CN108031992A - The ultrafast systems of processing of LTCC and its method - Google Patents
The ultrafast systems of processing of LTCC and its method Download PDFInfo
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- CN108031992A CN108031992A CN201711471017.5A CN201711471017A CN108031992A CN 108031992 A CN108031992 A CN 108031992A CN 201711471017 A CN201711471017 A CN 201711471017A CN 108031992 A CN108031992 A CN 108031992A
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- light
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- light beam
- scanning element
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The present invention relates to the ultrafast systems of processing of LTCC and method, it is equipped with according to optical path direction：Laser, output beam；First reflector element, will inject light beam sizing die group from Laser Output Beam；Beam shaping module, expands light beam and is filtered；Incident light, is divided into the two-beam of parallel direction and vertical direction by decay module；Second reflector element, the first scanning element is incident to by the P polarisations of the horizontal direction after light splitting；First scanning element, the light beam that the second reflector element reflects is focused, field lens is focused on processing object；Third reflecting unit, the second scanning element is incident to by the S polarisations of the vertical direction after light splitting；Second scanning element, the light beam that third reflecting unit reflects is focused, field lens is focused on processing object.Using ultrafast green ray picosecond laser device and matched high-speed vibrating mirror and optics, micro through hole diameter on ltcc substrate is down to less than 50 μm, micro through hole circularity reaches more than 95%, in 3 μm of taper.
Description
Technical field
The present invention relates to a kind of ultrafast systems of processing of LTCC and its method.
Background technology
At present, high density low-temperature co-fired ceramics (Low-temperature cofired ceramics, LTCC) substrate
Make the fine interconnection technique dependent on substrate inner conductor.In recent years, with the development of microelectric technique and packaging technology, surpass
The density of large scale integrated circuit is higher and higher.In order to meet the technological requirement of LTCC multilager base plates high density interconnection, it is necessary to make
The diameter and conducting wire line width of substrate micro through hole narrow down to 100 μm even less than 50 μm.Meanwhile the micro through hole on every ltcc substrate
Quantity reaches 50K even more than 100K, and the spacing accuracy of micro through hole is also higher and higher.
The processing of cutting and micropore (100 μm of ＜) for arbitrary shape, traditional processing method are extremely difficult to require.But
It is that laser has the characteristics that high accuracy, high density, high efficiency and contactless damage, and the energy of laser and hot spot are in very little
In the range of realize and be precisely controlled, so the lines of Laser Processing are very fine, aperture can reach very little, and can process and appoint
Meaning shape.Therefore mainly processing method of the laser-beam drilling machine as ltcc substrate micro through hole is used at present.
Ltcc substrate micro through hole laser-beam drilling machine on the market is primarily directed to a diameter of 50~100 μm of micropore at present,
The type of laser and the type selecting of other optics are limited to, is difficult to reach for a diameter of less than 50 μm of micro through holes and wants
Ask, and processing efficiency is difficult more than 1000 holes/second, even if improving efficiency reluctantly, reaches requirement, but thing followed micro through hole
Spacing accuracy also causes laser-beam drilling machine on the market to hang back.
The content of the invention
The purpose of the present invention is overcome the shortcomings of the prior art, there is provided a kind of ultrafast system of processing of LTCC and its side
Method.
