CN105101646A - Preparation method of composite polypropylene series resin sheet - Google Patents
Preparation method of composite polypropylene series resin sheet Download PDFInfo
- Publication number
- CN105101646A CN105101646A CN201510483806.5A CN201510483806A CN105101646A CN 105101646 A CN105101646 A CN 105101646A CN 201510483806 A CN201510483806 A CN 201510483806A CN 105101646 A CN105101646 A CN 105101646A
- Authority
- CN
- China
- Prior art keywords
- preparation
- resin sheet
- series resin
- polypropylene
- composite polypropylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
Abstract
The invention relates to a preparation method of a composite polypropylene series resin sheet. The composite polypropylene series resin sheet is prepared by adopting a mode of clamping a piece of carbon fiber cloth between two layers of flake-like polypropylene and carrying out thermal compression. The bonding strength between the carbon fiber cloth and the flake-like polypropylene is improved by adopting a mode of presoaking the carbon fiber cloth into epoxy resin. The composite polypropylene series resin sheet also has an electromagnetic shielding function when serving as an insulating dielectric or a bonding dielectric between an upper circuit layer and a lower circuit layer traditionally, thereby being capable of improving the electromagnetic shielding function of a multi-layer board, and being conducive to high-frequency performance of the multi-layer board.
Description
Technical field
The present invention relates to a kind of preparation method of fat sheet, particularly relate to a kind of preparation method of composite polypropylene series resin sheet.
Background technology
At present, during multilayer circuit board manufactures, the film for interlayer pressing is commonly acrylic resin sheet (PP film).When the multi-layer sheet of manufacture less than four layers, polypropylene film is as layers cementing medium and insulating medium layer, and stable performance, manufactures fraction defective lower.
Along with the development of science and technology, electronic product more and more pursues compactization while the complicated and diversification of pursuit function, this just requires that wiring board needs to adopt high-density line configuration and micro-aperture technique to reach target, the design of wiring board multiple stratification necessitates, for the electronic equipment of some complexity, the Multi-layer design of wiring board needs to reach eight layers, or even ten layers.But, because electronic product is pursued lightening, the thickness for wiring board is also that pursuit is lightening, even if when eight laminates or ten laminates, requirement for wiring board thickness very harsh more than 0.8 millimeter, otherwise can not cannot be competent at the requirement of electronic product for low level.Just because of this, require that the every one deck base material in wiring board all has lower thickness, the requirement for polypropylene film is also like this.For the electrical requirements of high speed signal, circuit board must provide there is alternating current characteristics impedance Control, high-frequency transmission ability, reduce unnecessary radiation (EMI) etc.
But owing to requiring that polypropylene film has lower thickness, the signal disturbing between line layer then can rise, and makes multiple-plate signal shielding miopragia, hinder multiple-plate circuit and promote.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of preparation method of composite polypropylene series resin sheet, make it have more value in industry.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of preparation method of composite polypropylene series resin sheet, to adapt to multi-layer sheet film demand, to improve multi-layer sheet signal shielding performance.
The preparation method of composite polypropylene series resin sheet of the present invention, carries out in the steps below:
Step one, preparation two ganoid carriers;
Step 2, preparation are soaked with the carbon cloth of epoxy resin in advance;
Step 3, by the polypropylene-based resin of melting respectively at two described carrier surface levellings, and respectively the polypropylene-based resin of two carrier surfaces is squeezed into sheet-like polypropylene with pressure roller;
The sheet-like polypropylene surface carbon cloth prepared of stacking at least one deck step 2 of step 4, wherein one carrier;
Step 5, another carrier is superimposed on the obtained superstructure of step 4 together with the sheet-like polypropylene on it, two described carriers lay respectively at top and the bottom of whole folded structure;
Step 6, whole folded structure step 5 prepared are delivered to heat pressure roller and carry out pressing, then peel off described carrier, obtained composite polypropylene series resin sheet of the present invention.
Further, in step 3, the thickness controlling described sheet-like polypropylene is 0.7-0.8mil.
Further, the order number of described carbon cloth is 300-600 order.
