CN105092904B - MEMS fixing device for silicon piece, fixing means and method of testing - Google Patents
MEMS fixing device for silicon piece, fixing means and method of testing Download PDFInfo
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- CN105092904B CN105092904B CN201410185540.1A CN201410185540A CN105092904B CN 105092904 B CN105092904 B CN 105092904B CN 201410185540 A CN201410185540 A CN 201410185540A CN 105092904 B CN105092904 B CN 105092904B
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- positioning strip
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Abstract
A kind of MEMS fixing device for silicon piece, including desk tray, the first positioning strip, the second positioning strip and the 3rd positioning strip, first positioning strip, the second positioning strip and the 3rd positioning strip are located at same level, first positioning strip and the second positioning strip are fixed on the desk tray, and one end of the 3rd positioning strip is by setting tie point and the base runner of the desk tray side to be connected.The present invention is not in the deformation of the sensitive piece in MEMS silicon chips inside caused by vacuum suction mode.
Description
Technical field
The present invention relates to silicon test field, more particularly to a kind of MEMS fixing device for silicon piece, fixing means and test
Method.
Background technology
At present, when testing common silicon wafer parameters, it is necessary to silicon chip is placed on the desk tray of probe station, vacuum is then passed through
The mode of absorption fixes silicon chip.
However, for including the MEMS of sensitive diaphragm in structure and discharging silicon chip, traditional vacuum suction silicon chip
Method can cause the gross distortion of the sensitive diaphragm or even rupture, and the deformation of the diaphragm directly influences the parameter shape of device
State.Therefore, traditional vacuum suction fixed form can not be adapted to MEMS silicon chips.
The content of the invention
Based on this, it is necessary to provide a kind of fixing device of suitable fixed MEMS silicon chips.
In addition, also provide a kind of MEMS silicon chips fixing means.
Finally, there is provided a kind of MEMS silicon wafer test methods.
A kind of MEMS fixing device for silicon piece, including desk tray, the first positioning strip, the second positioning strip and the 3rd positioning strip, institute
State the first positioning strip, the second positioning strip and the 3rd positioning strip and be located at same level, first positioning strip and the second positioning
Bar is fixed on the desk tray, and one end of the 3rd positioning strip is by setting the base runner of tie point and the desk tray side
Connection.
In one of the embodiments, the 3rd positioning strip can realize at least 90 degree by rotary shaft of the tie point
Rotation.
In one of the embodiments, the material of first positioning strip, the second positioning strip and the 3rd positioning strip is spy
Fluorine dragon.
In one of the embodiments, the 3rd positioning strip includes the tune being connected with the base runner of the desk tray side
Section portion, the holding section for contacting and engaging the MEMS silicon chips and the connection adjustment portion and the buffer part of holding section.
In one of the embodiments, the 3rd positioning strip is provided with spring clip on the one side contacted with MEMS silicon chips.
In one of the embodiments, first positioning strip and the second positioning strip are arranged in a mutually vertical manner.
A kind of MEMS silicon chips fixing means, including：
MEMS silicon chips to be measured are placed in desk tray and the first positioning strip and the second positioning strip by being fixed on desk tray are determined
Position；
3rd positioning strip is elapsed to the position tangent with the MEMS silicon chips and institute is blocked by the 3rd positioning strip
State MEMS silicon chips.
In one of the embodiments, it is described that MEMS silicon chips to be measured are placed in desk tray and by being fixed on desk tray
Before the step of one positioning strip and the second positioning strip position, in addition to the step of Incision Machine's of closing desk tray.
In one of the embodiments, it is described that MEMS silicon chips to be measured are placed in desk tray and by being fixed on desk tray
The step of one positioning strip and the second positioning strip position be specially：
The first positioning strip is close on the flat side of MEMS silicon chips to be measured；
The MEMS silicon chips are elapsed to the second positioning strip.
