CN105067013A - 一种环境传感器 - Google Patents
一种环境传感器 Download PDFInfo
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Abstract
本发明涉及一种环境传感器,ASIC芯片通过植锡球焊接在电路板上,且ASIC芯片的输出端与设置在电路板上的ASIC输出端导线电连接;所述传感器芯片通过植锡球焊接在所述ASIC芯片的上端,其中,所述传感器芯片的输出端与ASIC芯片的输入端电连接在一起;所述外部封装上还设置有将传感器芯片暴露在外界环境中的通道。本发明的环境传感器,传感器芯片、ASIC芯片分布在外部封装的竖直方向上,降低了整个环境传感器的在横向上的尺寸,从而可以节省外部封装的空间,使得产品可以做的更小,以满足现代电子产品的小型化发展;简化了传感器芯片与ASIC芯片之间的连接方式,使其制造工艺简单,制程效率高,生产成本低。
Description
技术领域
本发明涉及测量领域,更具体地,涉及一种传感器,尤其涉及一种环境传感器。
背景技术
环境传感器利用的是敏感材料的相关物理效应,如压阻效应、压电效应等,敏感材料在受到环境变量的作用后,其电阻或者电容发生变化,通过测量电路就可以得到正比于环境变量变化的电信号,环境传感器现已广泛应用于气压、高度、温湿度、气体等领域的测量和控制中。
近年来,随着科学技术的发展,手机、笔记本电脑等电子产品的体积在不断减小,而且人们对这些便携电子产品的性能要求也越来越高,这就要求与之配套的电子零部件的体积也必须随着减小。
现有的环境传感器,包括由电路板、外壳围成的封装结构,以及位于该封装结构中的传感器芯片、ASIC芯片,其中,传感器芯片和ASIC芯片均固定在电路板上,传感器芯片和ASIC芯片之间通过金线电连接,ASIC芯片与电路板之间通过金线电连接在一起。这样的连接方式,不但增加了制作工序,而且也不利于环境传感器的小型化发展。
发明内容
本发明的一个目的是提供一种环境传感器。
根据本发明的一个方面,提供一种环境传感器,包括外部封装以及位于所述外部封装内部的ASIC芯片、传感器芯片,所述外部封装包括电路板;其中,所述ASIC芯片通过植锡球焊接在电路板上,且ASIC芯片的输出端与设置在电路板上的ASIC输出端导线电连接;所述传感器芯片通过植锡球焊接在所述ASIC芯片的上端,其中,所述传感器芯片的输出端与ASIC芯片的输入端电连接在一起;所述外部封装上还设置有将传感器芯片暴露在外界环境中的通道。
优选地,所述ASIC芯片倒置安装,其输出端通过植锡球直接焊接在电路板上设置的ASIC输出端导线上;在所述ASIC芯片内部还设置有第一金属化通孔,所述第一金属化通孔的下端连接ASIC芯片的输入端;所述传感器芯片的输出端与第一金属化通孔的上端电连接在一起。
优选地,所述传感器芯片倒置安装,其输出端通过植锡球直接焊接在第一金属化通孔的上端。
优选地,所述传感器芯片内部设置有第二金属化通孔,所述第二金属化通孔的上端连接传感器芯片的输出端,所述传感器芯片上第二金属化通孔的下端作为焊接位置,并通过植锡球直接焊接在ASIC芯片上第一金属化通孔的上端。
优选地,所述ASIC输出端导线从电路板的上端面延伸至电路板的下端面,并在电路板的下端面形成焊盘。
优选地,所述外部封装还包括设置在电路板上的壳体,所述壳体与电路板围成了一具有内腔的外部封装。
优选地,所述通道为形成在壳体上连通内腔与外界的导通孔。
优选地,所述通道为形成在电路板上连通内腔与外界的导通孔。
优选地,所述外部封装包括注塑在电路板上并包裹所述ASIC芯片、传感器芯片的注塑体。
优选地,所述通道为形成在注塑体上将传感器芯片的敏感部位暴露在外界的缺口。
本发明的环境传感器,ASIC芯片通过植锡球的方式焊接在电路板上,且,ASIC芯片的输出端电连接ASIC输出端导线;传感器芯片通过植锡球的方式焊接在ASIC芯片的上端,且传感器芯片的输出端电连接ASIC的输入端。传感器芯片、ASIC芯片分布在外部封装的竖直方向上,降低了整个环境传感器的在横向上的尺寸,从而可以节省外部封装的空间,使得产品可以做的更小,以满足现代电子产品的小型化发展;简化了传感器芯片与ASIC芯片之间的连接方式,使其制造工艺简单,制程效率高,生产成本低。
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例,并且连同说明书一起用于解释本发明的原理。
图1是本发明环境传感器的结构示意图。
图2是本发明环境传感器第二实施例的结构示意图。
图3是本发明环境传感器第三实施例的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论,但在适当情况下,所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。
参考图1,本发明提供了一种环境传感器,其可以是压力传感器、温度传感器、湿度传感器等用于检测周围环境的传感器,其包括外部封装以及位于所述外部封装内部的ASIC芯片3、传感器芯片4。其中,外部封装包括电路板1,所述外部封装上还设置有将传感器芯片4暴露在外界环境中的通道,以使环境传感器中的传感器芯片4可以随着外界环境的变化而输出相应的电信号。
在本发明一个具体的实施例中,所述外部封装包括设置在电路板1上的壳体2,所述壳体2与电路板1围成了一具有内腔的外部封装。其中所述壳体2也可以呈平板状,此时,还需要设置一独立的侧壁部将壳体2支撑在电路板1上,以共同形成环境传感器的外部封装。其中,上述的通道可以为形成在壳体2或电路板1上用于连通内腔与外界的导通孔8,参考图1、图2。
在本发明另一具体的实施例中,所述外部封装包括注塑在电路板1上并包裹所述ASIC芯片3、传感器芯片4的注塑体11,参考图3。将ASIC芯片3、传感器芯片4固定好之后,在电路板1上灌封树脂或其它材料的注塑体11,通过该注塑体11将ASIC芯片3、传感器芯片4包裹在电路板1上,以形成环境传感器的外部封装。此时,所述通道为形成在注塑体11上的缺口12,通过该缺口12可以将传感器芯片4上的敏感部位暴露在外界的环境中,以便传感器芯片4可以随着外界环境的变化而输出相应的电信号。
本发明的环境传感器,所述ASIC芯片3通过植锡球5焊接在电路板1上,且ASIC芯片3的输出端与电路板1上的ASIC输出端导线7电连接在一起;所述传感器芯片4通过植锡球5焊接在所述ASIC芯片3的上端,其中,所述传感器芯片4的输出端与ASIC芯片3的输入端电连接在一起。
在本发明一个具体的实施方式中,所述ASIC芯片3以倒置的方式安装,以使ASIC芯片3上的输入端、输出端朝向电路板1的待焊接面,通过植锡球5的方式将ASIC芯片3的输出端直接焊接在电路板1的ASIC输出端导线7上。此时,由于ASIC芯片3的输入端也朝向电路板1,所以,在所述ASIC芯片3内部还设置有第一金属化通孔6,该第一金属化通孔6的下端连接ASIC芯片3的输入端,其上端暴露在ASIC芯片3的上端面;所述传感器芯片4的输出端与第一金属化通孔6的上端电连接在一起,从而实现了传感器芯片4与ASIC芯片3之间的电连接,参考图1。
传感器芯片4与ASIC芯片3之间的电连接可以采用传统的金线方式,在本发明一个优选的实施方式中,传感器芯片4也可以采用倒置安装的方式,也就是说,使传感器芯片4上的输出端朝向ASIC芯片3的上端面,通过植锡球5的方式将传感器芯片4的输出端直接焊接在第一金属化通孔6的上端,以实现传感器芯片4与ASIC芯片3之间的电连接,参考图1。
进一步优选的是,在所述传感器芯片4内部设置有第二金属化通孔10,所述第二金属化通孔10的上端连接传感器芯片4的输出端,第二金属化通孔10的下端暴露在传感器芯片4的下端面上,以使第二金属化通孔10的下端可作为焊接位置。采用这种方式,使得不再需要将传感器芯片4倒置,可通过植锡球5的方式将第二金属化通孔10的下端位置直接焊接在ASIC芯片3上第一金属化通孔6的上端,参考图2、图3。
在本发明另一具体的实施方式中,基于同样的道理,可在ASIC芯片3的内部设置第三金属化通孔(视图未给出),该第三金属化通孔的上端连接ASIC芯片3的输出端,第三金属化通孔的下端暴露在ASIC芯片3的下端面,采用这种方式,使得不再需要将ASIC芯片3倒置,可通过植锡球5将第三金属化通孔的下端直接焊接在电路板1的ASIC输出端导线7上。由于ASIC芯片3不需要倒置,此时,ASIC芯片3的输入端朝上,从而方便了其与传感器芯片4的连接,可以将传感器芯片4的输出端通过植锡球5的方式直接焊接在ASIC芯片3的输入端上。
本发明的环境传感器,ASIC芯片通过植锡球的方式焊接在电路板上,且,ASIC芯片的输出端电连接ASIC输出端导线;传感器芯片通过植锡球的方式焊接在ASIC芯片的上端,且传感器芯片的输出端电连接ASIC的输入端。传感器芯片、ASIC芯片分布在外部封装的竖直方向上,降低了整个环境传感器的在横向上的尺寸,从而可以节省外部封装的空间,使得产品可以做的更小,以满足现代电子产品的小型化发展。同时也简化了传感器芯片与ASIC芯片之间的连接方式,使其制造工艺简单,制程效率高,生产成本低。
本发明的环境传感器,所述ASIC输出端导线7可以贯穿电路板1的两侧,也就是说,ASIC输出端导线7从电路板1的上端面延伸至电路板1的下端面,并在电路板1的下端面形成焊盘9,通过该焊盘9可实现环境传感器与外部用户终端的连接。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上示例仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。
Claims (10)
1.一种环境传感器,其特征在于:包括外部封装以及位于所述外部封装内部的ASIC芯片(3)、传感器芯片(4),所述外部封装包括电路板(1);其中,所述ASIC芯片(3)通过植锡球(5)焊接在电路板(1)上,且ASIC芯片(3)的输出端与设置在电路板(1)上的ASIC输出端导线(7)电连接;所述传感器芯片(4)通过植锡球(5)焊接在所述ASIC芯片(3)的上端,其中,所述传感器芯片(4)的输出端与ASIC芯片(3)的输入端电连接在一起;所述外部封装上还设置有将传感器芯片(4)暴露在外界环境中的通道。
2.根据权利要求1所述的环境传感器,其特征在于:所述ASIC芯片(3)倒置安装,其输出端通过植锡球(5)直接焊接在电路板(1)上设置的ASIC输出端导线(7)上;在所述ASIC芯片(3)内部还设置有第一金属化通孔(6),所述第一金属化通孔(6)的下端连接ASIC芯片(3)的输入端;所述传感器芯片(4)的输出端与第一金属化通孔(6)的上端电连接在一起。
3.根据权利要求2所述的环境传感器,其特征在于:所述传感器芯片(4)倒置安装,其输出端通过植锡球(5)直接焊接在第一金属化通孔(6)的上端。
4.根据权利要求2所述的环境传感器,其特征在于:所述传感器芯片(4)内部设置有第二金属化通孔(10),所述第二金属化通孔(10)的上端连接传感器芯片(4)的输出端,所述传感器芯片(4)上第二金属化通孔(10)的下端作为焊接位置,并通过植锡球(5)直接焊接在ASIC芯片(3)上第一金属化通孔(6)的上端。
5.根据权利要求1所述的环境传感器,其特征在于:所述ASIC输出端导线(7)从电路板(1)的上端面延伸至电路板(1)的下端面,并在电路板(1)的下端面形成焊盘(9)。
6.根据权利要求1所述的环境传感器,其特征在于:所述外部封装还包括设置在电路板(1)上的壳体(2),所述壳体(2)与电路板(1)围成了一具有内腔的所述外部封装。
7.根据权利要求6所述的环境传感器,其特征在于:所述通道为形成在壳体(2)上连通内腔与外界的导通孔(8)。
8.根据权利要求6所述的环境传感器,其特征在于:所述通道为形成在电路板(1)上连通内腔与外界的导通孔(8)。
9.根据权利要求1所述的环境传感器,其特征在于:所述外部封装还包括注塑在电路板(1)上并包裹所述ASIC芯片(3)、传感器芯片(4)的注塑体(11)。
10.根据权利要求9所述的环境传感器,其特征在于:所述通道为形成在注塑体(11)上将传感器芯片(4)的敏感部位暴露在外界的缺口(12)。
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