CN109181134A - Polymer-based heat-conducting composite material and preparation method thereof - Google Patents
Polymer-based heat-conducting composite material and preparation method thereof Download PDFInfo
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- CN109181134A CN109181134A CN201811029659.4A CN201811029659A CN109181134A CN 109181134 A CN109181134 A CN 109181134A CN 201811029659 A CN201811029659 A CN 201811029659A CN 109181134 A CN109181134 A CN 109181134A
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- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 229920000642 polymer Polymers 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 19
- 239000004005 microsphere Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000011160 polymer matrix composite Substances 0.000 claims description 37
- 229920001940 conductive polymer Polymers 0.000 claims description 35
- 239000011230 binding agent Substances 0.000 claims description 20
- 239000004793 Polystyrene Substances 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 12
- 229920002223 polystyrene Polymers 0.000 claims description 12
- -1 polyethylene Polymers 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000004816 latex Substances 0.000 claims description 3
- 229920000126 latex Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 238000001556 precipitation Methods 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000011325 microbead Substances 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 6
- 239000000945 filler Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 239000008367 deionised water Substances 0.000 description 15
- 229910021641 deionized water Inorganic materials 0.000 description 15
- 239000000243 solution Substances 0.000 description 10
- 238000001035 drying Methods 0.000 description 8
- 239000011259 mixed solution Substances 0.000 description 8
- 239000013049 sediment Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000011068 loading method Methods 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920013657 polymer matrix composite Polymers 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011806 microball Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011805 ball Substances 0.000 description 1
- 239000011218 binary composite Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011206 ternary composite Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
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Abstract
The invention relates to a polymer-based heat-conducting composite material and a preparation method thereof. The thermoplastic polymer is used as a matrix, the heat conducting particles and the microspheres are used as fillers, the thermoplastic polymer and the fillers are uniformly mixed by a solution mixing method, and the polymer-heat conducting particle-microsphere ternary heat conducting insulating composite material is obtained by hot press molding. The composite material has the advantages that the microspheres are closely packed in the thermoplastic polymer matrix, so that the heat conducting particles in the polymer matrix form a three-dimensional ordered heat conducting network, the filling amount of the heat conducting particles can be reduced, and the heat conductivity of the composite material can be effectively increased. The thermal conductivity of the polymer-based heat-conducting composite material obtained by the invention can reach 2.46W/(m.K). The composite material has the advantages of high thermal conductivity, electric insulation, low density, convenient molding and the like.
Description
Technical field
The invention belongs to functional composite material technical fields, and in particular to a kind of polymer matrix insulating heat-conductive composite material and
Preparation method.
Background technique
Electronic device, opto-electronic device and medical device etc. can generate a large amount of heat (> 5W/cm at runtime2).It cannot
Timely dispersed heat can be accumulated, can seriously affect the speed of service of device, efficiency and reliability, even can generating device
The case where burning out.Currently, solving above-mentioned heat dissipation problem using the means such as fan or heat sink (heat sink).But with device
Miniaturise, be highly integrated, the technology development of high performance and integrated circuit 3 D assembling etc., conventional method can not
Effectively solve heat dissipation problem.Device must be encapsulated in in thermal conductive polymer sill or be used the heat management material of insulation high thermal conductivity
Material.This kind of material not only requires high thermal conductivity, guarantees the heat dissipation for effectively completing device, it is maintained to stablize, efficiently transport
Row；And be electrically insulated, electric leakage, even short circuit otherwise can occur.
In general, the thermal conductivity of insulative polymer material used for electronic packaging is not high [< 0.5W/ (mK)].It improves exhausted
The approach of the heating conduction of edge polymer material has: 1) improving the intrinsic thermal conductivity performance of resin matrix；2) leading for high-content is added
Hot filler；3) reduce interface resistance and 4) building connection heat conduction network.Pass through super drawing or the microcosmic orderly knot of reinforced resin
Heating conduction can be improved in approach such as structure (crystallization and grain size) etc., but preparation method is harsher, can not be in actual production
Middle large-scale use.Usually require a large amount of heat fillings (loading 50vol%-80vol%) of addition obtain thermal conductivity compared with
High polymer matrix composites.Add a large amount of heat fillings can seriously affect the density of composite material, mobile performance, molding plus
Work, mechanical property and stability etc., or even can not processing and forming.From the point of view of practical application, heat conduction network can be connected to by building
Etc. approach further increase thermal conductivity.
