CN105038209A - PA10T (polyamide10T) boron nitride composite heat dispersing material for LED light and preparation method thereof - Google Patents
PA10T (polyamide10T) boron nitride composite heat dispersing material for LED light and preparation method thereof Download PDFInfo
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- C08K7/00—Use of ingredients characterised by shape
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- C08K7/04—Fibres or whiskers inorganic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
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- C08K3/22—Oxides; Hydroxides of metals
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- C08K2003/2248—Oxides; Hydroxides of metals of copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K2003/2268—Ferrous oxide (FeO)
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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Abstract
A PA10T (polyamide10T) boron nitride composite heat dispersing material for an LED light is prepared from the following raw materials in parts by weight: 40-42 parts of magnesium oxide, 20-22 parts of boron nitride, 2-3 parts of chopped glass fiber, 30-32 parts of PA10T, 7-8 parts of aluminium oxide whiskers, 1-2 parts of gas phase aluminium oxide, 1-2 parts of graphene microchip, 1-2 parts of flake-like copper oxide, 1-2 parts of silver oxide, 1-1.5 parts of polyvinyl butyral, 3-4 parts of ethyl alcohol and 3-4 parts of SEBS. According to the composite heat dispersing material, boron nitride is modified by using SEBS, so that the notch impact strength of the material is improved; chopped glass fiber and aluminium oxide whiskers are modified, so that the heat conductivity coefficient and mechanical property of the composite material are improved, and the electrical property is maintained at a relatively high level; through using gas phase aluminium oxide, graphene microchip, flake-like copper oxide and silver oxide, the heat-dispersing property and bending strength of the material are improved, and the insulating property required for composite is guaranteed.
Description
Technical field
The present invention relates to LED heat sink material field, particularly relate to a kind of LED PA10T boron nitride composite heat dissipation material and preparation method thereof.
Background technology
The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.
Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.
Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.
The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.
Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.
Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.
Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.
Summary of the invention
The object of the present invention is to provide a kind of LED PA10T boron nitride composite heat dissipation material, this composite heat dissipation material thermal diffusivity is good, and flexural strength is high, ensures the insulating property of composite demand simultaneously.
Technical scheme of the present invention is as follows:
A kind of LED PA10T boron nitride composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, gas phase aluminium sesquioxide 1-2, graphene microchip 1-2, sheet cupric oxide 1-2, silver suboxide 1-2, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
The production method of described LED PA10T boron nitride composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin all to dissolve, add gas phase aluminium sesquioxide, graphene microchip, sheet cupric oxide, silver suboxide again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Beneficial effect of the present invention
Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using gas phase aluminium sesquioxide, graphene microchip, sheet cupric oxide, silver suboxide, improve thermal diffusivity and the flexural strength of material, ensureing the insulating property of composite demand simultaneously.
Embodiment
A kind of LED PA10T boron nitride composite heat dissipation material, is made up of the raw material of following weight part (kilogram): magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, gas phase aluminium sesquioxide 1.5, graphene microchip 1.5, sheet cupric oxide 1.5, silver suboxide 1.5, polyvinyl butyral acetal 1.3, ethanol 3.5, SEBS3.5.
The production method of described LED PA10T boron nitride composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 81 DEG C, be stirred to resin all to dissolve, add gas phase aluminium sesquioxide, graphene microchip, sheet cupric oxide, silver suboxide again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 5h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Experimental data: the normal direction thermal conductivity of this heat sink material is 3.78W/mK.
Claims (2)
1. a LED PA10T boron nitride composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, gas phase aluminium sesquioxide 1-2, graphene microchip 1-2, sheet cupric oxide 1-2, silver suboxide 1-2, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
2. the production method of LED PA10T boron nitride composite heat dissipation material according to claim 1, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin all to dissolve, add gas phase aluminium sesquioxide, graphene microchip, sheet cupric oxide, silver suboxide again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114031934A (en) * | 2021-12-15 | 2022-02-11 | 宁波公牛光电科技有限公司 | Polyamide composite material with high thermal conductivity coefficient and preparation method thereof |
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| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
| CN104277455A (en) * | 2014-09-28 | 2015-01-14 | 苏州长盛机电有限公司 | Preparation method of thermally conductive and insulating material |
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- 2015-06-23 CN CN201510348171.8A patent/CN105038209A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
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Non-Patent Citations (2)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114031934A (en) * | 2021-12-15 | 2022-02-11 | 宁波公牛光电科技有限公司 | Polyamide composite material with high thermal conductivity coefficient and preparation method thereof |
| CN114031934B (en) * | 2021-12-15 | 2023-07-04 | 宁波公牛光电科技有限公司 | Polyamide composite material with high heat conductivity coefficient and preparation method thereof |
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