The purpose of the present invention is achieved through the following technical solutions：
The ultrafast systems of processing of LTCC, are provided with according to optical path direction：
Laser, output beam；
First reflector element, comprising the first speculum arranged according to optical path direction, the light beam exported from laser is injected
Beam shaping module；
Beam shaping module, expands light beam and is changed the size for expanding hot spot, and to laser beam after expanding
Filtered；
Decay module, change the polarization state of laser beam after shaping and incident light is divided into parallel direction and vertical direction
Two-beam, comprising polarization slide and polarisation cube beamsplitter, polarization slide is located at polarisation cube beamsplitter incidence optical port, partially
The slide that shakes change incident beam polarization state, adjust light beam in the ratio of P polarisations and S polarisations, polarisation cube beamsplitter according to
The polarization state of light splits the light into the outgoing of two mutually perpendicular directions, and P polarisations are emitted from parallel direction, and S polarisations are from vertical direction
Outgoing；
Second reflector element, comprising the second speculum being sequentially arranged according to the horizontal optical path direction after light splitting, the 3rd anti-
Mirror and the 4th speculum are penetrated, the horizontal direction light after light splitting is incident to the first scanning element；
First scanning element, the light beam that the second reflector element reflects is focused, comprising being sequentially arranged according to optical path direction
Galvanometer and field lens, the P polarisations light of the horizontal direction after light splitting is mapped on the eyeglass of galvanometer through the second reflector element, gathered by field lens
It is burnt on processing object；
Third reflecting unit, it is anti-comprising the 5th speculum and the 6th being sequentially arranged according to the vertical optical path direction after light splitting
Mirror is penetrated, the S polarisations of the vertical direction after light splitting are incident to the second scanning element；
Second scanning element, the light beam that third reflecting unit reflects is focused, comprising being sequentially arranged according to optical path direction
Galvanometer and field lens, the vertical direction light after light splitting is mapped on the eyeglass of galvanometer through third reflecting unit, focused to by field lens plus
On work object；
Processing platform, for placing rapidoprint.
Further, the ultrafast systems of processing of above-mentioned LTCC, wherein, the laser is the ultrafast picosecond laser of narrow spaces
Device.
Further, the ultrafast systems of processing of above-mentioned LTCC, wherein, laser emitting end light path is opened equipped with control
The optical gate of Guan Guang.
Further, the ultrafast systems of processing of above-mentioned LTCC, wherein, the beam shaping module includes beam expanding lens and optical filtering
Piece, beam expanding lens are arranged in light path using oppositely positioned, and the size for expanding hot spot, optical filter cloth are expanded and changed to light beam
It is placed in after beam expanding lens, laser beam after expanding is filtered.
Further, the ultrafast systems of processing of above-mentioned LTCC, wherein, the galvanometer of first scanning element is light inlet hole
The galvanometer of footpath 14mm.
Further, the ultrafast systems of processing of above-mentioned LTCC, wherein, the galvanometer of second scanning element is light inlet hole
The galvanometer of footpath 14mm.
The ultrafast processing methods of LTCC of the present invention,
The light of laser output enters beam shaping module after the first speculum reflection of the first reflector element；
Light beam is expanded and filtered into shaping module, and the light beam after shaping is emitted directly toward decay module；
The polarization slide of decay module changes the polarization state for the light beam for inciding decay module, polarizes slide adjustment beam
The ratio of middle P polarisations and S polarisations, the light beam after polarizing enter the polarisation cube beamsplitter of decay module, polarisation cube
Optical splitter splits the light into two mutually perpendicular direction outgoing according to the polarization state of light, and P polarisations are emitted from parallel direction, S polarisations
It is emitted from vertical direction；
From the light beam of the horizontal direction of decay module outgoing, the second speculum, the 3rd speculum through the second reflector element
Enter the first scanning element after being reflected with the 4th speculum；After field lens focusing of the light beam through the first scanning element with galvanometer
Corresponding drawing is processed the material on processing platform；
From the light beam of the vertical direction of decay module outgoing, the 5th speculum and the 6th speculum through third reflecting unit
Enter the second scanning element after reflection；Field lens of the light beam Jing Guo the second scanning element focus on after with galvanometer corresponding drawing
Material on processing platform is processed.
Further, the ultrafast processing methods of above-mentioned LTCC, wherein, the beam shaping module includes beam expanding lens and filter
Mating plate, beam expanding lens are arranged in light path using oppositely positioned, and the size for expanding hot spot, optical filter are expanded and changed to light beam
It is arranged in after beam expanding lens, laser beam after expanding is filtered.
Further, the ultrafast processing methods of above-mentioned LTCC, wherein, the polarization slide adjusts P polarisations and S in light beam
The ratio of polarisation so that the light intensity of both direction is suitable, i.e., power error is within 5%.
