CN102850780B - A kind of heat conduction polyamide compoiste material and preparation method thereof - Google Patents
A kind of heat conduction polyamide compoiste material and preparation method thereof Download PDFInfo
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- CN102850780B CN102850780B CN201110179001.3A CN201110179001A CN102850780B CN 102850780 B CN102850780 B CN 102850780B CN 201110179001 A CN201110179001 A CN 201110179001A CN 102850780 B CN102850780 B CN 102850780B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
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Abstract
The invention belongs to technical field of polymer composite materials, disclose a kind of heat conduction polyamide compoiste material and preparation method thereof.Heat conduction polyamide compoiste material disclosed by the invention comprises following component and weight part: 20 ~ 40 parts of PA resins, 58.2 ~ 77.4 parts of heat conductive fillers, 0.2 ~ 0.3 part of oxidation inhibitor, 0.5 ~ 0.7 part of coupling agent, 0.5 ~ 0.7 part of liquid adjuvants, 0.2 ~ 0.4 part of lubricant and 0.3 ~ 0.6 part of processing aid.The preparation method of heat conduction polyamide compoiste material disclosed by the invention comprises the following steps: 1) mixed with 0.5 ~ 0.7 part of liquid adjuvants by 0.5 ~ 0.7 part of coupling agent, join in 58.2 ~ 77.4 parts of dry heat conductive fillers, stir 30 minutes in high mixer, for subsequent use after 100 DEG C of dry 3h; 2) by 20 ~ 40 of drying parts of PA resins, 0.2 ~ 0.3 part of oxidation inhibitor, 0.2 ~ 0.4 part of lubricant, 0.3 ~ 0.6 part of processing aid and step 1) mixture that obtains, put into high-speed mixer, stir 15 minutes, put into forcing machine extruding pelletization.Matrix material of the present invention has thermal conductivity, low density, good processibility, low cost.
Description
Technical field
The invention belongs to technical field of polymer composite materials, relate to a kind of heat conduction polyamide compoiste material and preparation method thereof.
Background technology
Although plastics have the advantage such as insulation, light weight, easily forming process, but when being used for the aspects such as computer, indicating meter framework, electrical and electronic component when plastics, because the thermal conductivity ratio of plastics is lower, be difficult to heat to be derived, the heat of accumulation has adverse influence to the stability that electron device runs.In order to address this problem, heat-conducting plastic enters the visual field of people, heat-conducting plastic be exactly there is heat conductivility aluminum oxide, silicon carbide, aluminium nitride, graphite, carbon nanotube etc. as filler, the matrix material that thermoplasticity or thermosetting resin are formed as matrix.Polymeric amide (PA) refers to the base polymer containing amide group repeated structural unit in molecular chain, form primarily of diamine and diprotic acid polycondensation or hexanolactam ring-opening polymerization, for toughness horn shape is translucent or creamy white crystals resin, physical strength is high, heat-resisting, wear-resisting, oil resistant, weak acid resistant, alkaline-resisting, electrical insulating property good, self-extinguishing, nontoxic, good weatherability, and the mobility of PA is relatively good, this point is for high packing material particularly important.
In heat conductive filler, Japanese scholars was once filler filling polyvinyl chloride and epoxy resin with metal powder, and thermal conductivity promotes to some extent, but because metal is easily corroded and conducts electricity, so do not obtain practical application; Also someone studies conductive graphite and carbon nanotube as heat conductive filler potting resin, and the cost of these fillers is higher, and larger on the impact of other performances of resin.Number of patent application 200780011249.0 discloses and utilizes PA6, and 6 is resin matrix, and aluminum oxide is the preparation of the heat conduction PA of filler, because the thermal conductivity of aluminum oxide is not high, the thermal conductivity of disclosed heat conduction PA in this way not high, in addition, the mechanical property of material is not high yet.There is the product about PA46 in CoolPolymer company, but PA46 price comparison is high, and other companies also have about PA6 and PA66 heat conduction product, but thermal conductivity and mechanical property are not high.
Summary of the invention
In order to overcome the shortcoming of high infill system, the object of this invention is to provide a kind of filled-type thermally conductive polyamide compoiste material with high thermal conductivity energy, preferably mechanical property and processing characteristics; This matrix material has thermal conductivity, low density, good processibility, low cost, can be used for portable electric appts, LED, transformer casing etc.
Another object of the present invention is to provide a kind of preparation method of above-mentioned heat conduction polyamide compoiste material.
Technical scheme of the present invention is as follows:
The invention provides a kind of heat conduction polyamide compoiste material, this matrix material comprises following component and weight part:
PA resin 20 ~ 40 parts,
Heat conductive filler 58.2 ~ 77.4 parts,
0.2 ~ 0.3 part, oxidation inhibitor,
Coupling agent 0.5 ~ 0.7 part,
Liquid adjuvants 0.5 ~ 0.7 part,
Lubricant 0.2 ~ 0.4 part,
Processing aid 0.3 ~ 0.6 part.
Described PA resin is the PA6 resin that extrusion grade has better mobility.
Described heat conductive filler is selected from one or more in heat conduction silicon carbide, heat conduction aluminum oxide, conductive graphite or heat conduction aluminium nitride; Wherein heat conduction aluminum oxide or heat conduction silicon carbide are main, and conductive graphite and heat conduction aluminium nitride add on a small quantity.
Described oxidation inhibitor is the composite of Hinered phenols primary antioxidant and phosphorous acid esters auxiliary antioxidant; be selected from oxidation inhibitor N further; N '-bis--(3-(3; 5-di-tert-butyl-hydroxy phenyl) propionyl) hexanediamine (oxidation inhibitor 1098) and oxidation inhibitor three [2.4-di-tert-butyl-phenyl] phosphorous acid ester (irgasfos 168) or oxidation inhibitor 4; 4 '-[1; 1 '-xenyl] subunit di 2 ethylhexyl phosphonic acid-four [2,4-bis-trimethylphenylmethane base] ester (oxidation inhibitor PEPQ) composite.
Described coupling agent is selected from titanate ester or silane coupling agent, is selected from sec.-propyl three stearic acid titanic acid ester (TTS) or γ-glycidyl ether oxygen propyl trimethoxy silicane (KH550) further.
Described liquid adjuvants is commercially available white oil.
Described lubricant is selected from silicone or N, N '-ethylene bis stearamide (EBS).
Described processing aid is selected from intermediate molecular weight resin compound or fatty acid ester blends, is preferably TR065 (intermediate molecular weight resin compound) or the TR044 (fatty acid ester blends) of STRUKTOL.
Present invention also offers a kind of preparation method of above-mentioned heat conduction polyamide compoiste material, the method comprises the following steps:
1) 0.5 ~ 0.7 part of coupling agent is mixed with 0.5 ~ 0.7 part of liquid adjuvants, join in 58.2 ~ 77.4 parts of dry heat conductive fillers, stir 30 minutes in high mixer, for subsequent use after 100 DEG C of dry 3h;
2) by 20 ~ 40 of drying parts of PA resins, 0.2 ~ 0.3 part of oxidation inhibitor, 0.2 ~ 0.4 part of lubricant, 0.3 ~ 0.6 part of processing aid and step 1) mixture that obtains, put into high-speed mixer, stir 15 minutes, put into forcing machine extruding pelletization.
Described step 1) in coupling agent and liquid adjuvants feed postition for spray.
It is 100 DEG C of dry 4h that the PA resin of described drying to refer to PA resin in temperature.
It is 100 DEG C of dry 4h that the heat conductive filler of described drying to refer to heat conductive filler in temperature.
Described forcing machine is twin screw extruder, and each section of temperature is respectively: 170 ~ 190 DEG C, 210 ~ 230 DEG C, 230 ~ 250 DEG C, 240 ~ 260 DEG C, 240 ~ 260 DEG C, 240 ~ 260 DEG C, and head is 230 ~ 250 DEG C.
The present invention compared with prior art, has the following advantages and beneficial effect:
1, the present invention adopts the matrix resin of high workability, and system workability is good, and mechanical property declines few.
2, the present invention adopts cheap heat conductive filler, and material cost reduces.
3, matrix material of the present invention has thermal conductivity, low density, good processibility, low cost, can be used for the aspects such as portable electric appts, LED, transformer casing.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 40 parts of PA6 dry 4h at 100 DEG C, by 58.2 parts of heat conduction silicon carbide dry 4h at 100 DEG C;
(2) dried 58.2 parts of heat conduction silicon carbide are put into high mixer, by the mixture of 0.5 part of coupling agent and 0.5 part of white oil in the mode of spraying, join in 58.2 parts of heat conduction silicon carbide in high-speed mixer, high-speed mixing 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by the mixture that 40 parts of dried PA6,0.1 part of oxidation inhibitor, 1098,0.2 part of irgasfos 168,0.2 part of EBS, 0.3 part of processing aid TR065 and step 2 obtain, put in high-speed mixer, at room temperature mix 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 1: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 1
| Performance | Embodiment 1 | Inspecting standard |
| Density (g/cm 3) | 1.824 | ISO1183 |
| Tensile strength (Mpa) | 92.7 | ISO 527-1 |
| Flexural strength (Mpa) | 154 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 5 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 40 | ISO179-1 |
| Heat-drawn wire (DEG C) | 173.5 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 1.1 | ASTME 1461-01 |
Embodiment 2
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 20 parts of PA resins dry 4h at 100 DEG C, by 77.4 parts of heat conduction aluminum oxide dry 4h at 100 DEG C;
(2) dried 77.4 parts of heat conduction aluminum oxide are put into high mixer, by the mixture of 0.7 part of coupling agent and 0.7 part of white oil, join in 77.4 parts of heat conduction aluminum oxide in high-speed mixer in the mode of spraying, high-speed mixing is after 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by the mixture that 20 parts of dried PA6,0.1 part of oxidation inhibitor, 1098,0.1 part of PEPQ, 0.2 part of EBS, 0.6 part of processing aid TR065 and step 2 obtain, put in high-speed mixer, at room temperature mix 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 2: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 2
| Performance | Embodiment 2 | Inspecting standard |
| Density (g/cm 3) | 2.523 | ISO1183 |
| Tensile strength (Mpa) | 63 | ISO 527-1 |
| Flexural strength (Mpa) | 97 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 4 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 12 | ISO179-1 |
| Heat-drawn wire (DEG C) | 140 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 1.5 | ASTME 1461-01 |
Embodiment 3
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 27.6 parts of PA6 resins dry 4h at 100 DEG C, by 40 parts of heat conduction aluminum oxide and 35 parts of heat conduction silicon carbide dry 4h at 100 DEG C;
(2) dried 40 parts of aluminum oxide and 35 parts of heat conduction silicon carbide are put into high mixer, by the mixture of 0.7 part of coupling agent and 0.7 part of white oil, in the mode of spraying, join 40 parts of heat conduction aluminum oxide in high-speed mixer and 35 parts of heat conduction silicon carbide, high-speed mixing is after 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by the mixture that 27.6 parts of dried PA6,0.1 part of oxidation inhibitor, 1098,0.1 part of PEPQ, 0.6 part of processing aid TR065 and step 2 obtain, join in high-speed mixer, at room temperature mix 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 3: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 3
| Performance | Embodiment 3 | Inspecting standard |
| Density (g/cm 3) | 2.19 | ISO1183 |
| Tensile strength (Mpa) | 70 | ISO 527-1 |
| Flexural strength (Mpa) | 119 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 5 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 24 | ISO179-1 |
| Heat-drawn wire (DEG C) | 150 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 1.7 | ASTME 1461-01 |
Embodiment 4
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 27.6 parts of PA6 dry 4h at 100 DEG C, by 10 parts of conductive graphites, 30 parts of heat conduction aluminum oxide and 35 parts of heat conduction silicon carbide dry 4h at 100 DEG C;
(2) dried 10 parts of conductive graphites, 40 parts of heat conduction aluminum oxide and 35 parts of heat conduction silicon carbide are put into high mixer, by the mixture of 0.7 part of coupling agent and 0.7 part of white oil, in the mode of spraying, join 10 parts of conductive graphites in high-speed mixer, 40 parts of aluminum oxide and 35 parts of silicon carbide, high-speed mixing is after 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by 27.6 parts of dried PA6, the mixture that 0.1 part of oxidation inhibitor, 1098,0.1 part of 168,0.4 parts of EBS, 0.6 part of processing aid TR065 and step 2 obtain, puts into high-speed mixer, at room temperature mixes 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 4: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 4
| Performance | Embodiment 3 | Inspecting standard |
