CN105255154A - Method for preparing thermosetting-resin-based heat conduction composite - Google Patents
Method for preparing thermosetting-resin-based heat conduction composite Download PDFInfo
- Publication number
- CN105255154A CN105255154A CN201510664415.3A CN201510664415A CN105255154A CN 105255154 A CN105255154 A CN 105255154A CN 201510664415 A CN201510664415 A CN 201510664415A CN 105255154 A CN105255154 A CN 105255154A
- Authority
- CN
- China
- Prior art keywords
- hollow glass
- heat conduction
- micron
- powder
- glass micropearl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the technical field of heat conduction composites, and particularly relates to a method for preparing a thermosetting-resin-based heat conduction composite. The method includes the steps that micron-size aluminum nitride, micron-size silicon carbide, micron-size aluminum oxide, micron-size heat conduction carbon powder and micron-size heat conduction graphite powder are irradiated and activated to be mixed into heat conduction powder; the heat conduction powder is subjected to ultrasonic dispersing through acetone to be even, and mixed liquor is obtained; hollow glass microspheres are placed into a sodium hydroxide solution, immersed and then taken out, silane coupling agents are directly sprayed to the hollow glass microspheres with the uneven surfaces, and the hollow glass microspheres with the uneven surfaces are placed into the heat conduction powder mixed liquor; the mixture is subjected to ultrasonic dispersion to be even, modified hollow glass microspheres are obtained after solvents are volatized, the modified hollow glass microspheres, the heat conduction powder and curing agents are physically blended and cured, and the thermosetting-resin-based heat conduction composite is obtained. The quantity of use heat conduction materials is greatly reduced, and it is guaranteed that the composite has the advantages of being light, resistant to corrosion, free of pollution, low in cost, high in accuracy, long in service life and the like; heat conduction efficiency is higher.
Description
Technical field
The invention belongs to heat-conductive composite material technical field, particularly relate to a kind of preparation method of thermosetting resin thing base heat-conductive composite material.
Background technology
Traditional thermally conductive material mostly is the good metallic substance of thermal conductivity, but because the corrosion resistance of metallic substance is poor, electroconductibility is high, density is large, to manufacture energy consumption high, limits its application in the field such as chemical industry, electronics.Most polymers material has the advantages such as excellent corrosion resistance nature, quality are light, good insulating, low cost of manufacture, but they are the poor conductor of heat mostly, thermal conductivity is little, and therefore will expand its application in heat conduction and heat radiation field, it is crucial for improving heat conductivility.Metal or the Inorganic Fillers Filled polymer materials of current use high thermal conductivity are the methods relatively commonly used, and the easy machine-shaping of the thermally conductive material obtained like this can be applied to much special field through suitable art breading or formula adjustment.Thermal-conductive polymer matrix composites refers to polymer materials to be matrix, with thermal conductivity material for filler, obtains through blended dispersion compound, has the heterogeneous compound system of certain heat conduction function.Thermal-conductive polymer matrix composites had both had heat conduction function, had again many excellent specific properties of mixture polymer composites, can more in a big way in regulate the conduction of material, heat conduction and mechanical property, be thus with a wide range of applications.But the polymeric matrix major part adopted at present is thermoplastics, with the blended employing mechanical blending of inorganic functional fillers, consistency is poor, and the requirement for heat conduction network is higher, and existing production technique is produced and do not reached requirement, and material usage is large, cost is higher.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned defect, a kind of preparation method of thermosetting resin thing base heat-conductive composite material is provided, thermally conductive material consumption is greatly less, ensure that material has the advantages such as lighting, corrosion-resistant, pollution-free, cost is low, precision is high, the life-span is long, heat transfer efficiency is higher.