Further, the ultrafast processing methods of above-mentioned LTCC, wherein, the processing platform can place four processing at the same time
Material, meets that the first scanning element and the second scanning element are processed at the same time.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas：
1. the present invention uses ultrafast green ray picosecond laser device and matched high-speed vibrating mirror and other optics,
Micro through hole diameter on ltcc substrate can be reduced to less than 50 μm, while ensure that the circularity of micro through hole reaches more than 95%,
Taper is within 3 μm；
2. can be on the premise of machining accuracy be ensured, by processing efficiency lifting to 1500 holes/second, than at present on the market
Fast more than 1 times of laser-beam drilling machine；The precision controlling of micro through hole spacing is within ± 5 μm；
3. filter element can optimize the quality at hot spot edge so as to improve the circularity of micro through hole profile；Various sizes of filter
Optical element coordinates different laser powers to achieve the purpose that to control micro through hole aperture；Can be by adjusting galvanometer scaling and every
The position of a concatenation module ensures the precision of micro through hole spacing.
Brief description of the drawings
Fig. 1：The light channel structure schematic diagram of the present invention.
Embodiment
In order to which the technical features, objects and effects of the present invention are more clearly understood, specific implementation is now described in detail
Scheme.
As shown in Figure 1, the ultrafast systems of processing of LTCC, are provided with according to optical path direction：
Laser A, is the ultrafast picosecond laser of narrow spaces, output beam, has higher repetition rate；Laser A goes out
Penetrate the optical gate that end light path is equipped with controlling switch light；
First reflector element, comprising the first speculum C1 arranged according to optical path direction, the light beam exported from laser A is penetrated
Enter beam shaping module B；
Beam shaping module B, comprising beam expanding lens B1 and optical filter B2, beam expanding lens B1 is arranged in light path using oppositely positioned
On, the size for expanding hot spot is expanded and changed to light beam, and optical filter B2 is arranged in after beam expanding lens B1, to swashing after expanding
Light light beam is filtered, to obtain the laser beam of quality higher；
Decay module D, change shaping after laser beam polarization state and incident light is divided into parallel direction and vertical direction
Two-beam, comprising polarization slide D1 and polarisation cube beamsplitter D2, polarization slide D1 be located at polarisation cube beamsplitter D2
Incident optical port, polarization slide D1 change the polarization state of incident beam, adjust the ratio of P polarisations and S polarisations in light beam, polarisation cube
Body optical splitter D2 splits the light into two mutually perpendicular direction outgoing according to the polarization state of light, and P polarisations are emitted from parallel direction, S
Polarisation is emitted from vertical direction；
Second reflector element, includes the second speculum C2 being sequentially arranged according to the horizontal optical path direction after light splitting, the 3rd
Speculum C3 and the 4th speculum C4, the first scanning element is incident to by the horizontal direction light after light splitting；
First scanning element, the light beam that the second reflector element reflects is focused, comprising being sequentially arranged according to optical path direction
Galvanometer E1 and field lens F1, galvanometer E1 is the galvanometer of light inlet aperture 14mm, and the P polarisations of the horizontal direction after light splitting are anti-through second
Penetrate unit to be mapped on the eyeglass of galvanometer E1, without being in the light or lacking optical phenomenon, focused to by field lens F1 on processing object；
Third reflecting unit, includes the 5th speculum C5 and the 6th being sequentially arranged according to the vertical optical path direction after light splitting
Speculum C6, the second scanning element is incident to by the vertical direction S polarisations after light splitting；
Second scanning element, the light beam that third reflecting unit reflects is focused, comprising being sequentially arranged according to optical path direction
Galvanometer E2 and field lens F2, galvanometer E2 is the galvanometer of light inlet aperture 14mm, and vertical direction light after light splitting is single through the 3rd reflection
Member is mapped on the eyeglass of galvanometer E2, without being in the light or lacking optical phenomenon, is focused to by field lens F2 on processing object；
Processing platform G, for placing rapidoprint；Can place four rapidoprints at the same time, meet the first scanning element and
Second scanning element is processed at the same time.
