CN105036783A - Method for brazing ceramic and metal or ceramic and ceramic - Google Patents
Method for brazing ceramic and metal or ceramic and ceramic Download PDFInfo
- Publication number
- CN105036783A CN105036783A CN201510401552.8A CN201510401552A CN105036783A CN 105036783 A CN105036783 A CN 105036783A CN 201510401552 A CN201510401552 A CN 201510401552A CN 105036783 A CN105036783 A CN 105036783A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- open slot
- welding
- pottery
- welding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The present invention provides a method for brazing a ceramic and a metal or a ceramic and a ceramic, and relates to a methods for brazing a ceramic and a metal, a ceramic and a ceramic, a ceramic and a ceramic-based composite, and a ceramic-based composite and a ceramic-based composite. The method comprises: making periodic or aperiodic open slots on a to-be-brazed surface of a ceramic or a ceramic-based composite, wherein the distance between adjacent open slots, the width of each open slot, and the depth of each open slot are of order of micrometers; and then placing an active brazer between to-be-brazed surfaces, and achieving effective connections between the ceramic and a metal, between the ceramic and a ceramic, or between the ceramic and a ceramic-based composite by using a vacuum brazing method. The method provided by the present invention can effectively increase a wetting area of the active brazer on the surface, and reduce residual stress of ceramic surface, thereby improving bonding strength between the ceramic and the metal and between the ceramic and the ceramic. The method is also applicable to connection between C/C composites, Cf/Sic composites and other materials of high hardness and high brittleness.
Description
Technical field
The present invention is a kind of method of ceramic/metal and pottery/Ceramic brazing, belongs to welding technology field.
Background technology
Pottery is a kind of high-temperature structural material having very much application future, with Al
2o
3pottery is example, and it has the excellent properties such as high temperature resistant, wear-resisting.And metallic substance generally has good toughness.In some military, industrial application, need material to have good toughness and good resistance to elevated temperatures, therefore pottery connects from metallic substance or two kinds of different stupaliths by normal needs, composition ceramic-metal, ceramic-ceramic composite simultaneously.This matrix material has good application prospect.
The general available soldering of connection of pottery or the method for diffusion welding, but directly to connect pottery from metallic substance or different stupaliths by these methods be very difficult, and this is mainly due to the thermal expansion coefficient difference (Al very greatly of two kinds of materials to be welded
2o
3pottery is 6.7 × 10
-6k
-1, metallic substance is 12-41 × 10
-6k
-1, both differ maximum and reach more than 6 times), such difference can cause in the process of cooling of high temperature brazing or diffusion welding structure, joint produces very large residual thermal stress, and then cause joint when stressed, occur crackle in interface, strength of joint is very low.In order to improve pottery and metal, pottery and the intensity of ceramic joining joint, just need to take suitable measure to reduce the residual thermal stress of joint.Patent of invention (contriver: bear Warburg Pincus, Mao Wei, Cheng Yaoyong. a kind of for SiO
2f/ SiO
2the processing method of composite ceramics and metallic substance soldering, patent application day: on 08 31st, 2010, the patent No.: ZL201010266686.0, authorized announcement date: on 09 26th, 2012; Contriver: bear Warburg Pincus, Chen Bo, Guo Shaoqing, hair is .SiO only
2f/ SiO
2the method of composite ceramics and metallic substance soldering, patent application day: on October 24th, 2012, the patent No.: ZL201210266686.0, authorized announcement date: on 01 08th, 2014) propose first by machining process at SiO
2f/ SiO
2the welding surface open channels of composite ceramics, and the damascene block processing that size and quantity matches, use AgCu-Ti active solder to be placed in SiO after assembling
2f/ SiO
2locate between the groove of composite ceramics welding surface and damascene block, and at welded SiO
2f/ SiO
2agCu-Ti solder is added at interface to be welded between composite ceramics and welded metallic substance, then by vacuum brazing type of heating, realizes SiO
2f/ SiO
2composite ceramics is connected with the effective of metallic substance.This method need comprise processing and assembling damascene block step, and operation relative complex, although can increase the strength of joint of joint to a certain extent, in reality processing and Application Areas, is subject to certain restrictions.In addition, the groove dimensions scope that this patent proposes is grade, and counter stress release action is limited, and the wettability of grade groove to solder, the limited use of fillibility.Paper (J.X.Xiong, J.L.Li, F.S.Zhang, etal.Directjoiningof2Dcarbon/carboncompositestoTi-6Al-4V alloywitharectangularwaveinterface [J] .MaterialsScienceandEngineeringA, 488 (2008) 205-213.) report a kind of on carbon/carbon compound material processing periodic rectangle groove, thus improve the research of itself and Ti-6Al-4V soldering joint strength.In paper, scientist proposes the mechanism that this periodicity groove alleviates welded stress.But same, the groove dimensions in this section of report is grade, and the edge of rectangle groove easily stress concentration occurs, and impels crackle to produce.On the other hand, to the pottery of large-size and the brazing of metallic substance, lack Joining Technology method that is effective, easy handling at present.
