CN105171235B - A kind of double focus laser micromachining device and its processing method - Google Patents
A kind of double focus laser micromachining device and its processing method Download PDFInfo
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Abstract
The present invention relates to technical field of laser processing, disclose a kind of double focus laser micromachining device and its processing method.Processing unit (plant) includes laser, one 45 degree of speculum, first half-wave plate, 3rd 45 degree of speculum and focus lamp, it is used to laser beam being divided into the first polarizer of horizontal polarization light beam P and vertical polarization light beam S on the output light path of the first half-wave plate, it is respectively arranged on horizontal polarization light path and the horizontal optical path device of orthogonal polarized light road and vertical optical path device, arranged on horizontal optical path device output terminal and the second polarizer of vertical optical path device output terminal, horizontal polarization light beam P is successively through horizontal polarization light path, second polarizer, 3rd 45 degree of speculum and focus lamp are after forming the first focus on machined object, vertical polarization light beam S is successively through vertical polarization light path, second polarizer, 3rd 45 degree of speculum and focus lamp are after forming the second focus on machined object.The present invention has the advantages that high in machining efficiency, effect is good.
Description
Technical field
The present invention relates to technical field of laser processing, more specifically, more particularly to a kind of double focus laser micro Process dress
It puts and its processing method.
Background technology
In the laser fines precision machining industry such as glass, LED wafer, silicon wafer, semiconductor, with product hierarchy
Promotion, the thickness of product has gradually thickening trend, and the mode that simple single focus carries out more round multilayer processings starts to lead
The downslide of production efficiency is caused, so the processing of double focus laser precise fine, which carries out improved efficiency, just shows important meaning.
In many conventional laser micro Process application fields, laser beam passes through shape after being focused on after outer light path into focus lamp
Into a focus, using focus peak power density come rapidoprint.With the increase of machined material thickness, processing efficiency
Income caused by the promotion of aspect increasingly attracts people's attention；And only promoted by the joint efficiency of various components,
It can be only achieved the advantage of whole efficiency promotion.Mechanical structure transformation, movement velocity promotion, automatically controlled program optimization, software algorithm are excellent
Change etc. and to be substantially accomplished unprecedented height, and the optimization in terms of laser and light path just becomes and restricts laser fine and add
The critical bottleneck problem of work improved efficiency.
As depicted in figs. 1 and 2, it is the outer light path schematic diagram of the single focal argon laser micro Process of tradition in the prior art, laser 1 '
The laser beam 70 sent passes sequentially through 45 degree of speculums 2 ', half-wave plate 3 ', 45 degree of speculums 4 ', beam expanding lens 5 ', 45 degree of speculums
6 ' and focus lamp 7 ' (71) after formed on the surface of machined object 8 ' (73) single focus (laser material internal is formed fry
Point) it is laser machined.It is this list focus structure Laser Micro-Machining device there are the problem of be：Processing efficiency is low, processing effect
Fruit is poor.
The content of the invention
It is an object of the invention to be directed to technical problem in the prior art, a kind of high in machining efficiency, effect is provided
Good double focus laser micromachining device and its processing method.
In order to solve posed problems above, the technical solution adopted by the present invention is：
A kind of double focus laser micromachining device, including laser, the one 45 degree of speculum, the first half-wave plate, the 3rd 45
Speculum and focus lamp are spent, further includes and is used to laser beam being divided into horizontal polarization on the output light path of the first half-wave plate
The first polarizer of light beam P and vertical polarization light beam S are respectively arranged on the horizon light of horizontal polarization light path and orthogonal polarized light road
Road device and vertical optical path device, arranged on horizontal optical path device output terminal and the second polarizer of vertical optical path device output terminal,
The horizontal polarization light beam P is successively through horizontal polarization light path, the second polarizer, the 3rd 45 degree of speculum and focus lamp after being added
Form the first focus on work object, the vertical polarization light beam S successively through vertical polarization light path, the second polarizer, the 3rd 45 degree it is anti-
Mirror and focus lamp are penetrated after forming the second focus on machined object.
According to a preferred embodiment of the invention：Horizontal polarization light path includes the 2nd 45 degree be arranged in horizontal polarization light path
Speculum and the beam expanding lens on the 2nd 45 degree of speculum reflected light path, and beam expanding lens is corresponding with the second polarizer.