When said system is used for LTCC ultrafast processing, first, the light of laser A outputs passes through the first of the first reflector element
Enter beam shaping module B after speculum C1 reflections；
Light beam enters after shaping module B after beam expanding lens B1 is expanded and filtered with optical filter B2, and beam quality is improved,
Light beam after shaping is emitted directly toward decay module D；
The polarization slide D1 of decay module D changes the polarization state for the light beam for inciding decay module, and polarization slide D1 is adjustable
Save the ratio of P polarisations and S polarisations in light beam so that the light intensity of both direction is suitable, i.e. power error polarizes it within 5%
Rear light beam enters polarisation the cube beamsplitter D2, polarisation cube beamsplitter D2 of decay module according to the polarization state of light by light
It is divided into two mutually perpendicular direction outgoing, P polarisations are emitted from parallel direction, and S polarisations are emitted from vertical direction；
From the light beam of the horizontal direction of decay module D outgoing, the second speculum C2 through the second reflector element, the 3rd reflection
Enter the first scanning element after mirror C3 and the 4th speculum C4 reflections；Field lens F1 of the light beam through the first scanning element focus on after by
Galvanometer E1 coordinates corresponding drawing to be processed the material on processing platform G；
From the light beam of the vertical direction of decay module D outgoing, the 5th speculum C5 and the 6th through third reflecting unit is anti-
Enter the second scanning element after penetrating mirror C6 reflections；After field lens F2 focusing of the light beam Jing Guo the second scanning element with galvanometer E1
Corresponding drawing is processed the material on processing platform G.
Can by manipulator from upper magazine feeding, then expect again on processing platform down.Processing platform is moved to processing
Position, is processed with the machined parameters and correction parameter of debugging.After machining, processing platform is moved to lower discharge position,
Expect blanking box under after manipulator feeding.
Using ultrafast green ray picosecond laser device and matched high-speed vibrating mirror and other optics, can incite somebody to action
Micro through hole diameter on ltcc substrate is reduced to less than 50 μm, while ensures that the circularity of micro through hole reaches more than 95%, and taper is 3
Within μm.
Can be on the premise of machining accuracy be ensured, by processing efficiency lifting to 1500 holes/second, than swashing on the market at present
Fast more than 1 times of light puncher.The precision controlling of micro through hole spacing is within ± 5 μm.
In conclusion the present invention can control the aperture of micro through hole and ensure machining accuracy, filter element can optimize
The quality at hot spot edge is so as to improve the circularity of micro through hole profile；Various sizes of filter element coordinates different laser powers to reach
To the purpose in control micro through hole aperture；It can be ensured by adjusting the position of galvanometer scaling and each concatenation module micro- logical
The precision of pitch of holes.
It should be noted that：The foregoing is merely the preferred embodiment of the present invention, is not limited to power of the invention
Sharp scope；At the same time more than description, should can understand and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (10)
- The ultrafast systems of processing of 1.LTCC, it is characterised in that：It is provided with according to optical path direction：Laser (A), output beam；First reflector element, comprising the first speculum (C1) arranged according to optical path direction, the light beam exported from laser (A) is penetrated Enter beam shaping module (B)；Beam shaping module (B), expands light beam and is changed the size for expanding hot spot, and to laser beam after expanding into Row filtering；Decay module (D), change the polarization state of laser beam after shaping and incident light is divided into parallel direction and vertical direction Two-beam, comprising polarization slide (D1) and polarisation cube beamsplitter (D2), polarization slide (D1) is located at the light splitting of polarisation cube Device (D2) incidence optical port, polarization slide (D1) change the polarization state of incident beam, adjust the ratio of P polarisations and S polarisations in light beam, Polarisation cube beamsplitter (D2) splits the light into the outgoing of two mutually perpendicular directions according to the polarization state of light, and P polarisations are from parallel Direction is emitted, and S polarisations are emitted from vertical direction；Second reflector element, comprising the second speculum (C2) being sequentially arranged according to the horizontal optical path direction after light splitting, the 3rd anti- Mirror (C3) and the 4th speculum (C4) are penetrated, the horizontal direction light after light splitting is incident to the first scanning element；First scanning element, the light beam that the second reflector element reflects is focused, is shaken comprising what is be sequentially arranged according to optical path direction Mirror (E1) and field lens (F1), the P polarisations light of the horizontal direction after light splitting are mapped to through the second reflector element on the eyeglass of galvanometer (E1), Focused to by field lens (F1) on processing object；Third reflecting unit, it is anti-comprising the 5th speculum (C5) and the 6th being sequentially arranged according to the vertical optical path direction after light splitting Mirror (C6) is penetrated, the S polarisations of the vertical direction after light splitting are incident to the second scanning element；Second scanning element, the light beam that third reflecting unit reflects is focused, is shaken comprising what is be sequentially arranged according to optical path direction Mirror (E2) and field lens (F2), the vertical direction light after light splitting is mapped to through third reflecting unit on the eyeglass of galvanometer (E2), by field lens (F2) focus on processing object；Processing platform (G), for placing rapidoprint.
