CN107808847B - Chip spacing maintaining method - Google Patents
Chip spacing maintaining method Download PDFInfo
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- CN107808847B CN107808847B CN201710769571.5A CN201710769571A CN107808847B CN 107808847 B CN107808847 B CN 107808847B CN 201710769571 A CN201710769571 A CN 201710769571A CN 107808847 B CN107808847 B CN 107808847B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Provided is a method for maintaining a chip interval, which can maintain the state of the expanded chip interval and prevent the chips from contacting each other caused by the loose of a sheet material even if an expansion sheet which does not shrink due to heating is adhered on a processed object. The chip interval maintaining method comprises the following steps: a chip interval forming step of expanding the sheet (T2) to form an interval between chips; and a sheet shrinking step of heating the sheet between the frame (F) and the workpiece (W) while maintaining the distance between the chips after the chip spacing forming step is performed, and shrinking the stretched sheet on the outer peripheral side of the workpiece, wherein the chip spacing maintaining method further comprises a step of bonding a plurality of heat-shrinkable tapes (T3) to the sheet between the frame and the workpiece before the sheet shrinking step is performed, and in the sheet shrinking step, the sheet in the area where the tapes are bonded is shrunk by heating the sheet between the frame and the workpiece together with the tapes.
Description
Technical Field
The present invention relates to a chip spacing maintaining method for maintaining a state in which the spacing of a plurality of chips constituting a workpiece is expanded on an expansion sheet.
Background
A plate-shaped object to be processed such as a semiconductor wafer has a front surface divided into a plurality of regions by planned dividing lines arranged in a lattice shape, and various devices are formed in each of the regions divided into the lattice shape. After the workpiece is ground and thinned to a predetermined thickness, the workpiece is divided into device chips along the lines to be divided, and the device chips are applied to various electronic devices and the like.
As a method of dividing a workpiece, for example, there are the following methods: first, a laser beam is converged inside a workpiece to form a modified layer as a division starting point, and an external force is applied to a line to be divided whose strength is reduced by the modified layer to divide the workpiece into chips. As means for applying an external force, means for expanding an expansion sheet attached to the back surface of a workpiece by an expansion device to expand the workpiece at the same time is used (for example, see patent document 1). That is, the object to be processed is supported by the annular frame via the expansion piece by adhering the expansion piece to the object to be processed so as to seal the opening of the annular frame and adhering the outer peripheral portion of the expansion piece to the annular frame. Next, the object supported by the annular frame is placed on an expanding drum of an expanding device, and the expanding sheet is expanded in the planar direction, whereby the object can be divided into chips by applying an external force to the lines to be divided whose strength is reduced by the modified layer.
Patent document 1: japanese patent laid-open No. 2010-147317
After the spread sheet is spread to appropriately divide the workpiece into chips and a predetermined interval is provided between the chips, the divided workpiece is conveyed to a pickup step of picking up the chips from the spread sheet in a state where the spread sheet is stuck. In the pick-up step, for example, the chip is lifted up from below by a needle and picked up by a vacuum chuck while being floated from the expansion sheet. When the tension is removed after the expansion sheet is expanded, since the region between the inner peripheral edge of the ring frame and the outer peripheral edge of the workpiece extends and becomes slack, when the workpiece is conveyed to the pickup step through the ring frame, there is a possibility that the chips come into contact with each other due to the slack of the expansion sheet and are damaged.
Therefore, as described in patent document 1, there is a method in which: after the object is divided into chips, only a slack region between an inner peripheral edge of the annular frame and an outer peripheral edge of the object in the expansion sheet is heated to shrink the slack region, and a portion to which the chips are attached is not shrunk to ensure that the chips do not come into contact with each other.
However, in the case where the spread sheet to be stuck to the workpiece is of a type that does not shrink or hardly shrinks due to heating, the loose region of the spread sheet cannot be shrunk accurately even by heating, and as a result, when the workpiece is processed through the ring frame, the chips may contact each other and be damaged.
Disclosure of Invention
Therefore, an object of the present invention is to provide a method for maintaining a chip spacing, which can maintain a state in which the chip spacing is widened and prevent the chips from coming into contact with each other and being damaged due to the looseness of an extending sheet, even when the extending sheet which is not shrunk or hardly shrunk by heating is attached to a work.