According to a preferred embodiment of the invention：Vertical optical path device includes the 4th 45 degree arranged on orthogonal polarized light road
Speculum, the 5th 45 degree of speculum on the 4th 45 degree of speculum reflected light path, arranged on the 5th 45 degree of speculum reflected light
Second half-wave plate of road, the 6th 45 degree of speculum on the second half-wave plate output light path, and the 6th 45 degree of speculum with
Second polarizer corresponds to.
According to a preferred embodiment of the invention：Further include the rotating device for controlling the first half-wave plate rotation angle.
According to a preferred embodiment of the invention：The multiple adjusting range of the beam expanding lens is 2-8 times, and adjusts the expansion
The multiple of Shu Jing adjusts the distance of the first focus and the second focus in the Z-axis direction.
According to a preferred embodiment of the invention：The relative distance of first focus and the second focus in the Z-axis direction
Scope is 0-100um.
According to a preferred embodiment of the invention：First focus and the second focus are in X-direction and Y direction
Relative distance scope is 0-30um.
According to a preferred embodiment of the invention：It further includes and is closed for controlled level light beam P and vertical polarization light beam S
Disconnected the first optical gate control switch and the second optical gate control switch.
According to a preferred embodiment of the invention：The NA value scopes of the focus lamp are 0.3-0.7.
The present invention also provides a kind of double focus laser micro-processing methods, comprise the following steps,
S1, the lower section that machined object is positioned over to focus lamp；
S2, laser is opened, sends laser beam；
S3, laser beam form horizontal polarization after passing sequentially through the one 45 degree of speculum, the first half-wave plate and the first polarizer
Light beam P and vertical polarization light beam S；
S4, horizontal polarization light beam P are successively through horizontal polarization light path, the second polarizer, the 3rd 45 degree of speculum and focus lamp
After forming the first focus on machined object, vertical polarization light beam S is successively through vertical polarization light path, the second polarizer, the 3rd 45
Speculum and focus lamp are spent after forming the second focus on machined object, and first focus and the second focus are in machined object
Fried point is respectively formed to realize the processing of material.
Compared with prior art, the beneficial effects of the present invention are：The present invention under polarizer by generating horizontal polarization
Light beam and vertical polarization light beam, and then realize that bifocus to laser accurate micro Process, improves the efficiency and effect of processing, relatively
It is compared in traditional single focal argon laser micro Process, processing efficiency is doubled and redoubled, and application field is extensive.
Description of the drawings
Fig. 1 is the light path schematic diagram of single focal argon laser micromachining device of the prior art.
Fig. 2 is single focal argon laser micro Process material sectional schematic diagram of the prior art.
Fig. 3 is the light path schematic diagram of the double focus laser micromachining device of the present invention.
Fig. 4 is the double focus laser micro Process material sectional schematic diagram of the present invention.
Fig. 5 is the double focus laser micro-processing method flow chart of the present invention.
Reference sign：1st, laser, 2, the 1st degree of speculums, the 3, first half-wave plate, the 4, first polarizer, 5,
2 45 degree of speculums, 6, beam expanding lens, the 7, second polarizer, 8, the 3rd 45 degree of speculums, 9, focus lamp, 10, machined object, 11,
5th 45 degree of speculum, 12, the 4th 45 degree of speculums, the 13, second half-wave plate, 14, the 6th 45 degree of speculums.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Embodiment one
Refering to shown in Fig. 3-Fig. 4, the present invention provides a kind of double focus laser micromachining device, including laser the 1, the 1st
Speculum 2, the first half-wave plate 3, the 3rd 45 degree of speculums 8 and focus lamps 9 are spent, are used on the output light path of the first half-wave plate 3
In the first polarizer 4 that laser beam is divided into horizontal polarization light beam P and vertical polarization light beam S, horizontal polarization is respectively arranged on
Light path and the horizontal optical path device of orthogonal polarized light road and vertical optical path device, arranged on horizontal optical path device output terminal and vertically
Second polarizer 7 of light path device output terminal, the horizontal polarization light beam P is successively through horizontal polarization light path, the second polarizer
7th, the 3rd 45 degree of speculum 8 and focus lamp 9 are after forming the first focus 62, the vertical polarization light beam S on machined object 10
Successively through vertical polarization light path, the second polarizer 7, the 3rd 45 degree of speculum 8 and focus lamp 9 after forming on machined object 10
Two focuses 63.
