CN105023883A - Plastic package and preparation method thereof - Google Patents
Plastic package and preparation method thereof Download PDFInfo
- Publication number
- CN105023883A CN105023883A CN201410177641.4A CN201410177641A CN105023883A CN 105023883 A CN105023883 A CN 105023883A CN 201410177641 A CN201410177641 A CN 201410177641A CN 105023883 A CN105023883 A CN 105023883A
- Authority
- CN
- China
- Prior art keywords
- resin material
- packaging layer
- plastic package
- chip
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 135
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 89
- 238000004806 packaging method and process Methods 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000011347 resin Substances 0.000 claims abstract description 64
- 239000000835 fiber Substances 0.000 claims description 32
- 238000012856 packing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 2
- 230000032798 delamination Effects 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000206 moulding compound Substances 0.000 description 3
- 230000029058 respiratory gaseous exchange Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- -1 such chip Substances 0.000 description 1
Abstract
The invention relates to a plastic package and a preparation method thereof. The plastic package comprises a chip 1, a supporting piece 2 used for supporting the chip and a packaging shell 5. The packaging shell 5 comprises a first plastic package layer 3 which coats the chip 1 so as to enable the chip 1 to be sealed and a second plastic package layer 4 which coats the first plastic package layer 3 so as to enable the first plastic package layer 3 to be sealed, wherein the first plastic package layer 3 is made of a first resin material; the second plastic package layer 4 is made of a second resin material; and an equivalent thermal expansion coefficient of the first resin material is less than an equivalent thermal expansion coefficient of the second resin material. The plastic package provided by the invention is wide in material selection range, and can reduce delamination and failure of products, thereby improving the reliability of the products.
Description
Technical field
The present invention relates to a kind of Plastic Package and preparation method thereof.
Background technology
Along with making rapid progress of electronic science and technology, semi-conductor industry process is also constantly developing.In recent years, Electronic Packaging to high density, lightweight, narrow pitch, low distribution, multi-functional, be applicable to surface install future development.Divide from encapsulation material used, Electronic Packaging mainly can be divided into metallic packaging, ceramic packaging and Plastic Package.The above two belong to air-tight packaging, have very high reliability, but due to high cost, these two kinds of packing forms are used for Aero-Space etc. have high performance requirements field to device.Plastic Package belongs to non-airtight encapsulation, this packing forms compared to two kinds of form reliabilities are lower above, but due to its cost low, technique is simple, is widely used in the life of people.At present, Plastic Package has become the main flow on market, is widely used in civilian consumer electronics product field.
Traditional material require for Plastic Package has following characteristics: good insulating properties, Acclimation temperature ability, capability of resistance to radiation, thermal coefficient of expansion (CTE), adhesiveness good between good chemical stability and strutting piece material, good compactness and the low cost etc. that are close with the material of contacted chip and strutting piece.Based on above feature, the material of traditional Plastic Package is mainly thermosetting epoxy resin.The advantage of epoxy resin is that electrical properties is excellent, mechanical strength good, shaping after-contraction is little, chemical resistance good, has certain radioresistance moisture resistant ability, withstand temperature high.But its shortcoming is exactly poor with the adhesiveness of the chip that contacts during encapsulation and strutting piece, and with the chip contacted during encapsulation and in order to supporting chip strutting piece between thermal coefficient of expansion be difficult to mate.
So-called inefficacy refers to that product loses design function originally.In the industrial production, the form of product failure is varied, but delamination inefficacy is a kind of ubiquitous failure mode.Delamination was lost efficacy mainly because the thermal coefficient of expansion of plastic packaging material does not mate with the thermal coefficient of expansion between substrate or lead frame, at high temperature produced and came off, and caused losing efficacy.In addition, due to the moisture resistant scarce capacity of plastic packaging material, steam enter the generation that also can cause delamination inefficacy or puffed rice phenomenon.Moreover, because the adhesiveness of the chip that contacts when epoxy resin and encapsulation and substrate or lead frame is poor, delamination also can be caused to lose efficacy.Delamination was lost efficacy seriously affects the reliability of Electronic Packaging, causes huge loss to enterprise.
Therefore, how can reduce product delamination to lose efficacy the research further thus Plastic Package of reliability improving product needs.
Summary of the invention
Object of the present invention easily produces delamination inefficacy to overcome Plastic Package of the prior art, thus reduces the problem of the reliability of product, provides a kind of and can reduce product delamination inefficacy thus the Plastic Package of the reliability of raising product.
The invention provides a kind of Plastic Package, this Plastic Package comprises chip, in order to the strutting piece 2 of supporting chip 1 and encapsulating housing 5, wherein, described encapsulating housing 5 comprises the second plastic packaging layer 4 that coating chip 1 seals to make the first plastic packaging layer 3 with the first plastic packaging layer 3 making chip 1 seal and coated first plastic packaging layer 3, wherein, described first plastic packaging layer 3 is made up of the first resin material; Described second plastic packaging layer 4 is made up of the second resin material; And the fiber yarn of described first resin material is less than the fiber yarn of described second resin material.
Present invention also offers a kind of method preparing Plastic Package, the method comprises the following steps:
A, chip 1 is mounted on strutting piece 2;
B, the first plastic packaging layer 3 to be coated on described chip 1 to realize the sealing of described chip 1;
C, the second plastic packaging layer 4 to be coated on described first plastic packaging layer 3 to realize the sealing of described first plastic packaging layer 3.
In the present invention, the present inventor finds through a large amount of scientific researches: traditional chip structure is chip, silver slurry (or Heraeus) and substrate (or nail frame) directly contact with moulding compound, such chip, silver are starched between (or Heraeus) and substrate (or nail frame) and moulding compound and just be there will be because caking property is inadequate, and thermal coefficient of expansion does not mate and the suction of steam causes lamination.The first plastic packaging layer that the present inventor adopts bi-material to prepare and the second plastic packaging layer replace the moulding compound being only a kind of material to encapsulate, and the first plastic packaging layer is directly directly contacted with chip, substrate etc., second plastic packaging layer is in the outside of the first plastic packaging layer, directly contact with air, and the fiber yarn preparing the first resin material of described first plastic packaging layer 3 is less than the fiber yarn of the second resin material preparing described second plastic packaging layer 4.Plastic Package of the present invention and adopt method of the present invention to prepare Plastic Package compared to traditional Plastic Package, owing to introducing the first plastic packaging layer, chip, substrate etc. can be made better with the associativity of the first plastic packaging layer, improve the mismatch problem of thermal coefficient of expansion, stress can be made greatly to reduce, improve overall reliability; In addition, due to the introducing of the second plastic packaging layer, improve the abilities such as the mechanical performance of chip, anticorrosive, water resistant gas, make package interior can not occur puffed rice phenomenon because of steam expanded by heating, also improve overall reliability; In addition, owing to introducing bi-material to replace original a kind of molding compound material to carry out moulding technology, by originally needing the key element concentrated on a kind of material to be distributed on bi-material, the selection space of material is greatly improved.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification, is used from explanation the present invention, but is not construed as limiting the invention with embodiment one below.In the accompanying drawings:
Fig. 1 is the cross-sectional view of the Plastic Package of Outline Package form of the prior art;
Fig. 2 is the cross-sectional view of the Plastic Package of Outline Package form provided by the invention;
Fig. 3 is the cross-sectional view of the Plastic Package of ball grid array structure packing forms of the prior art;
Fig. 4 is the cross-sectional view of the Plastic Package of ball grid array structure packing forms provided by the invention.
Description of reference numerals
1, chip 2, strutting piece
3, the first plastic packaging layer 4, second plastic packaging layer
5, encapsulating housing
Embodiment
Below the specific embodiment of the present invention is described in detail.Should be understood that, embodiment described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
Term used in the specification and claims and word, should not be understood to be limited to Typical values or dictionary definition, and be interpreted as having the implication relevant to the technology of the present invention field and the such principle of concept, the concept of term can be defined according to this principle inventor rightly, carry out to describe the most rightly the best approach that he or she knows and implement the present invention.
In the present invention, term " strutting piece " refers in encapsulation process, and in order to the object of supporting chip, when Outline Package (SOP), described " strutting piece " refers to lead frame; When ball grid array structure encapsulation (BGA), described " strutting piece " refers to substrate.
Usually, term " thermal coefficient of expansion " refers to the breathing phenomenon that object produces due to temperature change, and during expanded by heating, the expansion rate that its changing capability changes with unit temperature represents.In the present invention, the breathing phenomenon of other material except resin material is represented with term " thermal coefficient of expansion ".And term " fiber yarn " is made up of two parts due to the thermal coefficient of expansion of resin material, when temperature is less than glass transition temperature, thermal coefficient of expansion is less, is generally about 10ppm; When temperature is greater than glass transition temperature, thermal coefficient of expansion is very large, is generally tens ppm, therefore two sections of thermal coefficient of expansion equivalences is become to press the value of temperature-averaging, i.e. fiber yarn.In the present invention, the breathing phenomenon of resin material is represented with term " fiber yarn ".
The invention provides a kind of Plastic Package, this Plastic Package comprises chip 1, in order to the strutting piece 2 of supporting chip 1 and encapsulating housing 5, wherein, described encapsulating housing 5 comprises the second plastic packaging layer 4 that coating chip 1 seals to make the first plastic packaging layer 3 with the first plastic packaging layer 3 making chip 1 seal and coated first plastic packaging layer 3, wherein, described first plastic packaging layer 3 is made up of the first resin material; Described second plastic packaging layer 4 is made up of the second resin material; And the fiber yarn of described first resin material is less than the fiber yarn of described second resin material.
According to the present invention, the material for described strutting piece 2 is not particularly limited, the material that can be well known to those skilled in the art; And the shape of described strutting piece 2 is also not particularly limited, as long as described chip 1 can be supported, can be structure as a whole (that is, substrate), also can be non-integral structure (that is, lead frame).
According to the present invention, described first resin material and described second resin material are not particularly limited, can resin material well-known to those skilled in the art, preferably, for the requirement of the first resin material of the described first plastic packaging layer 3 of preparation, mainly adhesion strength is good, the fiber yarn of described first resin material and the matched coefficients of thermal expansion of the material directly contacted are well, do not need particularly preferred mechanical strength, strong chemical resistance, the moist ability of good radioresistance etc., like this, on the one hand due to described first plastic packaging layer 3 and chip, the material binding intensity such as substrate are well not easy to occur shearing or drawing inefficacy, on the other hand owing to preparing fiber yarn and the chip of the first resin material of described first plastic packaging layer 3, the matched coefficients of thermal expansion of the materials such as substrate is good, the stress produced due to the expansion between different materials in heating process can be reduced, serious delamination would not be there is like this in baking process process.Preferably, for the requirement radioresistance moisture resistant ability etc. that mainly mechanical strength is good, chemical resistance is good, good of the second resin material of preparation second plastic packaging layer 4, and, due to prepare the first plastic packaging layer 3 the first resin material and preparation the second plastic packaging layer 4 the second resin material be all organic material, so for the fiber yarn of the second resin material and the selection of adhesion strength very extensive.
Preferably, described first resin material and described second resin material are thermoset resin material;
More preferably, described first resin material and described second resin material are thermosetting epoxy resin separately.
According to the present invention, described thermosetting epoxy resin is not particularly limited, the thermosetting epoxy resin that can be used as Plastic Package that can be well known to those skilled in the art.
According to the present invention, the thickness for described first plastic packaging layer 3 is not particularly limited, and can determine according to the experience of those skilled in the art, as long as described chip 1 can be coated with, described chip 1 is sealed; In like manner, the thickness for described second plastic packaging layer 4 is not particularly limited, and can determine according to the experience of those skilled in the art, as long as described first plastic packaging layer 3 can be coated with, described first plastic packaging layer 3 is sealed.
According to the present invention, various packing forms as integrated antenna package may be used for described Plastic Package all without restriction, preferably, the packing forms of described Plastic Package is one or more in the encapsulation of dip, Outline Package, Flat type packaged and ball grid array structure.
According to the present invention, the difference of the fiber yarn of described second resin material and the fiber yarn of described first resin material can be 3 × 10
-6/ DEG C-15 × 10
-6/ DEG C, preferably, the difference of the fiber yarn of described second resin material and the fiber yarn of described first resin material is 5 × 10
-6/ DEG C-12 × 10
-6/ DEG C, more preferably, the difference of the fiber yarn of described second resin material and the fiber yarn of described first resin material is 8 × 10
-6/ DEG C-10 × 10
-6/ DEG C.
According to the present invention, the fiber yarn of described second resin material is 10 × 10
-6/ DEG C-30 × 10
-6/ DEG C, be preferably 12 × 10
-6/ DEG C-20 × 10
-6/ DEG C, be more preferably 15 × 10
-6/ DEG C-18 × 10
-6/ DEG C.
Present invention also offers a kind of method preparing Plastic Package, the method comprises the following steps:
A, chip 1 is mounted on strutting piece 2;
B, the first plastic packaging layer 3 to be coated on described chip 1 to realize the sealing of described chip 1;
C, the second plastic packaging layer 4 to be coated on described first plastic packaging layer 3 to realize the sealing of described first plastic packaging layer 3.
According to the present invention, the material of described strutting piece 2, prepare the first resin material of described first plastic packaging layer 3 and prepare the second resin material of described second plastic packaging layer 4; The fiber yarn of described first resin material and described second resin material; The thickness of described first plastic packaging layer 3 and described second plastic packaging layer 4; And the packing forms of described Plastic Package etc. is all same as described above, does not repeat them here.
Below with reference to accompanying drawing, the preferred embodiment of the present invention is described in detail.
Describe the present invention for the Plastic Package of the packing forms of the Plastic Package of Outline Package form (SOP) and ball grid array structure packing forms below.
As shown in Figure 1, Fig. 1 is the cross-sectional view of the Plastic Package of Outline Package form of the prior art, as shown in Figure 1, this Plastic Package is only made up of one deck plastic packaging layer, not only need the thermal coefficient of expansion considering this Plastic Package, that also need to consider this Plastic Package and substrate with adhesive property that is chip, but also need mechanical strength, the corrosion resistance and water resistant gas ability etc. of considering this Plastic Package, therefore, very harsh to the selection of the material making this Plastic Package.
As shown in Figure 2, Fig. 2 is the cross-sectional view of the Plastic Package of Outline Package form provided by the invention, as shown in Figure 2, this Plastic Package comprises chip 1, in order to the strutting piece 2 of supporting chip 1 and encapsulating housing 5, wherein, described encapsulating housing 5 comprises the second plastic packaging layer 4 that coating chip 1 seals to make the first plastic packaging layer 3 with the first plastic packaging layer 3 making chip 1 seal and coated first plastic packaging layer 3, and wherein, described first plastic packaging layer 3 is made up of the first resin material; Described second plastic packaging layer 4 is made up of the second resin material; And the fiber yarn of described first resin material is less than the fiber yarn of described second resin material.Because the fiber yarn of described first resin material is lower, be between chip and strutting piece material, as far as possible close with the thermal coefficient of expansion of chip, therefore avoid produce stress because difference of thermal expansion coefficients is excessive in baking process; Described second plastic packaging layer 4 is wrapped in the outside of described first plastic packaging layer 3; mainly play the effect of protection; described second plastic packaging layer 4 does not directly contact with chip 1, strutting piece 2 (lead frame); so; the selection space of the fiber yarn of described second resin material is larger; as long as higher than the fiber yarn of described first resin material, can as far as possible close to the stress that the thermal coefficient of expansion of strutting piece produces to reduce thermal mismatching.
Like this, described first resin material can be realized on the one hand better mate with the thermal coefficient of expansion between chip and strutting piece and better bond, can ensure that described second resin material has good mechanical performance, corrosion resistance and water resistant gas ability on the other hand, thus the reliability reducing delamination inefficacy and raising product can be realized.
As shown in Figure 3, Fig. 3 is the cross-sectional view of the Plastic Package of ball grid array structure packing forms of the prior art, as shown in Figure 3, the structure of this Plastic Package is identical with the structure of the Plastic Package shown in Fig. 1, institute's difference is, (namely strutting piece 2 in Fig. 3 is structure as a whole, when ball grid array structure encapsulation (BGA), strutting piece 2 is substrate), and the strutting piece 2 shown in Fig. 1 be non-integral structure (namely, when Outline Package (SOP), strutting piece 2 is lead frame).
As shown in Figure 4, Fig. 4 is the cross-sectional view of the Plastic Package of ball grid array structure packing forms provided by the invention, as shown in Figure 4, the structure of this Plastic Package is identical with the structure of the Plastic Package shown in Fig. 2, institute's difference is, (namely strutting piece 2 in Fig. 4 is structure as a whole, when ball grid array structure encapsulation (BGA), strutting piece 2 is substrate), and the strutting piece 2 shown in Fig. 2 be non-integral structure (namely, when Outline Package (SOP), strutting piece 2 is lead frame).
Therefore, in the present invention, the maximum difference between the Plastic Package of above-mentioned Outline Package form and the Plastic Package of ball grid array structure packing forms is that strutting piece 2 adopts lead frame or substrate.In addition, those with the Plastic Package of Outline Package form of the present invention and the overlapping description of the content of the Plastic Package of ball grid array structure packing forms will be omitted.
More than describe the specific embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned execution mode, within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each the concrete technical characteristic described in above-mentioned embodiment, in reconcilable situation, can be combined by any suitable mode.In order to avoid unnecessary repetition, the present invention illustrates no longer separately to various possible compound mode.
In addition, also can carry out combination in any between various different execution mode of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (8)
1. a Plastic Package, this Plastic Package comprises chip (1), in order to the strutting piece (2) of supporting chip (1) and encapsulating housing (5), it is characterized in that, described encapsulating housing (5) comprises coating chip (1) with the first plastic packaging layer (3) making chip (1) seal and coated first plastic packaging layer (3) with the second plastic packaging layer (4) making the first plastic packaging layer (3) seal, wherein, described first plastic packaging layer (3) is made up of the first resin material; Described second plastic packaging layer (4) is made up of the second resin material, and the fiber yarn of described first resin material is less than the fiber yarn of described second resin material.
2. Plastic Package according to claim 1, wherein, described first resin material and described second resin material are thermoset resin material.
3. Plastic Package according to claim 2, wherein, described first resin material and described second resin material are thermosetting epoxy resin separately.
4. Plastic Package according to claim 1, wherein, the packing forms of described Plastic Package is one or more in the encapsulation of dip, Outline Package, Flat type packaged and ball grid array structure.
5. according to the Plastic Package in claim 1-4 described in any one, wherein, the difference of the fiber yarn of described second resin material and the fiber yarn of described first resin material is 3 × 10
-6/ DEG C-15 × 10
-6/ DEG C.
6. Plastic Package according to claim 5, wherein, the difference of the fiber yarn of described second resin material and the fiber yarn of described first resin material is 5 × 10
-6/ DEG C-12 × 10
-6/ DEG C.
7. the Plastic Package according to claim 1 or 6, wherein, the fiber yarn of described second resin material is 10 × 10
-6/ DEG C-30 × 10
-6/ DEG C, be preferably 12 × 10
-w/ DEG C-20 × 10
-6/ DEG C.
8. the preparation method of the Plastic Package in claim 1-7 described in any one, the method comprises the following steps:
A, by chip (1) attachment on strutting piece (2);
B, the first plastic packaging layer (3) to be coated on described chip (1) to realize the sealing of described chip (1);
C, the second plastic packaging layer (4) to be coated on described first plastic packaging layer (3) to realize the sealing of described first plastic packaging layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410177641.4A CN105023883B (en) | 2014-04-29 | 2014-04-29 | A kind of Plastic Package and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410177641.4A CN105023883B (en) | 2014-04-29 | 2014-04-29 | A kind of Plastic Package and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105023883A true CN105023883A (en) | 2015-11-04 |
| CN105023883B CN105023883B (en) | 2018-09-14 |
Family
ID=54413743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410177641.4A Active CN105023883B (en) | 2014-04-29 | 2014-04-29 | A kind of Plastic Package and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105023883B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401367A (en) * | 2018-02-26 | 2018-08-14 | 广州致远电子有限公司 | Plastic packaging electronic module and preparation method thereof |
| CN110429067A (en) * | 2019-07-23 | 2019-11-08 | 中国科学技术大学 | Fit structure and Package boxes for Superconducting Quantum Processor encapsulation |
| CN110648928A (en) * | 2019-09-12 | 2020-01-03 | 广东佛智芯微电子技术研究有限公司 | Fan-out type packaging structure and packaging method for reducing plastic deformation of chip |
| CN110676183A (en) * | 2019-10-10 | 2020-01-10 | 广东佛智芯微电子技术研究有限公司 | Fan-out type packaging method for reducing plastic deformation of chip |
| CN110676180A (en) * | 2019-09-12 | 2020-01-10 | 广东佛智芯微电子技术研究有限公司 | Chip fan-out type packaging structure and packaging method |
| CN110739277A (en) * | 2019-09-11 | 2020-01-31 | 珠海格力电器股份有限公司 | kinds of packaging structure and manufacturing method thereof |
| CN113054085A (en) * | 2020-04-22 | 2021-06-29 | 深圳市聚飞光电股份有限公司 | LED illuminating part and illuminating device |
| CN114449792A (en) * | 2020-10-30 | 2022-05-06 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6315936B1 (en) * | 1997-12-05 | 2001-11-13 | Advanced Micro Devices, Inc. | Encapsulation method using non-homogeneous molding compound pellets |
| CN1736742A (en) * | 2004-08-21 | 2006-02-22 | 三星Techwin株式会社 | Vehicle tire with RFID tag |
| CN1750256A (en) * | 2004-09-16 | 2006-03-22 | 夏普株式会社 | Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
| CN101174598A (en) * | 2006-10-23 | 2008-05-07 | 恩益禧电子股份有限公司 | Electronic device and method of manufacturing the same |
| US20120248616A1 (en) * | 2011-03-31 | 2012-10-04 | Fujitsu Limited | Electronic component, electronic equipment, and soldering paste |
-
2014
- 2014-04-29 CN CN201410177641.4A patent/CN105023883B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6315936B1 (en) * | 1997-12-05 | 2001-11-13 | Advanced Micro Devices, Inc. | Encapsulation method using non-homogeneous molding compound pellets |
| CN1736742A (en) * | 2004-08-21 | 2006-02-22 | 三星Techwin株式会社 | Vehicle tire with RFID tag |
| CN1750256A (en) * | 2004-09-16 | 2006-03-22 | 夏普株式会社 | Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
| CN101174598A (en) * | 2006-10-23 | 2008-05-07 | 恩益禧电子股份有限公司 | Electronic device and method of manufacturing the same |
| US20120248616A1 (en) * | 2011-03-31 | 2012-10-04 | Fujitsu Limited | Electronic component, electronic equipment, and soldering paste |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401367A (en) * | 2018-02-26 | 2018-08-14 | 广州致远电子有限公司 | Plastic packaging electronic module and preparation method thereof |
| CN108401367B (en) * | 2018-02-26 | 2020-08-14 | 广州致远电子有限公司 | Plastic package electronic module and manufacturing method thereof |
| CN110429067A (en) * | 2019-07-23 | 2019-11-08 | 中国科学技术大学 | Fit structure and Package boxes for Superconducting Quantum Processor encapsulation |
| CN110739277A (en) * | 2019-09-11 | 2020-01-31 | 珠海格力电器股份有限公司 | kinds of packaging structure and manufacturing method thereof |
| CN110648928A (en) * | 2019-09-12 | 2020-01-03 | 广东佛智芯微电子技术研究有限公司 | Fan-out type packaging structure and packaging method for reducing plastic deformation of chip |
| CN110676180A (en) * | 2019-09-12 | 2020-01-10 | 广东佛智芯微电子技术研究有限公司 | Chip fan-out type packaging structure and packaging method |
| CN110676183A (en) * | 2019-10-10 | 2020-01-10 | 广东佛智芯微电子技术研究有限公司 | Fan-out type packaging method for reducing plastic deformation of chip |
| CN113054085A (en) * | 2020-04-22 | 2021-06-29 | 深圳市聚飞光电股份有限公司 | LED illuminating part and illuminating device |
| CN114449792A (en) * | 2020-10-30 | 2022-05-06 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105023883B (en) | 2018-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105023883A (en) | Plastic package and preparation method thereof | |
| EP2455991A4 (en) | Led chip assembly, led package, and manufacturing method of led package | |
| WO2008030508A3 (en) | Light emitting packages and methods of making same | |
| CN101752327B (en) | Semiconductor packaging piece with heat dissipation structure | |
| JP2014027272A5 (en) | ||
| CN102163590A (en) | Three-dimensional multi-chip encapsulation module based on buried substrate and method | |
| CN204375722U (en) | A kind of semiconductor package | |
| US20090140425A1 (en) | Chip Package | |
| CN106449778B (en) | Photoelectrical coupler encapsulating structure for large-scale integrated | |
| CN104810462A (en) | ESOP8 lead frame of medium-and high-power LED driving chip | |
| CN113241339B (en) | High-power silicon carbide diode and manufacturing method thereof | |
| CN202633053U (en) | Multi-core-set ceramic capacitor | |
| CN201478293U (en) | Airtight Seal Structure for Flip Chip Bonding | |
| CN105097722B (en) | Semiconductor packaging structure and packaging method | |
| CN206559780U (en) | Integrated cavity equipment for microwave circuit | |
| CN207781576U (en) | A kind of chip-packaging structure | |
| CN211350243U (en) | Insulation breakdown-resistant thermistor for electric meter | |
| CN107731764A (en) | A kind of semiconductor package | |
| CN108899306A (en) | A kind of integrated circuit plastics seal structure and preparation method thereof | |
| CN207503960U (en) | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding | |
| CN202633373U (en) | LED packaging device having local isolating structure | |
| CN105406352A (en) | Device and method for reducing power consumption of light emitting assembly with refrigeration function | |
| CN106847713B (en) | The method and fan-out package structure of roll-to-roll production fan-out package structure | |
| CN107801320A (en) | Encapsulating structure and its manufacture method between a kind of component and printed circuit board (PCB) | |
| CN110491839A (en) | A kind of radio-frequency devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231124 Address after: Room 201, 1st and 2nd floors, Building 3, No. 16 Yongchang Middle Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing, 100176 Patentee after: Beijing Xinli Technology Innovation Center Co.,Ltd. Address before: 100084 No. 1 Tsinghua Yuan, Beijing, Haidian District Patentee before: TSINGHUA University |