CN107915973A - Thermoplasticity heat-conductive resin composition and preparation method thereof - Google Patents
Thermoplasticity heat-conductive resin composition and preparation method thereof Download PDFInfo
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C08K2201/004—Additives being defined by their length
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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Abstract
The present invention relates to thermoplasticity heat-conductive resin composition and preparation method thereof, mainly solves the problems, such as that high heat filling dosage existing in the prior art, the processing performance of material and heat resistance are poor.By using thermoplasticity heat-conductive resin composition, including following components in terms of parts by weight：(A) 40~75 parts of thermoplastic resin；(B) 10~45 parts of heat conduction filler composition；(C) 0.1~10 part other auxiliary agents；Wherein, the heat conduction filler composition includes the heat filling by modifier modification, and the mass ratio of the modifying agent and heat filling is (0.2~2):100 technical solution, preferably solves the problems, such as this, available for thermoplasticity heat-conducting resin industrialized production.
Description
Technical field
The invention belongs to polymer composite, is related to a kind of thermoplasticity heat-conductive resin composition and preparation method thereof.Institute
State thermoplasticity heat-conductive resin composition and be suitable for electric, electronics and thermal component.
Background technology
Heat Conduction Material such as is commonly applied to exchange heat, radiates, is electric the industry.In recent years, electronic and electrical equipment lightweight, small
Type and high performance trend are obvious, and the caloric value of its heat generating components also has increase tendency.Excessive heat reduces the property of product
Can, heat conduction is distributed in time most important.Improve heating device heat dissipation performance, exploitation with high thermal conductivity and with into
The Heat Conduction Material of this advantage is particularly urgent.
Compared with the materials such as traditional metal, ceramics, heat-conducting plastic has lot of advantages：Heat dissipation uniformly, low thermal resistance, it is low into
This, the selection of convenient, a variety of matrix resin of machine-shaping, design freedom is high, 3 D complex degree is high, light, thermal coefficient of expansion
It is low, molding shrinkage is low, operating temperature is low, increase convective surface, file is integrated etc., heat-conducting plastic has become domestic and international at present
The research and development focus of heat sink material.Since the heat conductivility of pure high molecular material is very poor, only about 0.2Wm-1·K-1, so people
It is proposed to prepare conductive plastic material using high molecular material as matrix.Preparing heat-conducting plastic mainly has two methods：One kind is to use
Chemical synthesis process, i.e. Intrinsical, high molecular material of the synthesis with high conjugation degree, high-crystallinity or high-orientation, such as poly- second
Alkynes, polyphenylene sulfide, polythiophene etc..But its preparation process is cumbersome, difficulty is big, of high cost, it is difficult to realizes industrialized production.
Second, the inorganic filler of Heat Conduction Material, such as metal, high heat conduction is filled in polymer (such as polyolefin, polyester, nylon).Afterwards
Person's method is simple, efficient, and the work to filling-modified research is more both at home and abroad, such as RTP, DSM, Mitsubishi, SABIC, treasured
Riamb, the auspiciousness science and technology of silver, fly the company such as illustrious and influential.
The external multinomial patented invention on heat-conducting plastic exploitation, such as US 20120217434, US 20150069290, JP
2014231538th, WO 2009043850 etc., is mainly produced, there is provided the series of excellent high thermal conductivity is led using completion method
Thermoplastic materials product, but the ratio of used heat filling and auxiliary agent is higher, causes manufacturing cost height.Sumitomo Chemical strain formula
Commercial firm patent CN 101041719A disclose by the filler such as thermoplastic resin and granulated alumina fibre be pre-mixed after, through squeeze
Go out the granulation of machine melt kneading, then product is obtained through injection moulding, the component as electronic unit, particularly requires thermal conductivity
Component.Heat-conducting plastic prepared by the patent has 2.7~5.0Wm-1·K-1Parallel thermal conductivity, 0.6~2.9Wm-1·K-1Vertical thermal conductivity.Ti Kena house journals of U.S. CN 102482449A, which are disclosed, fills out liquid crystal polymer and heat conduction
Material, glass fibre etc. mix, and 0.6~1.5Wm of thermal conductivity is obtained after Screw Extrusion-1·K-1Heat conductive resin composition,
For requiring the Electrical and Electronic shell of high heat conductor.Shanghai Jie Shijie new materials house journal CN 103965616A are reported
Heat is made by the blending of Screw Extrusion melt kneading in thermoplastic resin, heat-conducting resin masterbatch, boron carbide particle, coupling agent etc.