In the present invention, laser beam is linear polarization, and polarization ratio is more than 50:1, laser beam passes through the first half-wave plate 3
The linear polarization angle of laser beam can be changed later and do not influence its polarization ratio.Laser beam passes through the first half-wave plate 3
Afterwards using the first polarizer 4, and since the characteristic of the first polarizer 4 is that horizontal polarisation component can be with full impregnated mistake, vertical polarization
Component can be all-trans with 45 degree, and for laser beam after half-wave plate, polarization angle can be adjusted to some angle, make laser
Light beam is simultaneously comprising horizontal polarisation component and vertical polarisation component, and then after the first polarizer 4, laser beam is divided into
Two beams, i.e.,：Horizontal polarization light beam P and vertical polarization light beam S.
Horizontal polarization light path includes the 2nd 45 degree of speculum 5 being arranged in horizontal polarization light path and arranged on the 2nd 45 degree of reflection
Beam expanding lens 6 on 5 reflected light path of mirror, and beam expanding lens 6 is corresponding with the second polarizer 7.
Vertical optical path device includes the 4th 45 degree of speculum 12 arranged on orthogonal polarized light road, arranged on the 4th 45 degree of reflection
The 5th 45 degree of speculum 11 on 12 reflected light path of mirror, the second half-wave plate on the 5th 45 degree of 11 reflected light path of speculum
13, the 6th 45 degree of speculum 14 on 13 output light path of the second half-wave plate, and the 6th 45 degree of speculum 14 and second polarizes
Piece 7 corresponds to.
The principle of double focus laser micromachining device of the present invention is：The laser beam that laser 1 exports, by the 1st
After spending speculum 2, the first half-wave plate 3 and the first polarizer 4 are passed perpendicularly through, since polarizer 4 is to horizontal polarization light (P polarization light)
With permeability, there is reflectivity to orthogonal polarized light (S-polarization light), can be led to by the angle for changing the first half-wave plate 3
It crosses the first polarizer 4 and laser beam is divided into two beams (horizontal polarization light beam P and vertical polarization light beam S), and two beam laser beams
Energy proportion can realize that horizontal polarization light beam P passes through the 2nd 45 degree of speculum 5 by changing the angle of the first half-wave plate
Afterwards into beam expanding lens 6, by the dispersion angle of the change laser beam of beam expanding lens 6, afterwards using the second polarizer 7 and the 3rd 45
Speculum 8 is spent, the first focus 62 is formed after eventually entering into focus lamp 9；And S-polarization light passes through 45 degree of speculums 11,12,14 and
Two half-wave plates 13 afterwards into the second polarizer 7 and the 3rd 45 degree of speculum 8, eventually enter into focus lamp 9 and form the second focus
63, as shown in Figure 4.
Preferably, in order to adjust the angle of the first half-wave plate 3, the present embodiment further includes control first half-wave
The rotating device (not shown) of 3 rotation angle of piece, the rotating device can be motor or rotary cylinder or rotary magnet etc.；
In this way, rotating device (not shown) can change the first focus 62 by controlling the rotation angle of the first half-wave plate 3
With the power proportions of the second focus 63, to be adapted to the laser processing technology occasion of different demands.
The distance of first focus 62 and the second focus 63 in the Z-axis direction can be adjusted by changing the multiple of beam expanding lens 6
Whole, the multiple adjusting range that beam expanding lens 6 is selected in the present embodiment is 2-8 times；In process, machined object 10 need to be according to pre-
Fixed track is moved and (existing motion control system can be used to control), and the first focus 62 and the second focus 63 are in quilt at this time
The first hot spot and the second hot spot are formed in machining object 10, that is, fried point is formed simultaneously in the inside of machined object 10, reaches and adds
Work material purpose.
Preferably, the relative distance of the first focus 62 and the second focus 63 in the Z-axis direction described in the present embodiment
Scope is 0-100um, and the size of the first focus 62 and the second focus 63 (or the first hot spot and second hot spot) is respectively less than 2um.
Preferably, the thickness of the machined object 10 in the present embodiment is greater than or equal to 80um, can be formed preferable
Processing effect.
Preferably, the first focus 62 and the second focus 63 described in the present embodiment are in X-direction and Y direction
Relative distance scope is 0-30um.