Wu Hong et al. (a kind of polymer-based insulating heat-conductive composite material, Wu Hong, Zhang Xiaomeng, Guo Shaoyun, Zhang Jiajia, Xu's Fang
Deng, CN107573564 and a kind of polymer-based insulating heat-conductive composite material for having both efficient heat-conductive characteristic and excellent mechanical performance, Wu
Macro, Zhang Xiaomeng, Guo Shaoyun, CN105175842) to prepare conductive particle using special biaxial tension orientation technology in succession orderly
The thermal-conductive polymer matrix composites of arrangement.Therefore, the highly thermally conductive polymeric with special construction is prepared using simple process
Based composites are still field major issue urgently to be solved.
Summary of the invention
Present invention seek to address that the above problem, a kind of thermal-conductive polymer matrix composites, another mesh of the invention are provided
The preparation method for being to provide above-mentioned material.
The technical solution of the present invention is as follows: being filler by matrix, conductive particle and microballoon of thermoplastic polymer, using solution
Thermoplastic polymer and filler are uniformly mixed by mixing method, are led using the hot-forming polymer-conductive particle-microballoon ternary that obtains
Thermal insulation composite material.It is advantageous that microballoon it is tightly packed in polymer thermoplastic matrix, make in polymeric matrix
Conductive particle forms the heat conduction network structure of three-dimensional order, which can reduce the loading of conductive particle and can effectively increase multiple
The thermal conductivity of condensation material.The thermal conductivity of thermal-conductive polymer matrix composites disclosed in the invention patent is up to 2.46W/ (mK).
The composite material has many advantages, such as that thermal conductivity is high, be electrically insulated, density is low, convenient formation.
The specific technical proposal of the invention is: a kind of thermal-conductive polymer matrix composites, it is characterised in that the polymerization
Object base heat-conductive composite material is made of three kinds of conductive particle, microballoon and thermoplastic polymer constituent elements, and conductive particle orderly divides
It dissipating in polymer thermoplastic matrix, conductive particle/thermoplastic polymer mixtures are distributed in closelypacked microballoon gap location,
Construct three-dimensional order heat conduction network.
It is preferred that the mass content of microballoon is 40%-60%, the matter of conductive particle in the thermal-conductive polymer matrix composites
Amount content is 20%-40wt%, and the mass content of polymer thermoplastic matrix is 10%-40%.
It is preferred that the thermoplastic polymer is one of polyethylene, polystyrene, polyvinyl chloride or polyurethane or two
Kind.
It is preferred that the conductive particle is graphite, carbon dust, graphene, carbon nanotube, boron nitride, silicon carbide, titanium oxide, oxygen
Change one of aluminium, zinc oxide or aluminium nitride or a variety of, wherein at least containing a kind of linear or platy particle.
It is preferred that the microballoon is one or both of polymer microballoon, unorganic glass microballoon or ceramic microsphere；Wherein
Microballoon is hollow structure or solid construction, and partial size is 1 μm -300 μm.Polymer microballoon cannot melt in hot pressing or big amplitude variation
Shape.
It is preferred that the polymer microballoon is polypropylene microballoon, polystyrene microsphere or latex microspheres；The ceramics are micro-
Ball is silica, aluminium oxide or titania microsphere.
The present invention also provides the methods of above-mentioned thermal-conductive polymer matrix composites, the specific steps of which are as follows:
(1) conductive particle and thermoplastic polymer are uniformly mixed in proportion using solwution method, add microballoon and is formed
Even system prepares the pre- binder of composite material using the precipitation method；
(2) the pre- binder of composite material will be prepared using pressure sintering prepare the polymer matrix with three-dimensional order heat conduction network
Heat-conductive composite material.
Hot pressing parameters in above-mentioned steps (2) according to different thermoplastic polymers appropriate adjustment, generally 150 DEG C-
200℃；General pressure is 5~10MPa.In whole preparation process, the structural form of microballoon cannot be destroyed.