2.1~4.2Wm of conductance-1·K-1Heat-conducting resin.Due to it with the addition of substantial amounts of inorganic filler in resin after, its melt-flow
Performance will become very poor, and the related data report of the material performance is showed no in above-mentioned patent.In addition, reported in the patent
Heat filling ratio is higher and reduce the mechanical property of material used by the heat-conducting resin in road, causes production cost higher,
Its application is limited to a certain extent.
The content of the invention
The first technical problem to be solved by the present invention be high heat filling dosage existing in the prior art, material plus
A kind of the problem of work performance and poor heat resistance, there is provided thermoplasticity heat-conductive resin composition.The thermoplasticity heat-conductive resin composition
Comprehensive performance is significantly improved, and has preferable heat resistance, mechanics and processing performance, suitable for electric, electronics and heat dissipation
Component.
The second technical problem to be solved by the present invention is to provide the thermoplasticity adaptable with solving one of technical problem and leads
The preparation method of hot resin composition.
To solve one of above-mentioned technical problem, the technical solution adopted by the present invention is as follows：A kind of thermoplasticity heat-conducting resin group
Compound, in terms of parts by weight, including following components：
(A) 40~75 parts of thermoplastic resin；
(B) 10~45 parts of heat conduction filler composition；
(C) 0.1~10 part other auxiliary agents；
Wherein, the heat conduction filler composition includes the mass ratio of heat filling and modifying agent, modifying agent and heat filling
For (0.2~2):100.
In above-mentioned technical proposal, the heat filling is selected from spherical, fiber powdery, sheet, chopped strand shape and long fibre
At least one of shape heat filling, more preferably from spherical, fiber powdery, sheet, chopped strand shape and long fine shape heat filling
In it is two or more, there is synergistic function to the comprehensive performance of thermoplasticity heat-conductive resin composition at this time.
In above-mentioned technical proposal, the heat filling is preferably modified by modifying agent.
In above-mentioned technical proposal, to account for the total mass percentage of the thermoplasticity heat-conductive resin composition, the heat conduction
The amount of fill composition is less than 40%.
In above-mentioned technical proposal, the thermoplastic resin be selected from polypropylene, polyester, nylon, polystyrene, styrene/
Acrylonitrile copolymer, phenylethylene/maleic anhydride copolymer, ABS, makrolon, polyphenylene oxide, polyphenylene sulfide, polyether-ether-ketone, liquid crystal
At least one of polymer.
In above-mentioned technical proposal, the spherical heat filling is selected from aluminium oxide, magnesia, zinc oxide, silica, oxygen
Change at least one of nickel, aluminium nitride, silicon nitride, boron nitride, carborundum, it is more preferably two or more；The spherical heat conduction
Filler preferably 30~2000 mesh, more preferably 50~800 mesh.
In above-mentioned technical proposal, the fiber powdery heat filling be selected from glass fiber powder, graphite powder and carbon fiber powder,
At least one of carbon nanotubes, it is more preferably two or more；Fiber powdery heat filling preferably 30~800 mesh, more
It is preferred that 50~800 mesh.
In above-mentioned technical proposal, the sheet heat filling is selected from least one of graphite and graphene, more preferably
For two kinds of combinations；Preferably 0.5~500 μm, more preferably 2~300 μm of the size of the sheet heat filling；Thickness preferably 10~
200nm, more preferably 40~150nm.