In the present embodiment, X-direction, Y direction and Z-direction are only the expression of three dimensions, can also be adopted
It is represented with other terms, the implementation without influencing the present invention.
In the present embodiment, it may also include the first light for controlled level light beam P and vertical polarization light beam S shut-offs
Lock control switch (not shown) and the second optical gate control switch (not shown)；By controlling the first optical gate control switch and the second light
Lock control switch, which can be realized, enables bifocus (the first focus 62 and the second focus 63) and single focus (the first focus 62 or the second
Focus 63) fast and accurately switching, achieve the effect that process different-thickness material.
Preferably, the NA value scopes of the focus lamp 9 described in the present embodiment are 0.3-0.7.
The bifocus micromachining device of the present embodiment is suitable for existing glass, LED wafer, silicon wafer, semiconductor etc.
In laser fine precision machining industry, especially for the thick LED wafer good cutting effect for being more than 130um of piece, straightness is good,
Chipping amount is small, and oblique segmentation angle is small, and when laser action is inside machined object, the first focus 62 and the second focus 63 are respectively in quilt
10 inside of machining object forms demolition point, and when machined object is moved according to certain track, the first focus 62 and second is burnt
Point 63 forms modification layer inside machined object 10, and due to the effect of stress, the upper surface of machined object 10 is passed through in laser
Track on form certain hallrcuts, reach separation machined object under the action of mechanical force afterwards to reach the mesh of cutting
's；The present embodiment is compared with single focus cutting technique, and the power of arbitrary one of focus is small in bifocus cutting technique
Required power is cut in single focus, the chipping amount after cutting can be obviously reduced, improves the straightness after cutting, and carries
The electrical property yield of high whole appearance processing yield and LED chip.
The advantages of double focus laser micromachining device of the present embodiment, is：62 He of the first focus can be changed as needed
The distance of second focus 63 in the Z-axis direction can also control the power ratio of the first focus 62 and the second focus 63 in real time, and
In the case where light path need not be adjusted, realize that single focus and bifocus fast and accurately switch, improve processing efficiency and improvement
Processing effect has great application prospect and widely promotes space；Can according to the precision machined needs of various laser fines,
Light path and mating lens parameters to the device etc. can change, but the core content of bifocus improved efficiency processing object is always
Do not become.
Preferably, the laser wavelength range of the laser in the present embodiment is 355nm-1064nm, comprising ultraviolet, green
Other lasers such as light, infrared laser.
Embodiment two
Refering to shown in Fig. 3, Fig. 4 and Fig. 5, the present embodiment also provides a kind of double focus laser micro-processing method, including following
Step,
The first step, the lower section that machined object 10 is positioned over to focus lamp 9, machined object 10 can select glass, LED wafer
Piece, silicon wafer, semiconductor etc.；
Second step opens laser 1, sends laser beam, and the wave-length coverage of the laser beam is 355nm-1064nm, can be purple
Outside, other laser such as green light, infrared；
3rd step, laser beam form water after passing sequentially through the one 45 degree of speculum 2, the first half-wave plate 3 and the first polarizer 4
Flat light beam P and vertical polarization light beam S；
4th step, horizontal polarization light beam P are successively through 7, the 3rd 45 degree of horizontal polarization light path, the second polarizer 8 and of speculum
Focus lamp 9 after forming the first focus 62 on machined object 10, vertical polarization light beam S successively through vertical polarization light path, second partially
7, the 3rd 45 degree of speculums 8 of piece and focus lamp 9 shake after forming the second focus 63, the first focus 62 and second on machined object 10
Focus 63 is respectively formed fried point to realize the processing of material in machined object 10.In the process, can be controlled by the first optical gate
Switch and the second optical gate control switch can be realized and enable bifocus (the first focus 62 and the second focus 63) and single focus (first
62 or second focus 63 of focus) fast and accurately switching, achieve the effect that process different-thickness material.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention and from above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (6)