The present invention for solving the above-described problems is a chip spacing maintaining method for maintaining a state in which a spacing between a plurality of chips constituting a workpiece is expanded, the workpiece being supported by a ring frame via an expanding sheet in a state of being attached to the expanding sheet, the chip spacing maintaining method including the steps of: a chip interval forming step of forming an interval between the chips by expanding the expansion sheet; and an expanding sheet shrinking step of heating the expanding sheet between the inner peripheral edge of the ring frame and the outer peripheral edge of the object to be processed while maintaining the interval between the chips, and shrinking the stretched expanding sheet on the outer peripheral side of the object to be processed, after the chip interval forming step is performed, the method for maintaining the chip interval further comprising a heat shrinkable tape attaching step of: in the expanding sheet shrinking step, the expanding sheet between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece and the heat-shrinkable tape are heated together, thereby shrinking the expanding sheet in the region to which the heat-shrinkable tape is bonded.
The method for maintaining the chip spacing according to the present invention includes a heat-shrinkable tape application step of applying a plurality of heat-shrinkable tapes to the expansion sheet between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece at least before the expansion sheet contraction step is performed, and in the expansion sheet contraction step, the heat-shrinkable tapes are heated together with the heat-shrinkable tapes and the expansion sheet between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece, so that the heat-shrinkable tapes are contracted by the heating and the expansion sheet in the region to which the heat-shrinkable tapes are applied is contracted, whereby the expansion sheet can be contracted without being contracted by the heating, and the state in which the chip spacing is expanded can be maintained. Therefore, it is possible to prevent the chips from being damaged by the chips coming into contact with each other due to the slack of the spread sheet.
Drawings
Fig. 1 is a perspective view showing an example of a workpiece and a protective tape.
Fig. 2 is a cross-sectional view showing a state in which a modified layer is formed inside a workpiece by a laser processing apparatus.
Fig. 3 is a perspective view showing a state in which the workpiece is ground by the grinding device, the rear surface of the workpiece is thinned to a predetermined thickness, and the workpiece is divided into chips by the grinding pressure.
Fig. 4 is a perspective view showing a state where the work is stuck to the extension sheet, supported by the ring frame, and the protective tape is separated from the work.
Fig. 5 is a plan view showing an example of a state in which a plurality of heat shrinkable tapes are bonded to an extension piece between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece.
Fig. 6 is a cross-sectional view showing a state in which the divided object to be processed, which is attached to the extending piece and supported by the annular frame, is set on the inter-chip space extending apparatus.
Fig. 7 is a cross-sectional view showing a state in which the extending piece is extended by the chip spacing extending device to form a predetermined spacing between the chips.
Fig. 8 is a cross-sectional view showing a state in which the expanding piece of the region to which the heat-shrinkable tape is bonded is shrunk by heating the expanding piece between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece together with the heat-shrinkable tape.
Description of the reference symbols
W: a workpiece; wa: the front surface of the processed object; wb: the back of the processed object; s: dividing the predetermined line; d: a device; m: a modified layer; c: a chip; t1: protecting the belt; t1a: the adhesive surface of the protective tape; t2: expanding the sheet; t2a: the bonding surface of the expansion sheet; t2b: a substrate side of the extended sheet; t3: a heat-shrinkable tape; 1: a laser processing device; 10: a chuck table; 10a: a holding surface of the chuck table; 11: a laser irradiation unit; 111: a condenser; 112: a condenser lens; 12: a processing feeding unit; 14: an alignment unit; 140: an infrared camera; 2: a grinding device; 20: a holding table; 20a: a holding surface for holding the table; 23: a Y-axis direction feeding unit; 21: a grinding unit; 210: a rotating shaft; 212: an electric motor; 213: a mounting seat; 214: grinding the grinding wheel; 214a: a grinding wheel base station; 214b: grinding the grinding tool; 5: a chip spacing expansion device; 50: an annular table; 50a: a holding surface of the annular table; 50c: an opening of the annular table; 52: fixing the clamp; 53: an expansion drum; 55: an annular workbench lifting unit; 550: a cylinder body; 551: a piston rod; 6: a suction holding table; 60: an adsorption part; 600: an adsorption surface; 61: a frame body; 610: an upper surface; 62: an attraction source; 7: a heating device.
Detailed Description
The workpiece W shown in fig. 1 is, for example, a semiconductor wafer having a circular outer shape, and a plurality of devices D are formed in a lattice-shaped region defined by the lines to divide S on the front side Wa of the workpiece W. When the object W is divided into chips having the devices D along the lines S to divide, for example, a modified layer is formed as a division start point in the object W by the laser processing apparatus 1 shown in fig. 2. Therefore, the protective tape T1 shown in fig. 1 is attached to the front side Wa.