The technical scheme that the present invention solves the employing of its technical problem is as follows:
A preparation method for thermosetting resin thing base heat-conductive composite material, comprises the steps:
Step 1, micron-sized aluminium nitride, micron-sized silicon carbide, micron-sized aluminium sesquioxide, micron-sized heat conduction carbon dust and micron-sized conductive graphite powder are carried out more than irradiation activation 1.2h with plasma activation instrument respectively under common plasma treatment pattern, and then be mixed into conduction powder with the ratio of 8:3:5:4, again by the conduction powder that is mixed into and acetone even with mass ratio 1:1 ultrasonic disperse, obtain conduction powder mixed solution; Hollow glass micropearl being put into concentration is that the sodium hydroxide solution of 0.1mol/L floods after 1.2 hours and takes out, after normal temperature is air-dry, silane coupling agent is sprayed directly on the hollow glass micropearl surface through sodium hydroxide solution process, obtains the hollow glass micropearl of surface irregularity;
Step 2, the hollow glass micropearl of surface irregularity step 1 prepared put into conduction powder mixed solution prepared by step 1, ultrasonic disperse more than 1.2 hours is until be uniformly dispersed together, obtain modification hollow glass micropearl after allowing solvent volatilize in atmosphere, namely the hollow glass micropearl of conduction powder has been wrapped up on surface;
Conduction powder through irradiation activation prepared by step 3, modification hollow glass micropearl urethane resin, step 2 prepared, step 1 and solidifying agent are through physical blending, first solidification treatment at 85 DEG C again after solidification treatment at 20 DEG C, conduction powder, solidifying agent are filled in the gap between urethane resin, modification hollow glass micropearl, obtain thermosetting resin base heat-conductive composite material.
Beneficial effect acquired by the present invention is: adopt such scheme, the present invention adopts urethane resin to be matrix, blended synthesis is carried out with glass hollow microballoon and other functional heat conductive fillers, finally obtain polymer-based carbon heat-conducting article, ensure that Drawing abillity, hollow glass micro-ball can better by parcels such as conduction powder after surface treatment, greatly reduce the consumption of conduction powder, simultaneously due to the filling of hollow glass micro-ball, make material lighting, conduction powder is filled at tiny balloon surface and gap portion, enter in polymeric matrix and be forced to formation and be interconnected passage of heat, improve heat transfer efficiency.
Accompanying drawing explanation
By the detailed description below in conjunction with accompanying drawing, aforesaid and other object, the feature and advantage of the present invention will become apparent.
Fig. 1 is step block diagram of the present invention.
Embodiment
Below in conjunction with specific embodiment, the present invention is further described.
The preparation method of a kind of thermosetting resin thing base heat-conductive composite material as shown in Figure 1, comprises the steps:
Step 1, micron-sized aluminium nitride, micron-sized silicon carbide, micron-sized aluminium sesquioxide, micron-sized heat conduction carbon dust and micron-sized conductive graphite powder are carried out more than irradiation activation 1.2h with plasma activation instrument respectively under common plasma treatment pattern, and then be mixed into conduction powder with the ratio of 8:3:5:4, again by the conduction powder that is mixed into and acetone even with mass ratio 1:1 ultrasonic disperse, obtain conduction powder mixed solution; Hollow glass micropearl being put into concentration is that the sodium hydroxide solution of 0.1mol/L floods after 1.2 hours and takes out, after normal temperature is air-dry, Silane coupling agent KH550 is sprayed directly on the hollow glass micropearl surface through sodium hydroxide solution process, obtains the hollow glass micropearl of surface irregularity;
Step 2, the hollow glass micropearl of surface irregularity step 1 prepared put into conduction powder mixed solution prepared by step 1, ultrasonic disperse more than 1.2 hours is until be uniformly dispersed together, obtain modification hollow glass micropearl after allowing solvent volatilize in atmosphere, namely the hollow glass micropearl of conduction powder has been wrapped up on surface;
Step 3, by 80g urethane resin, the modification hollow glass micropearl that 25g step 2 prepares, the conduction powder through irradiation activation of 15g step 1 preparation and the mixing of solidifying agent cobalt naphthenate, with high speed dispersion homogenizer 5min, then ultrasonic disperse 15min, be poured in mould, first solidification treatment at 85 DEG C again after solidification treatment at 20 DEG C, conduction powder, solidifying agent cobalt naphthenate is fully filled in urethane resin, in gap between modification hollow glass micropearl, urethane resin is matrix, blended synthesis is carried out with glass hollow microballoon and other functional heat conductive fillers, ensure that Drawing abillity, hollow glass micro-ball can better by parcels such as conduction powder after surface treatment, greatly reduce the consumption of conduction powder, simultaneously due to the filling of hollow glass micro-ball, make material lighting, conduction powder is filled at tiny balloon surface and gap portion, enter in polymeric matrix and be forced to formation and be interconnected passage of heat, the thermosetting resin base heat-conductive composite material obtained is made to have higher heat transfer efficiency.