A kind of MEMS silicon wafer test methods, including：
MEMS silicon chips are fixed by above-mentioned MEMS silicon chips fixing means；
The MEMS silicon chips are tested with testing needle.
Above-mentioned MEMS fixing device for silicon piece, fixing means and method of testing are by setting the first positioning strip, the second positioning strip
The positioning to the MEMS silicon chips is realized, then blocks the MEMS silicon chips by adjusting the 3rd positioning strip to realize fixation again,
So be not in the deformation of sensitive piece inside the MEMS silicon chips caused by vacuum suction mode during the fixation.
Brief description of the drawings
Fig. 1 is the MEMS fixing device for silicon piece schematic diagrames of an embodiment；
Fig. 2 is the MEMS silicon chip fixing means flow charts of an embodiment.
Embodiment
MEMS (Micro Electro Mechanical Systems, MEMS) is a kind of advanced manufacturing technology
Platform, it is grown up based on semiconductor fabrication.It using silicon is main that the one of main features of MEMS, which are exactly,
Material, because the intensity of silicon, hardness and Young's modulus and iron phase are worked as, density is similar to aluminium, and pyroconductivity is close to molybdenum and tungsten.
Fig. 1 is refer to, is the MEMS fixing device for silicon piece schematic diagrames of an embodiment.
The MEMS fixing device for silicon piece includes：Desk tray 110, the first positioning strip 130, the second positioning strip 140 and the 3rd are fixed
Position bar 150.Wherein, the first positioning strip 130, the second positioning strip 140 and the 3rd positioning strip 150 are located at same level.
In the present embodiment, desk tray 110 is circle.It is appreciated that in other embodiments, desk tray 110 can also basis
It is actually needed and is arranged to the shapes such as polygon.In addition, the side of desk tray 110 is provided with the pedestal being fixedly connected with desk tray 110.
Device under test is formed on MEMS silicon chips 120.The profile of MEMS silicon chips 120 is that one section of circular arc Jia Pingbian is formed.
During MEMS silicon chips 120 are fixed, the first positioning strip 130 is close on its flat side, i.e., realizes MEMS silicon by the first positioning strip 130
The flat side contraposition of piece 120.
First positioning strip 130 and the second positioning strip 140 are fixed on desk tray 110, and the first positioning strip 130 and second is fixed
Position bar 140 is arranged in a mutually vertical manner.The adjustment portion that 3rd positioning strip 150 includes being connected with the base runner of the side of desk tray 110 (is schemed not
Show), the holding section (not shown) for contacting and engaging MEMS silicon chips 120 and the connection adjustment portion and the buffering of holding section
Portion's (not shown).Buffer part can use spring, damper, elastomeric material etc., for being pressed from both sides closing the 3rd positioning strip 150
Reduce the shock to the edge of MEMS silicon chips 120 during tight MEMS silicon chips 120.In one of the embodiments, it is in the 3rd positioning strip
150 one side contacted with MEMS silicon chips 120 are provided with spring clip, and the 3rd positioning strip 150 blocks MEMS silicon chips by spring clip
120, so it is not easy that the edge of MEMS silicon chips 120 is caused to hit.
In the present embodiment, one end of the 3rd positioning strip 150 is adjustment portion by setting tie point (not shown) and desk tray
110 sides base runner connection, the 3rd positioning strip 150 using the tie point as rotary shaft can realize from MEMS silicon chips
Rotation of the 120 tangent positions to remote at least 90 degree of 120 direction of MEMS silicon chips.
In the present embodiment, the first positioning strip 130, the second positioning strip 140 and the 3rd positioning strip 150 are Teflon,
It is appreciated that in other embodiments, the first positioning strip 130, the second positioning strip 140 and the 3rd positioning strip 150 can use
Other materials similar to Teflon physical property and chemical property.
A kind of MEMS silicon chips fixing means includes：
MEMS silicon chips to be measured are placed in desk tray and the first positioning strip and the second positioning strip by being fixed on desk tray are determined
Position；
3rd positioning strip is elapsed to the position tangent with the MEMS silicon chips and institute is blocked by the 3rd positioning strip
State MEMS silicon chips.
Specific embodiment is refer to below, and Fig. 2 is the MEMS silicon chip fixing means flow charts of an embodiment.
A kind of MEMS silicon chips fixing means includes：
Step S110：Close the Incision Machine's of desk tray.
Traditional desk tray all has Incision Machine's, and device to be measured can be fixed by vacuum suction.But because this
Invention is directed to MEMS silicon chips, can cause its internal sensitive diaphragm gross distortion during vacuum suction MEMS silicon chips, so
The Incision Machine's of closing desk tray are needed before MEMS silicon chips to be measured are put on desk tray.
Step S120：MEMS silicon chips to be measured are placed in desk tray and the first positioning strip and second by being fixed on desk tray
Positioning strip positions.
The step is specially：
The first positioning strip is close on the flat side of MEMS silicon chips to be measured；
The MEMS silicon chips are elapsed to the second positioning strip.
In the present embodiment, first positioning strip is fixed on desk tray.First the flat side of MEMS silicon chips is aligned and is close to
First positioning strip, then keep the state of the first positioning strip, the position for being pushed into contact with the second positioning strip by MEMS silicon chips,
So be advantageous to the rapid-aligning of the MEMS silicon chips.Second positioning strip is also secured on desk tray and positioned with described first
Bar is mutually perpendicular to, and is so advantageous to overall positioning of the MEMS silicon chips on desk tray.First positioning strip, the second positioning strip
It is teflon material.
Teflon full name is polytetrafluoroethylene (PTFE), is a kind of chemical substance, and it has non-stick, heat resistance, sliding, moisture-resistant
The features such as property, wear resistance and corrosion resistance, at the same it is also flexible.
In addition, before step S120, in addition to the step of the 3rd positioning strip is opened.By MEMS silicon chips to be measured
Need to open the 3rd positioning strip before being put into desk tray, then shut the 3rd positioning again after MEMS silicon chips positioning to be measured
Bar.
Step S130：3rd positioning strip is elapsed to the edge of the MEMS silicon chips and blocked by the 3rd positioning strip
The MEMS silicon chips.
In the present embodiment, the 3rd positioning strip include be connected with the base runner of the desk tray side adjustment portion,
For contacting and engaging holding section and the connection adjustment portion and the buffer part of holding section of the MEMS silicon chips, thus it is described
3rd positioning strip is adjustable.The pedestal being fixedly connected with desk tray, the 3rd positioning strip are set in the side of the desk tray
One end be that adjustment portion sets the tie point that is connected with the base runner, then using the tie point as rotary shaft, promotion institute
Stating the other end of the 3rd positioning strip makes the 3rd positioning strip and the MEMS silicon chips tangent.
In the present embodiment, contacted on one side with the MEMS silicon chips in the 3rd positioning strip, i.e., described 3rd positioning strip
Spring clip is provided with the tangent side of the MEMS silicon chips, MEMS silicon chips are stated by spring clip residence.3rd positioning strip
For teflon material.
A kind of MEMS silicon wafer test methods, including：
MEMS silicon chips are fixed by above-mentioned MEMS silicon chips fixing means；
The MEMS silicon chips are tested with testing needle.
Above-mentioned MEMS fixing device for silicon piece, fixing means and method of testing are by setting the first positioning strip, the second positioning strip
The positioning to the MEMS silicon chips is realized, then blocks the MEMS silicon chips by adjusting the 3rd positioning strip to realize fixation again,
So be not in the deformation of sensitive piece inside the MEMS silicon chips caused by vacuum suction mode during the fixation, be adapted to
The fixation and test of MEMS silicon chips.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of MEMS fixing device for silicon piece, it is characterised in that including desk tray, the first positioning strip, the second positioning strip and the 3rd
Positioning strip, first positioning strip, the second positioning strip and the 3rd positioning strip are located at same level, first positioning strip and
Second positioning strip is fixed on the desk tray, and first positioning strip and the second positioning strip are arranged in a mutually vertical manner, and the described 3rd
One end of positioning strip is connected by tie point with the base runner of the desk tray side.
2. MEMS fixing device for silicon piece according to claim 1, it is characterised in that the 3rd positioning strip is with the connection
Point can realize at least 90 degree of rotation for rotary shaft.
3. MEMS fixing device for silicon piece according to claim 1, it is characterised in that first positioning strip, the second positioning
Article and the material of the 3rd positioning strip be Teflon.
4. MEMS fixing device for silicon piece according to claim 1, it is characterised in that the 3rd positioning strip include with it is described
Described in adjustment portion, the holding section for contacting and engaging the MEMS silicon chips and the connection that the base runner of desk tray side connects
Adjustment portion and the buffer part of holding section.
5. MEMS fixing device for silicon piece according to claim 4, it is characterised in that the 3rd positioning strip with MEMS silicon
One side of piece contact sets spring clip.
A kind of 6. MEMS silicon chips fixing means, it is characterised in that including：
MEMS silicon chips to be measured are placed in desk tray and the first positioning strip by being fixed on desk tray and the second positioning strip position；
3rd positioning strip is elapsed to the position tangent with the MEMS silicon chips and blocked by the 3rd positioning strip described
MEMS silicon chips.
7. MEMS silicon chips fixing means according to claim 6, it is characterised in that described to be placed in MEMS silicon chips to be measured
Before the step of desk tray and the positioning of the first positioning strip by being fixed on desk tray and the second positioning strip, in addition to close desk tray
The step of Incision Machine's.
8. MEMS silicon chips fixing means according to claim 6, it is characterised in that described to be placed in MEMS silicon chips to be measured
The step of desk tray and the first positioning strip by being fixed on desk tray and the second positioning strip position be specially：
The first positioning strip is close on the flat side of MEMS silicon chips to be measured；
The MEMS silicon chips are elapsed to the second positioning strip.
A kind of 9. MEMS silicon wafer test methods, it is characterised in that including：
MEMS silicon chips are fixed by the MEMS silicon chips fixing means described in any one of claim 6~8；
The MEMS silicon chips are tested with testing needle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185540.1A CN105092904B (en) | 2014-05-04 | 2014-05-04 | MEMS fixing device for silicon piece, fixing means and method of testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185540.1A CN105092904B (en) | 2014-05-04 | 2014-05-04 | MEMS fixing device for silicon piece, fixing means and method of testing |
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| Publication Number | Publication Date |
|---|---|
| CN105092904A CN105092904A (en) | 2015-11-25 |
| CN105092904B true CN105092904B (en) | 2018-04-10 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI590355B (en) * | 2016-02-25 | 2017-07-01 | 南茂科技股份有限公司 | Wafer testing fixture, wafer dynamic test fixture and wafer testing method |
| CN112101112A (en) * | 2020-08-13 | 2020-12-18 | 飞亚达精密科技股份有限公司 | Visual identification method and system for watch time |
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| CN1215226A (en) * | 1997-10-21 | 1999-04-28 | 研能科技股份有限公司 | Crystal wafer fixing device and method |
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| CN105092904A (en) | 2015-11-25 |
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Address after: 214028 Xinzhou Road, Wuxi national hi tech Industrial Development Zone, Jiangsu, China, No. 8 Applicant after: Wuxi Huarun Shanghua Technology Co., Ltd. Address before: 214028 Xinzhou Road, Wuxi national hi tech Industrial Development Zone, Jiangsu, China, No. 8 Applicant before: Wuxi CSMC Semiconductor Co., Ltd. |
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