 27 comprises USB interface, IEEE1394 interface, USB interface, S-Video lead-out terminal, TV-OUT interface, Modem(RJ-11), the interface such as network card interface (RJ-45), S/PDIF interface, PC card interface, Express card slot, card reader interface.
In the right edge being fixedly welded on mainboard 1 unified by multiple slot 27, be conducive to the arrangement of conductive circuit layer 14, meanwhile, utilize the gap of multiple slot 27 and vacant, mainboard 1 is dispelled the heat.
A method for making for computer main board, comprises the following steps;
There is provided a substrate 11 for providing overall support for mainboard 1, substrate 11 is in tabular;
Adopt the mode of integral molded plastic to produce substrate 11, by a tack coat 12, tack coat 12 is coated with or spreads the upper face of cloth in substrate 11; Utilize tack coat 12 that fixing bonding between tack coat 12 and the upper surface of substrate 11 is formed platy structure.
There is provided an articulamentum 13, articulamentum 13 is bondd by fixing between tack coat 12 and the upper surface of substrate 11;
Articulamentum 13 is provided with conductive circuit layer 14, and conductive circuit layer 14 is fixedly immersed in articulamentum 13 on the surface by the mode of being conflicted by high pressure; The conductive circuit layer 14 of having corroded is passed through the mode of extruding, immerse or be fitted on the surface of articulamentum 13, forming stable syndeton.
The surface of conductive circuit layer 14 is coated with resistant to elevated temperatures ink layer 15 and in conductive circuit layer 14, is welded to connect the terminal 16 of metal; The mode of welding welding is utilized to be welded in conductive circuit layer 14 by the terminal 16 of metal.
Fusion welding tin layers 17 on metal terminal 16.
By foregoing description, those skilled in the art can implement.
Above content described in this instructions is only to structure example of the present invention explanation; And the parts of the present invention title of getting also can be different, all equivalences of doing according to structure, feature and the principle described in inventional idea of the present invention or simple change, be included in the protection domain of patent of the present invention.
Claims (9)
1. the layout of a computer main board, it is characterized in that: described mainboard (1) comprises substrate (11) and is fixed on the tack coat (12) on substrate (11) top, the top of tack coat (12) is fixed with articulamentum (13), tack coat (12) is connected between substrate (11) top and articulamentum (13) bottom, articulamentum (13) immerses and has conductive circuit layer (14), conductive circuit layer (14) is coated with ink layer (15), conductive circuit layer (14) is fixed with terminal (16), terminal (16) is provided with soldering-tin layer (17), the surface of mainboard (1) is welded with central processing unit (21), embedded multi-media card (22), storer (23), power management integrated circuit (24), wireless receiver (25) and bluetooth (26).
2. the layout of computer main board according to claim 1, is characterized in that: described substrate (11) adopts polyimide resin to make, and the bottom of substrate (11) is fixed with heat-conducting layer (111), and heat-conducting layer (111) adopts boron nitride material to make.
3. the layout of computer main board according to claim 1, it is characterized in that: described central processing unit (21) is fixedly welded on the terminal in mainboard (1) centre position, wherein, embedded multi-media card (22), storer (23), power management integrated circuit (24), wireless receiver (25) and bluetooth (26) are arranged along central processing unit (21) and are welded on mainboard (1).
4. the layout of computer main board according to claim 1, it is characterized in that: described embedded multi-media card (22) is located at the left side of central processing unit (21), embedded multi-media card (22) is fixedly welded on the centre position, left side of mainboard (1).
5. the layout of computer main board according to claim 1, is characterized in that: described storer (23) is provided with multiple, the equally spaced following side being arranged in central processing unit (21) of storer (23).
6. the layout of computer main board according to claim 1, it is characterized in that: described power management integrated circuit (24) is fixedly welded on the limit, left side of mainboard (1), limit is fixed with power contact (241) in mainboard (1) left side, and power contact (241) is electrically connected by mainboard (1) limit, left side and power management integrated circuit (24).
7. the layout of computer main board according to claim 1, is characterized in that: described wireless receiver (25) and bluetooth (26) are fixedly welded on the upper edge place of mainboard (1).
8. the layout of computer main board according to claim 1, is characterized in that: the right edge of described mainboard (1) is fixed with multiple slot (27).
9. a method for making for computer main board, comprises the following steps;
There is provided a substrate (11) for providing overall support for mainboard (1), substrate (11) is in tabular;
There is provided a tack coat (12), the upper face in substrate (11) by tack coat (12) coating or paving cloth;
There is provided an articulamentum (13), articulamentum (13) is bondd by fixing between tack coat (12) and the upper surface of substrate (11);
Articulamentum (13) is provided with conductive circuit layer (14), and conductive circuit layer (14) is fixedly immersed in articulamentum (13) on the surface by the mode of being conflicted by high pressure;
The surface of conductive circuit layer (14) is coated with resistant to elevated temperatures ink layer (15) and in conductive circuit layer (14), is welded to connect the terminal (16) of metal;
In the upper fusion welding tin layers (17) of the terminal (16) of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510575450.8A CN105183084A (en) | 2015-09-11 | 2015-09-11 | Layout and manufacturing method of computer mainboard |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510575450.8A CN105183084A (en) | 2015-09-11 | 2015-09-11 | Layout and manufacturing method of computer mainboard |
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| CN105183084A true CN105183084A (en) | 2015-12-23 |
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| CN201510575450.8A Pending CN105183084A (en) | 2015-09-11 | 2015-09-11 | Layout and manufacturing method of computer mainboard |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080725A (en) * | 2019-07-11 | 2022-02-22 | 株式会社自动网络技术研究所 | Wiring module, electricity storage module, bus bar, and method for manufacturing electricity storage module |
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| CN102480849A (en) * | 2010-11-29 | 2012-05-30 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| EP2705532A2 (en) * | 2011-05-05 | 2014-03-12 | Intel Corporation | Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same |
| CN203537663U (en) * | 2013-10-30 | 2014-04-09 | 深圳市志金电子有限公司 | A pcb substrate |
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2015
- 2015-09-11 CN CN201510575450.8A patent/CN105183084A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526837A (en) * | 2008-05-27 | 2009-09-09 | 威盛电子股份有限公司 | Electronic device |
| CN102480849A (en) * | 2010-11-29 | 2012-05-30 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| EP2705532A2 (en) * | 2011-05-05 | 2014-03-12 | Intel Corporation | Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same |
| CN203537663U (en) * | 2013-10-30 | 2014-04-09 | 深圳市志金电子有限公司 | A pcb substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114080725A (en) * | 2019-07-11 | 2022-02-22 | 株式会社自动网络技术研究所 | Wiring module, electricity storage module, bus bar, and method for manufacturing electricity storage module |
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