CN103939754A - LED lamp and making method thereof - Google Patents
LED lamp and making method thereof Download PDFInfo
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- CN103939754A CN103939754A CN201310019671.8A CN201310019671A CN103939754A CN 103939754 A CN103939754 A CN 103939754A CN 201310019671 A CN201310019671 A CN 201310019671A CN 103939754 A CN103939754 A CN 103939754A
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- radiator structure
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Abstract
The invention relates to an LED lamp and a making method of the LED lamp. The LED lamp comprises a lamp body, an LED lamp chip, a lampshade and a heat radiation structure, and is characterized in that the heat radiation structure is composed of at least two layers of heat radiation structures made of different materials, the LED lamp chip is arranged above the heat radiation structure, the lampshade is connected with the heat radiation structure through threads, and the lamp body is connected and fixed to the heat radiation structure through a clamping groove. The forming method of the heat radiation structure is a two-time injection molding method, an inner high-heat-conduction structure serves as an insert, and then insulating heat-conduction plastics are injected outside. Compared with the prior art, the LED lamp has the advantages of being good in heat radiation effect, low in cost and the like.
Description
Technical field
The present invention relates to a kind of light fixture, be specifically related to a kind of LED lamp.
Background technology
LED light fixture is to using light-emitting diode chip for backlight unit as the light fixture of light-emitting component, and its structure comprises the radiator structure of LED lamp chip, lampshade and the heat radiation of help LED lamp.The radiator structure of most LED lamp adopts aluminium or copper material in the market.Because the radiator structure of aluminium or copper material does not have heat storage capacity, can only rely on its surface and the contact area of air to dispel the heat, therefore this class radiator must bring the too much metal of radiator structure consumption thus with abundant fin to guarantee enough large surface area, and manufacturing cost is too high.
Summary of the invention
Object of the present invention is exactly to provide a kind of good heat dissipation effect, LED lamp that cost is low and preparation method thereof in order to overcome the defect of above-mentioned prior art existence.
Object of the present invention can be achieved through the following technical solutions: a kind of LED lamp, comprise lamp body, LED lamp chip, lampshade and radiator structure, it is characterized in that, described radiator structure is comprised of the radiator structure of at least two-layer unlike material, described LED lamp chip is placed in the top of described radiator structure, described lampshade is connected by screw thread with radiator structure, and described lamp body and radiator structure are connected and fixed by draw-in groove.
Described radiator structure is comprised of the radiator structure of two-layer unlike material, and its ectomesoderm is general conductive structure, and its material adopts heat-conducting plastic, and internal layer is high conductive structure, and its material is highly heat-conductive material.
Described radiator structure is comprised of the radiator structure of two-layer above unlike material, and wherein outermost layer is general conductive structure, and its material adopts heat-conducting plastic, and all the other internal layer radiator structures are high conductive structure, adopts the highly heat-conductive material that multilayer is different to form.
Described radiator structure upper end is provided with screw thread, and lower end is provided with draw-in groove, and radiator structure upper end fixes by helicitic texture and lampshade, and lower end is connected with lamp body by draw-in groove;
Described lamp body lower end is provided with screw thread, and lamp body is connected with light fixture by screw thread, and lamp body upper end is provided with boss and the groove matching with described radiator structure draw-in groove, fixes with radiator structure;
Described LED lamp chip is positioned over the upper end of radiator structure, and LED lamp chip is fixed on radiator structure by boss and solder joint.
Described radiator structure is non-individual body or local engraved structure, in its outer setting, there is muscle position, muscle position is in the periphery of radiator structure according to 30 °, 45 ° or 60 ° of angular array, and the wall thickness of muscle position designs according to wattage of the bulb, and the heat producing is conveniently distributed.
Described heat-conducting plastic is heat filling modified plastic material, and its raw material comprises the component of following weight portion:
Plastics: 100 parts;
Heat filling: 40～80 parts;
Fire retardant: 10～20 parts;
Coupling agent: 5～12 parts;
Lubricant: 0.4～1.8 part;
Antioxidant: 0.8～2 part.
Described plastics are selected from one or more in nylon (PA6/PA66), Merlon (PC), polyphenylene sulfide (PPS), polypropylene (PP), polymeric liquid crystal copolymer (LCP), thermoplastic elastomer (TPE) (TPE), polyethylene (PE);
Described heat filling is selected from one or more in alundum (Al2O3), graphite, carborundum, fibrous highly-conductive hot carbon powder, flakey highly-conductive hot carbon powder, aluminium nitride;
Described fire retardant is selected from one or more in aluminium hydroxide, magnesium hydroxide, antimony oxide, Firebrake ZB;
Described coupling agent is selected from a kind of in gamma-aminopropyl-triethoxy-silane, 3-aminopropyl trimethoxysilane, isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters;
Described lubricant is selected from one or more in OPE, paraffin, stearic acid;
Described antioxidant is selected from: 2; tri-grades of butyl-4-methylphenols of 6-, N; N '-bis--(3-(3; 5-di-tert-butyl-hydroxy phenyl) propiono) one or more in hexamethylene diamine, two (tri-grades of butyl-4-hydroxy phenyls of 3,5-) thioether, three [2.4-di-tert-butyl-phenyl] phosphite ester.
Described highly heat-conductive material is metal material, is selected from one or more in aluminium, copper, platinum, gold, silver, iron, lead.
A preparation method for LED lamp, is characterized in that: comprise the following steps:
(1) highly heat-conductive material is cast into inserts;
(2) weigh by weight 0.8～2 part, 100 parts, plastics, 40～80 parts of heat fillings, 10～20 parts of fire retardants, 5～12 parts of coupling agents, 0.4～1.8 part of lubricant, antioxidant and join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes radiator structure;
(4) lamp body, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp body, and lampshade is arranged on radiator structure top, obtains described LED lamp.
Compared with prior art, the invention has the advantages that, because internal layer is highly heat-conductive material, when LED lamp is used, chip place at LED lamp can produce a large amount of heats, the high conductive structure of internal layer can be transferred to rapidly radiator structure by the heat at chip place, and then the outer surface by radiator structure distributes energy.Meanwhile, the skin of radiator structure is insulating materials, can remove the setting of insulating barrier from, reduces production costs.
Accompanying drawing explanation
The wick schematic diagram of Fig. 1 LED lamp;
The overall schematic of Fig. 2 LED lamp;
The profile of Fig. 3 sandwich construction.
In figure: 1LED lamp chip; 2 lampshades; 3 radiator structures; 4 sandwich constructions; 5 conductive structures; 6 high conductive structures; 7 lamp bodies.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described.
Embodiment 1
As shown in Figures 1 to 3, a kind of Novel LED light, comprise LED lamp chip 1, lampshade 2 and the radiator structure 3 that helps LED lamp to dispel the heat, described radiator structure 3 is the sandwich construction 4 that the radiator structure by two-layer unlike material forms, this sandwich construction 4 comprises outer conductive structure 5, its material adopts heat-conducting plastic, and interior floor height conductive structure 6, and its material adopts highly heat-conductive material.Heat-conducting plastic adopts plastics to add filling, plastic basis material is nylon (PA6), filler is fibrous highly-conductive hot carbon powder, the raw material that adopt specifically comprise 0.4 part of 0 part of NYLON610,40 parts, fibrous highly-conductive hot carbon powder, 10 parts, aluminium hydroxide, 5 parts of gamma-aminopropyl-triethoxy-silanes, OPE, 2,0.8 part of tri-grades of butyl-4-methylphenol of 6-by weight.High heat-conductivity conducting material 6 adopts metallic copper.The sandwich construction 4 of this radiator structure 3 adopts quadric injection moulds, and using inside, high conductive structure 5 is as inserts, then injection moulding insulating and heat-conducting plastics externally.Inner high conductive structure 5 is die cast.Radiator structure 3 is non-individual body.Radiator structure 3 has muscle position in its outer setting, and muscle position is in the periphery of radiator structure according to 30 ° of angular array, and the wall thickness of muscle position can design according to wattage of the bulb, and the heat producing is conveniently distributed.
Described radiator structure 3 upper ends are provided with screw thread, and lower end is provided with draw-in groove, and radiator structure 3 upper ends fix by helicitic texture and lampshade 2, and lower end is connected with lamp body 7 by draw-in groove;
Described lamp body 7 lower ends are provided with screw thread, and lamp body 7 is connected with light fixture by screw thread, and lamp body 7 upper ends are provided with boss and the groove matching with described radiator structure draw-in groove, fix with radiator structure;
Described LED lamp chip 1 is positioned over the upper end of radiator structure, and LED lamp chip is fixed on radiator structure by boss and solder joint.
The preparation method of above-mentioned LED lamp, comprises the following steps:
(1) metallic copper is cast into inserts 5;
(2) weigh by weight 0.4 part of 0 part of NYLON610,40 parts, fibrous highly-conductive hot carbon powder, 10 parts, aluminium hydroxide, 5 parts of gamma-aminopropyl-triethoxy-silanes, OPE, 2,0.8 part of tri-grades of butyl-4-methylphenol of 6-join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes the radiator structure of 2 layers of structure;
(4) lamp holder, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp holder, and lampshade is arranged on radiator structure top, obtains described LED lamp.
Embodiment 2
As shown in Figures 1 to 3, a kind of Novel LED light, comprises LED lamp chip 1, lampshade 2 and the radiator structure 3 that helps LED lamp to dispel the heat, and described radiator structure 3 adopts sandwich constructions 4 designs, and this sandwich construction 4 is double-layer structure.The outer conductive structure 5 of radiator structure 3, adopts heat-conducting plastic, and the internal layer of radiator structure 3 is high conductive structure 6, adopts highly heat-conductive material.Heat-conducting plastic adopts plastics to add filling, and plastic basis material is Merlon (PC), and filler is carborundum.High heat-conductivity conducting material 6 adopts metallic copper.The sandwich construction 4 of this radiator structure 3 adopts quadric injection moulds, and using inside, high conductive structure 5 is as inserts, then injection moulding insulating and heat-conducting plastics externally.Inner high conductive structure 5 is die cast.The structure that radiator structure 3 is hollow out.Radiator structure 3 has muscle position in its outer setting, and muscle position is in the periphery of radiator structure according to 45° angle degree array, and the wall thickness of muscle position and quantity can design according to wattage of the bulb, and the heat producing is conveniently distributed.
The preparation method of above-mentioned LED lamp, comprises the following steps:
(1) metallic aluminium is cast into inserts;
(2) weigh by weight 100 parts of Merlon, 60 parts, carborundum, 15 parts of magnesium hydroxides, 8 parts of coupling agent 3-aminopropyl trimethoxysilane, 1.4 parts, lubricant paraffin, antioxidant two (3, tri-grades of butyl-4-hydroxy phenyls of 5-) 1.5 parts of thioethers join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes the radiator structure of 2 layers of structure;
(4) lamp holder, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp holder, and lampshade is arranged on radiator structure top, obtains described LED lamp.
Embodiment 3
As shown in Figures 1 to 3, a kind of Novel LED light, comprises LED lamp chip 1, lampshade 2 and the radiator structure 3 that helps LED lamp to dispel the heat, and described radiator structure 3 adopts sandwich constructions 4 designs, and this sandwich construction 4 is three-decker.The outer conductive structure 5 of radiator structure 3, adopts heat-conducting plastic, and the internal layer of radiator structure 3 is high conductive structure 6, adopts highly heat-conductive material.Heat-conducting plastic adopts plastics to add filling, and plastic basis material is Merlon (PC), and filler is carborundum.Endothecium structure is divided into two-layer, adopts twice die cast, and two-layer high heat-conductivity conducting material 6 adopts metallic copper and silver.The sandwich construction 4 of this radiator structure 3 adopts quadric injection moulds, and using inside, high conductive structure 5 is as inserts, then injection moulding insulating and heat-conducting plastics externally.Inner high conductive structure 5 is die cast.Radiator structure 3 is that non-individual body or part are the structure of hollow out.Radiator structure 3 has muscle position in its outer setting, and muscle position is in the periphery of radiator structure according to 60 ° of angular array, and the wall thickness of muscle position and quantity can design according to wattage of the bulb, and the heat producing is conveniently distributed.
The preparation method of above-mentioned LED lamp, comprises the following steps:
(1) after being superimposed, copper sheet and silver strip be cast into the inserts of 2 layers;
(2) weigh by weight 2 parts of 100 parts of Merlon, 80 parts, carborundum, 20 parts of antimony oxides, 12 parts of isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters, 1.8 parts of stearic acid, three [2.4-di-tert-butyl-phenyl] phosphite ester and join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes radiator structure;
(4) lamp holder, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp holder, and lampshade is arranged on radiator structure top, obtains described LED lamp.
Embodiment 4
As shown in Figures 1 to 3, a kind of Novel LED light, comprises LED lamp chip 1, lampshade 2 and the radiator structure 3 that helps LED lamp to dispel the heat, and described radiator structure 3 adopts sandwich constructions 4 designs, and this sandwich construction 4 is double-layer structure.With air contact portion be the conductive structure 5 of radiator structure 3, adopt insulating heat-conduction material, the internal layer of radiator structure 3 is high conductive structure 6, adopts electric-conductivity heat-conductivity high material.Insulating heat-conduction material adopts plastics to add filling, and plastic basis material is polyphenylene sulfide (PPS), and filler is alundum (Al2O3).High heat-conductivity conducting material 6 adopts metal, and internal layer is two-layer, is respectively aluminium and copper.The sandwich construction 4 of this radiator structure 3 adopts quadric injection mould or Multi-step injection moldings, and using inside, high conductive structure 5 is as inserts, then injection moulding insulating and heat-conducting plastics externally.Inner high conductive structure 5 is die cast.Radiator structure 3 is that non-individual body or part are the structure of hollow out.Radiator structure 3 has muscle position in its outer setting, and muscle position is in the periphery of radiator structure according to 45° angle degree array, and the wall thickness of muscle position and quantity can design according to wattage of the bulb, and the heat producing is conveniently distributed.
The preparation method of above-mentioned LED lamp, comprises the following steps:
(1) after being superimposed, copper sheet and aluminium flake be cast into the inserts of 2 layers;
(2) weigh by weight 100 parts of polyphenylene sulfides, 50 parts of alundum (Al2O3)s, 18 parts, aluminium hydroxide, 8 parts of coupling agent 3-aminopropyl trimethoxysilane, 1.6 parts of stearic acid, N, N '-bis--(3-(3,5-di-tert-butyl-hydroxy phenyl) propiono) 1.2 parts of hexamethylene diamines join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes radiator structure;
(4) lamp holder, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp holder, and lampshade is arranged on radiator structure top, obtains described LED lamp.
The above-mentioned description to embodiment is can understand and apply the invention for ease of those skilled in the art.Person skilled in the art obviously can easily make various modifications to these embodiment, and General Principle described herein is applied in other embodiment and needn't passes through performing creative labour.Therefore, the invention is not restricted to the embodiment here, those skilled in the art are according to announcement of the present invention, and not departing from the improvement that category of the present invention makes and revise all should be within protection scope of the present invention.
Claims (10)
1. a LED lamp, comprise lamp body, LED lamp chip, lampshade and radiator structure, it is characterized in that, described radiator structure is comprised of the radiator structure of at least two-layer unlike material, described LED lamp chip is placed in the top of described radiator structure, described lampshade is connected by screw thread with radiator structure, and described lamp body and radiator structure are connected and fixed by draw-in groove.
2. a kind of LED lamp according to claim 1, is characterized in that, described radiator structure is comprised of the radiator structure of two-layer unlike material, its ectomesoderm is general conductive structure, its material adopts heat-conducting plastic, and internal layer is high conductive structure, and its material is highly heat-conductive material.
3. a kind of LED lamp according to claim 1, it is characterized in that, described radiator structure is comprised of the radiator structure of two-layer above unlike material, wherein outermost layer is general conductive structure, its material adopts heat-conducting plastic, all the other internal layer radiator structures are high conductive structure, adopt the highly heat-conductive material that multilayer is different to form.
4. a kind of LED lamp according to claim 1, is characterized in that, described radiator structure upper end is provided with screw thread, and lower end is provided with draw-in groove, and radiator structure upper end fixes by helicitic texture and lampshade, and lower end is connected with lamp body by draw-in groove;
Described lamp body lower end is provided with screw thread, and lamp body is connected with light fixture by screw thread, and lamp body upper end is provided with boss and the groove matching with described radiator structure draw-in groove, fixes with radiator structure;
Described LED lamp chip is positioned over the upper end of radiator structure, and LED lamp chip is fixed on radiator structure by boss and solder joint.
5. a kind of LED lamp according to claim 1, it is characterized in that, described radiator structure is non-individual body or local engraved structure, in its outer setting, there is muscle position, muscle position in the periphery of radiator structure respectively according to 30 ° or 45 ° or 60 ° of angular array, the wall thickness of muscle position designs according to wattage of the bulb, and the heat producing is conveniently distributed.
6. according to a kind of LED lamp described in claim 2 or 3, it is characterized in that, described heat-conducting plastic is heat filling modified plastic material, and its raw material comprises the component of following weight portion:
Plastics: 100 parts;
Heat filling: 40～80 parts;
Fire retardant: 10～20 parts;
Coupling agent: 5～12 parts;
Lubricant: 0.4～1.8 part;
Antioxidant: 0.8～2 part.
7. a kind of LED lamp according to claim 6, is characterized in that, described plastics are selected from one or more in nylon, Merlon, polyphenylene sulfide, polypropylene, polymeric liquid crystal copolymer, thermoplastic elastomer (TPE), polyethylene;
Described heat filling is selected from one or more in alundum (Al2O3), graphite, carborundum, fibrous highly-conductive hot carbon powder, flakey highly-conductive hot carbon powder, aluminium nitride.
8. a kind of LED lamp according to claim 6, is characterized in that, described fire retardant is selected from one or more in aluminium hydroxide, magnesium hydroxide, antimony oxide, Firebrake ZB;
Described coupling agent is selected from a kind of in gamma-aminopropyl-triethoxy-silane, 3-aminopropyl trimethoxysilane, isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters;
Described lubricant is selected from one or more in OPE, paraffin, stearic acid;
Described antioxidant is selected from: 2; tri-grades of butyl-4-methylphenols of 6-, N; N '-bis--(3-(3; 5-di-tert-butyl-hydroxy phenyl) propiono) one or more in hexamethylene diamine, two (tri-grades of butyl-4-hydroxy phenyls of 3,5-) thioether, three [2.4-di-tert-butyl-phenyl] phosphite ester.
9. according to a kind of LED lamp described in claim 2 or 3, it is characterized in that, described highly heat-conductive material is metal material, is selected from one or more in aluminium, copper, platinum, gold, silver, iron, lead.
10. a preparation method for the LED lamp as described in any one in claim 1～9, is characterized in that: comprise the following steps:
(1) highly heat-conductive material is cast into inserts;
(2) weigh by weight 0.8～2 part, 100 parts, plastics, 40～80 parts of heat fillings, 10～20 parts of fire retardants, 5～12 parts of coupling agents, 0.4～1.8 part of lubricant, antioxidant and join in extruder, melt extrude, pelletizing makes heat filling modified plastic material;
(3) inserts is put into injection machine mould, heat filling modified plastic material is added in injection machine, injection mo(u)lding, makes radiator structure;
(4) lamp body, LED lamp chip, lampshade and the radiator structure that shift to an earlier date injection formed are assembled, LED lamp chip is arranged in radiator structure, and radiator structure is arranged on lamp body, and lampshade is arranged on radiator structure top, obtains described LED lamp.
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| CN104845344A (en) * | 2015-04-21 | 2015-08-19 | 安徽祈艾特电子科技有限公司 | Aging-resistant heat-dissipation plastic for LED lamps and preparation method thereof |
| CN104845343A (en) * | 2015-04-21 | 2015-08-19 | 安徽祈艾特电子科技有限公司 | Heat-dissipation plastic containing carbon nanosphere particles and used for LED lamps and preparation method thereof |
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Application publication date: 20140723 |