CN105063660B - 一种电解精炼过程中直接制备纳米硅粉体的方法 - Google Patents
一种电解精炼过程中直接制备纳米硅粉体的方法 Download PDFInfo
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- CN105063660B CN105063660B CN201510466179.4A CN201510466179A CN105063660B CN 105063660 B CN105063660 B CN 105063660B CN 201510466179 A CN201510466179 A CN 201510466179A CN 105063660 B CN105063660 B CN 105063660B
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- 238000000034 method Methods 0.000 title claims abstract description 68
- 239000005543 nano-size silicon particle Substances 0.000 title claims abstract description 38
- 230000008569 process Effects 0.000 title claims description 35
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 65
- 239000000956 alloy Substances 0.000 claims abstract description 65
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000008367 deionised water Substances 0.000 claims abstract description 5
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 16
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- 239000000843 powder Substances 0.000 claims description 16
- 229910052786 argon Inorganic materials 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 11
- 239000003792 electrolyte Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 239000011863 silicon-based powder Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910016344 CuSi Inorganic materials 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium chloride Substances Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000005660 chlorination reaction Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 1
- 238000007670 refining Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 4
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 3
- 239000002086 nanomaterial Substances 0.000 abstract description 2
- 238000010306 acid treatment Methods 0.000 abstract 1
- 238000010310 metallurgical process Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229910000914 Mn alloy Inorganic materials 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 235000013339 cereals Nutrition 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
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- 238000005554 pickling Methods 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910021487 silica fume Inorganic materials 0.000 description 3
- -1 wherein Substances 0.000 description 3
- 229910017818 Cu—Mg Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- AIAFIGZLFHZCAD-UHFFFAOYSA-N [Si].[Mn].[Cu] Chemical compound [Si].[Mn].[Cu] AIAFIGZLFHZCAD-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002608 ionic liquid Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000006396 nitration reaction Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009854 hydrometallurgy Methods 0.000 description 1
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- 238000000608 laser ablation Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
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- 238000007086 side reaction Methods 0.000 description 1
- 239000012686 silicon precursor Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Abstract
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CN105274562A (zh) * | 2015-11-27 | 2016-01-27 | 国家电网公司 | 一种铝硅合金的电解分离铝、硅的方法 |
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DE4243697C1 (de) * | 1992-12-18 | 1994-03-17 | Mib Metallurg Und Oberflaechen | Elektrolytisches Verfahren zur Gewinnung von Platin hoher Reinheit aus Platinlegierungen |
JPH07145495A (ja) * | 1993-11-20 | 1995-06-06 | Toho Aen Kk | 電解精製法 |
CN1333108C (zh) * | 2003-09-29 | 2007-08-22 | 北京大学 | 阳极氧化法制备纳米硅颗粒的方法 |
CN102634817A (zh) * | 2011-02-15 | 2012-08-15 | 中国科学院过程工程研究所 | 一种以玻碳为惰性阳极的离子液体低温电解铝方法 |
CN102534666B (zh) * | 2011-12-30 | 2014-10-22 | 大连理工大学 | 一种高纯硅与高纯铝的电化学双精炼提纯的方法 |
CN103173780B (zh) * | 2013-03-01 | 2015-06-03 | 中南大学 | 一种半连续熔盐电解制备太阳级多晶硅材料的方法及装置 |
CN103882465A (zh) * | 2014-03-05 | 2014-06-25 | 江苏华富储能新技术股份有限公司 | 一种高纯纳米硅的制备方法及其应用 |
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Effective date of registration: 20190930 Address after: 415137 Hunan Chenyu Fuji New Energy Technology Co., Ltd. Patentee after: Hunan Chenyu Fuji New Energy Technology Co., Ltd. Address before: Yuelu District City, Hunan province 410083 Changsha Lushan Road No. 932 Patentee before: Central South University |
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Address after: 415137 Agricultural Reclamation Avenue of West Dongting Biotechnology Park, Changde National High-tech Industrial Development Zone, Hunan Province Patentee after: Hunan Chenyu Fuji New Energy Technology Co., Ltd. Address before: 415137 Hunan Chenyu Fuji New Energy Technology Co., Ltd. Patentee before: Hunan Chenyu Fuji New Energy Technology Co., Ltd. |
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Denomination of invention: Method for directly preparing nanometer silicon powder in electrolytic refining process Effective date of registration: 20200320 Granted publication date: 20170704 Pledgee: Changde Finance Guarantee Co., Ltd. Pledgor: HUNAN CHENYU FUJI NEW ENERGY TECHNOLOGY Co.,Ltd. Registration number: Y2020980000906 |
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Date of cancellation: 20220317 Granted publication date: 20170704 Pledgee: Changde Finance Guarantee Co.,Ltd. Pledgor: HUNAN CHENYU FUJI NEW ENERGY TECHNOLOGY Co.,Ltd. Registration number: Y2020980000906 |
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