Further, in step 4, stacking two-layer carbon cloth.Further, wherein the order number of one deck carbon cloth is 300-400 order, and the order number of another layer of carbon cloth is 500-600 order.
Further, in step 6, the gross thickness controlling described composite polypropylene series resin sheet is 1.6-1.8mil.
Further, described carrier is ganoid Copper Foil.
Further, in step 6, hot pressing temperature controls at 165 DEG C.
By such scheme, the present invention at least has the following advantages: the preparation method of composite polypropylene series resin sheet of the present invention is by being sandwiched in the mode of also hot pressing between two-layer sheet-like polypropylene by carbon cloth, and by the mode of pre-for carbon cloth epoxy resin dipping being improved the adhesion between carbon cloth and sheet-like polypropylene, prepare a kind of composite polypropylene series resin sheet, this composite polypropylene series resin sheet traditional serves as dielectric between upper and lower line layer and then while medium having, also there is electro-magnetic screen function, multiple-plate electro-magnetic screen function can be improved, be beneficial to multiple-plate high frequency performance.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, be described in detail below with preferred embodiment of the present invention.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Embodiment: a kind of preparation method of composite polypropylene series resin sheet, carry out in the steps below:
Step one, prepare two ganoid carriers, this carrier specifically can adopt thickness to be the Copper Foil of more than 200 microns;
Step 2, preparation are soaked with the carbon cloth of epoxy resin in advance, and this carbon cloth is specifically divided into two kinds, and one is order number is 300-400 object carbon cloth, and another kind is order number is 500-600 object carbon cloth;
Step 3, by the polypropylene-based resin of melting respectively at two described carrier surface levellings, and respectively the polypropylene-based resin of two carrier surfaces is squeezed into sheet-like polypropylene with pressure roller, controlling the polyacrylic thickness of sheet is 0.7-0.8mil;
The sheet-like polypropylene surface of step 4, wherein one carrier is the carbon cloth (order number 300-400 order) prepared of stacking one deck step 2 first, then carbon cloth prepared by stacking one deck step 2 (order number 500-600 order);
Step 5, another carrier is superimposed on the obtained superstructure of step 4 together with the sheet-like polypropylene on it, two described carriers lay respectively at top and the bottom of whole folded structure;
Step 6, whole folded structure step 5 prepared are delivered to heat pressure roller and carry out pressing, hot pressing temperature controls at 165 DEG C, then peel off described carrier, the gross thickness controlling described composite polypropylene series resin sheet is 1.6-1.8mil, obtained composite polypropylene series resin sheet of the present invention.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (8)
1. a preparation method for composite polypropylene series resin sheet, is characterized in that: carry out in the steps below:
Step one, preparation two ganoid carriers;
Step 2, preparation are soaked with the carbon cloth of epoxy resin in advance;
Step 3, by the polypropylene-based resin of melting respectively at two described carrier surface levellings, and respectively the polypropylene-based resin of two carrier surfaces is squeezed into sheet-like polypropylene with pressure roller;
The sheet-like polypropylene surface carbon cloth prepared of stacking at least one deck step 2 of step 4, wherein one carrier;
Step 5, another carrier is superimposed on the obtained superstructure of step 4 together with the sheet-like polypropylene on it, two described carriers lay respectively at top and the bottom of whole folded structure;
Step 6, whole folded structure step 5 prepared are delivered to heat pressure roller and carry out pressing, then peel off described carrier, obtained described composite polypropylene series resin sheet.
2. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: in step 3, and the thickness controlling described sheet-like polypropylene is 0.7-0.8mil.
3. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: the order number of described carbon cloth is 300-600 order.
4. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: in step 4, stacking two-layer carbon cloth.
5. the preparation method of composite polypropylene series resin sheet according to claim 4, is characterized in that: wherein the order number of one deck carbon cloth is 300-400 order, and the order number of another layer of carbon cloth is 500-600 order.
6. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: in step 6, and the gross thickness controlling described composite polypropylene series resin sheet is 1.6-1.8mil.
7. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: described carrier is ganoid Copper Foil.
8. the preparation method of composite polypropylene series resin sheet according to claim 1, is characterized in that: in step 6, and hot pressing temperature controls at 165 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510483806.5A CN105101646A (en) | 2015-08-10 | 2015-08-10 | Preparation method of composite polypropylene series resin sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510483806.5A CN105101646A (en) | 2015-08-10 | 2015-08-10 | Preparation method of composite polypropylene series resin sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101646A true CN105101646A (en) | 2015-11-25 |
Family
ID=54580849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510483806.5A Pending CN105101646A (en) | 2015-08-10 | 2015-08-10 | Preparation method of composite polypropylene series resin sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101646A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104222A (en) * | 2004-09-30 | 2006-04-20 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| CN101701099A (en) * | 2009-10-28 | 2010-05-05 | 中国人民解放军国防科学技术大学 | Epoxy resin film for resin film melt impregnating process and preparation method thereof |
| CN101934613A (en) * | 2009-06-30 | 2011-01-05 | 江苏纤强复合材料有限公司 | Glass fiber mat enhanced polypropylene plate with decoration surface layer |
| CN102196670A (en) * | 2010-01-22 | 2011-09-21 | 住友电木株式会社 | Method for laminating prepreg, method for producing printed wiring board and prepreg roll |
| CN103029403A (en) * | 2011-09-30 | 2013-04-10 | 深圳光启高等理工研究院 | Preparation method of medium base plate and metamaterial |
-
2015
- 2015-08-10 CN CN201510483806.5A patent/CN105101646A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104222A (en) * | 2004-09-30 | 2006-04-20 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| CN101934613A (en) * | 2009-06-30 | 2011-01-05 | 江苏纤强复合材料有限公司 | Glass fiber mat enhanced polypropylene plate with decoration surface layer |
| CN101701099A (en) * | 2009-10-28 | 2010-05-05 | 中国人民解放军国防科学技术大学 | Epoxy resin film for resin film melt impregnating process and preparation method thereof |
| CN102196670A (en) * | 2010-01-22 | 2011-09-21 | 住友电木株式会社 | Method for laminating prepreg, method for producing printed wiring board and prepreg roll |
| CN103029403A (en) * | 2011-09-30 | 2013-04-10 | 深圳光启高等理工研究院 | Preparation method of medium base plate and metamaterial |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN102395249B (en) | Manufacturing method of four-layer copper-based metal plate | |
| CN109699132A (en) | Multilayer LCP low temperature compression method and the product of preparation | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN103188882A (en) | Circuit board and manufacture method thereof | |
| CN105451428A (en) | Laminated circuit board processing method and laminated circuit board | |
| CN105430941A (en) | Technology for improving thick copper board stitching white edge | |
| CN102009514B (en) | Manufacturing method of sandwich plate | |
| CN102009513B (en) | Insulating reinforced plate and making method thereof | |
| CN101460013A (en) | Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same | |
| CN104999682A (en) | Preparing method for glass-fiber reinforced polypropylene series resin flake | |
| CN201797646U (en) | Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board | |
| CN203198324U (en) | Copper-clad plate and printed circuit board thereof | |
| CN103826390A (en) | Thick copper printed circuit board and manufacturing method thereof | |
| CN105101646A (en) | Preparation method of composite polypropylene series resin sheet | |
| CN103458607A (en) | Extinction stiffening plate used for printed circuit board | |
| CN203984767U (en) | A kind of high capacity aluminum-based circuit board | |
| CN102166847A (en) | Preparation method of aluminum-based copper-clad laminate | |
| CN113630990B (en) | Combined pressing plate process for inner thin core plate and multiple layers of prepregs | |
| CN206446211U (en) | A kind of high proof voltage aluminum-based copper-clad plate | |
| CN206323639U (en) | A kind of three sandwich circuit boards of warpage preventing | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| CN201374874Y (en) | Printed circuit board | |
| CN204721711U (en) | A kind of multilayer circuit board | |
| CN203435219U (en) | Novel circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
|
| RJ01 | Rejection of invention patent application after publication |