The protective tape T1 is, for example, a disk-shaped film having an outer diameter approximately equal to the outer diameter of the workpiece W, and includes an adhesive surface T1a having adhesive force. For example, a UV-hardening paste made of an acrylic base resin or the like, which hardens when irradiated with ultraviolet rays and reduces the adhesive strength, is used for the adhesive surface T1a. By joining the adhesive surface T1a of the protective tape T1 to the front surface Wa of the workpiece W, the front surface Wa of the workpiece W is protected by the protective tape T1.
The laser processing apparatus 1 includes, for example, at least: a chuck table 10 for sucking and holding a workpiece W; and a laser irradiation unit 11 that irradiates the workpiece W held on the chuck table 10 with laser light. The chuck table 10 has a circular outer shape, for example, and sucks and holds the workpiece W on a holding surface 10a made of a porous member or the like. The chuck table 10 is rotatable about a vertical axis and is movable back and forth in the X-axis direction by the machining feed unit 12.
The laser irradiation unit 11 includes, for example, a laser oscillator, not shown, which can oscillate a laser beam having a predetermined wavelength and being transparent to the workpiece W, and can focus the laser beam inside the workpiece W by causing the laser beam oscillated from the laser oscillator to enter a condenser lens 112 inside a condenser 111. For example, when the workpiece W is a silicon wafer and a good modified layer is to be formed inside the workpiece W by the laser irradiation unit 11, laser light having a wavelength in the infrared region is emitted from the laser oscillator.
An alignment unit 14 for detecting a line S to divide the workpiece W is disposed in the vicinity of the laser irradiation unit 11. The alignment unit 14 has: infrared irradiation means, not shown, for irradiating infrared rays; and an infrared camera 140 which is configured by an optical system for capturing infrared rays, an imaging device (infrared CCD) for outputting an electric signal corresponding to the infrared rays, and the like, and which is capable of detecting the line to divide S on the front side Wa of the workpiece W by image processing such as pattern matching from an image acquired by the infrared camera 140. The laser irradiation unit 11 and the alignment unit 14 are integrally configured, and move in the Y-axis direction and the Z-axis direction in an interlocked manner.
A case where the laser processing apparatus 1 is used to form a modified layer as a division starting point on the workpiece W along the lines to divide S will be described below. First, alignment is performed such that the holding surface 10a of the chuck table 10 of the laser processing apparatus 1 shown in fig. 2 faces the front surface Wa of the workpiece W protected by the protective tape T1, and the workpiece W is placed on the chuck table 10 with the rear surface Wb side as the upper side. Then, a suction source, not shown, connected to the chuck table 10 is operated to suck and hold the workpiece W on the chuck table 10.
Next, the workpiece W held on the chuck table 10 is fed in the-X direction (forward direction) by the processing feed unit 12, and the alignment unit 14 detects the line to divide S. Here, the front side Wa of the workpiece W on which the lines to divide S are formed shown in fig. 1 is located on the lower side and does not directly face the alignment unit 14, but the lines to divide S can be imaged by the infrared camera 140 passing through the rear side Wb of the workpiece W. The alignment unit 14 performs image processing such as pattern matching on the basis of the image of the lines S to be divided captured by the infrared camera 140, and detects the positions of the lines S to be divided.
As the line to divide S is detected, the laser irradiation unit 11 is driven in the Y axis direction to perform alignment in the Y axis direction between the line to divide S to which the laser beam is irradiated and the condenser 111. For example, the alignment is performed such that the center line of the line to divide S is positioned directly below the condenser lens 112 included in the condenser 111.
Next, the condenser 111 positions the converging point of the laser beam of a predetermined wavelength at a predetermined height position inside the object W corresponding to the line to divide S. Then, while the laser beam oscillated from the laser oscillator and condensed by the condenser lens 112 is irradiated along the line to divide S, the workpiece W is subjected to machining feed in the-X direction at a predetermined machining feed speed, and a modified layer M is formed inside the workpiece W as shown in fig. 2. The modified layer M is formed at a position between the back surface Wb of the workpiece W and a position above the front surface Wa by a thickness corresponding to the finished thickness of the device chip, for example.
For example, when the workpiece W moves in the-X direction to a predetermined position in the X-axis direction where the laser beam is completely irradiated on one line to be divided S, the irradiation of the laser beam is stopped, the machining feed of the workpiece W in the-X direction (forward direction) is temporarily stopped, and the laser beam irradiation unit 11 is moved in the + Y direction to position the line to be divided S adjacent to the line to be divided S on which the laser beam is irradiated and the condenser 111 in the Y-axis direction. Next, the processing feed unit 11 performs processing feed in the + X direction (backward direction) on the workpiece W, and irradiates the line to divide S with laser light in the same manner as the irradiation of laser light in the forward direction. By sequentially performing the same irradiation of the laser light, the laser light is irradiated from the rear surface Wb side of the workpiece W along all the planned dividing lines S extending in the X-axis direction, and the modified layer M as a division starting point is formed inside the workpiece W. Further, when the chuck table 10 is rotated by 90 degrees and then the same laser beam is irradiated, the modified layer M is formed along all the planned dividing lines S which are staggered in the vertical and horizontal directions.
For example, the grinding apparatus 2 shown in fig. 3 grinds the rear surface Wb of the workpiece W to thin the workpiece W on which the modified layer M is formed to a finish thickness, and causes the crack to extend toward the front surface Wa from the modified layer M as a division starting point by a grinding pressure, thereby dividing the workpiece W into the respective device chips.
The grinding device 2 includes, for example, at least: a holding table 20 for sucking and holding the workpiece W; and a grinding unit 21 that grinds the workpiece W held by the holding table 20. The holding table 20 has a circular outer shape, for example, and sucks and holds the workpiece W on a holding surface 20a made of a porous member or the like. The holding table 20 is rotatable about an axis in the vertical direction and is movable back and forth in the Y-axis direction by the Y-axis direction feed unit 23.
The grinding unit 21 is vertically movable by a grinding feed unit 22, and the grinding feed unit 22 performs grinding feed in a Z-axis direction in which the grinding unit 21 is separated from or approaches the holding table 20. The grinding and feeding unit 22 is, for example, a ball screw mechanism operated by a motor or the like. The grinding unit 21 has: a rotating shaft 210 whose axial direction is the vertical direction (Z-axis direction); a motor 212 that rotationally drives the rotating shaft 210; an annular mounting seat 213 connected to the lower end of the rotary shaft 210; and a grinding wheel 214 detachably connected to a lower surface of the mounting base 213.
The grinding wheel 214 has: a grinding wheel base 214a; and a plurality of grinding stones 214b of a substantially rectangular parallelepiped shape annularly arranged on the bottom surface of the grinding wheel base 214 a. For example, the grinding stone 214b is formed by fixedly bonding diamond abrasive grains or the like with a resin bond, a metal bond or the like. The grinding stone 214b may be integrally formed in a ring shape.
For example, a not-shown flow path as a grinding water passage communicating with a grinding water supply source is formed through the inside of the rotary shaft 210 in the axial direction (Z-axis direction) of the rotary shaft 210, and the flow path passes through the mounting seat 213 and opens at the bottom surface of the grinding wheel base 214a so that the grinding water can be discharged toward the grinding wheel 214 b.
Hereinafter, a case of grinding and dividing the workpiece W by the grinding device 2 will be described. First, the workpiece W is placed on the holding surface 20a with the back surface Wb facing upward so that the center of the holding table 20 substantially coincides with the center of the workpiece W. Then, the workpiece W is sucked and held on the holding table 20 by transmitting a suction force generated by a suction source, not shown, to the holding surface 20 a.
Next, the holding table 20 holding the workpiece W is moved in the + Y direction to a position below the grinding unit 21, and the grinding wheel 214 of the grinding unit 21 is aligned with the workpiece W. For example, as shown in fig. 3, the alignment is performed as follows: the rotation center of the grinding wheel 214 is shifted from the rotation center of the holding table 20 by a predetermined distance in the + Y direction, and the rotation locus of the grinding wheel 214b is made to pass through the rotation center of the holding table 20.
After the grinding wheel 214 of the grinding unit 21 is aligned with the workpiece W, the rotating shaft 210 is rotationally driven in a counterclockwise direction when viewed from the + Z direction side, and the grinding wheel 214 is rotated accordingly. Then, the grinding feed unit 22 feeds the grinding unit 21 in the-Z direction, and the grinding whetstone 214b of the rotating grinding wheel 214 is brought into contact with the back surface Wb of the workpiece W to perform grinding. In the grinding, since the workpiece W held on the holding surface 20a rotates as the holding table 20 rotates, the grinding whetstone 214b grinds the entire back surface Wb of the workpiece W. During the grinding process, the grinding water is supplied to the contact portion between the grinding stone 214b and the workpiece W through the flow path in the rotary shaft 210, and the contact portion between the grinding stone 214b and the rear surface Wb of the workpiece W is cooled and cleaned.
When the grinding is continued to thin the workpiece W to the finish thickness, the grinding pressure is applied along the modified layer M to extend the crack toward the front side Wa of the workpiece W, and the workpiece W is divided into the rectangular device chips C as shown in fig. 3.
As shown in fig. 4, the work W divided into chips C is stuck to the extending sheet T2, and the protective tape T1 is separated while the processing by the annular frame F is realized with the extended sheet T2 supported by the annular frame F.
The stretch sheet T2 is, for example, a disk-shaped sheet having an outer diameter larger than the outer diameter of the workpiece W, and has a base layer made of, for example, a PET (polyethylene terephthalate) resin stretch film or a PEN (polyethylene naphthalate) resin film or the like having a small heat shrinkage property and an appropriate elasticity against a mechanical external force, and has a bonding surface T2a formed by laminating a UV-hardening paste on the base layer, and the UV-hardening paste is hardened by irradiation with ultraviolet rays to reduce the bonding force. The material, thickness, and the like of the base layer of the extension sheet T2 can be appropriately changed according to the type of the workpiece W, the thickness of the workpiece W, and the like.
The back surface Fb of the annular frame F having a circular opening is bonded to the outer peripheral portion of the bonding surface T2a of the extension sheet T2 facing upward in fig. 4. Further, the workpiece W is positioned above the adhesive surface T2a of the extension piece T2 exposed in the opening of the annular frame F such that the back surface Wb side faces downward. At this time, the center of the workpiece W is aligned to substantially coincide with the center of the opening of the annular frame F. Then, the back surface Wb of the workpiece W is pressed against the adhesive surface T2a of the extension sheet T2, and the extension sheet T2 is adhered to the back surface Wb of the workpiece. In this way, the workpiece W is supported by the annular frame F via the extending piece T2, and the protective tape T1 is separated from the front side Wa of the workpiece W.
Next, the extended section T2 is extended so as to form a predetermined space between the chips C supported by the annular frame F via the extended section T2. This is to prevent the following: since the workpiece W divided into the chips C maintains the shape of the workpiece W as a whole in a state of being supported by the annular frame F via the extending sheet T2, and there is no space between the chips C, the chips C adjacent to each other rub against each other when the workpiece W is transported later or when the chips C are picked up from the extending sheet T2, and chip defects occur, thereby deteriorating the quality of the chips C.
However, since the region T2C of the expanded piece T2 between the inner peripheral edge Fe of the annular frame F and the outer peripheral edge Wd of the workpiece W is in a relaxed state due to the expansion, it is necessary to prevent the chips C from contacting each other and damaging the chips C due to the relaxation of the expanded piece T2 when the workpiece W is processed by the annular frame F. Therefore, the chip spacing maintaining method of the present invention is implemented as follows.
(1) Step of sticking heat-shrinkable tape
For example, in the present embodiment, first, a heat-shrinkable tape application step is performed to apply a plurality of heat-shrinkable tapes T3 to an area T2c of the extension sheet T2 between the inner peripheral edge Fe of the annular frame F and the outer peripheral edge Wd of the workpiece W. The heat-shrinkable tape T3 is made of, for example, a resin (for example, polypropylene, polyvinyl chloride, or the like) having at least a larger heat-shrinkable property than the expanded sheet T2 and an appropriate stretchability against a mechanical external force, and is formed in a rectangular shape. The heat-shrinkable tape T3 has an adhesive surface formed of an adhesive layer in the present embodiment, but may not have an adhesive surface. In addition, the rectangular heat-shrinkable tape T3 can be applied more easily while suppressing cost, for example, than a heat-shrinkable tape having an annular outer shape. That is, for example, the rectangular heat-shrinkable tape T3 can be cut out only by linearly cutting the long heat-shrinkable tape, but the cutting operation is complicated and many parts are generated which need to be discarded because the ring-shaped heat-shrinkable tape needs to be cut into a circular shape.
As shown in fig. 5, a plurality of rectangular heat-shrinkable tapes T3 (for example, 18 sheets in the illustrated example) are annularly attached to an area T2c of the extension sheet T2 between the inner peripheral edge Fe of the annular frame F and the outer peripheral edge Wd of the workpiece W at predetermined intervals in the circumferential direction of the workpiece W. When the heat-shrinkable band T3 has a characteristic of being easily expandable and contractible in any one of the longitudinal direction and the transverse direction, it is preferable that the direction in which the heat-shrinkable band T3 is easily expandable and contractible be aligned with the radial direction of the workpiece W.
In the region T2c of the extension piece T2, a plurality of rectangular heat-shrinkable tapes T3 may be annularly pasted (for example, 18 sheets in total) at a predetermined interval in the circumferential direction of the workpiece W, and then a plurality of heat-shrinkable tapes T3 (for example, 12 sheets in total) may be annularly pasted one time radially outward.
(2) Chip space forming step
For example, after the heat-shrinkable tape application step is performed, the workpiece W is conveyed to the inter-chip space expanding device 5 shown in fig. 6 while being supported by the ring-shaped frame F via the expanding sheet T2. The chip interval spreading device 5 is a device capable of spreading the interval of each chip C by spreading the spreading sheet T2. The inter-chip space expanding device 5 includes, for example, a ring table 50, and the ring table 50 has an outer diameter larger than the outer diameter of the expanding piece T2, and the diameter of the opening 50c of the ring table 50 is formed smaller than the outer diameter of the expanding piece T2. For example, 4 (only two in the illustrated example) fixing jigs 52 are uniformly arranged on the outer peripheral portion of the ring table 50. The fixing jig 52 can be rotated about the rotation shaft 52c by a spring or the like, not shown, and the ring frame F and the expanding piece T2 can be sandwiched between the holding surface 50a of the ring table 50 and the lower surface of the fixing jig 52.
A cylindrical expansion drum 53 having a fixed height position is disposed in the opening 50c of the annular table 50, and the center of the annular table 50 substantially coincides with the center of the expansion drum 53. The outer diameter of the expanding drum 53 is formed smaller than the outer diameter of the expanding piece T2 and larger than the outer diameter of the workpiece W.
A suction holding table 6 for suction holding the workpiece W is disposed on the inner peripheral side of the expansion drum 53. The suction holding table 6 includes: an adsorption part 60 formed of a porous member and having an adsorption surface 600 on an upper surface thereof; a frame 61 for supporting the suction unit 60; and a suction source 62 that transmits a suction force to the suction unit 60. The suction surface 600 and the upper surface 610 of the frame 61 are formed on the same plane, and the work W can be sucked and held on the suction surface 600 via the expanding sheet T2 by transmitting the suction force generated by the suction source 62 to the suction surface 600.
The ring table 50 can be moved up and down in the Z-axis direction by the ring table lifting and lowering unit 55, for example. The ring table lifting unit 55 is, for example, a cylinder, and includes: a bottomed cylindrical cylinder 550 having a piston (not shown) therein and a bottom portion on a base end side (on the (-Z direction side); and a piston rod 551 inserted into the cylinder 550, one end of which is mounted on the piston. The other end of the piston rod 551 is fixed to the lower surface of the ring table 50. The pressure inside the cylinder 550 is changed by supplying (or discharging) air to the cylinder 550, and the piston rod 551 moves in the Z-axis direction, and the ring table 50 moves in the Z-axis direction.
To form a predetermined space between the chips C, for example, the ring frame F is placed on the holding surface 50a of the ring table 50 located at the reference height position via the extending piece T2. Next, the fixing jig 52 is rotated to clamp and fix the ring frame F and the extension piece T2 between the fixing jig 52 and the holding surface 50a of the ring table 50. In this state, the holding surface 50a of the annular table 50 is at the same height position as the annular upper end surface of the extension drum 53, and the upper end surface of the extension drum 53 abuts on a region T2c of the extension sheet T2 between the inner peripheral edge Fe of the annular frame F and the outer peripheral edge Wd of the workpiece W from the base material surface side (lower surface side in fig. 6) of the extension sheet T2. Further, the area on the inner peripheral side of the area T2c in the base material surface side of the expansion sheet T2 is supported by the suction surface 600 and the upper surface 610, but the suction holding of the suction surface 600 is not performed.
As shown in fig. 7, the ring table lifting unit 55 lowers the ring table 50 in the-Z direction with the ring frame F and the extension sheet T2 sandwiched between the ring table and the fixing jig 52, thereby positioning the holding surface 50a of the ring table 50 at the extension sheet extension position below the upper end surface of the extension drum 53. As a result, the expanding drum 53 is raised relative to the fixing jig 52, and the expanding pieces T2 are pushed up by the upper end surface of the expanding drum 53 and radially expanded outward in the radial direction. Also, the heat-shrinkable tape T3 is also expanded by the adhesive force of the expansion sheet T2 and the tension applied in the horizontal direction. As the spreading piece T2 is spread, a predetermined interval V is formed between the chips C. The size of the gap V is appropriately changeable according to the lowering position of the ring table 50.
For example, the thermal shrinkage tape bonding step may be performed after the inter-chip space forming step.