The foregoing is only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification sheets of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (1)
1. a preparation method for thermosetting resin thing base heat-conductive composite material, is characterized in that, comprise the steps:
Step 1, micron-sized aluminium nitride, micron-sized silicon carbide, micron-sized aluminium sesquioxide, micron-sized heat conduction carbon dust and micron-sized conductive graphite powder are carried out more than irradiation activation 1.2h with plasma activation instrument respectively under common plasma treatment pattern, and then be mixed into conduction powder with the ratio of 8:3:5:4, again by the conduction powder that is mixed into and acetone even with mass ratio 1:1 ultrasonic disperse, obtain conduction powder mixed solution; Hollow glass micropearl being put into concentration is that the sodium hydroxide solution of 0.1mol/L floods after 1.2 hours and takes out, after normal temperature is air-dry, silane coupling agent is sprayed directly on the hollow glass micropearl surface through sodium hydroxide solution process, obtains the hollow glass micropearl of surface irregularity;
Step 2, the hollow glass micropearl of surface irregularity step 1 prepared put into conduction powder mixed solution prepared by step 1, ultrasonic disperse more than 1.2 hours is until be uniformly dispersed together, obtain modification hollow glass micropearl after allowing solvent volatilize in atmosphere, namely the hollow glass micropearl of conduction powder has been wrapped up on surface;
Conduction powder through irradiation activation prepared by step 3, modification hollow glass micropearl urethane resin, step 2 prepared, step 1 and solidifying agent are through physical blending, first solidify at 20 DEG C after 3 hours and solidify 2 hours at 85 DEG C again, conduction powder, solidifying agent are filled in the gap between urethane resin, modification hollow glass micropearl, obtain thermosetting resin base heat-conductive composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664415.3A CN105255154A (en) | 2015-10-13 | 2015-10-13 | Method for preparing thermosetting-resin-based heat conduction composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664415.3A CN105255154A (en) | 2015-10-13 | 2015-10-13 | Method for preparing thermosetting-resin-based heat conduction composite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105255154A true CN105255154A (en) | 2016-01-20 |
Family
ID=55095108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510664415.3A Pending CN105255154A (en) | 2015-10-13 | 2015-10-13 | Method for preparing thermosetting-resin-based heat conduction composite |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105255154A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106589817A (en) * | 2016-12-07 | 2017-04-26 | 广东国利先进复合材料研发有限公司 | Heat conducting plate and preparation method thereof |
| CN107641188A (en) * | 2017-09-22 | 2018-01-30 | 厦门同欣源包装制品有限公司 | A kind of sole is made of ETPU materials and its preparation method and application |
| CN108129827A (en) * | 2017-12-04 | 2018-06-08 | 常州浩瀚万康纳米材料有限公司 | A kind of preparation method of thermosetting property heat-conductive composite material |
| CN108912689A (en) * | 2018-07-17 | 2018-11-30 | 德阳中碳新材料科技有限公司 | A kind of preparation method of heat-conducting interface material |
| CN117887316A (en) * | 2024-03-18 | 2024-04-16 | 广东邦宁新材料科技有限公司 | Antiskid pavement marking paint and preparation method thereof |
-
2015
- 2015-10-13 CN CN201510664415.3A patent/CN105255154A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106589817A (en) * | 2016-12-07 | 2017-04-26 | 广东国利先进复合材料研发有限公司 | Heat conducting plate and preparation method thereof |
| CN107641188A (en) * | 2017-09-22 | 2018-01-30 | 厦门同欣源包装制品有限公司 | A kind of sole is made of ETPU materials and its preparation method and application |
| CN108129827A (en) * | 2017-12-04 | 2018-06-08 | 常州浩瀚万康纳米材料有限公司 | A kind of preparation method of thermosetting property heat-conductive composite material |
| CN108912689A (en) * | 2018-07-17 | 2018-11-30 | 德阳中碳新材料科技有限公司 | A kind of preparation method of heat-conducting interface material |
| CN117887316A (en) * | 2024-03-18 | 2024-04-16 | 广东邦宁新材料科技有限公司 | Antiskid pavement marking paint and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105255154A (en) | Method for preparing thermosetting-resin-based heat conduction composite | |
| CN103756252B (en) | A kind of thermosetting resin base heat-conductive composite material and its preparation method and application | |
| CN103756298B (en) | A kind of thermoplastic polymer based thermal conductive composite and its preparation method and application | |
| CN110951254A (en) | Boron nitride composite high-thermal-conductivity insulating polymer composite material and preparation method thereof | |
| CN109181134A (en) | A kind of thermal-conductive polymer matrix composites and preparation method thereof | |
| CN105778510A (en) | Method for preparing thermally conductive composite material with directivity | |
| CN106987123B (en) | Graphene/boron nitride loaded nano-silver heat-conducting special high polymer material and preparation method thereof | |
| CN109206961A (en) | A kind of graphene conductive heat-conductive coating and preparation method thereof | |
| CN103073836A (en) | High thermal conductivity carbon fiber resin-based composite material and preparation method thereof | |
| CN102876044A (en) | Magnetic metal power/silicone rubber heat conduction composite material and preparation method thereof | |
| CN101717540A (en) | Method for mixing preparation of carbon nano tube/polymer composites | |
| CN104673160A (en) | Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof | |
| CN102850717A (en) | High thermal conductivity phenolic resin and preparation method | |
| CN103627101A (en) | Preparation method and applications of thermosetting phenolic resin coated hollow glass microspheres | |
| CN108929521B (en) | High-thermal-conductivity and high-electric-conductivity graphene-based composite material and preparation method thereof | |
| Zhao et al. | One-step enrichment of silica nanoparticles on milled carbon fibers and their effects on thermal, electrical, and mechanical properties of polymethyl-vinyl siloxane rubber composites | |
| CN105461963B (en) | A kind of boron nitride powder of surface organic modification and its preparation method and application | |
| CN111117155A (en) | Preparation method of graphene/epoxy resin composite material | |
| CN107459775B (en) | A kind of epoxy resins insulation heat-conductive composite material and preparation method thereof | |
| CN103602038A (en) | Preparation method of high-heat-conductivity phenol aldehyde resin-base high polymer material | |
| CN103408898A (en) | High-thermal-conductivity electrical insulating material for superconducting magnet and preparation method of high-thermal-conductivity electrical insulating material | |
| CN113416510A (en) | Epoxy resin pouring sealant and preparation method thereof | |
| CN109679280B (en) | Preparation method of high-thermal-conductivity electromagnetic shielding material | |
| CN107011631A (en) | A kind of heat filling containing crystalline flake graphite and preparation method and application | |
| CN106751770A (en) | Graphene heat conduction functional agglomerate of a kind of nylon 6 and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160120 |