In above-mentioned technical proposal, the chopped strand shape heat filling in glass fibre and carbon fiber at least one
Kind, more preferably two kinds of combinations；Length preferably 0.1~12mm of the chopped strand shape heat filling, more preferably 0.5~
8mm；Preferably 0.1~50 μm, more preferably 5~35 μm of diameter.
In above-mentioned technical proposal, the long fine shape heat filling is selected from least one of glass fibre and carbon fiber,
More preferably two kinds combinations；Preferably 0.1~50 μm, more preferably 5~35 μm of the diameter of the long fine shape heat filling.
In above-mentioned technical proposal, the modifying agent is selected from silanes modifying agent, polyesters modifying agent, titanate ester modifying agent
At least one of, more preferably from silanes modifying agent, such as aminopropyl triethoxysilane, γ-glycidyl ether oxygen propyl three
At least one of methoxy silane, γ-methacryloxypropyl trimethoxy silane；The processing aid is selected from anti-
Oxygen agent and plasticiser；The antioxidant is selected from polyphenol kind antioxidant, such as four [β-(3,5- di-tert-butyl-hydroxy phenyl) third
Acid] pentaerythritol ester, at least one of β-positive octadecanol ester of (3,5- di-tert-butyl-hydroxy phenyls) propionic acid；Described
Plasticiser is selected from least one of white oil, paraffin wax.
To solve the two of above-mentioned technical problem, the technical solution adopted by the present invention is as follows：A kind of thermoplasticity heat-conducting resin group
The preparation method of compound, comprises the following steps：
(1) the desired amount of heat filling is subjected to surface modification treatment with the desired amount of modifying agent, obtains the heat conduction
Fill composition；
(2) the desired amount of heat conduction filler composition is mixed with thermoplastic resin, the processing aid of drying process in one
Mixed in device such as high-speed mixer, import in a screw extruder and melted, mediate, extrude, being granulated, thermoplasticity is made
Heat-conductive resin composition.Preferable screw extruder is double screw extruder.
To solve the two of above-mentioned technical problem, the technical solution adopted by the present invention is as follows：A kind of thermoplasticity heat-conducting resin group
The preparation method of compound, it is further comprising the steps of：
(1) the desired amount of heat filling is subjected to surface modification treatment with the desired amount of modifying agent, obtains the heat conduction
Fill composition；
(2) it is the desired amount of heat conduction filler composition and the thermoplastic resin of drying process, processing aid is mixed without high speed
Conjunction machine mixes, and directly metering, which is imported in a screw extruder, is melted, mediates, extrude, being granulated, and thermoplasticity heat conduction tree is made
Oil/fat composition.Preferable screw extruder is double screw extruder.
Invention method is accompanied by processing modified adjuvant by selecting the heat filling of special construction (size, shape),
Entered by melt blending in base resin material, obtain the thermoplasticity heat conduction with higher thermal conductivity, mechanics and heat resistance
Resin combination, and reduce production cost, beneficial to realizing industrialized production.The key of the method for the present invention is leading for different structure
The collocation of hot filler material, ratio, feed way, the selection of thermoplastification processing conditions etc..
Using parallel 1.0~4.6Wm of thermal conductivity of the thermoplasticity heat-conductive resin composition prepared by the present invention-1·K-1、
0.3~1.0Wm of vertical thermal conductivity-1·K-1, 5.6~18.6GPa of bending modulus, 116~134 DEG C of heat distortion temperature, melt flow
3.5~18g10min of dynamic speed-1, achieve preferable technique effect.
The performance of the present invention is determined by the following procedure：
Density measurement：Sample is placed in ALFA MIRAGE SD-200L electronic densitometers, measures the density of Heat Conduction Material.
Melt index (MFR) measures：By ASTM D1238 standards, measured using LLOYD DAVENPORT fusion index instruments.
Heat resistance is tested：Dimension card is measured using Italy's CEAST companies Wei Ka thermal deformation analyzers by 306 standards of ISO
Softening point；Heat distortion temperature is measured using Italy's CEAST companies Wei Ka thermal deformation analyzers by ISO 75-2 standards.
Tensile property is tested：By 527 standards of ISO using Instron Company Materials of U.S. testing machine measure.
Bending property is tested：By 178 standards of ISO using Instron Company Materials of U.S. testing machine measure.
Notched impact properties is tested：By 179 standards of ISO using CEAST companies of Italy Apparatus for Impacting at low-temp measure.
Heat conductivility is tested：Surveyed by ASTM E1461 standards using NETZSCH companies of Germany laser thermal conductivity coefficient measurement instrument
It is fixed.
Below by specific embodiment, the present invention will be further elaborated.
Embodiment
【Embodiment 1】
Heat filling is surface-treated：Weigh the second of 30 parts of graphite powder I (2000 mesh) and 10 parts of silane coupled agent concentrations 3.0%
Alcoholic solution is thoroughly mixed in stainless steel ware, when drying 4 is small at 100 DEG C after naturally dry, obtains heat filling
Composition A1.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A1, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] seasons
1,010 0.8 parts of Doutrate, 0.8 part of white oil, are placed in homogenizer and are sufficiently mixed 2 minutes.Mixed material is imported into double spiral shells
Melting extrusion in bar extruder, granulation obtain thermoplasticity heat-conductive resin composition B1.1~9 section of double screw extruder and die orifice
Temperature is followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, and screw rod turns
150 revs/min of speed, melt temperature are 279 DEG C, and melt pressure is 22~36bar, 21~33Hz of moment of torsion.
Injection molded test：Dried B1 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B1 the results are shown in Table 1.
【Embodiment 2】
Heat filling is surface-treated：Weigh the second of 30 parts of graphite powder II (500 mesh) and 10 parts of silane coupled agent concentrations 3.0%
Alcoholic solution is thoroughly mixed in stainless steel ware, when drying 4 is small at 100 DEG C after naturally dry, obtains heat filling
Composition A2.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A2,1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains the combination of thermoplasticity heat-conducting resin
Thing B1.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 279 DEG C, and melt pressure is 22~36bar,
21~33Hz of moment of torsion.
Injection molded test：Dried B2 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B2 the results are shown in Table 1.
【Embodiment 3】
Heat filling is surface-treated：Weigh 15 parts of graphite powder I (2000 mesh), 15 parts of graphite powder II (500 mesh) and 10 parts of silicon
The ethanol solution of alkane coupling agent concentrations 3.0% is thoroughly mixed in stainless steel ware, is done after naturally dry at 100 DEG C
It is dry 4 it is small when, obtain heat conduction filler composition A3.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A3,1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains the combination of thermoplasticity heat-conducting resin
Thing B3.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 287 DEG C, and melt pressure is 28~39bar,
30~37Hz of moment of torsion.
Injection molded test：Dried B3 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B3 the results are shown in Table 1.
【Embodiment 4】
Heat filling is surface-treated：Weigh flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 30 parts with 10 parts of silicon
The ethanol solution of alkane coupling agent concentrations 3.0% is thoroughly mixed in stainless steel ware, is done after naturally dry at 100 DEG C
It is dry 4 it is small when, obtain heat conduction filler composition A4.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 19.8g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A4,1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2.5 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains thermoplasticity heat-conducting resin group
Compound B4.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280
DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 290 DEG C, melt pressure for 19~
50bar, 23~35Hz of moment of torsion.
Injection molded test：Dried B4 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B4 the results are shown in Table 1.
【Embodiment 5】
Heat filling is surface-treated：Weigh flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 7.5 parts, be chopped carbon
The ethanol solution of 22.5 parts of fiber powder (100 μm of length, 15 μm of diameter) and 10 parts of silane coupled agent concentrations 3.0% is in stainless steel device
It is thoroughly mixed in ware, when drying 4 is small at 100 DEG C after naturally dry, obtains heat conduction filler composition A5.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A5,1,010 1.6 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains the combination of thermoplasticity heat-conducting resin
Thing B5.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 284 DEG C, and melt pressure is 30~57bar,
31~42Hz of moment of torsion.
Injection molded test：Dried B5 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B5 the results are shown in Table 1.
【Embodiment 6】
Heat filling is surface-treated：Weigh flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 7.5 parts, threadiness
22.5 parts of graphite powder CF-200 (200 mesh) and the ethanol solution of 10 parts of silane coupled agent concentrations 3.0% fill in stainless steel ware
Divide and be stirred, when drying 4 is small at 100 DEG C after naturally dry, obtain heat conduction filler composition A6.
The preparation of heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts in 105
DEG C, when drying process 6 is small under vacuum condition after, with A6,1,010 1.6 parts, 0.8 part of white oil, be placed in homogenizer fully mixed
Close 2 minutes.Said mixture material is imported into melting extrusion in extruder, granulation obtains heat-conductive resin composition B6.Twin-screw squeezes
Go out 1~9 section of machine and die orifice temperature be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 286 DEG C, and melt pressure is 33~50bar, moment of torsion 29~
45Hz。
Injection molded test：Dried B6 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of heat-conductive resin composition B6 the results are shown in Table 1.
【Embodiment 7】
Heat filling is surface-treated：Weigh flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 5 parts, flake graphite
Alkene YH1 (particle diameter D50：20 μm, thickness 80nm) 2.5 parts, 22.5 parts of fiber graphite powder CF-200 (200 mesh) and 10 parts of silane idols
The ethanol solution of connection agent concentration 3.0% is thoroughly mixed in stainless steel ware, after naturally dry dry 4 at 100 DEG C
Hour, obtain heat conduction filler composition A7.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A7,1,010 1.6 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2 minutes.Said mixture material is imported into melting extrusion in extruder, granulation obtains thermoplasticity heat-conductive resin composition
B7.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 288 DEG C, and melt pressure is 27~42bar,
26~42Hz of moment of torsion.
Injection molded test：Dried B7 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B7 the results are shown in Table 1.
【Embodiment 8】
Heat filling is surface-treated：Weigh flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 5 parts, fibrous stone
The ethanol solution of 22.7 parts of black (90 μm of length, 10 μm of diameter) and 10 parts of silane coupled agent concentrations 3.0% is in stainless steel ware
It is thoroughly mixed, when drying 4 is small at 100 DEG C after naturally dry, obtains heat conduction filler composition A8.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1)70.5
After when part drying process 6 is small under 105 DEG C, vacuum condition, with A8,1,010 1.6 parts, 0.8 part of white oil, homogenizer is placed in
In be sufficiently mixed 2 minutes.Carbon fiber length is imported in double screw extruder for fine 1.8 parts by side feeding, said mixture material is led
Enter melting extrusion in extruder, granulation obtains thermoplasticity heat-conductive resin composition B8.1~9 section of double screw extruder and die orifice
Temperature is followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, and screw rod turns
150 revs/min of speed, melt temperature are 285 DEG C, and melt pressure is 29~48bar, 31~41Hz of moment of torsion.
Injection molded test：Dried B8 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B8 the results are shown in Table 1.
【Embodiment 9】
Heat filling is surface-treated：It is dense with 10 parts of silane coupling agents to weigh 30 parts of fiber graphite powder CF-200 (200 mesh)
The ethanol solution of degree 3.0% is thoroughly mixed in stainless steel ware, when drying 4 is small at 100 DEG C after naturally dry, is obtained
To heat conduction filler composition A9.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with A9,1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer
It is sufficiently mixed 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains the combination of thermoplasticity heat-conducting resin
Thing B9.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 287 DEG C, and melt pressure is 28~39bar,
30~37Hz of moment of torsion.
Injection molded test：Dried B9 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B9 the results are shown in Table 1.
【Embodiment 10】
Heat filling is surface-treated：It is dense with 10 parts of silane coupling agents to weigh 30 parts of fiber graphite powder CF-200 (200 mesh)
The ethanol solution of degree 3.0% is thoroughly mixed in stainless steel ware, when drying 4 is small at 100 DEG C after naturally dry, is obtained
To heat conduction filler composition A9.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
When drying process 6 is small under 105 DEG C, vacuum condition, twin-screw is imported by loss-in-weight feeder respectively with A9,1,010 0.8 parts and is squeezed
Go out in machine, 0.8 part of white oil is imported in double screw extruder by HLB-1008 piston pump with constant flow, through melting, mediating, extruding, making
Grain obtains thermoplasticity heat-conductive resin composition B10.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240
DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature
For 285 DEG C, melt pressure is 24~35bar, 28~33Hz of moment of torsion.
Injection molded test：Dried B10 is molded into by standard batten, injection molding machine 1~3 using German BOY M55 injection molding machines
Section and film mouth temperature are respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C, and 60 DEG C of mold temperature, is placed in Bluepard BPS-
When placement 24 is small in 100CB climatic chambers (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition B10 the results are shown in Table 1.
【Comparative example 1】
Injection molded test：By polycarbonate pellet C1 (melt index 12.3g10min-1) done under 105 DEG C, vacuum condition
After when dry processing 6 is small, standard batten is molded into using German BOY M55 injection molding machines, 1~3 section of injection molding machine and film mouth temperature
Respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB climatic chambers
When placement 24 is small in (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of C1 the results are shown in Table 2.
【Comparative example 2】
Heat filling is surface-treated：Weigh 5 parts of graphite powder I (2000 mesh), 5 parts of graphite powder II (500 mesh) and 10 parts of silane
The ethanol solution of coupling agent concentrations 1.0% is thoroughly mixed in stainless steel ware, dry at 100 DEG C after naturally dry
4 it is small when, obtain heat conduction filler composition D.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 90 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with D, 1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer and fills
Divide mixing 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains thermoplasticity heat-conductive resin composition
C2.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 278 DEG C, and melt pressure is 23~32bar,
26~30Hz of moment of torsion.
Injection molded test：Dried C2 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition C2 the results are shown in Table 2.
【Comparative example 3】
Heat filling is surface-treated：Weigh 10 parts of ball-aluminium oxide (150 mesh) and 10 parts of silane coupled agent concentrations 1.0%
Ethanol solution is thoroughly mixed in stainless steel ware, when drying 4 is small at 100 DEG C after naturally dry, is obtained heat conduction and is filled out
Feed composition E.
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 90 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with E, 1,010 0.8 parts, 0.8 part of white oil, it is placed in homogenizer and fills
Divide mixing 2 minutes.Mixed material is imported into melting extrusion in double screw extruder, granulation obtains thermoplasticity heat-conductive resin composition
C3.The temperature of 1~9 section of double screw extruder and die orifice be followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C,
280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C, 150 revs/min of screw speed, melt temperature is 288 DEG C, and melt pressure is 35~55bar,
32~40Hz of moment of torsion.
Injection molded test：Dried C3 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition C3 the results are shown in Table 2.
【Comparative example 4】
The preparation of thermoplasticity heat-conductive resin composition：By polycarbonate pellet (melt index 12.3g10min-1) 70 parts
After when drying process 6 is small under 105 DEG C, vacuum condition, with flake graphite alkene YH5 (particle diameter D50：150 μm, thickness 80nm) 5 parts,
Flake graphite alkene YH1 (particle diameter D50：20 μm, thickness 80nm) 2.5 parts, 22.5 parts of fiber graphite powder CF-200 (200 mesh) with
0.3 part of silane coupling agent, 1,010 1.6 parts, 0.8 part of white oil, are placed in homogenizer and are sufficiently mixed 2 minutes.By above-mentioned mixing
Material imports melting extrusion in extruder, and granulation obtains thermoplasticity heat-conductive resin composition C4.1~9 section of double screw extruder and
The temperature of die orifice is followed successively by 220 DEG C, 240 DEG C, 260 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 280 DEG C, 270 DEG C,
150 revs/min of screw speed, melt temperature are 288 DEG C, and melt pressure is 27~42bar, 26~42Hz of moment of torsion.
Injection molded test：Dried C4 is molded into by standard batten, 1~3 section of injection molding machine using German BOY M55 injection molding machines
It it is respectively 280 DEG C, 290 DEG C, 300 DEG C and 290 DEG C with film mouth temperature, 60 DEG C of mold temperature, is placed in Bluepard BPS-100CB
When placement 24 is small in climatic chamber (23 DEG C of temperature, relative humidity 50%).
The all-round property testing of thermoplasticity heat-conductive resin composition C4 the results are shown in Table 2.
The comprehensive performance of heat-conductive resin composition in 1 embodiment 1~10 of table
The comprehensive performance of heat-conductive resin composition in 2 comparative example 1~4 of table
Contrasted from above-described embodiment and comparative example, the thermoplasticity heat-conductive resin composition prepared by the present invention is heat-resisting
Performance, mechanics, heat conductivility and melt flowability are preferable, especially select to obtain after two kinds of different heat fillings are composite modified
Heat-conductive resin composition comprehensive performance it is best, such as two kinds of flake graphite alkene, the compounding (embodiment 7) of fiber graphite powder.
Invention method is accompanied by modification and helps by selecting the conductive particle composition of special construction (size, shape)
Agent, is entered in base resin material by melt blending, obtains the thermoplastic with higher thermal conductivity, mechanics and melt flowability
Property heat-conductive resin composition, and reduce production cost, beneficial to realizing industrialized production.
Claims (10)
- A kind of 1. thermoplasticity heat-conductive resin composition, including following components in terms of parts by weight：(A) 40~75 parts of thermoplastic resin；(B) 10~45 parts of heat conduction filler composition；(C) 0.1~10 part other auxiliary agents；Wherein, the heat conduction filler composition includes the heat filling by modifier modification, the modifying agent and heat filling Mass ratio is (0.2~2):100；The heat filling is selected from spherical, fiber powdery, sheet, chopped strand shape and long fine shape and leads At least one of hot filler.
- 2. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the thermoplastic resin is selected from poly- third Alkene, polyester, nylon, polystyrene, styrene/acrylonitrile copolymer, phenylethylene/maleic anhydride copolymer, ABS, makrolon, At least one of polyphenylene oxide, polyphenylene sulfide, polyether-ether-ketone, liquid crystal polymer.
- 3. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the spherical heat filling is selected from oxygen Change at least one of aluminium, magnesia, zinc oxide, silica, nickel oxide, aluminium nitride, silicon nitride, boron nitride, carborundum；Institute It is preferably 30~2000 mesh to state spherical heat filling particle diameter.
- 4. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the fiber powdery heat filling choosing From at least one of glass fiber powder, graphite powder and carbon fiber powder, carbon nanotubes；The fiber powdery heat filling particle diameter is excellent Elect 30~800 mesh as.
- 5. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the sheet heat filling is selected from stone At least one of ink and graphene；The length of the sheet heat filling is preferably 0.5~500 μm, thickness be preferably 10~ 200nm。
- 6. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the chopped strand shape heat filling Selected from least one of glass fibre and carbon fiber；The length of the chopped strand shape heat filling be preferably 0.1~12mm, Diameter is preferably 0.1~10 μm.
- 7. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the long fine shape heat filling is selected from At least one of glass fibre and carbon fiber；The diameter of the long fine shape heat filling is preferably 0.1~10 μm.
- 8. thermoplasticity heat-conductive resin composition according to claim 1, it is characterised in that the modifying agent changes selected from silanes At least one of property agent, polyesters modifying agent, titanate ester modifying agent.
- 9. the preparation method of any thermoplasticity heat-conductive resin composition of claim 1~8, comprises the following steps：(1) the desired amount of heat filling is subjected to surface modification treatment with the desired amount of modifying agent, obtains the heat filling Composition；(2) by the desired amount of heat conduction filler composition and the thermoplastic resin of drying process, processing aid in high-speed mixer Mixing, imports in screw extruder and is melted, mediate, extrude, being granulated, and thermoplasticity heat-conductive resin composition is made.
- 10. the preparation method of any thermoplasticity heat-conductive resin composition of claim 1~8, further comprising the steps of：(1) the desired amount of heat filling is subjected to surface modification treatment with the desired amount of modifying agent, obtains the heat filling Composition；(2) by the desired amount of heat conduction filler composition and the thermoplastic resin of drying process, processing aid without high-speed mixer Mixing, is introduced directly into screw extruder and is melted, mediated, extruded, is granulated, and thermoplasticity heat-conductive resin composition is made.
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|---|---|---|---|---|
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102311644A (en) * | 2011-04-28 | 2012-01-11 | 刘立文 | Calcium sulfate whisker modified polyphenylene sulfide composite material and preparation method thereof |
| CN103059565A (en) * | 2013-01-25 | 2013-04-24 | 本松工程塑料（杭州）有限公司 | Heat-conducting nylon composite material, preparation method and application thereof |
| CN103087389A (en) * | 2013-01-31 | 2013-05-08 | 合肥工业大学 | High-heat-conductivity high-toughness composite material and preparation method thereof |
| KR20130118078A (en) * | 2012-04-19 | 2013-10-29 | 한국화학연구원 | Method for preparing the molded parts of heat resistant and thermally conductive polymer compositions and the molded parts of heat resistant and thermally conductive polymer compositions prepared by the same method |
| CN103589071A (en) * | 2013-09-30 | 2014-02-19 | 广东聚石化学股份有限公司 | Reinforced polyolefin heat-conducting plastic and preparation method thereof |
| CN105273372A (en) * | 2015-11-18 | 2016-01-27 | 东莞市万江明冠实业有限公司 | Macromolecule heat conduction and dissipation blended composite material and automatic preparation method |
-
2016
- 2016-10-08 CN CN201610877475.8A patent/CN107915973A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102311644A (en) * | 2011-04-28 | 2012-01-11 | 刘立文 | Calcium sulfate whisker modified polyphenylene sulfide composite material and preparation method thereof |
| KR20130118078A (en) * | 2012-04-19 | 2013-10-29 | 한국화학연구원 | Method for preparing the molded parts of heat resistant and thermally conductive polymer compositions and the molded parts of heat resistant and thermally conductive polymer compositions prepared by the same method |
| CN103059565A (en) * | 2013-01-25 | 2013-04-24 | 本松工程塑料（杭州）有限公司 | Heat-conducting nylon composite material, preparation method and application thereof |
| CN103087389A (en) * | 2013-01-31 | 2013-05-08 | 合肥工业大学 | High-heat-conductivity high-toughness composite material and preparation method thereof |
| CN103589071A (en) * | 2013-09-30 | 2014-02-19 | 广东聚石化学股份有限公司 | Reinforced polyolefin heat-conducting plastic and preparation method thereof |
| CN105273372A (en) * | 2015-11-18 | 2016-01-27 | 东莞市万江明冠实业有限公司 | Macromolecule heat conduction and dissipation blended composite material and automatic preparation method |
Non-Patent Citations (1)
| Title |
|---|
| 冯新德，等: "《高分子辞典》", 30 June 1998, 中国石化出版社 * |
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