| Density (g/cm 3) | 2.15 | ISO1183 |
| Tensile strength (Mpa) | 65.3 | ISO 527-1 |
| Flexural strength (Mpa) | 115 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 4 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 14 | ISO179-1 |
| Heat-drawn wire (DEG C) | 160 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 3.5 | ASTME 1461-01 |
Embodiment 5
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 35 parts of PA6 dry 4h at 100 DEG C, by 10 parts of heat conduction aluminium nitride, 25 parts of heat conduction aluminum oxide and 27.8 parts of heat conduction silicon carbide dry 4h at 100 DEG C;
(2) dried 10 parts of heat conduction aluminium nitride, 25 parts of heat conduction aluminum oxide and 27.8 parts of heat conduction silicon carbide are put into high mixer, by the mixture of 0.6 part of coupling agent and 0.6 part of white oil, in the mode of spraying, join 10 parts of heat conduction aluminium nitride in high-speed mixer, 25 parts of heat conduction aluminum oxide and 27.8 parts of heat conduction silicon carbide, high-speed mixing is after 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by dried PA6, the mixture that 0.1 part of oxidation inhibitor, 1098,0.2 part of 168,0.3 parts of lubricant and 0.6 part of processing aid TR065 and step 2 obtain, joins in high mixer, at room temperature mixes 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 5: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 5
| Performance | Embodiment 3 | Inspecting standard |
| Density (g/cm 3) | 1.968 | ISO1183 |
| Tensile strength (Mpa) | 80 | ISO 527-1 |
| Flexural strength (Mpa) | 130 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 5 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 33 | ISO179-1 |
| Heat-drawn wire (DEG C) | 170 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 1.8 | ASTME 1461-01 |
Embodiment 6
A kind of PA thermally conductive material, mark by weight, is made up of following component:
(1) by 25 parts of PA6 dry 4h at 100 DEG C, by 40 parts of heat conduction aluminum oxide and 32.4 parts of heat conduction aluminium nitride dry 4h at 100 DEG C;
(2) dried 40 parts of heat conduction aluminum oxide and 32.4 parts of heat conduction aluminium nitride are put into high mixer, by the mixture of 0.7 part of coupling agent and 0.7 part of white oil, in the mode of spraying, join 40 parts of heat conduction aluminum oxide in high-speed mixer and 32.4 parts of heat conduction aluminium nitride, high-speed mixing is after 30 minutes, stand-by after dry 3h at 100 DEG C;
(3) by the mixture that 25 parts of dried PA6,0.1 part of oxidation inhibitor, 1098,0.1 part of PEPQ, 0.4 part of silicone lubricant and 0.6 part of processing aid TR065 and step 2 obtain, join in high-speed mixer, at room temperature mix 15 minutes;
(4) join in twin screw extruder by the compound of step (3) gained, screw rod 1 ~ 6 district temperature is respectively 180 ~ 200 DEG C, 210 ~ 230 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, 220 ~ 240 DEG C, 230 ~ 240 DEG C, head is 230 ~ 240 DEG C; Extruding pelletization.Be injection molded into exemplar after dry 3h at 100 DEG C, the particle obtained, standby survey, the temperature of injection moulding machine is 230 ~ 280 DEG C.
Sample mechanical property is by following standard testing, and result is as shown in table 6: this matrix material not only has higher thermal conductivity, also has higher heat-drawn wire and good mechanical property.
Table 6
| Performance | Embodiment 3 | Inspecting standard |
| Density (g/cm 3) | 2.241 | ISO1183 |
| Tensile strength (Mpa) | 71 | ISO 527-1 |
| Flexural strength (Mpa) | 103 | ISO 178 |
| Charpy notched Izod impact strength (KJ/m 2) | 4 | ISO179-1 |
| Charpy unnotched impact strength (KJ/m 2) | 17 | ISO179-1 |
| Heat-drawn wire (DEG C) | 156 | ISO 75-1，2 |
| Thermal conductivity (W/mK) | 4.1 | ASTME 1461-01 |
Above-mentioned is can understand and apply the invention for ease of those skilled in the art to the description of embodiment.Person skilled in the art obviously easily can make various amendment to these embodiments, and General Principle described herein is applied in other embodiments and need not through performing creative labour.Therefore, the invention is not restricted to embodiment here, those skilled in the art, according to announcement of the present invention, do not depart from improvement that scope makes and amendment all should within protection scope of the present invention.
Claims (6)
1. a heat conduction polyamide compoiste material, is characterized in that: this matrix material comprises following component and weight part:
Described PA resin is the PA6 resin of extrusion grade;
Described heat conductive filler is selected from one or more in heat conduction silicon carbide, heat conduction aluminum oxide or heat conduction aluminium nitride;
Described coupling agent is selected from sec.-propyl three stearic acid titanic acid ester or γ-glycidyl ether oxygen propyl trimethoxy silicane;
Described liquid adjuvants is white oil;
Described processing aid is selected from TR065 or TR044 of STRUKTOL.
2. heat conduction polyamide compoiste material according to claim 1; it is characterized in that: described oxidation inhibitor is the composite of Hinered phenols primary antioxidant and phosphorous acid esters auxiliary antioxidant; be selected from oxidation inhibitor N; N '-bis--(3-(3; 5-di-tert-butyl-hydroxy phenyl) propionyl) hexanediamine and oxidation inhibitor three [2.4-di-tert-butyl-phenyl] phosphorous acid ester or oxidation inhibitor 4; 4 '-[1; 1 '-xenyl] subunit di 2 ethylhexyl phosphonic acid-four [2,4-bis-trimethylphenylmethane base] ester composite.
3. heat conduction polyamide compoiste material according to claim 1, is characterized in that: described lubricant is selected from silicone or N, N '-ethylene bis stearamide.
4. the preparation method of the arbitrary described heat conduction polyamide compoiste material of claims 1 to 3, is characterized in that:
The method comprises the following steps:
1) 0.5 ~ 0.7 part of coupling agent is mixed with 0.5 ~ 0.7 part of liquid adjuvants, join in 58.2 ~ 77.4 parts of dry heat conductive fillers, stir 30 minutes in high mixer, for subsequent use after 100 DEG C of dry 3h;
2) by 20 ~ 40 of drying parts of PA resins, 0.2 ~ 0.3 part of oxidation inhibitor, 0.2 ~ 0.4 part of lubricant, 0.3 ~ 0.6 part of processing aid and step 1) mixture that obtains, put into high-speed mixer, stir 15 minutes, put into forcing machine extruding pelletization.
5. the preparation method of heat conduction polyamide compoiste material according to claim 4, is characterized in that: described step 1) in coupling agent and liquid adjuvants feed postition for spray; It is 100 DEG C of dry 4h that the PA resin of described drying to refer to PA resin in temperature; It is 100 DEG C of dry 4h that the heat conductive filler of described drying to refer to heat conductive filler in temperature.
6. the preparation method of heat conduction polyamide compoiste material according to claim 4, it is characterized in that: described forcing machine is twin screw extruder, each section of temperature is respectively: 170 ~ 190 DEG C, 210 ~ 230 DEG C, 230 ~ 250 DEG C, 240 ~ 260 DEG C, 240 ~ 260 DEG C, 240 ~ 260 DEG C, head is 230 ~ 250 DEG C.
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| CN103939754A (en) * | 2013-01-18 | 2014-07-23 | 合肥杰事杰新材料股份有限公司 | LED lamp and making method thereof |
| CN103497507B (en) * | 2013-09-29 | 2016-04-13 | 广东顾纳凯材料科技有限公司 | A kind of star-branched polyamide-based heat-conductive composite material and preparation method thereof |
| CN105419318A (en) * | 2015-12-30 | 2016-03-23 | 湖南南风新材料有限公司 | Wear resistant thermal conductive composite nylon, preparation method thereof, and preparation method of filament of same |
| CN106009636A (en) * | 2016-05-25 | 2016-10-12 | 杭州金州高分子科技有限公司 | High-impact-resistance and high-heat-conduction insulating electromagnetic wave absorption polycaprolactam material |
| CN110591349A (en) * | 2019-10-18 | 2019-12-20 | 佛山市智标科技有限公司 | Heat-conducting PA composite material and preparation method thereof |
| CN113801467A (en) * | 2021-09-01 | 2021-12-17 | 可为科技(南通)有限公司 | Manufacturing method of heat conduction material, heat conduction material and heat conduction bracket |
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| CN101796115A (en) * | 2007-08-08 | 2010-08-04 | 朗盛德国有限责任公司 | The thermoplasticity mixing material of heat conduction and electrical isolation |
| CN102070899A (en) * | 2010-12-30 | 2011-05-25 | 广东银禧科技股份有限公司 | Insulating and heat-conducting polyamide composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796115A (en) * | 2007-08-08 | 2010-08-04 | 朗盛德国有限责任公司 | The thermoplasticity mixing material of heat conduction and electrical isolation |
| CN102070899A (en) * | 2010-12-30 | 2011-05-25 | 广东银禧科技股份有限公司 | Insulating and heat-conducting polyamide composite material and preparation method thereof |
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