CN105174947A - 一种低温烧结薄介质多层陶瓷电容器用cog质陶瓷材料 - Google Patents
一种低温烧结薄介质多层陶瓷电容器用cog质陶瓷材料 Download PDFInfo
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- CN105174947A CN105174947A CN201510563313.2A CN201510563313A CN105174947A CN 105174947 A CN105174947 A CN 105174947A CN 201510563313 A CN201510563313 A CN 201510563313A CN 105174947 A CN105174947 A CN 105174947A
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CN201510563313.2A CN105174947B (zh) | 2015-09-08 | 2015-09-08 | 一种低温烧结薄介质多层陶瓷电容器用cog质陶瓷材料 |
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CN105174947A true CN105174947A (zh) | 2015-12-23 |
CN105174947B CN105174947B (zh) | 2020-03-06 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106866139A (zh) * | 2017-01-19 | 2017-06-20 | 山东国瓷功能材料股份有限公司 | 铜内电极mlcc用c0g介质陶瓷材料及其制备方法和应用 |
CN111635227A (zh) * | 2020-06-28 | 2020-09-08 | 厦门松元电子有限公司 | 一种高频陶瓷介质材料及其制备方法和多层陶瓷电容器 |
CN113948235A (zh) * | 2021-12-20 | 2022-01-18 | 西安宏星电子浆料科技股份有限公司 | 一种高分散性、低收缩率的镍内电极浆料及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1429792A (zh) * | 2001-12-27 | 2003-07-16 | 三星电机株式会社 | 不可还原的介电陶瓷组合物 |
US20050185360A1 (en) * | 2004-02-06 | 2005-08-25 | Avx Corporation | Integrated capacitor assembly |
CN1774406A (zh) * | 2003-02-17 | 2006-05-17 | Tdk株式会社 | 电介质瓷器组合物及电子部件 |
CN102199037A (zh) * | 2010-03-17 | 2011-09-28 | 株式会社村田制作所 | 电介体瓷器组合物及温度补偿用层叠电容器 |
CN103553591A (zh) * | 2013-10-11 | 2014-02-05 | 山东国瓷功能材料股份有限公司 | 一种高温高绝缘性能多层陶瓷电容器用电介质陶瓷材料 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1429792A (zh) * | 2001-12-27 | 2003-07-16 | 三星电机株式会社 | 不可还原的介电陶瓷组合物 |
CN1774406A (zh) * | 2003-02-17 | 2006-05-17 | Tdk株式会社 | 电介质瓷器组合物及电子部件 |
US20050185360A1 (en) * | 2004-02-06 | 2005-08-25 | Avx Corporation | Integrated capacitor assembly |
CN102199037A (zh) * | 2010-03-17 | 2011-09-28 | 株式会社村田制作所 | 电介体瓷器组合物及温度补偿用层叠电容器 |
CN103553591A (zh) * | 2013-10-11 | 2014-02-05 | 山东国瓷功能材料股份有限公司 | 一种高温高绝缘性能多层陶瓷电容器用电介质陶瓷材料 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106866139A (zh) * | 2017-01-19 | 2017-06-20 | 山东国瓷功能材料股份有限公司 | 铜内电极mlcc用c0g介质陶瓷材料及其制备方法和应用 |
CN111635227A (zh) * | 2020-06-28 | 2020-09-08 | 厦门松元电子有限公司 | 一种高频陶瓷介质材料及其制备方法和多层陶瓷电容器 |
CN113948235A (zh) * | 2021-12-20 | 2022-01-18 | 西安宏星电子浆料科技股份有限公司 | 一种高分散性、低收缩率的镍内电极浆料及其制备方法 |
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CN105174947B (zh) | 2020-03-06 |
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Application publication date: 20151223 Assignee: JIANGSU GUOCI HONGYUAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Assignor: SHANDONG SINOCERA FUNCTIONAL MATERIAL Co.,Ltd. Contract record no.: X2021980007152 Denomination of invention: A cog ceramic material for low temperature sintered thin dielectric multilayer ceramic capacitor Granted publication date: 20200306 License type: Common License Record date: 20210730 |
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Denomination of invention: A cog ceramic material for low temperature sintered thin dielectric multilayer ceramic capacitor Effective date of registration: 20211227 Granted publication date: 20200306 Pledgee: SHANGHAI GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Pledgor: SHANDONG SINOCERA FUNCTIONAL MATERIAL Co.,Ltd. Registration number: Y2021980016312 |