The utility model has the advantages that
(1) good heat conductivity of polymer matrix composite disclosed in the invention patent.The present invention piles up microballoon in poly-
It closes in object matrix, conductive particle is orderly distributed in polymeric matrix, forms conductive particle orientation in a polymer matrix in this way
Three dimentional heat conduction network (see Fig. 1), select the form (linear or sheet) of conductive particle increase the interfacial contact between conductive particle,
Interface resistance is reduced to improve the thermal conductivity of composite material.Simultaneously as largely filled using microballoon, it is thermally conductive in composite material
The additive amount of particle is lower, within the scope of 10wt%-50wt%.When conductive particle loading is 40wt%, polymer matrix is led
The thermal conductivity of hot composite material is up to 2.46W/ (mK), and according to different technical parameters and compositing formula in 0.50W/ (m
K it) is adjusted in -2.46W/ (mK) range.
(2) density of polymer matrix composite disclosed in the invention patent is adjustable.Microballoon in the composite material is micro-
Solid microsphere or hollow microsphere can be used in ball, and density can change between 0.1g/mL and 3.0g/mL.Obtained polymerization
The density of object based composites can be adjusted between 0.5g/mL and 2.5g/mL.Meet the needs in different application field.
(3) preparation method is simple for thermal-conductive polymer matrix composites disclosed in the invention patent, without large-scale instrument
Device is produced on a large scale, and has universality.
Detailed description of the invention
The photo of Fig. 1 thermal-conductive polymer matrix composites；Wherein (A) conductive particle/polymer binary composite is (without micro-
Ball) transmitted light photograph, the transmitted light photograph of (B) conductive particle/microballoon/polymer ternary composite material, (C) material object photo；
The hot-forming thermal conductivity for preparing thermal-conductive polymer matrix composites under Fig. 2 different temperatures；
The identical conductive particle loading of Fig. 3, different polymer/microballoon ratio prepare thermal-conductive polymer matrix composites
Thermal conductivity；
Fig. 4 difference conductive particle additive amount prepares the thermal conductivity of thermal-conductive polymer matrix composites.
Specific embodiment
Following with embodiment, present invention be described in more detail.It should be pointed out that following embodiment is used only as illustrating
Technical solution of the present invention rather than limit.Those skilled in the art are in the objective for not departing from technical solution of the present invention and the feelings of range
Under condition, to modification or equivalent replacement that technical solution of the present invention carries out, it should all cover in scope of the presently claimed invention
In the middle.
Embodiment 1
8g platelet boron nitride and 16g polystyrene are separately added into the n,N dimethylformamide of 80mL, gathered at 80 DEG C
After styrene is completely dissolved, then by 16g polypropylene microballoon (partial size is 200 μm -250 μm) above-mentioned mixed liquor of addition, stir strongly
It mixes mixing and obtains ternary mixed solution system.Ternary mixed solution is poured into 800mL deionized water rapidly and is precipitated.Sediment warp
For 24 hours, the pre- binder of composite material is made in drying at 80 DEG C after deionized water washing three times.
The pre- binder of 6.31g composite material is weighed according to mold size (sample size 30mm × 8mm) to adopt at 170 DEG C respectively
It is formed with the pressure hot pressing 15min of 10MPa and thermal-conductive polymer matrix composites sample is made.
Embodiment 2
12g platelet boron nitride and 8g polystyrene are separately added into the n,N dimethylformamide of 80mL, gathered at 80 DEG C
After styrene is completely dissolved, then by 20g polypropylene microballoon (partial size is 200 μm -250 μm) above-mentioned mixed liquor of addition, stir strongly
It mixes mixing and obtains ternary mixed solution system.Ternary mixed solution is poured into 800mL deionized water rapidly and is precipitated.Sediment warp
For 24 hours, the pre- binder of composite material is made in drying at 80 DEG C after deionized water washing three times.
The pre- binder of 6.41g composite material is weighed according to mold size (sample size 30mm × 8mm) to adopt at 170 DEG C respectively
It is formed with the pressure hot pressing 15min of 10MPa and thermal-conductive polymer matrix composites sample is made.
Embodiment 3
15.42g platelet boron nitride and 6g polystyrene are separately added into the n,N dimethylformamide of 80mL, at 80 DEG C
After lower polystyrene is completely dissolved, then 30g polypropylene microballoon (partial size be 200 μm -250 μm) is added in above-mentioned mixed liquor, by force
Strong be stirred obtains ternary mixed solution system.Ternary mixed solution is poured into 800mL deionized water rapidly and is precipitated.Precipitating
For 24 hours, the pre- binder of composite material is made in drying to object at 80 DEG C after deionized water is washed three times.
The pre- binder of 6.32g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 170 DEG C
The pressure hot pressing 15min of 10MPa, which is formed, is made thermal-conductive polymer matrix composites sample.
Embodiment 4
20g platelet boron nitride and 5g polystyrene are separately added into the n,N dimethylformamide of 80mL, gathered at 80 DEG C
After styrene is completely dissolved, then by 25g polypropylene microballoon (partial size is 200 μm -250 μm) above-mentioned mixed liquor of addition, stir strongly
It mixes mixing and obtains ternary mixed solution system.Ternary mixed solution is poured into 800mL deionized water rapidly and is precipitated.Sediment warp
For 24 hours, the pre- binder of composite material is made in drying at 80 DEG C after deionized water washing three times.
The pre- binder of 6.80g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 170 DEG C
The pressure hot pressing 15min of 10MPa, which is formed, is made thermal-conductive polymer matrix composites sample.
Embodiment 5
14g platelet boron nitride, 1.42g line are strengthened carbon nanotube to be scattered in respectively in the n,N dimethylformamide of 80mL,
7g thermoplastic polyurethane elastomer is added at 80 DEG C, (partial size is 100 μm of -150 μ by 20g latex microspheres again after it is completely dissolved
M) it is added in above-mentioned mixed liquor with 8g hollow glass microballoon (partial size is 1 μm -3 μm), it is molten to be stirred acquisition Diversity strongly
Liquid system.Diversity solution is poured into 800mL deionized water rapidly and is precipitated.Sediment through deionized water wash three times after in
For 24 hours, the pre- binder of composite material is made in drying at 80 DEG C.
The pre- binder of 6.10g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 150 DEG C
The pressure hot pressing 15min of 5MPa forms thermal-conductive polymer matrix composites sample obtained.
Embodiment 6
It disperses 10g silicon nitride, 5g platelet boron nitride in the n,N dimethylformamide of 80mL respectively, adds at 80 DEG C
Enter 7g polyethylene, again by 24g aluminum oxide micro-sphere (partial size is 100 μm or so) and 4g hollow glass microballoon after it is completely dissolved
(partial size is 1 μm -5 μm) is added in above-mentioned mixed liquor, is stirred strongly and obtains Diversity solution system.It rapidly will be polynary mixed
Conjunction solution, which pours into 800mL deionized water, to be precipitated.Drying for 24 hours, is made sediment at 80 DEG C after deionized water is washed three times
The pre- binder of composite material.
The pre- binder of 6.62g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 150 DEG C
The pressure hot pressing 15min of 10MPa, which is formed, is made thermal-conductive polymer matrix composites sample.
Embodiment 7
It disperses 13g silicon nitride, 2g flake graphite alkene in the n,N dimethylformamide of 80mL respectively, adds at 80 DEG C
Enter 5g polyvinyl chloride and 2g polystyrene, again by 23g aluminum oxide micro-sphere (partial size is 100 μm or so) and 5g after it is completely dissolved
Hollow glass microballoon (partial size is 1 μm -5 μm) is added in above-mentioned mixed liquor, is stirred strongly and obtains Diversity solution system.
Diversity solution is poured into 800mL deionized water rapidly and is precipitated.Sediment is after deionized water is washed three times at 80 DEG C
For 24 hours, the pre- binder of composite material is made in drying.
The pre- binder of 6.03g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 170 DEG C
The pressure hot pressing 15min of 10MPa, which is formed, is made thermal-conductive polymer matrix composites sample.
