CN105131591A - Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof - Google Patents
Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof Download PDFInfo
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- CN105131591A CN105131591A CN201510436499.5A CN201510436499A CN105131591A CN 105131591 A CN105131591 A CN 105131591A CN 201510436499 A CN201510436499 A CN 201510436499A CN 105131591 A CN105131591 A CN 105131591A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/9258—Velocity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A heat-resistant PA10T composite heat-dissipating material used in LED lights is prepared from following raw materials, by weight, 40-42 parts of magnesium oxide, 20-22 parts of boron nitride, 2-3 parts of short-cut glass fibers, 30-32 parts of polyamide PA10T, 7-8 parts of aluminium oxide crystal whisker, 1-2 parts of aluminum magnesium spinel powder, 1-2 parts of rare earth, 1-2 parts of polycarbosilane, 2-2.5 parts of hydroxypropyl starch, 1-1.5 parts of polyvinyl butyral, 6-7 parts of ethanol and 3-4 parts of SEBS. The composite heat-dissipating material is prepared from the magnesium oxide and the boron nitride, thereby achieving excellent a compounded synergistic heat-dissipating effect. By means of the SEBS for modifying the boron nitride, the material is enhanced in notch impact strength. By means of the short-cut glass fibers and the aluminium oxide crystal whisker, the composite, after modification, is increased in heat conductive coefficient and mechanical performance and is high-level in electrical property. By means of the aluminum magnesium spinel powder, the rare earth, the polycarbosilane and the hydroxypropyl starch, the material is improved in heat dissipation and heat resistance and is increased in plasticity.
Description
Technical field
The present invention relates to LED heat sink material field, particularly relate to a kind of LED heat-resisting PA10T composite heat dissipation material and preparation method thereof.
Background technology
The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.
Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.
Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.
The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.
Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.
Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.
Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.
Summary of the invention
The object of the present invention is to provide the heat-resisting PA10T composite heat dissipation material of a kind of LED, this composite heat dissipation material thermal diffusivity, thermotolerance, plasticity-are good.
Technical scheme of the present invention is as follows:
The heat-resisting PA10T composite heat dissipation material of a kind of LED, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, aluminum-spinel powder 1-2, rare earth 1-2, Polycarbosilane 1-2, hydroxypropylated starch 2-2.5, polyvinyl butyral acetal 1-1.5, ethanol 6-7, SEBS3-4.
The described LED production method of heat-resisting PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add aluminum-spinel powder, rare earth again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, hydroxypropylated starch, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Beneficial effect of the present invention
Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using aluminum-spinel powder, rare earth, Polycarbosilane, hydroxypropylated starch, while the thermal diffusivity that improve material and thermotolerance, improve plasticity-.
Embodiment
The heat-resisting PA10T composite heat dissipation material of a kind of LED, is made up of the raw material of following weight part (kilogram): magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, aluminum-spinel powder 1.5, rare earth 1.5, Polycarbosilane 1.5, hydroxypropylated starch 2.3, polyvinyl butyral acetal 1.3, ethanol 6.5, SEBS3.5.
The described LED production method of heat-resisting PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 81 DEG C, be stirred to resin and all dissolve, add aluminum-spinel powder, rare earth again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, hydroxypropylated starch, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 5h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Experimental data: the normal direction thermal conductivity of this heat sink material is 3.14W/mK.
Claims (2)
1. the heat-resisting PA10T composite heat dissipation material of LED, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, aluminum-spinel powder 1-2, rare earth 1-2, Polycarbosilane 1-2, hydroxypropylated starch 2-2.5, polyvinyl butyral acetal 1-1.5, ethanol 6-7, SEBS3-4.
2. the LED according to claim 1 production method of heat-resisting PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add aluminum-spinel powder, rare earth again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, hydroxypropylated starch, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510436499.5A CN105131591A (en) | 2015-07-23 | 2015-07-23 | Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof |
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| CN201510436499.5A CN105131591A (en) | 2015-07-23 | 2015-07-23 | Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105778479A (en) * | 2016-04-12 | 2016-07-20 | 苏州甫众塑胶有限公司 | Lamp shell plastic material and preparation method thereof |
| CN106700507A (en) * | 2016-11-30 | 2017-05-24 | 宁波仁慈新材料科技有限公司 | Radiation-resistant heat-conducting heat-dissipation nylon and preparation method thereof |
| CN110627356A (en) * | 2019-11-01 | 2019-12-31 | 吴俊楠 | Preparation method of high-temperature-resistant fluorescent glass for LED |
Citations (4)
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| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
| CN104277455A (en) * | 2014-09-28 | 2015-01-14 | 苏州长盛机电有限公司 | Preparation method of thermally conductive and insulating material |
-
2015
- 2015-07-23 CN CN201510436499.5A patent/CN105131591A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
| CN104277455A (en) * | 2014-09-28 | 2015-01-14 | 苏州长盛机电有限公司 | Preparation method of thermally conductive and insulating material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105778479A (en) * | 2016-04-12 | 2016-07-20 | 苏州甫众塑胶有限公司 | Lamp shell plastic material and preparation method thereof |
| CN106700507A (en) * | 2016-11-30 | 2017-05-24 | 宁波仁慈新材料科技有限公司 | Radiation-resistant heat-conducting heat-dissipation nylon and preparation method thereof |
| CN110627356A (en) * | 2019-11-01 | 2019-12-31 | 吴俊楠 | Preparation method of high-temperature-resistant fluorescent glass for LED |
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Application publication date: 20151209 |