Summary of the invention
The object of this invention is to provide the processing method of a kind of pottery effectively can alleviating the residual thermal stress that welding joint is formed after soldering and metal, ceramic and Ceramic brazing, be intended to the residual stress distribution state improving brazed joint further, alleviate stress to concentrate and the tearing tendency produced, simplify the processing step of grade open slot soldering, reduce production cost.
Technical solution of the present invention is as follows:
A method for welding for pottery and metal, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the welding surface of pottery, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between pottery and the welding surface of metal, fill active solder, then carry out vacuum brazing.
Pottery and a ceramic method for welding, it is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the one-sided of ceramic welding surface, or process respectively periodically or acyclic open slot at the bilateral of ceramic welding surface, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after surface metalation to be welded.
A method for welding for pottery and ceramic matric composite, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the welding surface of pottery or ceramic matric composite, or simultaneously at welding surface processing periodic or acyclic open slot respectively that be ceramic and ceramic matric composite, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after pottery and ceramic matric composite surface metalation.
A method for welding for ceramic matric composite and ceramic matric composite, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the one-sided of welding surface of ceramic matric composite, or process respectively periodically or acyclic open slot at the bilateral of welding surface, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after ceramic matric composite surface metalation.
Preferably, seamlessly transit and narrow between two walls of described periodicity or aperiodicity open slot and bottom surface, open slot cross section is in nearly semicircle, tetragon, " U " shape or " V " shape; Parallel or arranged crosswise between groove with groove; Described arranged crosswise adopts groove to distribute as net shape with mutually vertical between groove.
Preferably, the proportionlity of described periodicity or aperiodicity open slot is d
1: d
2: h=1:0.05-0.4:0.05-0.4, wherein d
1=50 μm-500 μm.
In technique scheme, described welding surface is plane or curved surface.
The present invention has the following advantages and the technique effect of high-lighting: of the present invention for pottery and metal, pottery and pottery and ceramic and ceramic matric composite method for welding, by processing groove at ceramic surface to be welded, and use active solder to heat wetting to fill up groove.By such technique, make ceramic surface form multiple micron order groove, solder can be sprawled along groove under the effect of capillary force, increases the spreading area of solder at ceramic surface.Active solder reacts with pottery and is filled in micron dimensioned trenches, the thermal expansivity of its responding layer is between pottery to be welded and metal to be welded, effectively alleviate the stress concentration produced in process of cooling, greatly reduce pottery and the joint postwelding residual thermal stress formed after welding metal material brazing, the cracking phenomena occurred after avoiding material to connect.The open slot of processing seamlessly transits, and can effectively reduce stress concentration, thus alleviate the tearing tendency of hard brittle material.Open slot size is less, without the need to adding damascene block corresponding to shape in brazing process, effectively can simplify brazing process, reducing costs.The present invention is not only applicable to stupalith (as Al
2o
3pottery, Si
3n
4pottery, SiC ceramic etc.), also can be used for the connection between other high rigidity hard brittle material.
Accompanying drawing explanation
Fig. 1 is the pottery and metal welding surface (open slot is " U " shape) the syndeton schematic diagram that adopt technical solution of the present invention.
Fig. 2 is the open slot size relationship schematic diagram that welding surface processes.
Fig. 3 is the pottery and metal welding surface (open slot is " V " shape) the syndeton schematic diagram that adopt technical solution of the present invention.
Fig. 4 adopts the pottery of technical solution of the present invention and metal welding surface (open slot is near semicircle) syndeton schematic diagram.
Fig. 5 is the curve ceramic and the metal welding surface syndeton schematic diagram that adopt technical solution of the present invention.
Fig. 6 is the pottery and ceramic welding surface (open slot is located at one-sided ceramic surface) the syndeton schematic diagram that adopt technical solution of the present invention.