- 2. the ultrafast systems of processing of LTCC according to claim 1, it is characterised in that：The laser (A) surpasses for narrow spaces Fast picosecond laser.
- 3. the ultrafast systems of processing of LTCC according to claim 1 or 2, it is characterised in that：Laser (A) the exit end light Road is equipped with the optical gate of controlling switch light.
- 4. the ultrafast systems of processing of LTCC according to claim 1, it is characterised in that：The beam shaping module (B) includes Beam expanding lens (B1) and optical filter (B2), beam expanding lens (B1) are arranged in light path using oppositely positioned, light beam are expanded and is changed Become the size for expanding hot spot, optical filter (B2) is arranged in after beam expanding lens (B1), laser beam after expanding is filtered.
- 5. the ultrafast systems of processing of LTCC according to claim 1, it is characterised in that：The galvanometer of first scanning element (E1) galvanometer for being light inlet aperture 14mm.
- 6. the ultrafast systems of processing of LTCC according to claim 1, it is characterised in that：The galvanometer of second scanning element (E2) galvanometer for being light inlet aperture 14mm.
- 7. the system described in claim 1 realizes the ultrafast processing methods of LTCC, it is characterised in that：The light of laser (A) output enters beam shaping module after the first speculum (C1) reflection of the first reflector element (B)；Light beam is expanded and filtered into shaping module (B), and the light beam after shaping is emitted directly toward decay module (D)；The polarization slide (D1) of decay module (D) changes the polarization state for the light beam for inciding decay module, and polarization slide (D1) can The ratio of P polarisations and S polarisations in light beam is adjusted, the light beam after polarizing enters the polarisation cube beamsplitter of decay module (D2), polarisation cube beamsplitter (D2) splits the light into the outgoing of two mutually perpendicular directions according to the polarization state of light, P polarisations from Parallel direction is emitted, and S polarisations are emitted from vertical direction；From the light beam of the horizontal direction of decay module (D) outgoing, the second speculum (C2) through the second reflector element, the 3rd reflection Enter the first scanning element after mirror (C3) and the reflection of the 4th speculum (C4)；Field lens (F1) of the light beam through the first scanning element focuses on The material on processing platform (G) is processed from corresponding drawing with galvanometer (E1) afterwards；From the light beam of the vertical direction of decay module (D) outgoing, the 5th speculum (C5) and the 6th through third reflecting unit are anti- Enter the second scanning element after penetrating mirror (C6) reflection；By galvanometer after field lens (F2) focusing of the light beam Jing Guo the second scanning element (E1) corresponding drawing is coordinated to be processed the material on processing platform (G).
- 8. the ultrafast processing methods of LTCC according to claim 7, it is characterised in that：The beam shaping module (B) includes Beam expanding lens (B1) and optical filter (B2), beam expanding lens (B1) are arranged in light path using oppositely positioned, light beam are expanded and is changed Become the size for expanding hot spot, optical filter (B2) is arranged in after beam expanding lens (B1), laser beam after expanding is filtered.
- 9. the ultrafast processing methods of LTCC according to claim 7, it is characterised in that：The polarization slide (D1) adjusts light beam The ratio of middle P polarisations and S polarisations so that the light intensity of both direction is suitable, i.e., power error is within 5%.
- 10. the ultrafast processing methods of LTCC according to claim 7, it is characterised in that：The processing platform (G) can put at the same time Four rapidoprints are put, meet that the first scanning element and the second scanning element are processed at the same time.
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| CN108907457A (en) * | 2018-08-14 | 2018-11-30 | 江苏瑞驰机电科技有限公司 | The device for merging, separating optical delivery is realized by laser reversal |
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| CN110216382A (en) * | 2019-07-05 | 2019-09-10 | 北京莱泽光电技术有限公司 | Drilling equipment and boring method |
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