CN202189772U - Wafer fixing device - Google Patents
Wafer fixing device Download PDFInfo
- Publication number
- CN202189772U CN202189772U CN2011202687566U CN201120268756U CN202189772U CN 202189772 U CN202189772 U CN 202189772U CN 2011202687566 U CN2011202687566 U CN 2011202687566U CN 201120268756 U CN201120268756 U CN 201120268756U CN 202189772 U CN202189772 U CN 202189772U
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- China
- Prior art keywords
- loading plate
- pressing plate
- mounting apparatus
- wafer mounting
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The utility model provides a wafer fixing device, including a loading plate and a pressure plate. The loading plate possesses a circular perforation; the pressure plate is annular shaped, and the fixing position of the pressure plate on the loading plate is corresponding to the circular perforation; and at least one of the loading plate and the pressure plate is magnetic, and the loading plate is fixedly connected with the pressure plate by magnetic force adsorption.
Description
Technical field
The utility model is about a kind of wafer (Wafer Frame) fixture, particularly about a kind of wafer mounting apparatus that is used for fixing a primary and secondary ring (Double Ring).
Background technology
Please refer to Fig. 1, existing wafer mounting apparatus 100 comprises a ring-like pressing plate 101 and a loading plate 102.Wherein, have a plurality of reeds 103 and a plurality of screw 104 on the ring-like pressing plate 101.Ring-like pressing plate 101 can pass through reed 103 and screw; Utilize screw 104 to screw in or screw out the screw hole that is positioned at load bearing seat 102 back sides; Ring-like pressing plate 101 and loading plate 102 are pressed or get loose, and through reed 103 that a primary and secondary ring 10 is fixing or be located away from load bearing seat 102.
But when fixing with dismounting to primary and secondary ring 10 owing to the user; Need to be directed against one by one the action that screw 104 screws in or screws out; Primary and secondary ring 10 can be fixed with wafer mounting apparatus 100 and separate, and primary and secondary ring 10 is when being fixed on wafer mounting apparatus 100, screw 104 needs to aim at earlier the screw hole at loading plate 102 back sides; Thus, quite lose time and manpower.
The utility model content
Therefore, in order to address the above problem, one of purpose of the utility model is a kind of wafer mounting apparatus to be provided, can to save the operating time.
One of purpose of the utility model is a kind of wafer mounting apparatus to be provided, can to save the manpower of operation.
One embodiment of the utility model provides a kind of wafer mounting apparatus, and wafer mounting apparatus comprises a loading plate and a pressing plate.Loading plate has a circular perforations; Pressing plate is a ring body, and pressing plate is fixed in the corresponding circular perforations in position of loading plate; Wherein, loading plate and pressing plate one of which at least have magnetic, and loading plate and this pressing plate utilize magnetic force absorption fixing.
One embodiment of the utility model provides a kind of wafer mounting apparatus, comprises a loading plate, a pressing plate and a fixed strip.Loading plate has a circular perforations; Pressing plate is a ring body, and pressing plate is fixed in the corresponding circular perforations in position of loading plate; Fixed strip has a fixing protuberance; Wherein, when pressing plate was fixed in the corresponding circular perforations in the position of loading plate, fixedly protuberance made this pressing plate can be installed in a predeterminated position of this loading plate against this pressing plate.
The beneficial effect of the utility model is; Because the loading plate of the wafer mounting apparatus of the utility model and pressing plate one of which at least have magnetic; Make loading plate and pressing plate at least one of which can utilize magnetic force to adsorb; Make pressing plate can be fixed in loading plate rapidly, utilize the design of reference column, location notch or hinge again, save user's time and manpower.
Description of drawings
Fig. 1 shows the sketch map of the wafer mounting apparatus of prior art.
Fig. 2 A shows the sketch map of the wafer mounting apparatus of the utility model one embodiment.
Fig. 2 B shows the pressing plate sketch map of the utility model one embodiment.
Fig. 2 C shows the reference column of the utility model one embodiment and the partial enlarged drawing of location notch.
Fig. 3 shows the sketch map of the wafer mounting apparatus of the utility model one embodiment.
Fig. 4 shows the sketch map of the wafer mounting apparatus of the utility model one embodiment.
Fig. 5 shows the wafer mounting apparatus sketch map of the utility model one embodiment.
Fig. 6 A shows the wafer mounting apparatus sketch map of the utility model one embodiment.
Fig. 6 B shows the end view of the utility model A, B and C in Fig. 6 A at 3.
Drawing reference numeral:
100,200,300,400 wafer mounting apparatus
102,201,401,501,601 loading plates
103 reeds
The 201a reference column
101,202,302,402,502,602 pressing plates
The 202a magnetic element
The 202b location notch
203,41a retaining element
The 203a screw
20 dismounting mouths
30,31 sub-pressing plates
41,63 hinges
The O circular perforations
10,204 primary and secondary rings
61 fixed strips
61a is protuberance fixedly
64 retaining elements
Embodiment
See also Fig. 2 A, Fig. 2 A shows the wafer mounting apparatus sketch map of the utility model one embodiment, and wafer mounting apparatus 200 comprises a loading plate 201 and a pressing plate 202.
Loading plate 201 has a circular perforations O; Pressing plate 202 is a ring body, and pressing plate 202 is fixed in the corresponding circular perforations O in position of loading plate 201, and the big or small corresponding circular perforations O of ring body; Wherein, Loading plate 201 and pressing plate 202 one of which at least have magnetic, and loading plate 201 and pressing plate 202 one of which at least utilize magnetic force to adsorb, and make pressing plate 202 be fixed in loading plate 201.
Please consult Fig. 2 B simultaneously, Fig. 2 B shows the pressing plate sketch map of the utility model one embodiment, in the present embodiment; Circular perforations O is a positive circle, and the ring body of pressing plate 202 is an orbicular ring body, and pressing plate 202 equidistance are provided with a plurality of magnetic element 202a; The utility model should be as limit, visual user's demand adjustment magnetic element 202a position and quantity, in addition; Magnetic element 202a equidistance is arranged at the ring body of pressing plate 202, and wherein magnetic element 202a can be a magnet and realizes.
Please note at this; Please consult Fig. 2 C simultaneously, Fig. 2 C shows the reference column of the utility model one embodiment and the partial enlarged drawing of location notch, and loading plate 201 is provided with at least one reference column 201a; In one embodiment; Reference column 201a is vertically installed in the upper surface of loading plate 201, and accordingly, the ring body of pressing plate 202 is provided with at least one location notch 202b.In the present embodiment, location notch 202b is the groove of semicircle column type, and reference column 201a is a cylinder.
Note that at this location notch 202b is arranged between the external diameter and internal diameter of ring body of pressing plate 202, and reference column 201a is not limited to cylinder, also can be by can realizing by various cylinder, and the shape of location notch 202b can with reference column 201a tabling.
Wherein, Reference column 201a is corresponding with position and the number of location notch 202b; Location notch 202b in order to guiding reference column 201a the user can be combined with pressing plate 202 with accurately making loading plate 201 more quickly, and makes pressing plate 202 can be installed in loading plate to adorn a predeterminated position of 201.
In one embodiment, wafer mounting apparatus 200 has a retaining element 203, and retaining element 203 equidistance are divided on the pressing plate 202, but the utility model should be as limit, the position of visual user's demand increase and decrease retaining element 203 or adjustment retaining element 203.Wherein, Retaining element 203 1 ends are perpendicular to the ring body of pressing plate 202, when in order to a fixing primary and secondary ring (Double Ring) 204; The ring body of retaining element 203 other end traverse primary and secondary rings 204; Element 203 is fixed in loading plate 201 so primary and secondary ring 204 is fixed, and the external diameter of the ring body of pressing plate 202 is greater than the primary and secondary ring, and the scope of moving horizontally of primary and secondary ring 204 is restricted within the pressing plate 202.Note that at this retaining element 203 can be a reed and realizes, and in one embodiment, the structure that retaining element 203 and pressing plate 202 are formed in one, the utility model should be as limit.
In other words; Through location notch 202b and reference column 201a, when pressing plate 202 utilized magnetic force to adsorb and is fixed in loading plate 201, reference column 201a and location notch 202b were tabling; So; When primary and secondary ring 204 is fixed in wafer mounting apparatus 200,, can save the spent time of screw hole that screw need be aimed at load bearing seat 102 earlier in the prior art by location notch 202b guiding reference column 201a; So the user directly screws in or screw out the screw 203a on the retaining element 203, the primary and secondary ring 204 of can fixing or get loose is in wafer mounting apparatus 200.
In addition; The loading plate 201 of the utility model more comprises two dismounting mouths 20, and dismounting mouth 20 is divided on the loading plate 201, is oval recess; When pressing plate 202 utilizes magnetic force to adsorb and is fixed in loading plate 201; The outer rim of pressing plate 202 is partly overlapping with dismounting mouthfuls 20, supplies the user to utilize both hands or other machinery, through dismounting mouthfuls 20 with pressing plate 202 from loading plate 201 dismountings.
Note that in another embodiment that at this loading plate 201 is provided with at least one location notch 202b; Accordingly; The ring body of pressing plate 202 is provided with at least one reference column 201a, and reference column 201a is vertically installed in the lower surface (figure do not show) of pressing plate 202, and wherein lower surface is that pressing plate 202 is fixed in the contact-making surface when loading plate 201; All the other principles are not given unnecessary details at this with aforementioned identical separately.
See also Fig. 3, Fig. 3 shows the wafer mounting apparatus sketch map of the utility model one embodiment, and wafer mounting apparatus 300 is with wafer mounting apparatus 200 differences; Pressing plate 302 can be combined by two sub-pressing plates 30,31; In other words, sub-pressing plate 30 and 31 is semicircle, is an orbicular pressing plate 302 after sub-pressing plate 30 and 31 combinations; All the other principles are given unnecessary details with aforementioned identical for the sake of clarity no longer separately.
See also Fig. 4, Fig. 4 shows the wafer mounting apparatus sketch map of the utility model one embodiment, and wafer mounting apparatus 400 comprises a loading plate 401 and a pressing plate 402.
Loading plate 401 has a circular perforations O, and pressing plate 402 is a ring body, and the big or small corresponding circular perforations O of ring body; Wherein, Loading plate 401 has magnetic, makes loading plate 401 and pressing plate 402 can carry out magnetic force absorption, so pressing plate 402 can be fixed in loading plate 401 through magnetic force.
In the present embodiment, circular perforations O is one positive circular, and the ring body of pressing plate 402 is an orbicular ring body, and loading plate 401 comprises a hinge 41, and pivot button 41 has magnetic, and pivot button 41 utilizes magnetic force to adsorb and is fixed in loading plate 401.
In one embodiment, pivot button 41 comprises a retaining element 41a, and when pivot button 41 utilized magnetic force to adsorb and is fixed in loading plate 401, retaining element 41a was vertical and press in the ring body of pressing plate 402, in order to a fixing primary and secondary ring (figure does not show).When user's primary and secondary ring of desiring to get loose, rotatable pivot button 41 makes pivot button 41 and loading plate open the ring body of pressing plate 402 so retaining element 41a can get loose in 401 minutes.
In other words; Magnetic through pivot button 41; Make pressing plate 402 utilize magnetic force to adsorb and be fixed in loading plate 401; Screw need be aimed at the spent time of screw hole of load bearing seat 102 earlier in the saving prior art, so the screw (figure does not show) on direct screw-in of user or the back-out retaining element 41a, the primary and secondary ring of can fixing or get loose is in wafer mounting apparatus 400.
See also Fig. 5; Fig. 5 shows the wafer mounting apparatus sketch map of the utility model one embodiment; Wafer mounting apparatus 500 is that with the difference of wafer mounting apparatus 400 pressing plate 502 of wafer mounting apparatus 500 has magnetic; In an embodiment, the loading plate 501 of wafer mounting apparatus 500 is not had magnetic, and loading plate 501 has a hinge 51 and a retaining element 52.
When pressing plate 502 passes through rotation hub 51, pressing plate 502 is contacted in loading plate 501, this moment, pressing plate 502 utilized magnetic force to adsorb, and made pressing plate 502 be fixed in loading plate 501.This moment, the user utilized retaining element 52 again, made the ring body of retaining element 52 perpendicular to pressing plate 502, let primary and secondary ring 504 be fixed in wafer mounting apparatus 500, and all the other operating principles are not given unnecessary details at this with aforementioned identical separately.
See also Fig. 6 A, Fig. 6 A shows the wafer mounting apparatus sketch map of the utility model one embodiment, and wafer mounting apparatus 600 comprises a loading plate, a pressing plate and a fixed strip.Loading plate 601 has a circular perforations O, and pressing plate 602 is a ring body, and pressing plate 602 is fixed in the corresponding circular perforations O in position of loading plate 601, and the big or small corresponding circular perforations O of ring body.
Please note at this; Please consult Fig. 6 B simultaneously; Fig. 6 B shows the end view of the utility model A, B and C in Fig. 6 A at 3, and in the present embodiment, wafer mounting apparatus 600 has two fixed strips 61; And be arranged at the dual-side of loading plate 601 respectively, fixed strip 61 has a fixing protuberance 61a respectively.
Fixed strip 61 1 ends connect a hinge 63, and fixed strip 61 is through rotation hub 63, make fixed strip 61 contacts or away from pressing plate 602, and in other words, the user is through rotation hub 63, the wafer mounting apparatus 600 that can begin get loose or fixation clip 602 in loading plate 601.In one embodiment, hinge 63 can be an elastic component and realizes, for example: spring.
Wherein, When pressing plate 602 is fixed in position and the corresponding circular perforations of loading plate; Fixing protuberance 61a rest against pressure plate 602 makes pressing plate 602 can be installed in a predeterminated position of this loading plate, and fixedly the top of protuberance 61a (B point) for being resisted against primary and secondary ring 204; So can be understood by Fig. 6 B, fixedly the height of the B of protuberance 61a point in end view is lower than A point or C point.
In addition; Loading plate 601 has a retaining element 64, and when pressing plate 602 was fixed in the predeterminated position of loading plate 602, retaining element 64 can be fixed the other end of fixed strip 61; Fixed strip 61 is moved in a pre-set space, can avoid pressing plate 602 to break away from loading plate 601 thus.
In sum; Because loading plate and pressing plate one of which at least have magnetic, make loading plate and pressing plate at least one of which can utilize magnetic force to adsorb, make pressing plate can be fixed in loading plate rapidly; Utilize the design of reference column, location notch or hinge again, save user's time and manpower.
Claims (10)
1. a wafer mounting apparatus is characterized in that, said wafer mounting apparatus comprises:
One loading plate has a circular perforations; And
One pressing plate is a ring body, and said pressing plate is fixed in the corresponding said circular perforations in position of said loading plate;
Wherein, said loading plate and said pressing plate one of which at least have magnetic, and said loading plate and said pressing plate utilize magnetic force absorption fixing.
2. wafer mounting apparatus as claimed in claim 1 is characterized in that said loading plate is provided with at least one reference column, and said reference column is vertical at a surface of said loading plate.
3. wafer mounting apparatus as claimed in claim 2 is characterized in that said ring body is provided with at least one location notch, in order to guide said reference column, makes said pressing plate can be installed in a predeterminated position of said loading plate.
4. wafer mounting apparatus as claimed in claim 1 is characterized in that said ring body is provided with at least one reference column, and said reference column is vertical at a surface of said ring body.
5. wafer mounting apparatus as claimed in claim 4 is characterized in that said loading plate is provided with at least one location notch, in order to guide said reference column, makes said pressing plate can be installed in a predeterminated position of said loading plate.
6. wafer mounting apparatus as claimed in claim 1 is characterized in that, in order to putting a primary and secondary ring, and the external diameter of said ring body is greater than said primary and secondary ring.
7. wafer mounting apparatus as claimed in claim 6 is characterized in that said wafer mounting apparatus has a retaining element, and said retaining element makes said primary and secondary ring be fixed in said wafer mounting apparatus perpendicular to said ring body.
8. wafer mounting apparatus as claimed in claim 7; It is characterized in that said loading plate comprises a hinge, said loading plate utilizes said hinge to be connected with said pressing plate; And said wafer mounting apparatus makes said pressing plate contact or is away from said loading plate through rotation hub; Said loading plate comprises a retaining element, and when said pressing plate utilized magnetic force to adsorb and is fixed in said loading plate, said retaining element one end was perpendicular to said ring body, and the said retaining element other end is in order to a fixing primary and secondary ring.
9. wafer mounting apparatus as claimed in claim 1 is characterized in that said loading plate comprises a hinge, and said pivot button has magnetic, and said pivot button utilizes magnetic force to adsorb and is fixed in said loading plate; Said pivot button comprises a retaining element, and when said pivot button utilized magnetic force to adsorb and is fixed in said loading plate, said retaining element one end was perpendicular to said ring body, and the said retaining element other end is in order to a fixing primary and secondary ring.
10. a wafer mounting apparatus is characterized in that, said wafer mounting apparatus comprises:
One loading plate has a circular perforations;
One pressing plate is a ring body, and said pressing plate is fixed in the corresponding said circular perforations in position of said loading plate; And
One fixed strip has a fixing protuberance;
Wherein, when said pressing plate was fixed in the corresponding circular perforations in the position of loading plate, said fixedly protuberance made said pressing plate can be fixed in a predeterminated position of said loading plate against said pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202687566U CN202189772U (en) | 2011-07-27 | 2011-07-27 | Wafer fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202687566U CN202189772U (en) | 2011-07-27 | 2011-07-27 | Wafer fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202189772U true CN202189772U (en) | 2012-04-11 |
Family
ID=45921207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202687566U Expired - Fee Related CN202189772U (en) | 2011-07-27 | 2011-07-27 | Wafer fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202189772U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102840425A (en) * | 2012-08-06 | 2012-12-26 | 北京七星华创电子股份有限公司 | Supporting leg device |
| CN103074610A (en) * | 2012-08-28 | 2013-05-01 | 光达光电设备科技（嘉兴）有限公司 | Substrate supporting structure and reaction chamber containing the same |
| CN104459220A (en) * | 2014-11-05 | 2015-03-25 | 东晶锐康晶体（成都）有限公司 | Testing pressure head positioning mechanism |
| CN104733366A (en) * | 2015-03-27 | 2015-06-24 | 北京七星华创电子股份有限公司 | Supporting leg device |
| CN104916572A (en) * | 2014-03-14 | 2015-09-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and plasma processing device |
| CN105092904A (en) * | 2014-05-04 | 2015-11-25 | 无锡华润上华半导体有限公司 | MEMS silicon wafer fixing device, fixing method and testing method |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| WO2022083181A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Mounting clamp for carrier ring for wafer |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
-
2011
- 2011-07-27 CN CN2011202687566U patent/CN202189772U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102840425A (en) * | 2012-08-06 | 2012-12-26 | 北京七星华创电子股份有限公司 | Supporting leg device |
| CN103074610A (en) * | 2012-08-28 | 2013-05-01 | 光达光电设备科技（嘉兴）有限公司 | Substrate supporting structure and reaction chamber containing the same |
| CN104916572B (en) * | 2014-03-14 | 2018-03-09 | 北京北方华创微电子装备有限公司 | A kind of bogey and plasma processing device |
| CN104916572A (en) * | 2014-03-14 | 2015-09-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and plasma processing device |
| CN105092904B (en) * | 2014-05-04 | 2018-04-10 | 无锡华润上华科技有限公司 | MEMS fixing device for silicon piece, fixing means and method of testing |
| CN105092904A (en) * | 2014-05-04 | 2015-11-25 | 无锡华润上华半导体有限公司 | MEMS silicon wafer fixing device, fixing method and testing method |
| CN104459220A (en) * | 2014-11-05 | 2015-03-25 | 东晶锐康晶体（成都）有限公司 | Testing pressure head positioning mechanism |
| CN104733366B (en) * | 2015-03-27 | 2017-07-25 | 北京七星华创电子股份有限公司 | A kind of support feet |
| CN104733366A (en) * | 2015-03-27 | 2015-06-24 | 北京七星华创电子股份有限公司 | Supporting leg device |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11183411B2 (en) | 2019-07-26 | 2021-11-23 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
| WO2022083181A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Mounting clamp for carrier ring for wafer |
| US11610803B2 (en) | 2020-10-20 | 2023-03-21 | Changxin Memory Technologies, Inc. | Mounting fixture of bearing ring for wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20160727 |