Fig. 7 is the pottery and ceramic welding surface (open slot is located at bilateral ceramic surface) the syndeton schematic diagram that adopt technical solution of the present invention.
Fig. 8 is the vertically arranged open slot structural representation of ceramic welding surface.
In figure: 1-pottery; 2-active solder; 3-metal; 4-open slot.
Embodiment
Below in conjunction with accompanying drawing, technical solution of the present invention is described in further detail:
A kind of pottery and metal that the present invention proposes or pottery and the method for welding of pottery, comprise pottery and metal, pottery and ceramic, ceramic and ceramic matric composite and ceramic matric composite and ceramic matric composite soldering; The core of these four kinds of method for welding processes periodically or acyclic open slot at ceramic welding surface (comprising pottery or ceramic matric composite surface), the processing of open slot can use laser (as femtosecond, psec and nanosecond laser), extraordinary electrical spark, machining etc. to remove the method for material, also can prepare when ceramic sintering.Pottery and metal, welding surface between pottery and pottery can be plane or curved surface.As shown in Figure 2, the distance between adjacent apertures groove is set to d
1, the width of open slot is set to d
2, the degree of depth of open slot is set to h, meets relation between three: d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm.It is d that the preferred proportion of described periodicity or aperiodicity open slot closes
1: d
2: h=1:0.05-0.4:0.05-0.4, wherein d
1=50 μm ~ 500 μm.
For pottery and solder bonding metal situation, fill the active solder chosen between ceramic surface to be welded after processing and metal, under selected active solder vacuum brazing technique condition, carry out vacuum brazing; Or ceramic surface to be welded after processing carries out metalized, and fill solder between ceramic surface to be welded after metalized and metal, under selected solder vacuum brazing technique condition, carry out vacuum brazing, realize the connection between pottery and metal.
For the situation of pottery with Ceramic brazing, process periodically or acyclic open slot at the one-sided of ceramic welding surface, or process respectively periodically or acyclic open slot at the bilateral of ceramic welding surface, fill the active solder chosen betwixt, or fill active solder to after pottery and ceramic matric composite surface metalation, under selected active solder vacuum brazing technique condition, carry out vacuum brazing, realize the connection between pottery and pottery.
For the situation of pottery with ceramic matric composite soldering, between welding surface, fill active solder carry out vacuum brazing, or carry out vacuum brazing to filling active solder after pottery and ceramic matric composite surface metalation.
For the situation of ceramic matric composite and ceramic matric composite soldering, between welding surface, fill active solder carry out vacuum brazing, or carry out vacuum brazing to filling active solder after ceramic matric composite surface metalation.
Ceramic surface periodicity of the present invention or aperiodicity open slot, its two wall and below seamlessly transit narrows, its cross section can in nearly semicircle, tetragon, " U " shape or " V " shape, each open slot is parallel to each other is distributed in ceramic surface to be welded, or mutually vertically distributes as net shape at ceramic surface to be welded.
Embodiment 1
As shown in Figure 1, at Al
2o
3pottery 1 surface working goes out the open slot 4 of through shape, and the width of open slot 4 is 10 μm, and the degree of depth of open slot 4 is 10 μm, is spaced apart 40 μm between open slot.Two walls of open slot and below seamlessly transit narrows, and its cross section is in " U " shape.
Then, directly at Al to be welded
2o
3ceramic surface 1 is placed through ultrasonic cleaning and the AgCu-Ti active solder foil 2 dried up with the interface of metallic substance 3, and metallic substance 3 is 304 stainless steels, and in AgCu-Ti active solder foil, the content of Ti is 2wt.%, and thickness is 30 μm;
Carry out vacuum brazing in stove, brazing temperature is 900 DEG C, and vacuum tightness is not less than 2 × 10
-2pa, is incubated 10 minutes, and rate of temperature fall controls, at 10 DEG C/min, to be cooled to room temperature, namely achieves the Al of 10mm × 10mm
2o
3connection between pottery and 304 stainless steels.Soldering joint strength is more than 60MPa, and intensity is increased to 3 times of planar interface joint.
Embodiment 2
As shown in Figure 6, at bilateral Al
2o
3pottery 1 surface working goes out the open slot 4 of through shape, and the width of open slot 4 is 200 μm, and the degree of depth of open slot 4 is 200 μm, is spaced apart 1000 μm between open slot.Two walls of open slot and below seamlessly transit narrows, and its cross section is in nearly semicircle, tetragon, " U " shape or " V " shape.