Comparative example 1
15g boron nitride and 35g polystyrene are separately added into the n,N dimethylformamide of 80mL, stirred at 80 DEG C
Mixing obtains Binary Mixtures system after polystyrene is completely dissolved.Rapidly by Binary Mixtures pour into 800mL go from
It is precipitated in sub- water.For 24 hours, the pre- binder of composite material is made in drying to sediment at 80 DEG C after deionized water is washed three times.
The pre- binder of 7.05g composite material is weighed according to mold size (sample size 30mm × 8mm), is used at 170 DEG C
The pressure hot pressing 15min of 10MPa, which is formed, is made thermal-conductive polymer matrix composites sample.
Above-mentioned acquisition thermal-conductive polymer matrix composites sample is tested using 2500 heat conduction coefficient tester of Hot Disk TPS
The performance of product is listed in table 1.
The composition and thermal conductivity of 1 thermal-conductive polymer matrix composites sample of table
Hot pressing parameters are huge on the influence of the thermal conductivity of thermal-conductive polymer matrix composites, are primarily due to temperature Gao Shike
The stabilization and form of polymer microballoon can be will affect.Guarantee the form of microballoon and stabilization pair in polymeric matrix during the preparation process
It is most important (see Fig. 2) to improve thermal conductivity.The ratio of polymer and microballoon is also regulation heat in thermal-conductive polymer matrix composites
An important factor for conductance (see Fig. 3).The loading of conductive particle influences the formation and stabilization of passage of heat in polymeric matrix, mentions
The loading of high thermal conductivity particle can significantly improve the thermal conductivity of thermal-conductive polymer matrix composites (see Fig. 4).By Fig. 2-Fig. 4 and
Table 1 as it can be seen that the thermal conductivity of thermal-conductive polymer matrix composites disclosed in the invention patent up to 2.46W/ (mK), and according to
Different technical parameters and compositing formula are adjusted in 0.50W/ (mK) -2.46W/ (mK) range.
Claims (8)
1. a kind of thermal-conductive polymer matrix composites, it is characterised in that the thermal-conductive polymer matrix composites are by thermally conductive grain
Three kinds of son, microballoon and thermoplastic polymer constituent elements are constituted, and conductive particle is orderly scattered in polymer thermoplastic matrix, is led
Hot particle/thermoplastic polymer mixtures are distributed in closelypacked microballoon gap location, construct three-dimensional order heat conduction network.
2. thermal-conductive polymer matrix composites according to claim 1, it is characterised in that the polymer matrix is thermally conductive compound
The mass content of microballoon is 40%-60% in material, and the mass content of conductive particle is 20%-40wt%, thermoplastic polymer
The mass content of matrix is 10%-40%.
3. thermal-conductive polymer matrix composites according to claim 1, it is characterised in that the thermoplastic polymer is
One or both of polyethylene, polystyrene, polyvinyl chloride or polyurethane.
4. thermal-conductive polymer matrix composites according to claim 1, it is characterised in that the conductive particle be graphite,
One of carbon dust, graphene, carbon nanotube, boron nitride, silicon carbide, titanium oxide, aluminium oxide, zinc oxide or aluminium nitride are more
Kind, wherein at least containing a kind of linear or platy particle.
5. thermal-conductive polymer matrix composites according to claim 1, it is characterised in that the microballoon is that polymer is micro-
One or both of ball, unorganic glass microballoon or ceramic microsphere；Wherein microballoon is hollow structure or solid construction, and partial size is
1μm-300μm。
6. thermal-conductive polymer matrix composites according to claim 5, it is characterised in that the polymer microballoon is poly-
Acryl microbeads, polystyrene microsphere or latex microspheres；The ceramic microsphere is silica, aluminium oxide or titania microsphere.
7. a kind of method for preparing thermal-conductive polymer matrix composites as described in claim 1, the specific steps of which are as follows:
(1) conductive particle and thermoplastic polymer are uniformly mixed in proportion using solwution method, add microballoon and forms homogeneous body
System, prepares the pre- binder of composite material using the precipitation method；
(2) the pre- binder of composite material will be prepared using pressure sintering to prepare the polymer matrix with three-dimensional order heat conduction network thermally conductive
Composite material.
8. method according to claim 7, it is characterised in that the hot pressing temperature in step (2) is 150 DEG C -200 DEG C；Pressure is
5~10MPa.
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