(3) Contracting step of the stent
After a predetermined interval V is formed between the chips, the suction source 62 is communicated with the suction portion 60 to perform a suction action on the suction surface 600, and the suction holding is performed on the inner peripheral side of the region T2c in the extension sheet T2. Then, as shown in fig. 8, for example, when the ring table elevation unit 55 raises the ring table 50 in the + Z direction so that the holding surface 50a of the ring table 50 is at the same height position as the ring-shaped upper end surface of the expansion drum 53, the force pulling the expansion piece T2 in the horizontal direction disappears, and the tension of the expansion piece T2 is released. Accordingly, the region T2c of the expanding piece T2 between the inner peripheral edge Fe of the annular frame F and the outer peripheral edge Wd of the workpiece W is in a relaxed state due to the expansion. Therefore, the region T2c of the extension sheet T2 is heated together with the heat-shrinkable tape T3 by the heating unit 7 shown in fig. 8.
The heating means 7 is, for example, an infrared heater capable of emitting infrared rays, and heats the heat-shrinkable tape T3 and the region T2c of the extension sheet T2 from above in a non-contact manner. The heating unit 7 may be a contact type, or may be a hot air heater capable of jetting hot air from a nozzle. Since the heat shrinkage rate of the heat-shrinkable tape T3 is large and the heat-shrinkable tape T3 is expanded in the inter-chip space forming step, heating is performed by the heating unit 7, for example, the heat-shrinkable tape T3 is shrunk toward the radially inner side to the size before expansion. The extension piece T2 is hardly contracted by the heat generated by the heating of the heating unit 7, but the contraction force of the heat-shrinkable tape T3 is transmitted to the region T2c of the extension piece T2 to which the heat-shrinkable tape T3 is bonded as a mechanical external force, and therefore the region T2c of the loosened extension piece T2 is pulled radially inward and contracted to the state before expansion. Further, since the heating unit 7 heats only the heat shrinkable tape T3 and the region T2C of the expansion sheet T2, the interval V between the adjacent chips C can be maintained in accordance with the size after expansion. Further, since the inner peripheral side of the region T2C is sucked and held on the suction surface 600, the chips C do not move, and the interval V between the adjacent chips C can be reliably maintained.
After the expansion sheet contraction step is completed, the plurality of chips C are conveyed to a pickup device, not shown, in a state of being supported by the ring-shaped frame F via the expansion sheet T2, the interval V between the chips C is maintained in an expanded state, and the expansion sheet T2 is returned to a state of being attached to the ring-shaped frame F in a tightened state without being in a loose state, so that the chips C can be prevented from being damaged by contact with each other when the object W to be processed is processed via the ring-shaped frame F.
The method of maintaining the chip spacing according to the present invention is not limited to the above-described embodiment, and the configurations of the laser processing apparatus 1, the grinding apparatus 2, and the chip spacing extending apparatus 5 shown in the drawings are not limited thereto, and may be appropriately modified within a range in which the effects of the present invention can be exhibited.
For example, in the present embodiment, after the modified layer M is formed in the workpiece W by the laser processing apparatus 1, the workpiece W is ground and divided by the grinding apparatus 2, but instead of grinding the workpiece W by the grinding apparatus 2, the extension tape T2 may be extended by the chip interval extension apparatus 5 to divide the workpiece W and form a predetermined interval between chips.
The workpiece W may be divided without using the laser processing apparatus 1. That is, first, the workpiece W may be cut along the planned dividing line S from the front side Wa side by a cutting device having a rotatable cutting tool, a machining groove having a predetermined depth may be formed in the workpiece W, and then the workpiece W may be ground from the rear side Wb side to a height position at which the bottom of the machining groove is exposed, thereby being divided into chips. After that, the chip interval spreading device 5 may spread the spread tape T2 to form a predetermined interval between chips.
Claims (1)
1. A chip spacing maintaining method for maintaining a state in which a spacing between a plurality of chips constituting a workpiece is expanded, the workpiece being supported by an annular frame via an expanding sheet in a state of being attached to the expanding sheet, the chip spacing maintaining method comprising the steps of:
a chip space forming step of fixing the extension piece on a holding surface of a ring-shaped table, supporting the extension piece in a state of not being sucked and held by a suction surface of a suction holding table arranged on an inner peripheral side of the ring-shaped table, relatively moving the holding surface and the suction surface in a vertical direction, and extending the extension piece to form a space between the chips; and
an expanding sheet shrinking step of heating the expanding sheet between the inner peripheral edge of the ring frame and the outer peripheral edge of the workpiece to shrink the stretched expanding sheet on the outer peripheral side of the workpiece, in a state where the suction surface of the suction holding table sucks and holds the area of the expanding sheet corresponding to the chips while maintaining the interval between the chips after the chip interval forming step is performed,
the chip interval maintaining method also comprises the following thermal shrinkage tape pasting step: adhering a plurality of rectangular heat-shrinkable tapes to the expansion sheet between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece at least before the expansion sheet shrinking step is performed,
in the expanding sheet shrinking step, the expanding sheet between the inner peripheral edge of the annular frame and the outer peripheral edge of the workpiece and the heat shrinkable tape are heated together, and the expanding sheet in the region to which the heat shrinkable tape is bonded is shrunk.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016176352A JP6741529B2 (en) | 2016-09-09 | 2016-09-09 | Tip spacing maintenance method |
| JP2016-176352 | 2016-09-09 |
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| Publication Number | Publication Date |
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| CN107808847A CN107808847A (en) | 2018-03-16 |
| CN107808847B true CN107808847B (en) | 2023-04-11 |
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| CN201710769571.5A Active CN107808847B (en) | 2016-09-09 | 2017-08-31 | Chip spacing maintaining method |
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| JP (1) | JP6741529B2 (en) |
| KR (1) | KR102305385B1 (en) |
| CN (1) | CN107808847B (en) |
| TW (1) | TWI718326B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7154809B2 (en) * | 2018-04-20 | 2022-10-18 | 株式会社ディスコ | Wafer processing method |
| JP2020102569A (en) * | 2018-12-25 | 2020-07-02 | 東レエンジニアリング株式会社 | Holding table |
| JP2022167030A (en) | 2021-04-22 | 2022-11-04 | 株式会社ディスコ | Chip spacing formation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005530A (en) * | 2005-06-23 | 2007-01-11 | Lintec Corp | Manufacturing method of chip product |
| CN101887841A (en) * | 2009-05-11 | 2010-11-17 | 株式会社迪思科 | Adhesive tape expansion method |
| CN104979261A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Chip interval maintaining method |
| CN105097479A (en) * | 2014-05-08 | 2015-11-25 | 株式会社迪思科 | Chip interval maintaining device and chip interval maintaining method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6312800B1 (en) | 1997-02-10 | 2001-11-06 | Lintec Corporation | Pressure sensitive adhesive sheet for producing a chip |
| JP4471627B2 (en) * | 2003-11-06 | 2010-06-02 | 株式会社ディスコ | Wafer division method |
| JP2006203133A (en) | 2005-01-24 | 2006-08-03 | Lintec Corp | Manufacturing method of chip body, manufacturing method of device and adhesive sheet for fixing chip body |
| JP5378780B2 (en) | 2008-12-19 | 2013-12-25 | 株式会社ディスコ | Tape expansion method and tape expansion device |
| JP5536555B2 (en) | 2010-06-22 | 2014-07-02 | 株式会社ディスコ | Expansion tape shrink device |
| JP5013148B1 (en) | 2011-02-16 | 2012-08-29 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP6249586B2 (en) | 2011-08-31 | 2017-12-20 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP6298635B2 (en) | 2014-01-10 | 2018-03-20 | 株式会社ディスコ | Dividing device and workpiece dividing method |
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2016
- 2016-09-09 JP JP2016176352A patent/JP6741529B2/en active Active
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- 2017-08-03 TW TW106126221A patent/TWI718326B/en active
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- 2017-09-04 KR KR1020170112608A patent/KR102305385B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005530A (en) * | 2005-06-23 | 2007-01-11 | Lintec Corp | Manufacturing method of chip product |
| CN101887841A (en) * | 2009-05-11 | 2010-11-17 | 株式会社迪思科 | Adhesive tape expansion method |
| CN104979261A (en) * | 2014-04-14 | 2015-10-14 | 株式会社迪思科 | Chip interval maintaining method |
| CN105097479A (en) * | 2014-05-08 | 2015-11-25 | 株式会社迪思科 | Chip interval maintaining device and chip interval maintaining method |
Also Published As
| Publication number | Publication date |
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| JP2018041894A (en) | 2018-03-15 |
| TW201812882A (en) | 2018-04-01 |
| KR102305385B1 (en) | 2021-09-24 |
| JP6741529B2 (en) | 2020-08-19 |
| KR20180028932A (en) | 2018-03-19 |
| TWI718326B (en) | 2021-02-11 |
| CN107808847A (en) | 2018-03-16 |
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