Then, directly at Al to be welded
2o
3pottery to be placed through ultrasonic cleaning and in AgCu-Ti active solder foil 2, the AgCu-Ti active solder foil dried up, the content of Ti is 2.0wt.% between 1 surface, and thickness is 400 μm.
Carry out vacuum brazing in stove, brazing temperature is 900 DEG C, and vacuum tightness is not less than 2 × 10
-2pa, is incubated 10 minutes, and rate of temperature fall controls, at 10 DEG C/min, to be cooled to room temperature, namely achieves the Al of 10mm × 10mm
2o
3pottery and Al
2o
3the connection of pottery.Strength of joint is more than 40MPa, and intensity is increased to 2 times of planar interface joint.
Claims (8)
1. a method for welding for pottery and metal, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the welding surface of pottery, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between pottery and the welding surface of metal, fill active solder, then carry out vacuum brazing.
2. pottery and a ceramic method for welding, it is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the one-sided of ceramic welding surface, or process respectively periodically or acyclic open slot at the bilateral of ceramic welding surface, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after surface metalation to be welded.
3. a method for welding for pottery and ceramic matric composite, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the welding surface of pottery or ceramic matric composite, or simultaneously at welding surface processing periodic or acyclic open slot respectively that be ceramic and ceramic matric composite, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after pottery and ceramic matric composite surface metalation.
4. a method for welding for ceramic matric composite and ceramic matric composite, is characterized in that, described method comprises the steps:
1) process periodically or acyclic open slot at the one-sided of welding surface of ceramic matric composite, or process respectively periodically or acyclic open slot at the bilateral of welding surface, the distance between adjacent apertures groove is d
1, the width of open slot is d
2, the degree of depth of open slot is h, d
1: d
2: h=1:0.05-1:0.05-1, wherein d
1=20 μm ~ 1000 μm;
2) between welding surface, fill active solder and carry out vacuum brazing, or carry out vacuum brazing to filling active solder after ceramic matric composite surface metalation.
5. according to the method for welding described in the arbitrary claim of Claims 1 to 4, it is characterized in that: seamlessly transit between two walls of described periodicity or aperiodicity open slot and bottom surface and narrow, open slot cross section is in nearly semicircle, tetragon, " U " shape or " V " shape; Parallel or arranged crosswise between groove with groove.
6. according to the method for welding described in the arbitrary claim of Claims 1 to 4, it is characterized in that: the proportionlity of described periodicity or aperiodicity open slot is d
1: d
2: h=1:0.05-0.4:0.05-0.4, wherein d
1=50 μm ~ 500 μm.
7. according to method for welding according to claim 5, it is characterized in that: described arranged crosswise adopts groove to distribute as net shape with mutually vertical between groove.
8. according to the method for welding described in the arbitrary claim of Claims 1 to 4, it is characterized in that: described welding surface is plane or curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510401552.8A CN105036783B (en) | 2015-07-09 | 2015-07-09 | A kind of method for welding of ceramics and metal or ceramics and ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510401552.8A CN105036783B (en) | 2015-07-09 | 2015-07-09 | A kind of method for welding of ceramics and metal or ceramics and ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105036783A true CN105036783A (en) | 2015-11-11 |
| CN105036783B CN105036783B (en) | 2018-07-17 |
Family
ID=54443832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510401552.8A Active CN105036783B (en) | 2015-07-09 | 2015-07-09 | A kind of method for welding of ceramics and metal or ceramics and ceramics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105036783B (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108299004A (en) * | 2018-02-06 | 2018-07-20 | 中国科学院上海硅酸盐研究所 | A method of alleviating porous silicon nitride ceramic and transparent aluminium oxynitride ceramic joining process thermal stress |
| CN108381053A (en) * | 2018-02-02 | 2018-08-10 | 厦门祐尼三的新材料科技有限公司 | A kind of processing method of ceramics 3D cover boards, electronic equipment |
| CN108929115A (en) * | 2017-05-27 | 2018-12-04 | 天津大学 | Method based on the modified raising solder wetting performance in carbon carbon composite surface |
| CN109081702A (en) * | 2018-08-14 | 2018-12-25 | 常熟理工学院 | A kind of method of carbon fibre composite plate and ceramic board welding |
| CN110317046A (en) * | 2019-07-11 | 2019-10-11 | 武汉重远炉窑工程技术服务有限公司 | A kind of magnesia high-temperature ceramic soldering material |
| CN110734297A (en) * | 2019-11-14 | 2020-01-31 | 上海富驰高科技股份有限公司 | Method for connecting ceramic and metal and joint structure |
| CN110734298A (en) * | 2018-12-31 | 2020-01-31 | 深圳硅基仿生科技有限公司 | Brazing structure of ceramic and metal |
| CN112552068A (en) * | 2020-11-26 | 2021-03-26 | 西安鑫垚陶瓷复合材料有限公司 | Protection tool and method for rivet welding of C/SiC-ZrC and C/SiC ceramic matrix composite |
| CN113275683A (en) * | 2021-03-29 | 2021-08-20 | 南京工程学院 | Preparation method of metal ceramic composite material with overlapped double bionic structures |
| WO2021196004A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市合众清洁能源研究 | Method for strengthening joining performance of ceramic material by means of texturing |
| CN114178640A (en) * | 2021-09-24 | 2022-03-15 | 中国航发北京航空材料研究院 | Thermal shock-resistant graphite and metal brazing method |
| CN114380614A (en) * | 2022-01-17 | 2022-04-22 | 杨晓战 | High-etching-precision ceramic metal-clad plate, preparation method and chip packaging module |
| CN115557798A (en) * | 2022-09-28 | 2023-01-03 | 华中科技大学 | AlN ceramic copper-clad substrate with firmly combined copper layer and ceramic substrate and preparation method thereof |
| CN116496098A (en) * | 2022-01-18 | 2023-07-28 | 上海富乐华半导体科技有限公司 | Ceramic substrate with metal coated on both sides and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160090A (en) * | 1990-09-21 | 1992-11-03 | Schwarzkopf Technologies Corporation | Method of making high-strength brazed joints |
| CN101935226A (en) * | 2010-08-31 | 2011-01-05 | 中国航空工业集团公司北京航空材料研究院 | Process for soldering SiO2f/SiO2 composite ceramic and metal material |
-
2015
- 2015-07-09 CN CN201510401552.8A patent/CN105036783B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160090A (en) * | 1990-09-21 | 1992-11-03 | Schwarzkopf Technologies Corporation | Method of making high-strength brazed joints |
| CN101935226A (en) * | 2010-08-31 | 2011-01-05 | 中国航空工业集团公司北京航空材料研究院 | Process for soldering SiO2f/SiO2 composite ceramic and metal material |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108929115A (en) * | 2017-05-27 | 2018-12-04 | 天津大学 | Method based on the modified raising solder wetting performance in carbon carbon composite surface |
| CN108381053A (en) * | 2018-02-02 | 2018-08-10 | 厦门祐尼三的新材料科技有限公司 | A kind of processing method of ceramics 3D cover boards, electronic equipment |
| CN108381053B (en) * | 2018-02-02 | 2020-11-03 | 厦门祐尼三的新材料科技有限公司 | Processing method of ceramic 3D cover plate and electronic equipment |
| CN108299004A (en) * | 2018-02-06 | 2018-07-20 | 中国科学院上海硅酸盐研究所 | A method of alleviating porous silicon nitride ceramic and transparent aluminium oxynitride ceramic joining process thermal stress |
| CN108299004B (en) * | 2018-02-06 | 2020-12-11 | 中国科学院上海硅酸盐研究所 | Method for relieving thermal stress in connection process of porous silicon nitride ceramic and transparent aluminum oxynitride ceramic |
| CN109081702B (en) * | 2018-08-14 | 2021-06-08 | 常熟理工学院 | Method for welding carbon fiber composite material plate and ceramic plate |
| CN109081702A (en) * | 2018-08-14 | 2018-12-25 | 常熟理工学院 | A kind of method of carbon fibre composite plate and ceramic board welding |
| CN110734298A (en) * | 2018-12-31 | 2020-01-31 | 深圳硅基仿生科技有限公司 | Brazing structure of ceramic and metal |
| CN110317046A (en) * | 2019-07-11 | 2019-10-11 | 武汉重远炉窑工程技术服务有限公司 | A kind of magnesia high-temperature ceramic soldering material |
| CN110317046B (en) * | 2019-07-11 | 2021-12-24 | 武汉重远炉窑工程技术服务有限公司 | Magnesia high-temperature ceramic welding material |
| CN110734297A (en) * | 2019-11-14 | 2020-01-31 | 上海富驰高科技股份有限公司 | Method for connecting ceramic and metal and joint structure |
| WO2021196004A1 (en) * | 2020-03-31 | 2021-10-07 | 深圳市合众清洁能源研究 | Method for strengthening joining performance of ceramic material by means of texturing |
| CN112552068A (en) * | 2020-11-26 | 2021-03-26 | 西安鑫垚陶瓷复合材料有限公司 | Protection tool and method for rivet welding of C/SiC-ZrC and C/SiC ceramic matrix composite |
| CN112552068B (en) * | 2020-11-26 | 2022-12-20 | 西安鑫垚陶瓷复合材料有限公司 | Protection tool and method for rivet welding of C/SiC-ZrC and C/SiC ceramic matrix composite |
| CN113275683A (en) * | 2021-03-29 | 2021-08-20 | 南京工程学院 | Preparation method of metal ceramic composite material with overlapped double bionic structures |
| CN114178640A (en) * | 2021-09-24 | 2022-03-15 | 中国航发北京航空材料研究院 | Thermal shock-resistant graphite and metal brazing method |
| CN114380614A (en) * | 2022-01-17 | 2022-04-22 | 杨晓战 | High-etching-precision ceramic metal-clad plate, preparation method and chip packaging module |
| CN116496098A (en) * | 2022-01-18 | 2023-07-28 | 上海富乐华半导体科技有限公司 | Ceramic substrate with metal coated on both sides and preparation method thereof |
| CN115557798A (en) * | 2022-09-28 | 2023-01-03 | 华中科技大学 | AlN ceramic copper-clad substrate with firmly combined copper layer and ceramic substrate and preparation method thereof |
| CN115557798B (en) * | 2022-09-28 | 2024-02-09 | 华中科技大学 | AlN ceramic copper-clad substrate with firmly combined copper layer and ceramic substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105036783B (en) | 2018-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105036783A (en) | Method for brazing ceramic and metal or ceramic and ceramic | |
| CN101935226B (en) | Process for soldering SiO2f/SiO2 composite ceramic and metal material | |
| CN103273155B (en) | Diffusion bonding method of silicon carbide ceramics and ferritic stainless steel | |
| CN105346161B (en) | A kind of preparation method of tungsten/transition zone/steel composite material and its low-temp low-pressure activity diffusion connection | |
| CN105967759B (en) | A kind of rare-earth oxide modified Si-Mo-O gradient antioxidant coating and preparation method | |
| CN102430829B (en) | Method for raising brazing strength for ZrB2-based material | |
| CN105272369B (en) | A kind of porous ceramics connection method | |
| CN108546095A (en) | A kind of method that oxide ceramics is welded to connect with metal | |
| CN110330356B (en) | Silicon carbide ceramic brazing connection method | |
| CN105418131A (en) | Alumina ceramic low temperature brazing connection method | |
| CN104058772A (en) | Ceramic composite material substrate and manufacturing technology thereof | |
| CN102924110B (en) | Method for brazing SiO2f/SiO2 composite ceramic and metal material | |
| CN105149717A (en) | Silicon-based ceramic surface metallization method | |
| CN103331499B (en) | Method for brazing ZrB2-SiC composite ceramic material by using Pd-Co-Ni brazing filler metals | |
| CN103981382A (en) | Preparation method of high heat-conducting diamond/copper-based composite material | |
| CN102689108A (en) | Composite brazing material for connecting Si3N4 ceramic and 42CrMo steel and brazing method by using same | |
| CN105585326B (en) | A kind of technique of nanometer of foil diffusion connection carbon/silicon carbide ceramic matrix composite | |
| CN102260088A (en) | Low-stress low-temperature ceramic brazing method | |
| CN103613388B (en) | Method for low-temperature synthesis of TiB2-Ti ceramic composite material | |
| Wang et al. | The preparation and mechanical properties of carbon/carbon composite joints using Ti–Si–SiC–C filler as interlayer | |
| CN104690385A (en) | Composite interlayer and method for brazing metal with ceramic and ceramic matrix composite material by utilizing same | |
| CN107825806A (en) | A kind of preparation method of titanium/titanium carbide laminated composite materials | |
| CN103341675B (en) | Method for braze welding of Cf/SiC composite material and metal Nb by using Ti-Co-Nb brazing filler metal | |
| CN104496511B (en) | A kind of online reaction forming method of ceramic form | |
| JP5764506B2 (en) | Ceramic porous body-metal heat insulating material and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |