CN105097479A - Chip interval maintaining device and chip interval maintaining method - Google Patents
Chip interval maintaining device and chip interval maintaining method Download PDFInfo
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- CN105097479A CN105097479A CN201510229164.6A CN201510229164A CN105097479A CN 105097479 A CN105097479 A CN 105097479A CN 201510229164 A CN201510229164 A CN 201510229164A CN 105097479 A CN105097479 A CN 105097479A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 230000007480 spreading Effects 0.000 claims description 132
- 238000010521 absorption reaction Methods 0.000 claims description 25
- 230000011218 segmentation Effects 0.000 claims description 24
- 238000012423 maintenance Methods 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000008602 contraction Effects 0.000 description 11
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a chip interval maintaining device and a chip interval maintaining method. Relaxation of an expanded expansion film can be accurately removed in a short time. The chip interval maintaining device is a device which maintains intervals of a plurality of chips (C) of a processed object (W), which is supported on an annular frame (F) across an expansion film (S), through an expansion state. The chip interval maintaining device is provided with a workbench (11) attracting and holding the processed object, a frame holding unit (12) holding the annular frame at the periphery of the workbench, the expansion film enabling the holding workbench and the frame holding unit to move relative to each other in a vertical direction, an expansion unit (37) forming the intervals between the chips of the processed object, a heating unit (41) irradiating heat to a protrusion part (R) which is generated at the periphery of the processed object due to a release of expansion of an expansion belt, and a pressing unit (23) pressing a thermal irradiation position of the heating unit on the expansion film from the lower part.
Description
Technical field
The present invention relates to street holdout device and street maintenance method that each chip after by the segmentation being supported in the machined object on ring-shaped frame across film spreading is maintained the state of expansion street.
Background technology
In the past, knownly be attached on the machined object on film spreading, form the segmentation starting point of upgrading layer, laser processing groove, cutting slot etc. along segmentation preset lines, then machined object is divided into the method (for example, referring to patent documentation 1) of each chip.In the dividing method described in patent documentation 1, be pasted on the film spreading expansion on ring-shaped frame, thus apply external force to the segmentation starting point formed along segmentation preset lines, machined object is divided into each chip by the segmentation starting point reduced along this intensity.But once relieve the expansion of film spreading, then can produce larger relaxing on film spreading, adjacent chips contacts with each other and there is the possibility producing defect and breakage.
Therefore, also proposed under the state at the interval maintaining (fix) chip chamber, give hot etc. outside stimulus to the surrounding of the larger machined object of the relax level of film spreading, make the method for the lax contraction of film spreading.For the method, worry due to the material of film spreading and thickness and make the lax contraction based on outside stimulus insufficient, or laxly not shrink.So, propose and a kind ofly hold relaxing and carrying out thermo-compressed of film spreading, thus on film spreading, form the method (for example, referring to patent documentation 2) of tension force.In the method described in this patent documentation 2, the lax of the film spreading produced is swelled upward, hold this protrusion in all-round scope and carry out thermo-compressed around machined object, to remove the lax of film spreading.
Patent documentation 1 Japanese Unexamined Patent Publication 2007-189057 publication
Patent documentation 2 Japanese Unexamined Patent Publication 2013-239557 publication
But, when film spreading is attached on ring-shaped frame, tension force can be applied on a direction of film spreading, thus can produce tension force deviation on the direction being applied in tension force and another direction orthogonal with it.Therefore, in the method described in patent documentation 2, be subject to the tension force impact of film spreading inherence, protrusion can be produced in the radial different distance place around machined object.Therefore, when observing from upper surface, the surrounding of machined object can be that ellipticity is surrounded by protrusion, exist be difficult in all-round scope to protrusion thermo-compressed with removes film spreading relax problem.
Summary of the invention
The present invention completes in view of the foregoing, its object is to provide a kind of and can remove the lax street holdout device and street maintenance method that produce due to the expansion of film spreading at short notice exactly.
Street holdout device of the present invention, it is expansion state by forming the distance maintaining being attached at multiple chips film spreading being installed on the machined object on ring-shaped frame, it has: workbench, it has the supporting surface supporting machined object, and supports machined object across film spreading in the mode can adsorbing maintenance; Framework holding unit, it has the holding surface keeping ring-shaped frame around this workbench; Expansion elements, it forms interval by this film spreading of expansion at this chip chamber multiple; Heating unit, it irradiates heat from upper side to protrusion and makes it shrink, wherein, this protrusion is keeping having been expanded this film spreading by this expansion elements by the absorption of this workbench across this film spreading and form spaced this chip multiple at this chip chamber while, is swelled between the periphery and the inner circumferential of this ring-shaped frame of machined object by removing the expansion of this expansion elements by the redundance of this film spreading; And pressing unit, it is disposed in relative with the thermal exposure mouth of this heating unit immediately below this film spreading, and press this film spreading from the direction of this thermal exposure mouth of this heating unit of lower direction of this film spreading, this protrusion is moved near this thermal exposure mouth of this heating unit.
According to this structure, machined object is held on workbench, and ring-shaped frame is held on framework holding unit, is expanded and form interval at chip chamber by film spreading.Then, the expansion of film spreading is removed under the state relying on the chip chamber being adsorbed on machined object of workbench to maintain interval, thus between the periphery and the inner circumferential of ring-shaped frame of machined object, form protrusion by the redundance protuberance of the lax generation of film spreading.Now, by means of the deviation of the tension force of film spreading inherence, when resulting from the protrusion around machined object and departing from immediately below thermal exposure mouth, rely on pressing unit pressing film spreading and protrusion is moved to immediately below thermal exposure mouth.Protrusion moves near thermal exposure mouth, therefore from thermal exposure mouth, irradiates heat to protrusion, can make protrusion thermal contraction efficiently.
In addition, street maintenance method of the present invention, use street holdout device as above, be expansion state by forming the distance maintaining being attached at multiple chips film spreading being installed on the machined object on ring-shaped frame, have: keep step, across this film spreading mounting machined object on this workbench, and keep this ring-shaped frame by this framework holding unit; Street expansion step, after implementing this maintenance step, make the distance that this workbench and this framework holding unit relative movement in vertical direction specifys, make this workbench relative to this framework holding unit jack-up this film spreading that extends, thus at the plurality of chip chamber formation interval; Absorption keeps step, after implementing this street expansion step, keeps machined object, thus maintain the interval of this adjacent chip chamber by this workbench across the absorption of this film spreading; Protrusion forming step, after starting this absorption maintenance step, make this workbench and this framework holding unit relative movement in vertical direction, remove the jack-up of this workbench relative to this framework holding unit, form the expansion of this film spreading and protrusion that the long position of this film spreading that formed is swelled to the face side of this film spreading at the outer circumferential side of machined object; And heat shrink step, after implementing this protrusion forming step, by this pressing unit pressing film spreading, this protrusion is moved to immediately below this thermal exposure mouth of this heating unit, and makes this protrusion heat shrink by this heating unit.
In addition, in said chip distance maintaining method, on the machined object of many segmentation preset lines being set with intersection, segmentation starting point is formed along this segmentation preset lines, in this street expansion step, machined object is split into multiple chip, and is formed with interval at chip chamber.
According to the present invention, by making the protrusion produced after relieving the expansion state of film spreading move immediately below thermal exposure mouth, thus produce due to the expansion of film spreading lax can be removed at short notice exactly.
Accompanying drawing explanation
Fig. 1 is the stereogram of the street holdout device of present embodiment.
Fig. 2 A ~ 2C is upper surface schematic diagram and the generalized section of the workbench of present embodiment.
Fig. 3 A ~ 3C is the action specification figure of the pressing unit of present embodiment.
Fig. 4 is the figure of an example of the maintenance step representing present embodiment.
Fig. 5 is the figure of an example of the street expansion step representing present embodiment.
Fig. 6 represents that the absorption of present embodiment keeps the figure of an example of step.
Fig. 7 is the figure of an example of the protrusion forming step representing present embodiment.
Fig. 8 A ~ 8B is the figure of an example of the heat shrink step representing present embodiment.
Label declaration
1: street holdout device; 11: workbench; 12: framework holding unit; 21: supporting surface; 23: pressing unit; 32: holding surface; 37: lift cylinder (expansion elements); 41: heating unit; 45: thermal exposure mouth; 52: segmentation preset lines; 54: upgrading layer (segmentation starting point); C: chip; F: ring-shaped frame; R: protrusion; S: film spreading; W: machined object.
Embodiment
Below, the street holdout device of present embodiment is described.Fig. 1 is the stereogram of the street holdout device of present embodiment.Fig. 2 is upper surface schematic diagram and the generalized section of the workbench of present embodiment.In addition, Fig. 2 A is the upper surface schematic diagram representing workbench, and Fig. 2 B is the generalized section of the A-A line represented along Fig. 2 A, and Fig. 2 C is the generalized section of the B-B line represented along Fig. 2 A.In addition, the street holdout device of present embodiment is not limited to the structure shown in Fig. 1, can suitably change.
As shown in Figure 1, street holdout device 1 is configured to, and is expanded, by across film spreading S, the discoideus machined object W be supported on ring-shaped frame F is divided into each chip by the film of film spreading S.In addition, street holdout device 1 is configured to, and removes the expansion of film spreading S under the state maintaining street, and what produced afterwards in the releasing of film expansion by heat shrink (pyrocondensation) removal is relaxed.So, film spreading S stretches and only makes the position thermal contraction that significantly relaxes, is fixed as the state of the street after the segmentation maintaining machined object W.
The front 51 of machined object W is provided with cancellate segmentation preset lines 52, each region that divided preset lines 52 marks off is formed with various device (not shown).The outer rim of machined object W is provided with the recess 53 representing crystal orientation.In addition, machined object W both can be the semiconductor wafer being formed with the devices such as IC, LSI on the semiconductor substrate of silicon, GaAs etc., also can be the optical device wafer being formed with the optical devices such as LED on the inorganic material substrate of pottery, glass, sapphire class.Machined object W is being moved to street holdout device 1 across film spreading S under being supported in the state on ring-shaped frame F.
In addition, the upgrading layer 54 (with reference to Fig. 4) as segmentation starting point is formed with in the inside of machined object W along segmentation preset lines 52.In addition, upgrading layer 54 refers to the state becoming by means of the irradiation of laser and make the density of the inside of machined object W, refractive index, mechanical strength and other physical characteristics different from surrounding, and intensity is lower than the region of surrounding.Upgrading layer 54 is such as melt process region, slit region, insulation breakdown region, variations in refractive index region, also can be the region that above-mentioned zone mixing exists.In addition, in the following description, show upgrading layer 54 as the citing of segmentation starting point, as long as and the starting point split when starting point reduces the intensity of machined object W and can become segmentation, can be such as laser processing groove, cutting slot, Cutting Road.
Street holdout device 1 is configured with the workbench 11 that can adsorb and keep machined object W in central authorities, and around workbench 11, be configured with the framework holding unit 12 keeping ring-shaped frame F.Workbench 11 is supported by multiple column sections 29, and the upper surface of workbench 11 is formed by porous ceramic film material the supporting surface 21 supporting machined object W.Supporting surface 21 is connected to absorption source 13 (with reference to Fig. 4) by the stream in workbench 11, and relies on the negative pressure that produces at supporting surface 21 and adsorb and remain machined object W.In addition, be provided with open and close valve 14 (with reference to Fig. 4) at the stream be connected with absorption source 13 from supporting surface 21, the absorption switching supporting surface 21 by means of open and close valve 14 keeps removing with absorption.
As shown in Figure 2 A, the all-round scope of the neighboring of workbench 11 is provided with multiple roller 22 and multiple pressing unit 23.In this case, the adjacent being equipped with the position of 2 rollers 22 in the circumferential direction is continuously equipped with 1 pressing unit 23, and the neighboring of workbench 11 is evenly provided with multiple roller 22 and multiple pressing unit 23.As shown in Figure 2 B, multiple roller 22 is disposed on the end difference 24 that formed on the neighboring of workbench 11, and machined object W (with reference to Fig. 1) is supported on supporting surface 21, thus transfers in the downside of film spreading S (with reference to Fig. 1).Multiple roller 22 is transferred on film spreading S, thus can suppress the friction of the neighboring resulting from workbench 11 when the expansion of film spreading S.
As shown in Figure 2 C, multiple pressing unit 23 to haunt the movable pin on the supporting surface 21 of workbench 11, and be disposed in the end difference 24 formed on the neighboring of workbench 11.In addition, on the end difference 24 being equipped with pressing unit 23, cover 25 is provided with in the mode of the surrounding surrounding the pin front end of pressing unit 23.On the position being provided with pressing unit 23, the friction produced in the neighboring of workbench 11 during the expansion of film spreading S can be suppressed by means of this cover 25.In addition, the cylinder 26 driving pressing unit 23 is provided with at the lower surface of workbench 11.In addition, the action of pressing unit 23 is described after.
Return Fig. 1, the holding surface 32 of the mounting workbench 31 on framework holding unit 12 is placed with ring-shaped frame F, in the mode sandwiched from top by cover plate 33, around workbench 11, remain ring-shaped frame F by the holding surface 32 of mounting workbench 31.Mounting workbench 31 is quadrilateral shape when observing from upper surface, is formed with in central authorities the circular open 34 that diameter is greater than workbench 11.The cylinder rod 38 of 4 lift cylinders 37 be elevated for making mounting workbench 31 supports the corner of mounting workbench 31 from downside.4 lift cylinders 37 are made up of electric cylinder etc., are elevated and the expansion elements that film spreading S is expanded carries out work as making framework holding unit 12.
Cover plate 33 is formed as having in central authorities the rectangular plate-like that diameter is greater than the circular open 35 of workbench 11.If be placed with cover plate 33 on mounting workbench 31, then rely on cover plate 33 and mounting workbench 31 to keep ring-shaped frame F, and a part of machined object W and film spreading S is exposed up from the circular open 35 of cover plate 33.In addition, cover plate 33 being placed under the state on mounting workbench 31, such as, is fixed on mounting workbench 31 by not shown clamping part.
The discoideus lifter plate 42 possessing multiple heating unit 41 is provided with above cover plate 33.Lifter plate 42 is fixed on the lower end of the rotating shaft 43 of rotation by not shown motor etc., and relies on not shown elevating mechanism to move in vertical direction.Multiple heating unit 41 is far infra-red heaters, and is located in the annular section between ring-shaped frame F and machined object W.Heating unit 41 such as irradiates the far infrared at 3 μm ~ 25 μm with peak value waveform being difficult to be absorbed by metal material, thus can the heating of restraining device each several part, only suitably heats the irradiated site of film spreading S.
In this street holdout device 1, drive lift cylinder 37 and framework holding unit 12 is declined under the state that remain ring-shaped frame F, thus workbench 11 is outstanding from the circular open 34,35 of cover plate 33 and mounting workbench 31.Workbench 11 is relative to framework holding unit 12 jack-up, thus film spreading S expands diametrically and makes machined object W be split into each chip.In addition, if framework holding unit 12 rises and relieves the expansion of film spreading S, then film spreading S can relax, and around machined object W, generation relaxes, the redundance protuberance of film spreading S.
Thermal contraction is there is in the protrusion R (with reference to Fig. 3 B) of the protuberance on this film spreading S by means of multiple heating unit 41.In this case, heating unit 41 can cause damage to machined object W when the range of exposures of far infrared is excessive, and thus the preferred protrusion R point to film spreading S irradiates far infrared to carry out localized heating.But, if there is tension force in the prescribed direction being attached at the film spreading S inside on ring-shaped frame F, be then subject to the impact of this tension force deviation, protrusion R can be produced on the position of far-infrared radiation position of departing from heating unit 41.
So, in the street holdout device 1 of present embodiment, when the protrusion R of the surrounding resulting from machined object W deviate from the irradiation position of far infrared, by means of above-mentioned pressing unit 23 jack-up film spreading S, thus protrusion R is made to aim at the irradiation position of far infrared.And, from heating unit 41, far infrared is irradiated to protrusion R point, thus protrusion R can thermal contraction efficiently.
Below, with reference to Fig. 3, workbench and pressing unit are described.Fig. 3 is the action specification figure of the pressing unit of present embodiment.In addition, Fig. 3 A represents the upper surface schematic diagram of machined object, and Fig. 3 B represents the generalized section of the C-C line along Fig. 3 A, and Fig. 3 C represents the generalized section of the D-D line along Fig. 3 A.
As shown in Figure 3A, if when relieving the expansion of film spreading S after the segmentation of machined object W, the excess portion branch of film spreading S swells and produces protrusion R between the periphery of machined object W and the inner circumferential of ring-shaped frame F.As mentioned above, there is tension force in film spreading S inside along prescribed direction, the generation position of the protrusion R therefore between the periphery of machined object W and the inner circumferential of ring-shaped frame F is different in the circumferential direction.Specifically, at P1 place, position, produce protrusion R in the roughly centre position of the inner circumferential of the periphery of machined object W and ring-shaped frame F, and at P2 place, position, near the periphery of machined object W, produce protrusion R.
In addition, heating unit 41 (with reference to Fig. 3 B) as shown in double dot dash line L, aims at the roughly centre position of the periphery of machined object W and the inner circumferential of ring-shaped frame F to the irradiation position of far infrared.At P1 place, position, the protrusion R of film spreading S is consistent with the irradiation position of far infrared, and at P2 place, position, the protrusion R of film spreading S deviates from the irradiation position of far infrared.In addition, at the dorsal part of film spreading S, along far infrared irradiation position and be equipped with multiple pressing unit 23 at equal intervals.That is, immediately below the thermal exposure mouth 45 of multiple heating unit 41 (with reference to Fig. 3 B), multiple pressing unit 23 is positioned with across film spreading S.
And multiple pressing unit 23 is outstanding from the supporting surface 21 of workbench 11, thus make that to be elliptoid protrusion R when upper surface is observed move to the irradiation position of the far infrared shown in dotted line.Specifically, on the position P1 shown in Fig. 3 B, the roughly centre position of the inner circumferential of the periphery of machined object W and ring-shaped frame F produces the protrusion R of film spreading S, and pressing unit 23 need not be driven protrusion R can be positioned on the irradiation position of far infrared.On the other hand, on the position P2 shown in Fig. 3 C, produce the protrusion R of film spreading S near the periphery of machined object W, by pressing unit 23 jack-up film spreading S, thus protrusion R moves to the irradiation position of far infrared.
As above, rely on pressing unit 23 and from the below of film spreading S, press film spreading S in the direction of the thermal exposure mouth 45 of heating unit 41, the protrusion R of film spreading S is moved near thermal exposure mouth 45.Then, the protrusion R to film spreading S from the thermal exposure mouth 45 of heating unit 41 irradiates far infrared with high-precision dot.Therefore, only heated near protrusion R, damage can not be brought to machined object W, only protrusion R heat shrink efficiently can be made.
With reference to Fig. 4 to Fig. 7, the street maintenance method of street holdout device is described.Fig. 4 is the figure of an example of the maintenance step representing present embodiment.Fig. 5 is the figure of an example of the street expansion step representing present embodiment.Fig. 6 represents that the absorption of present embodiment keeps the figure of an example of step.Fig. 7 is the figure of an example of the protrusion forming step representing present embodiment.Fig. 8 is the figure of an example of the heat shrink step representing present embodiment.In addition, be described with the prerequisite being formed with segmentation starting point by step before on machined object.
As shown in Figure 4, first implement to keep step.In maintenance step, workbench 11 loads machined object W across film spreading S, is kept the ring-shaped frame F of the surrounding of machined object W by framework holding unit 12.Now, workbench 11 is formed as diameter and is greater than machined object W, and the below of the film spreading S between machined object W and ring-shaped frame F is configured with the pressing unit 23 of workbench 11.In addition, open and close valve 14 is closed, and has cut off the absorption affinity of absorption source 13 for supporting surface 21.And then, in the inside of machined object W, be formed with the upgrading layer 54 as segmentation starting point along segmentation preset lines 52 (with reference to Fig. 1).
As shown in Figure 5, after maintenance step, street expansion step is implemented.In street expansion step, framework holding unit 12 from initial position vertical direction decline regulation distance, thus workbench 11 relative to framework holding unit 12 by jack-up.Its result, the film spreading S being pasted with machined object W expands in radiation direction, gives external force via film spreading S to the upgrading layer 54 (with reference to Fig. 2) of machined object W.Upgrading layer 54 after machined object W reduces with intensity is split into each chip C for splitting starting point.Film spreading S extends into and adjacent chips C is left completely, thus forms interval between multiple chip C.
Now, on the neighboring of workbench 11, film spreading S transfers on multiple roller 22 (with reference to Fig. 2), thus can suppress the friction etc. of film spreading S when expanding.In addition, about street expansion step, declined relative to workbench 11 by framework holding unit 12, thus film spreading S expands, but be not limited to this structure.As long as the distance that workbench 11 and framework holding unit 12 relative movement in vertical direction specify, thus make the structure that film spreading S expands.Such as, both can be that workbench 11 rises relative to framework holding unit 12 and expands film spreading S, also can be that workbench 11 rises and framework holding unit 12 declines, thus expansion film spreading S.
As shown in Figure 6, after street expansion step, implement absorption and keep step.Keep in step in absorption, open and close valve 14 is opened and absorption source 13 is communicated with supporting surface 21, and the supporting surface 21 on workbench 11 produces absorption affinity.Now, film spreading S extends, and therefore maintains machined object W by workbench 11 across film spreading S absorption, thus is maintained the interval between adjacent chips C.So, when the expansion of street, not not hinder the mode of the expansion of film spreading S to adsorb maintenance film spreading S by workbench 11, but the mode maintaining street with the expansion at street afterwards adsorbs maintenance film spreading S by workbench 11.
As shown in Figure 7, the rear enforcement protrusion forming step of step is kept in absorption.In protrusion forming step, framework holding unit 12 rising from down position, thus relieve the jack-up of workbench 11 relative to framework holding unit 12.By the releasing of the jack-up of workbench 11, expanded by film spreading S and the long position protuberance that formed, thus form protrusion R at the outer circumferential side of machined object W.Now, on workbench 11, absorption maintains film spreading S, even if therefore the film spreading S of the surrounding of machined object W relaxes, the film spreading S on workbench 11 also can not produce lax.
As shown in Figure 8, after protrusion forming step, heat shrink step is implemented.As shown in Figure 8 A, in heat shrink step, by pressing unit 23 from downside pressing film spreading S, and the protrusion R of film spreading S moves immediately below the thermal exposure mouth 45 of heating unit 41.Such as, rely on pressing unit 23 immediately below the thermal exposure mouth 45 of heating unit 41, make the protrusion R made new advances, thus the protrusion R resulted near the periphery of machined object W is moved.Then, as shown in Figure 8 B, the point from the far infrared of the thermal exposure mouth 45 of heating unit 41 is relied on to irradiate and make the protrusion R heat shrink (pyrocondensation) of film spreading S.Then, multiple heating unit 41 rotates around vertical axle, and the protrusion R of film spreading S is in all-round scope heat shrink.
As above, by means of be present in film spreading S inside tension force deviation and make the protrusion R resulted from around machined object W depart from the irradiation position of heating unit 41 time, film spreading S can rely on pressing unit 23 move to the irradiation position of heating unit 41.Thus, the protrusion R thermal contraction efficiently of film spreading S is made by means of the some irradiation of heating unit 41.In heat shrink step, the only protrusion R thermal contraction of the film spreading S of the surrounding of machined object W, even if the absorption therefore relieving workbench 11 keeps, also can fix with the state at the interval maintaining adjacent chips C.
As above, in the street holdout device 1 of present embodiment, machined object W is held on workbench 11, and ring-shaped frame F is held on framework holding unit 12, and film spreading S expands, thus forms interval at chip chamber.And, remove the expansion of film spreading S under the state maintaining interval relying on the absorption of workbench 11 between the chip C of machined object W, thus make the lax redundance caused of film spreading S swell between the periphery of machined object W and the inner circumferential of ring-shaped frame F and form protrusion R.Now, by means of the deviation of tension force being present in film spreading S inside, when resulting from the protrusion R around machined object W and departing from immediately below thermal exposure mouth 45, press film spreading S by pressing unit 23 and protrusion R is moved immediately below thermal exposure mouth 45.Because protrusion R moves near thermal exposure mouth 45, therefore, it is possible to irradiate far infrared to protrusion R from thermal exposure mouth 45, protrusion R thermal contraction efficiently can be made.
In addition, the invention is not restricted to above-mentioned execution mode, can various change be carried out and implement.The content of above-mentioned execution mode is not limited to the size and shape shown in accompanying drawing, suitably can change in the scope playing effect of the present invention.In addition, can suitably change and implement in the scope not departing from the object of the invention.
Such as, in the street expansion step of present embodiment, be configured to by the expansion of film spreading S and machined object W be divided into multiple chip C, and form interval between multiple chip C, but being not limited to this structure.Such as, in the divided situation of machined object W, in street expansion step, as long as form interval by the expansion of film spreading S between multiple chip C.
In addition, in the present embodiment, heating unit 41 is configured to irradiate far infrared to the protrusion R point of film spreading S and make this protrusion R thermal contraction, but is not limited to this structure.As long as heating unit 41 can make protrusion R thermal contraction, just arbitrary structures can be adopted.
In addition, in the present embodiment, be configured to framework holding unit 12 and rely on mounting workbench 31 and cover plate 33 to sandwich ring-shaped frame F, but be not limited to this structure.As long as framework holding unit 12 can keep ring-shaped frame F, such as, framework holding unit 12 can be configured to four limits clamping part driven by air actuator etc. being arranged at mounting workbench 31, to keep four limits of ring-shaped frame F.
In addition, in the present embodiment, form pressing unit 23 by multiple movable pin, but be not limited to this structure.As long as pressing unit 23 is configured to the protrusion R pressing film spreading S, and moves it near the thermal exposure mouth 45 of heating unit 41, just arbitrary structures can be adopted.Such as, pressing unit 23 can be configured to make the perisporium of tubular outstanding from the supporting surface 21 of workbench 11, and presses the protrusion R of film spreading S in all-round scope.
As mentioned above, the present invention has the lax effect can removed exactly at short notice and produce due to the expansion of film spreading, is particularly useful for maintaining the street maintenance method of state of multiple streets having expanded little chip, bigbore machined object.
Claims (3)
1. a street holdout device, the distance maintaining of the multiple chips forming machined object is expansion state by it, and wherein, this machined object is attached on film spreading and is installed on ring-shaped frame,
The feature of this street holdout device is to have:
Workbench, it has the supporting surface supporting machined object, and supports machined object across film spreading in the mode can adsorbing maintenance;
Framework holding unit, it has the holding surface keeping ring-shaped frame around this workbench;
Expansion elements, it forms interval by this film spreading of expansion at this chip chamber multiple;
Heating unit, it irradiates heat from upper side to protrusion and this protrusion is shunk, wherein, this protrusion is this workbench keeps having been expanded this film spreading by this expansion elements across the absorption of this film spreading and forms spaced this chip multiple at this chip chamber while, is swelled between the periphery and the inner circumferential of this ring-shaped frame of machined object by removing the expansion of this expansion elements by the redundance of this film spreading; And
Pressing unit, it is disposed in relative with the thermal exposure mouth of this heating unit immediately below this film spreading, and the direction from the below of this film spreading towards this thermal exposure mouth of this heating unit presses this film spreading, makes this protrusion move near this thermal exposure mouth of this heating unit.
2. a street maintenance method, uses the street holdout device described in claim 1, and be expansion state by the distance maintaining of the multiple chips forming machined object, wherein, this machined object is attached on film spreading and is installed on ring-shaped frame,
This street maintenance method, is made up of following steps:
Keep step, across this film spreading mounting machined object on this workbench, and keep this ring-shaped frame by this framework holding unit;
Street expansion step, after implementing this maintenance step, make the distance that this workbench and this framework holding unit relative movement in vertical direction specifys, make this workbench relative to this framework holding unit jack-up this film spreading that extends, thus at the plurality of chip chamber formation interval;
Absorption keeps step, after implementing this street expansion step, keeps machined object, thus maintain the interval of this adjacent chip chamber by this workbench across the absorption of this film spreading;
Protrusion forming step, after starting this absorption maintenance step, make this workbench and this framework holding unit relative movement in vertical direction, remove the jack-up of this workbench relative to this framework holding unit, form the expansion of this film spreading and protrusion that the long position of this film spreading that formed is swelled to the face side of this film spreading at the outer circumferential side of machined object; And
Heat shrink step, after implementing this protrusion forming step, by this pressing unit pressing film spreading, this protrusion is moved to immediately below this thermal exposure mouth of this heating unit, and by this heating unit, this protrusion is heated and make it shrink.
3. street maintenance method according to claim 2, is characterized in that,
On the machined object of many segmentation preset lines being set with intersection, be formed with segmentation starting point along this segmentation preset lines,
In this street expansion step, machined object is split into multiple chip, and is formed with interval at chip chamber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-096486 | 2014-05-08 | ||
| JP2014096486A JP6266429B2 (en) | 2014-05-08 | 2014-05-08 | Chip interval maintaining device and chip interval maintaining method |
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| Publication Number | Publication Date |
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| CN105097479A true CN105097479A (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510229164.6A Pending CN105097479A (en) | 2014-05-08 | 2015-05-07 | Chip interval maintaining device and chip interval maintaining method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6266429B2 (en) |
| KR (1) | KR102249339B1 (en) |
| CN (1) | CN105097479A (en) |
| TW (1) | TWI653674B (en) |
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| CN107808847A (en) * | 2016-09-09 | 2018-03-16 | 株式会社迪思科 | Chip distance maintaining method |
| CN110034045A (en) * | 2017-12-27 | 2019-07-19 | 株式会社迪思科 | Segmenting device |
| CN110148572A (en) * | 2018-02-13 | 2019-08-20 | 株式会社迪思科 | Segmenting device |
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| JP6820099B2 (en) * | 2017-05-10 | 2021-01-27 | リンテック株式会社 | Separation device and separation method |
| JP6934327B2 (en) * | 2017-06-07 | 2021-09-15 | 株式会社ディスコ | Wafer division method and division device |
| JP6847529B2 (en) * | 2017-06-15 | 2021-03-24 | 株式会社ディスコ | Cutting method of work piece |
| JP7321883B2 (en) | 2019-10-18 | 2023-08-07 | 株式会社ディスコ | How to extend the sheet |
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Also Published As
| Publication number | Publication date |
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| TW201543559A (en) | 2015-11-16 |
| TWI653674B (en) | 2019-03-11 |
| JP2015216151A (en) | 2015-12-03 |
| JP6266429B2 (en) | 2018-01-24 |
| KR20150128579A (en) | 2015-11-18 |
| KR102249339B1 (en) | 2021-05-06 |
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Application publication date: 20151125 |