CN207783254U - A kind of HDI high-density circuit boards that thermal diffusivity is good - Google Patents
A kind of HDI high-density circuit boards that thermal diffusivity is good Download PDFInfo
- Publication number
- CN207783254U CN207783254U CN201721556119.2U CN201721556119U CN207783254U CN 207783254 U CN207783254 U CN 207783254U CN 201721556119 U CN201721556119 U CN 201721556119U CN 207783254 U CN207783254 U CN 207783254U
- Authority
- CN
- China
- Prior art keywords
- hole
- insulating layer
- thermal diffusivity
- wiring board
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model is related to wiring board arts, more specifically, it is related to a kind of HDI high-density circuit boards that thermal diffusivity is good, including first line plate, the second wiring board and insulating layer, the insulating layer is located between first line plate and second wiring board, the first line plate and second wiring board are equipped with several buried via holes, and the insulating layer is equipped with several first through hole in thickness direction, and the first through hole is connected to part buried via hole；The first through hole is covered with copper coating with buried via hole inner wall, and conductive column is equipped in the first through hole；The insulating layer is equipped with several second through-holes parallel with the insulating layer upper and lower surface in the longitudinal direction, and wire is embedded in second through-hole, and the length of the wire is equal to the length of the insulating layer.It second through-hole of the utility model and is embedded in wire therein and can increase heat dissipation, with good thermal diffusivity.
Description
Technical field
The utility model is related to wiring board arts, more particularly, to a kind of good HDI high-density circuit boards of thermal diffusivity.
Background technology
High-density circuit board (HDI, High Density Interconnector) manufacture is developed most in circuit-board industry
One of fast field.With the production cost that can reduce multilayer circuit board, increase line density, reliability height, anti-pollution
Property, against weather, uviolresistance, moisture-proof poly- edge, good electrical property, anti-aging property it is good, tensile strength is high, can not puncture, make
The advantages that with easy maintenance.
At present extensively practical wiring board be epoxy glass fabric base material or phenolic resin glass cloth base material.Though these base materials
So there is excellent electric property and processing performance, but poor radiation can hardly refer to as the sinking path of high heater element
It hopes and heat is conducted by PCB resins itself, but radiate from the surface of element into surrounding air, heat dissipation can reduce product operation
Temperature improves product power density and reliability, extends product service life；Small product size can be reduced simultaneously, reduce hardware
And assembly cost；It is therefore proposed that a kind of HDI high-density circuit boards that the thermal diffusivity to solve the above problems is good are actually necessary.
Utility model content
The utility model is at least one defect (deficiency) overcome described in the above-mentioned prior art, and it is good to provide a kind of thermal diffusivity
HDI high-density circuit boards.
In order to solve the above technical problems, the technical solution of the utility model is as follows：A kind of HDI high-density lines that thermal diffusivity is good
Road plate, including first line plate, the second wiring board and insulating layer, the insulating layer are located at first line plate and second circuit
Between plate, the first line plate and second wiring board are equipped with several buried via holes, and the insulating layer is set in thickness direction
There are several first through hole, the first through hole to be connected to part buried via hole；The first through hole is covered with copper plating with buried via hole inner wall
Layer, the first through hole is interior to be equipped with conductive column；The insulating layer in the longitudinal direction be equipped with several with above and below the insulating layer
The second parallel through-hole of surface, wire is embedded in second through-hole, and the length of the wire is equal to the insulating layer
Length.
Further, the insulating layer is ceramic material.
Further, the through-hole diameter is less than buried via diameter.
Further, the first line plate and the second wiring board are polyimide copper clad lamination.
Further, the circuit in the outer-layer circuit and internal layer circuit and second wiring board on the first line plate
It is connected by the conductive column in through-hole.
Further, the thickness of the first line plate and second wiring board is equal.
Further, the through-hole is staggered.
Compared with prior art, the advantageous effect of technical solutions of the utility model is：Second through-hole of the utility model and
Heat dissipation can be increased by being embedded in wire therein, and epoxy glass fabric base material or phenolic resin are replaced with copper coating and ceramic material
Glass cloth has good thermal diffusivity.In addition, the utility model also has the production cost that can reduce multilayer circuit board, increase
Line density, high reliability.
Description of the drawings
Fig. 1 is the good high-density line plate structure schematic diagram of the thermal diffusivity of the utility model；
Fig. 2 is the structural schematic diagram of the insulating layer of the utility model.
Specific implementation mode
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；It is attached in order to more preferably illustrate the present embodiment
Scheme certain components to have omission, zoom in or out, does not represent the size of actual product；To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also be to be indirectly connected with by intermediary, it can be with
Say the connection inside two elements.For the ordinary skill in the art, it can understand that above-mentioned term exists with concrete condition
The concrete meaning of the utility model.The technical solution of the utility model is done further with reference to the accompanying drawings and examples
It is bright.
As depicted in figs. 1 and 2, present embodiment discloses a kind of good HDI high-density circuit boards of thermal diffusivity, including First Line
Road plate 1, the second wiring board 2 and insulating layer 3, the insulating layer 3 are located between first line plate 1 and second wiring board 2, institute
It states first line plate 1 and second wiring board 2 is equipped with several buried via holes 6, the insulating layer 3 is equipped with several in thickness direction
A first through hole 7, the first through hole 7 are connected to part buried via hole 6；The first through hole 7 is covered with copper plating with 6 inner wall of buried via hole
Layer, the first through hole 7 is interior to be equipped with conductive column 8；The insulating layer 3 is equipped with several and the insulating layer 3 in the longitudinal direction
The second parallel through-hole 9 of upper and lower surface, and second through-hole 9 is not connected to the first through hole 7, in second through-hole 9
It is embedded with wire 10, the length of the wire 10 is equal to the length of the insulating layer 3.
It in the utility model, the second through-hole 9 and is embedded in wire 10 therein and can increase heat dissipation, with copper coating and pottery
Ceramic material replaces epoxy glass fabric base material or phenolic resin glass cloth, has good thermal diffusivity.
When it is implemented, the insulating layer 3 is ceramic material.Good insulation effect can be provided in this way.
When it is implemented, 7 diameter of the through-hole is less than 6 diameter of buried via hole.The first line plate 1 and can be protected in this way
Two wiring boards 2, in order to avoid there is cavity in the inside of first line plate 1 and the second wiring board 2, so as to avoid the damage of circuit board
It is bad.The circuit in outer-layer circuit 9 and internal layer circuit 10 and second wiring board 2 on the first line plate 1 passes through through-hole
In conductive column 8 connect.It may be implemented to realize connection function between the inside of each sandwich circuit in this way.Reduce multilayer circuit board
Production cost increases line density, improves reliability.
When it is implemented, 1 and second wiring board 2 of the first line plate is polyimide copper clad lamination.Polyimide multilayer
The TG values of wiring board, polyimides reach 257 DEG C, and dielectric constant can reach 4.1 ± 0.1 in the range of 1MH2-10MH2, because
The good HDI high-density circuit boards of the thermal diffusivity of this utility model have excellent high-frequency dielectric performance, and being capable of heat-resisting quantity
Energy radiation resistance, tool have been widely used.
When it is implemented, the first line plate 1 is equal with the thickness of second wiring board 2.This reality being arranged in this way
It is easier to prepare with the good HDI high-density circuit boards of novel thermal diffusivity, it is possible to reduce bring because of thickness difference during fabrication
Inconvenience.
When it is implemented, the through-hole 7 is staggered.The HDI that can make the thermal diffusivity of the utility model good in this way is highly dense
Degree wiring board quality is more uniform, durable, is not in because the position that through-hole setting is concentrated is easily damaged going out for equal undesirable conditions
It is existing.
In figure, description position relationship only for illustration, should not be understood as the limitation to this patent；Obviously, this reality
It is only intended to clearly illustrate the utility model example with novel above-described embodiment, and is not to the utility model
Embodiment restriction.For those of ordinary skill in the art, it can also make on the basis of the above description
Other various forms of variations or variation.There is no necessity and possibility to exhaust all the enbodiments.It is all new in this practicality
All any modification, equivalent and improvement etc., should be included in the utility model right and want made by within the spirit and principle of type
Within the protection domain asked.
Claims (7)
1. a kind of good HDI high-density circuit boards of thermal diffusivity, it is characterised in that：Including first line plate, the second wiring board and absolutely
Edge layer, the insulating layer are located between first line plate and second wiring board, the first line plate and second line
Road plate is equipped with several buried via holes, and the insulating layer is equipped with several first through hole, the first through hole and portion in thickness direction
Divide buried via hole connection；
The first through hole is covered with copper coating with buried via hole inner wall, and conductive column is equipped in the through-hole；
The insulating layer is equipped with several second through-holes parallel with the insulating layer upper and lower surface in the longitudinal direction, and described the
Wire is embedded in two through-holes, the length of the wire is equal to the length of the insulating layer.
2. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, it is characterised in that：The insulating layer is pottery
Ceramic material.
3. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, it is characterised in that：The through-hole diameter is small
In the buried via diameter.
4. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, which is characterized in that the first line plate
It is polyimide copper clad lamination with the second wiring board.
5. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, it is characterised in that：The first line plate
On outer-layer circuit connected by the conductive column in through-hole with internal layer circuit with the circuit on second wiring board.
6. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, it is characterised in that：The first line plate
It is equal with the thickness of the second wiring board.
7. the good HDI high-density circuit boards of thermal diffusivity according to claim 1, it is characterised in that：The through-hole is staggeredly set
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721556119.2U CN207783254U (en) | 2017-11-20 | 2017-11-20 | A kind of HDI high-density circuit boards that thermal diffusivity is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721556119.2U CN207783254U (en) | 2017-11-20 | 2017-11-20 | A kind of HDI high-density circuit boards that thermal diffusivity is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783254U true CN207783254U (en) | 2018-08-28 |
Family
ID=63233693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721556119.2U Expired - Fee Related CN207783254U (en) | 2017-11-20 | 2017-11-20 | A kind of HDI high-density circuit boards that thermal diffusivity is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783254U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730575A (en) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | Method for manufacturing solid through hole |
-
2017
- 2017-11-20 CN CN201721556119.2U patent/CN207783254U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730575A (en) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | Method for manufacturing solid through hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20201120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |