CN114031934B - Polyamide composite material with high heat conductivity coefficient and preparation method thereof - Google Patents
Polyamide composite material with high heat conductivity coefficient and preparation method thereof Download PDFInfo
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Abstract
The invention belongs to the technical field of composite materials, and relates to a polyamide composite material with high heat conductivity coefficient, which comprises the following components in percentage by mass: polyamide: 40-80 wt%; one-dimensional heat conducting filler: 10 to 50 weight percent; modified second phase polymer: 10-20wt%; the modified second phase polymer is a mixture of the second phase polymer and a two-dimensional heat conducting filler, and the second phase polymer is a polymer material incompatible with polyamide. By introducing an incompatible second phase into the polyamide and improving the heat conduction performance of the second phase, a heat conduction enrichment phase is formed, and a one-dimensional heat conduction filler is introduced, an effective heat conduction network is constructed, so that the heat conduction coefficient and the mechanical property of the polyamide are greatly improved.
Description
Technical Field
The invention belongs to the technical field of composite materials, and relates to a polyamide composite material with high heat conductivity and a preparation method thereof.
Background
With the continuous development of modern industry, various electronic devices such as LED lamps are continuously developed toward miniaturization and integration. The smaller space and concentrated heat increase the temperature of the electronic device during operation, which not only reduces the working efficiency and stability of the electronic device, but also remarkably reduces the service life of the electronic device, resulting in increased cost. Traditional electronic device packaging materials are metal or ceramic, and have high heat conductivity coefficients, but the two materials are often high in specific gravity and have certain molding difficulty. The polymer composite material has obvious advantages in many aspects, such as small specific gravity, easy molding, low cost, excellent mechanical properties and the like, and is gradually replacing metal and ceramic to become a common electronic device packaging material. However, the thermal conductivity of the polymer is generally low, and it is difficult to meet the requirement of the electronic component on the working temperature. Polymer composites with higher thermal conductivity have thus been developed while maintaining the advantages of the polymer itself.
The advantage of easy modification of the polymer gives the possibility of multiple functions, and the heat conductivity of the polymer composite material can be improved to a certain extent by adding the heat conducting filler in the aspect of heat conductivity, which is also the most common strategy. According to the difference of the thermal conductivity coefficient, morphology and the like of the filler, the thermal conductivity coefficient of the final composite material can also have a certain difference. In addition, when the amount of the heat conductive filler added is small, the heat conductivity of the polymer is generally not improved much, whereas when the heat conductive filler is added in a higher proportion, the heat conductivity starts to be improved more rapidly because the heat conductive paths having a higher heat conductivity are formed by the mutual contact between the fillers. However, higher thermal conductive fillers tend to reduce the advantages of the polymer itself, such as processability, partial mechanical properties, etc., and strategies with higher thermal conductivity efficiency need to be developed.
In recent years, many studies have been made to more effectively improve the thermal conductivity of polymers. For example, fillers of various sizes are used, and the synergistic effect between the sizes is utilized, namely, the large-size filler provides a heat conducting network, and the small-size filler fills the gaps, so that a perfect heat conducting network is formed. It is also possible to use fillers of various forms, for example, synergy between the flake and rod fillers, to compensate for the possible anisotropy caused by the fillers. However, the improvement of the thermal conductivity of these polymers still cannot meet the requirement of electronic components on high thermal conductivity, so that further development of polymer composite materials with excellent thermal conductivity and mechanical properties is needed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a polyamide composite material, which forms a heat conduction enrichment phase by introducing an incompatible second phase into polyamide and improving the heat conduction property of the second phase, and constructs an effective heat conduction network by introducing a one-dimensional heat conduction filler, thereby greatly improving the heat conduction coefficient and the mechanical property of the polyamide.
The first aspect of the invention provides a polyamide composite material with high heat conductivity coefficient, which comprises the following components in percentage by mass:
polyamide: 40-80 wt%;
one-dimensional heat conducting filler: 10 to 50 weight percent;
modified second phase polymer: 10-20wt%;
wherein the modified second phase polymer is a mixture of the second phase polymer and a two-dimensional heat conductive filler.
Preferably, the second phase polymer is a polymeric material that is incompatible with the polyamide.
Preferably, the second phase polymer is one or more of POE-g-MAH, PE-g-MAH, EPDM-g-MAH, PP-g-MAH, PPO-g-MAH, PE-g-MAH.
Preferably, the two-dimensional heat conductive filler is one or more of two-dimensional platy boron nitride, two-dimensional platy aluminum oxide, two-dimensional platy aluminum nitride, two-dimensional nitrogen platy silicon and two-dimensional MXene.
Preferably, the mass ratio of the second phase polymer to the two-dimensional heat conductive filler is (2-4): (1-3).
Preferably, the modified second phase polymer is obtained from a preparation process comprising the steps of: dispersing the second phase polymer in an organic solvent, heating, refluxing and stirring, then adding a two-dimensional heat conducting filler, continuing heating, refluxing and stirring, finally pouring the mixture into the second solvent, filtering and drying to obtain the modified second phase polymer.
The organic solvent is tetrahydrofuran, etc., and the second solvent is ethanol, water, diethyl ether, acetone, toluene, etc.
Preferably, the modified second phase polymer is obtained from a preparation process comprising the steps of: and mixing the second-phase polymer with the two-dimensional heat conducting filler, and adding the mixture into a screw extruder for melt granulation to obtain the modified second-phase polymer.
Preferably, the one-dimensional heat conducting filler is one or two of glass fiber and whisker.
Preferably, the whisker is one or more of magnesium oxide whisker, zinc oxide whisker, aluminum nitride whisker, aluminum oxide whisker, boron nitride whisker and silicon carbide whisker.
The second aspect of the invention provides a method for preparing a polyamide composite material with high thermal conductivity, comprising the following steps:
and mixing the polyamide, the one-dimensional heat conducting filler and the modified second-phase polymer, and adding the mixture into a screw extruder for extrusion granulation to obtain the polyamide composite material with high heat conductivity coefficient.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention mixes the two-dimension heat conduction filler and the second phase polymer in advance to form a mixture of the two-dimension heat conduction filler and the second phase polymer, then mixes and extrudes the mixture and polyamide, and under the orientation and phase separation effect during extrusion processing, the second phase polymer forms a second phase in the polyamide matrix, and the two-dimension heat conduction filler is uniformly dispersed in the second phase to form a heat conduction enrichment phase; the one-dimensional heat conducting filler is added along with the modified second-phase polymer, and can be used as a bridge for connecting heat conducting aggregation phases in the extrusion processing process to connect the heat conducting aggregation phases to form a heat conducting passage, so that the heat conducting coefficient of the polymer is greatly improved.
2. The second phase polymer introduced by the invention can also improve the comprehensive performance of the polyamide composite material and promote the industrialization feasibility of the polyamide composite material.
3. The modified second-phase polymer can be obtained by a simple solution mixing or extrusion mixing method, and the modified second-phase polymer can obtain a heat conduction enrichment phase in the process of blending and extrusion with polyamide, so that the preparation mode of the heat conduction enrichment phase is very simple.
4. The preparation method of the polyamide composite material with high heat conductivity coefficient is very simple, can be realized through extrusion processing, and is very suitable for industrial production.
Drawings
FIG. 1 is a schematic illustration of the preparation of a high thermal conductivity polyamide composite material of the present invention;
FIG. 2 is a flow chart of a method for preparing a polyamide composite material with high thermal conductivity according to the present invention;
FIG. 3 is a schematic diagram of the preparation of the polyamide composite material of comparative example 1.
Detailed Description
Hereinafter, embodiments will be described in detail with respect to a polyamide composite material having a high thermal conductivity and a method of preparing the same according to the present invention, however, these embodiments are exemplary, and the present disclosure is not limited thereto. And the drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure.
The polyamide composite material with high thermal conductivity provided by some embodiments of the invention comprises the following components in percentage by mass: polyamide: 40-80 wt%; one-dimensional heat conducting filler: 10 to 50 weight percent; modified second phase polymer: 10-20wt%; the modified second phase polymer is a mixture of the second phase polymer and a two-dimensional heat conducting filler, and the second phase polymer is a polymer material incompatible with polyamide.
The preparation principle diagram of the polyamide composite material with high heat conductivity coefficient is shown in figure 1: the two-dimensional heat conducting filler and the second phase polymer are mixed in advance to form a mixture of the two-dimensional heat conducting filler and the second phase polymer, the mixture and the polyamide are mixed and extruded, the second phase polymer forms a second phase in a polyamide matrix under the action of orientation and phase separation during extrusion processing, the two-dimensional heat conducting filler is uniformly dispersed in the second phase to form a heat conducting enrichment phase, and the introduction of the second phase can also improve the comprehensive performance of a polymer substrate. The one-dimensional heat conducting filler is added along with the modified second-phase polymer, and the one-dimensional heat conducting filler is of a linear or rod-shaped structure, so that the one-dimensional heat conducting filler is used as a bridge for connecting heat conducting aggregation phases in the extrusion processing process, and the heat conducting aggregation phases are connected to form a heat conducting passage, so that the heat conducting coefficient of the polymer is greatly improved.
According to the invention, the second phase, the two-dimensional heat conducting filler and the one-dimensional heat conducting filler are introduced, and the heat conducting property and the mechanical property of the polymer base material are improved by utilizing the orientation and the phase separation effect during extrusion processing.
The polyamide in some embodiments of the invention is preferably one or both of PA6, PA 66.
The second phase polymer of the present invention is a polymeric material that is incompatible with the polyamide, preferably one or more of POE-g-MAH, PE-g-MAH, EPDM-g-MAH, PP-g-MAH, PPO-g-MAH, PE-g-MAH.
The one-dimensional heat conducting filler of the invention refers to heat conducting fillers with linear, rod-shaped, tubular structures and the like, and is preferably one or two of glass fibers and whiskers. The whisker is more preferably one or more of magnesium oxide whisker, zinc oxide whisker, aluminum nitride whisker, aluminum oxide whisker, boron nitride whisker, and silicon carbide whisker.
The two-dimensional heat-conducting filler refers to a platy heat-conducting filler, and is preferably one or more of two-dimensional platy boron nitride, two-dimensional platy aluminum oxide, two-dimensional platy aluminum nitride, two-dimensional platy silicon nitride and two-dimensional MXene.
The preparation method of the polyamide composite material with high thermal conductivity provided in some embodiments of the invention, as shown in fig. 2, comprises the following steps:
s1, mixing the second-phase polymer with the two-dimensional heat conducting filler to obtain the modified second-phase polymer. The mixing mode comprises solvent mixing and extrusion mixing. The solvent mixing comprises the following steps: dispersing the second phase polymer in an organic solvent, heating, refluxing and stirring, then adding a two-dimensional heat conducting filler, continuing heating, refluxing and stirring, finally pouring the mixture into the second solvent, filtering and drying to obtain the modified second phase polymer. The organic solvent is tetrahydrofuran, etc., and the second solvent is ethanol, water, diethyl ether, acetone, toluene, etc.
Extrusion mixing comprises the following steps: and mixing the second-phase polymer with the two-dimensional heat conducting filler, and adding the mixture into a screw extruder for melt granulation to obtain the modified second-phase polymer. The rotation speed of the screw extruder is preferably 200-500 rpm, the temperature of the screw extruder from the feed inlet is 210-230 ℃, 230-245 ℃ and the temperature of the machine head is 230-240 ℃.
S2, mixing the polyamide, the one-dimensional heat conducting filler and the modified second-phase polymer, and adding the mixture into a screw extruder for extrusion granulation to obtain the polyamide composite material with high heat conductivity coefficient. The rotation speed of the screw extruder is preferably 200-500 rpm, the temperature of the screw extruder from the feed inlet is 210-230 ℃, 230-245 ℃ and the temperature of the machine head is 230-240 ℃.
The technical solution of the present invention will be further described by means of specific embodiments and drawings, it should be understood that the specific embodiments and drawings described herein are only for better illustrating the present disclosure, and are not limiting to the scope of protection. Unless otherwise indicated, all materials used in the examples of the present invention are those commonly used in the art, and all methods used in the examples are those commonly used in the art.
Example 1
The polyamide composite material with high heat conductivity coefficient of the embodiment comprises the following components in percentage by mass: PA6:40wt% of magnesium oxide whisker: 45wt%; modified POE-g-MAH:15wt% of modified POE-g-MAH is a mixture of POE-g-MAH and two-dimensional flaky boron nitride, and the mass ratio of the POE-g-MAH to the two-dimensional flaky boron nitride is 2:3.
The modified POE-g-MAH is obtained by the following preparation method:
dispersing POE-g-MAH in tetrahydrofuran, heating and refluxing for stirring at 50 ℃, then adding two-dimensional flaky boron nitride, continuously heating and refluxing for stirring, finally pouring the mixture into ethanol, filtering and drying to obtain the modified POE-g-MAH.
The polyamide composite material with high heat conductivity is prepared by the following preparation method:
mixing PA6, magnesia whisker and modified POE-g-MAH, adding into a double screw extruder, extruding and granulating to obtain the polyamide composite material with high heat conductivity coefficient. The rotation speed of the double-screw extruder is 300r/min, and the temperature of the double-screw extruder is 225 ℃, 240 ℃ and the temperature of the machine head is 240 ℃ from the feed inlet.
Example 2
The polyamide composite material with high heat conductivity coefficient of the embodiment comprises the following components in percentage by mass: PA6:40wt% of magnesium oxide whisker: 50wt%; modified POE-g-MAH:10wt% of modified POE-g-MAH is a mixture of POE-g-MAH and two-dimensional flaky boron nitride, and the mass ratio of the POE-g-MAH to the two-dimensional flaky boron nitride is 2:3.
The preparation method of the modified POE-g-MAH and the preparation method of the polyamide composite material with high heat conductivity coefficient are the same as those of the example 1.
Example 3
The polyamide composite material with high heat conductivity coefficient of the embodiment comprises the following components in percentage by mass: PA6:40wt% of magnesium oxide whisker: 40wt%; modified POE-g-MAH:20wt% of modified POE-g-MAH is a mixture of POE-g-MAH and two-dimensional flaky boron nitride, and the mass ratio of the POE-g-MAH to the two-dimensional flaky boron nitride is 3:2.
The preparation method of the modified POE-g-MAH and the preparation method of the polyamide composite material with high heat conductivity coefficient are the same as those of the example 1.
Example 4
The polyamide composite material with high heat conductivity coefficient of the embodiment comprises the following components in percentage by mass: PA6:80wt% of glass fiber: 10wt%; modified PE-g-MAH:10wt% of modified PE-g-MAH is a mixture of PE-g-MAH and two-dimensional flaky alumina, and the mass ratio of PE-g-MAH to two-dimensional flaky alumina is 4:1.
The modified PE-g-MAH is obtained by the following preparation method:
mixing PE-g-MAH and two-dimensional flaky alumina, and adding the mixture into a screw extruder for melt granulation to obtain the modified PE-g-MAH. The rotation speed of the double-screw extruder is 300r/min, and the temperature of the double-screw extruder is 225 ℃, 240 ℃ and the temperature of the machine head is 240 ℃ from the feed inlet.
The preparation method of the polyamide composite material with high heat conductivity coefficient is the same as that of the example 1.
Example 5
The polyamide composite material with high heat conductivity coefficient of the embodiment comprises the following components in percentage by mass: PA6:50wt% of magnesium oxide whisker: 20wt%; glass fiber: 10wt%; modified POE-g-MAH:20wt% of modified POE-g-MAH is a mixture of POE-g-MAH and two-dimensional flaky boron nitride, and the mass ratio of the POE-g-MAH to the two-dimensional flaky boron nitride is 7:3.
The preparation method of the modified POE-g-MAH and the preparation method of the polyamide composite material with high heat conductivity coefficient are the same as those of the example 1.
Comparative example 1
The polyamide composite material of the comparative example 1 comprises the following components in percentage by mass: PA6:50wt% of magnesium oxide whisker: 20wt%; glass fiber: 10wt%; POE-g-MAH:20wt%. Mixing PA6, magnesia whisker, glass fiber and POE-g-MAH, and extruding and granulating in a double screw extruder to obtain the polyamide composite material. The rotational speed and the temperature of each zone of the twin-screw extruder were the same as in example 1.
Comparative example 2
The polyamide composite material of comparative example 2 comprises the following components in percentage by mass: PA6:50wt% of magnesium oxide whisker: 20wt%; glass fiber: 10wt%; POE-g-MAH:14wt%; two-dimensional flake boron nitride: 6wt%.
Mixing PA6, magnesia whisker, glass fiber, POE-g-MAH and two-dimensional flaky boron nitride, and adding the mixture into a double-screw extruder for extrusion granulation to obtain the polyamide composite material. The rotational speed and the temperature of each zone of the twin-screw extruder were the same as in example 1.
Comparative example 3
The polyamide composite material of comparative example 3 comprises the following components in percentage by mass: PA6:50wt% of magnesium oxide whisker: 20wt%; glass fiber: 10wt%; POE-g-MAH:14wt%; two-dimensional flake boron nitride: 6wt%.
Dispersing POE-g-MAH in tetrahydrofuran, heating, refluxing and stirring at 50 ℃, then adding two-dimensional flaky boron nitride, magnesium oxide whisker and glass fiber, continuing heating, refluxing and stirring, finally pouring the mixture into ethanol, filtering and drying to obtain a mixture;
and mixing the PA6 and the prepared mixture, and adding the mixture into a double-screw extruder for extrusion granulation to obtain the polyamide composite material. The rotational speed and the temperature of each zone of the twin-screw extruder were the same as in example 1.
The polyamide composites of examples 1-5 and comparative examples 1-3 were subjected to thermal conductivity testing, and the experimental results are shown in Table 1. Referring to GB/T32064-2015 transient planar thermal method, thermal conductivity was tested using the hotdsk TPS 2500S.
TABLE 1 thermal conductivity and mechanical data for Polyamide composites of examples 1-5 and comparative examples 1-3
FIG. 3 is a schematic diagram of the preparation of the polyamide composite material of comparative example 1, and it can be seen that the thermal conductivity of comparative example 1 is only 0.671W/(mK) due to the fact that the unmodified POE-g-MAH is adopted and the heat conduction enrichment phase is not formed. Comparative example 2 all the raw materials were mixed together and extruded to pellet, and the heat conductive rich phase was not effectively formed in the polyamide composite material, which was shown to have a lower heat conductivity than that of example 5 in comparative example 2. All the heat conducting fillers in the comparative example 3 are mixed with POE-g-MAH first to form modified POE-g-MAH which is mixed and extruded in PA6, the modified POE-g-MAH can form a heat conducting enrichment phase in PA6, but the heat conducting enrichment phase cannot be connected due to the fact that the one-dimensional heat conducting filler is lack of a connecting bridge function, and the heat conducting coefficient of the comparative example 3 is low.
Finally, it should be noted that the specific embodiments described herein are merely illustrative of the spirit of the invention and are not limiting of the invention's embodiments. Those skilled in the art to which the invention pertains may make various modifications or additions to the described embodiments or may be substituted in a similar manner, without and without all of the embodiments herein being fully understood. While these obvious variations and modifications, which come within the spirit of the invention, are within the scope of the invention, they are to be construed as being without departing from the spirit of the invention.
Claims (7)
1. The polyamide composite material with high heat conductivity is characterized by comprising the following components in percentage by mass:
polyamide: 40-80 wt%;
one-dimensional heat conducting filler: 10-50wt%;
modified second phase polymer: 10-20wt%;
wherein the modified second phase polymer is a mixture of the second phase polymer and a two-dimensional heat conducting filler;
the second phase polymer is one or more of POE-g-MAH, PE-g-MAH, EPDM-g-MAH, PP-g-MAH and PPO-g-MAH;
the mass ratio of the second-phase polymer to the two-dimensional heat conduction filler is (2-4): (1-3).
2. The high thermal conductivity polyamide composite material according to claim 1, wherein the two-dimensional thermally conductive filler is one or more of two-dimensional platy boron nitride, two-dimensional platy aluminum oxide, two-dimensional platy aluminum nitride, two-dimensional platy silicon nitride, and two-dimensional MXene.
3. The high thermal conductivity polyamide composite material of claim 1, wherein the modified second phase polymer is obtained from a preparation process comprising the steps of: dispersing the second phase polymer in an organic solvent, heating, refluxing and stirring, then adding a two-dimensional heat conducting filler, continuing heating, refluxing and stirring, finally pouring the mixture into the second solvent, filtering and drying to obtain the modified second phase polymer.
4. The high thermal conductivity polyamide composite material of claim 1, wherein the modified second phase polymer is obtained from a preparation process comprising the steps of: and mixing the second-phase polymer with the two-dimensional heat conducting filler, and adding the mixture into a screw extruder for melt granulation to obtain the modified second-phase polymer.
5. The high thermal conductivity polyamide composite material according to claim 1, wherein the one-dimensional thermal conductive filler is one or both of glass fiber and whisker.
6. The high thermal conductivity polyamide composite material according to claim 5, wherein the whisker is one or more of magnesium oxide whisker, zinc oxide whisker, aluminum nitride whisker, aluminum oxide whisker, boron nitride whisker, silicon carbide whisker.
7. A method of preparing a high thermal conductivity polyamide composite material according to claim 1, comprising the steps of: and mixing the polyamide, the one-dimensional heat conducting filler and the modified second-phase polymer, and adding the mixture into a screw extruder for extrusion granulation to obtain the polyamide composite material with high heat conductivity coefficient.
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102070899A (en) * | 2010-12-30 | 2011-05-25 | 广东银禧科技股份有限公司 | Insulating and heat-conducting polyamide composite material and preparation method thereof |
| CN102174254A (en) * | 2010-12-27 | 2011-09-07 | 东莞劲胜精密组件股份有限公司 | Highly heat-conducting insulation engineering plastic and preparation method thereof |
| CN102477182A (en) * | 2010-11-25 | 2012-05-30 | 合肥杰事杰新材料股份有限公司 | Long carbon fiber enhanced high-heat-conductivity polymer composite and preparation method thereof |
| CN102604371A (en) * | 2012-02-17 | 2012-07-25 | 南京聚隆科技股份有限公司 | Insulating and heat conducting polyamide composite material with high cost performance and preparation method thereof |
| CN102757640A (en) * | 2012-07-25 | 2012-10-31 | 东莞市意普万尼龙科技股份有限公司 | Heat conduction nylon composite material and preparation method thereof |
| CN103862589A (en) * | 2012-12-18 | 2014-06-18 | 杭州千石科技有限公司 | Method for preparing polyamide-based heat conduction composite material through melt blending |
| CN104387761A (en) * | 2014-11-11 | 2015-03-04 | 惠州市沃特新材料有限公司 | High-thermal conductivity polyamide composite material and preparation method thereof |
| CN105038209A (en) * | 2015-06-23 | 2015-11-11 | 阜阳市光普照明科技有限公司 | PA10T (polyamide10T) boron nitride composite heat dispersing material for LED light and preparation method thereof |
| CN106280414A (en) * | 2016-08-04 | 2017-01-04 | 北京工商大学 | A kind of nylon base heat-conductive composite material and preparation method thereof |
| CN107118442A (en) * | 2017-06-21 | 2017-09-01 | 安徽江淮汽车集团股份有限公司 | A kind of heat conduction antibacterial PP PS composites and preparation method thereof |
| JP2017190407A (en) * | 2016-04-14 | 2017-10-19 | ユニチカ株式会社 | Polyamide resin composition and molded article comprising the same |
| CN108587155A (en) * | 2018-05-25 | 2018-09-28 | 郑州智锦电子科技有限公司 | A kind of heat conduction polyamide compoiste material and preparation method thereof |
| WO2019242126A1 (en) * | 2018-06-20 | 2019-12-26 | 上海锦湖日丽塑料有限公司 | Polyamide resin composition having high metal texture and preparation method of polyamide resin composition |
| CN111303511A (en) * | 2018-12-12 | 2020-06-19 | 新奥石墨烯技术有限公司 | Polymer composite material containing micro-nano hybrid structure filler and preparation method thereof |
| CN111978615A (en) * | 2020-08-17 | 2020-11-24 | 新奥石墨烯技术有限公司 | Polymer heat-conducting master batch and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3323795A4 (en) * | 2015-09-16 | 2019-03-13 | Dainichiseika Color & Chemicals Mfg. Co., Ltd. | Alumina-based heat conductive oxide and method for producing same |
-
2021
- 2021-12-15 CN CN202111533040.9A patent/CN114031934B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102477182A (en) * | 2010-11-25 | 2012-05-30 | 合肥杰事杰新材料股份有限公司 | Long carbon fiber enhanced high-heat-conductivity polymer composite and preparation method thereof |
| CN102174254A (en) * | 2010-12-27 | 2011-09-07 | 东莞劲胜精密组件股份有限公司 | Highly heat-conducting insulation engineering plastic and preparation method thereof |
| CN102070899A (en) * | 2010-12-30 | 2011-05-25 | 广东银禧科技股份有限公司 | Insulating and heat-conducting polyamide composite material and preparation method thereof |
| CN102604371A (en) * | 2012-02-17 | 2012-07-25 | 南京聚隆科技股份有限公司 | Insulating and heat conducting polyamide composite material with high cost performance and preparation method thereof |
| CN102757640A (en) * | 2012-07-25 | 2012-10-31 | 东莞市意普万尼龙科技股份有限公司 | Heat conduction nylon composite material and preparation method thereof |
| CN103862589A (en) * | 2012-12-18 | 2014-06-18 | 杭州千石科技有限公司 | Method for preparing polyamide-based heat conduction composite material through melt blending |
| CN104387761A (en) * | 2014-11-11 | 2015-03-04 | 惠州市沃特新材料有限公司 | High-thermal conductivity polyamide composite material and preparation method thereof |
| CN105038209A (en) * | 2015-06-23 | 2015-11-11 | 阜阳市光普照明科技有限公司 | PA10T (polyamide10T) boron nitride composite heat dispersing material for LED light and preparation method thereof |
| JP2017190407A (en) * | 2016-04-14 | 2017-10-19 | ユニチカ株式会社 | Polyamide resin composition and molded article comprising the same |
| CN106280414A (en) * | 2016-08-04 | 2017-01-04 | 北京工商大学 | A kind of nylon base heat-conductive composite material and preparation method thereof |
| CN107118442A (en) * | 2017-06-21 | 2017-09-01 | 安徽江淮汽车集团股份有限公司 | A kind of heat conduction antibacterial PP PS composites and preparation method thereof |
| CN108587155A (en) * | 2018-05-25 | 2018-09-28 | 郑州智锦电子科技有限公司 | A kind of heat conduction polyamide compoiste material and preparation method thereof |
| WO2019242126A1 (en) * | 2018-06-20 | 2019-12-26 | 上海锦湖日丽塑料有限公司 | Polyamide resin composition having high metal texture and preparation method of polyamide resin composition |
| CN111303511A (en) * | 2018-12-12 | 2020-06-19 | 新奥石墨烯技术有限公司 | Polymer composite material containing micro-nano hybrid structure filler and preparation method thereof |
| CN111978615A (en) * | 2020-08-17 | 2020-11-24 | 新奥石墨烯技术有限公司 | Polymer heat-conducting master batch and preparation method and application thereof |
Non-Patent Citations (3)
| Title |
|---|
| Enhanced Comprehensive Properties of Nylon-6 Nanocomposites by Aniline-Modified Boron Nitride Nanosheets;Wang, ZJ 等;INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH;第57卷(第32期);第11005-11013页 * |
| Thermal conductive nylon 6 composites with hybrid fillers prepared through reaction during extrusion;Meng, XG;COMPOSITES SCIENCE AND TECHNOLOGY 234(第234期);第1-10页 * |
| 功能尼龙6复合材料的制备及性能表征;史青;中国优秀硕士学位论文全文数据库 工程科技I辑(02);第B020-138页 * |
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