CN104987711A - PA10T composite heat disspating material for high-power LED lamps and preparation method therefor - Google Patents

Abstract

The invention relates to a PA10T composite heat disspating material for high-power LED lamps. The PA10T composite heat disspating material is prepared from the following raw materials in parts by weight: 40-42 parts of magnesium oxide, 20-22 parts of boron nitride, 2-3 parts of chopped glass fiber, 30-32 parts of polyamide PA10T, 7-8 parts of alumina whisker, 3-4 parts of organic bentonite, 1-2 parts of nano-copper powder, 0.8-1.1 parts of nano-silver powder, 1.2-1.6 parts of micron-sized graphite powder, 1-1.5 parts of polyvinyl butyral, 6-7 parts of ethyl alcohol and 3-4 parts of SEBS. The composite heat disspating material disclosed by the invention uses magnesium oxide and boron nitride, so that a good compound synergy radiation effect is generated; by using the nano-copper powder, nano-silver powder and micron-sized graphite powder, a good synergy radiation effect is achieved, the heat conduction is greatly improved, and the composite heat disspating material is suitable for high-power LED lamps; and by using the organic bentonite, the bending resistance of the material is improved.

Description

A kind of PA10T composite heat dissipation material used for large power LED lamp and preparation method thereof

Technical field

The present invention relates to LED heat sink material field, particularly relate to a kind of PA10T composite heat dissipation material used for large power LED lamp and preparation method thereof.

Background technology

The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.

Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.

Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.

The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.

Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.

Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.

Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.

Summary of the invention

The object of the present invention is to provide a kind of PA10T composite heat dissipation material used for large power LED lamp, this composite heat dissipation material thermal conductivity is good, and anti-bending strength is good, is applicable to high-power LED light fixture.

Technical scheme of the present invention is as follows:

A kind of PA10T composite heat dissipation material used for large power LED lamp, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, organobentonite 3-4, copper nanoparticle 1-2, nano-silver powder 0.8-1.1, micron order Graphite Powder 99 1.2-1.6, polyvinyl butyral acetal 1-1.5, ethanol 6-7, SEBS3-4.

The production method of described PA10T composite heat dissipation material used for large power LED lamp, is characterized in that:

(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add copper nanoparticle, nano-silver powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;

(2) boron nitride mixed with SEBS, organobentonite, micron order Graphite Powder 99, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;

(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.

Beneficial effect of the present invention

Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using copper nanoparticle, nano-silver powder, micron order Graphite Powder 99, have well collaborative thermolysis, thermal conductivity improves greatly, is applicable to high-power LED light fixture; By using organobentonite, improve the anti-bending strength of material.

Embodiment

A kind of PA10T composite heat dissipation material used for large power LED lamp, is made up of the raw material of following weight part: magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, organobentonite 3.5, copper nanoparticle 1.5, nano-silver powder 1, micron order Graphite Powder 99 1.4, polyvinyl butyral acetal 1.3, ethanol 6.5, SEBS3.5.

The production method of described PA10T composite heat dissipation material used for large power LED lamp, is characterized in that:

(1) polyvinyl butyral acetal is added in ethanol, be heated to 80 DEG C, be stirred to resin and all dissolve, add copper nanoparticle, nano-silver powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;

(2) boron nitride mixed with SEBS, organobentonite, micron order Graphite Powder 99, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;

(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 5h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.

Experimental data: the normal direction thermal conductivity of this heat sink material is 4.23W/mK.

Claims (2)

1. a PA10T composite heat dissipation material used for large power LED lamp, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, organobentonite 3-4, copper nanoparticle 1-2, nano-silver powder 0.8-1.1, micron order Graphite Powder 99 1.2-1.6, polyvinyl butyral acetal 1-1.5, ethanol 6-7, SEBS3-4.

2. the production method of PA10T composite heat dissipation material used for large power LED lamp according to claim 1, is characterized in that:

(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add copper nanoparticle, nano-silver powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;

(2) boron nitride mixed with SEBS, organobentonite, micron order Graphite Powder 99, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;

(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.