1. a kind of double focus laser micromachining device, including laser (1), the one 45 degree of speculum (2), the first half-wave plate (3),
3rd 45 degree of speculum (8) and focus lamp (9), it is characterised in that：It further includes and is used on the output light path of the first half-wave plate (3)
In the first polarizer (4) that laser beam is divided into horizontal polarization light beam P and vertical polarization light beam S, it is respectively arranged on horizontal inclined
Light path of shaking and the horizontal optical path device of orthogonal polarized light road and vertical optical path device arranged on horizontal optical path device output terminal and hang down
The second polarizer (7) of straight light path device output terminal, the horizontal polarization light beam P is successively through horizontal polarization light path, the second polarization
Piece (7), the 3rd 45 degree of speculum (8) and focus lamp (9) are described vertical after forming the first focus (62) on machined object (10)
Light beam S is successively through vertical polarization light path, the second polarizer (7), the 3rd 45 degree of speculum (8) and focus lamp (9) after quilt
The second focus (63) is formed in machining object (10)；
The horizontal polarization light path is anti-including the 2nd 45 degree of speculum (5) in horizontal polarization light path and arranged on the 2nd 45 degree
The beam expanding lens (6) on mirror (5) reflected light path is penetrated, and beam expanding lens (6) is corresponding with the second polarizer (7)；
The vertical optical path device includes the 4th 45 degree of speculum (12) arranged on orthogonal polarized light road, anti-arranged on the 4th 45 degree
The 5th 45 degree of speculum (11) on mirror (12) reflected light path is penetrated, second on the 5th 45 degree of speculum (11) reflected light path
Half-wave plate (13), the 6th 45 degree of speculum (14) on the second half-wave plate (13) output light path, and the 6th 45 degree of speculum
(14) it is corresponding with the second polarizer (7)；
The multiple adjusting range of the beam expanding lens (6) is 2-8 times, and the multiple for adjusting the beam expanding lens (6) adjusts the first focus
(62) and the second focus (63) distance in the Z-axis direction.
2. double focus laser micromachining device according to claim 1, it is characterised in that：Further include control described the first half
The rotating device of wave plate (3) rotation angle.
3. double focus laser micromachining device according to claim 1, it is characterised in that：First focus (62) and
The relative distance scope of two focuses (63) in the Z-axis direction is 0-100um.
4. double focus laser micromachining device according to claim 1, it is characterised in that：First focus (62) and
Relative distance scope of two focuses (63) in X-direction and Y direction is 0-30um.
5. double focus laser micromachining device according to claim 1, it is characterised in that：It further includes inclined for controlled level
Shake the first optical gate control switch of light beam P and vertical polarization light beam S shut-offs and the second optical gate control switch.
6. double focus laser micromachining device according to claim 1, it is characterised in that：The NA values of the focus lamp (9)
Scope is 0.3-0.7.
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| CN107378259B (en) * | 2016-05-17 | 2019-09-20 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device and method of Low-k material |
| CN106964894A (en) * | 2016-11-03 | 2017-07-21 | 苏州镭明激光科技有限公司 | A kind of variable double focus laser micromachining device |
| CN107052592B (en) * | 2017-05-23 | 2019-01-29 | 苏州德龙激光股份有限公司 | Double light beam laser system of processing and its method |
| JP6896344B2 (en) * | 2017-09-22 | 2021-06-30 | 株式会社ディスコ | Chip manufacturing method |
| CN108515273B (en) * | 2018-03-29 | 2020-10-13 | 大族激光科技产业集团股份有限公司 | Cutting device and cutting method for LED wafer |
| CN108500477A (en) * | 2018-03-29 | 2018-09-07 | 大族激光科技产业集团股份有限公司 | The cutting method and cutter device of LED wafer |
| CN111940892B (en) * | 2019-05-14 | 2023-06-02 | 雷科股份有限公司 | Fast switching optical path architecture for dicing low dielectric value material wafers |
| CN110102910A (en) * | 2019-06-19 | 2019-08-09 | 浙江圣石激光科技股份有限公司 | Double light path laser processing unit (plant) and method for Wafer Dicing |
| CN111014948B (en) * | 2019-11-29 | 2022-04-15 | 大族激光科技产业集团股份有限公司 | Double-focus laser processing system and method |
| CN111889895A (en) * | 2020-07-02 | 2020-11-06 | 松山湖材料实验室 | Jet-assisted multi-pulse-width laser ingot stripping method |
| CN113146071A (en) * | 2021-05-31 | 2021-07-23 | 苏州德龙激光股份有限公司 | Laser filamentation processing system capable of automatically switching filament length and method thereof |
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