CN114449792A - Shell, manufacturing method thereof and electronic equipment - Google Patents
Shell, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN114449792A CN114449792A CN202011197510.4A CN202011197510A CN114449792A CN 114449792 A CN114449792 A CN 114449792A CN 202011197510 A CN202011197510 A CN 202011197510A CN 114449792 A CN114449792 A CN 114449792A
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- Prior art keywords
- layer
- housing
- wrapping
- core layer
- core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
Abstract
The application discloses casing and preparation method, electronic equipment thereof, wherein, the casing includes: a core layer and a wrapping layer; the packaging layer defines a closed space, and the core layer is filled in the closed space; wherein the core layer has a first coefficient of thermal expansion greater than a second coefficient of thermal expansion of the cladding layer. Through above-mentioned mode, this application can provide technical support for improving the intensity of whole casing periphery.
Description
Technical Field
The present disclosure relates to the field of housing technologies, and in particular, to a housing, a manufacturing method thereof, and an electronic device.
Background
Due to functional and appearance requirements, many production and living tools, such as electronic devices, household appliances, etc., have housings.
With the development of science and technology, the user has higher and higher requirements on the strength and the like of the shell of various current devices, and the shell with low strength is easy to break, so that the increasing requirements of the user cannot be met.
Disclosure of Invention
The technical problem that the application mainly solves is to provide a shell, a manufacturing method thereof and electronic equipment, and technical support can be provided for improving the strength of the periphery of the whole shell.
In order to solve the technical problem, the application adopts a technical scheme that: providing a housing, the housing comprising: a core layer and a wrapping layer; the wrapping layer defines a closed space, and the core layer is filled in the closed space; wherein the first coefficient of thermal expansion of the core layer is greater than the second coefficient of thermal expansion of the cladding layer.
In order to solve the above technical problem, another technical solution adopted by the present application is: a method of making a housing is provided, the method comprising: providing a wrapping material and a core material; heating the wrapping material and the core material to enable the wrapping material to be in a flowing state and wrap the core material, so that the core material is filled in a closed space formed by the wrapping material; cooling the wrapping material and the core material to obtain the shell; wherein the first coefficient of thermal expansion of the cladding material is less than the second coefficient of thermal expansion of the core material.
In order to solve the above technical problem, the present application adopts another technical solution: the electronic equipment comprises a shell and a functional device, wherein the shell is defined with an accommodating space; the functional device is accommodated in the accommodating space; wherein the housing is as described above.
The beneficial effect of this application is: be different from prior art's condition, the casing includes core layer and parcel layer in this application, and wherein, the parcel layer definition has the enclosure space, and the core layer is filled in the enclosure space, and the first coefficient of thermal expansion of core layer is greater than the second coefficient of thermal expansion of parcel layer. Through this kind of mode, after heating above-mentioned casing and cooling process, the shrink of the parcel layer that coefficient of thermal expansion is little, and the shrink of the core layer that coefficient of thermal expansion is big to can form compressive stress at the parcel layer, and form tensile stress at the core layer, because the parcel layer wraps up in the periphery of whole core layer, thereby make the casing periphery all form corresponding compressive stress, provide technical support for improving the intensity of whole casing periphery.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of an electronic device according to the present application;
FIG. 2 is a schematic view of a portion of an embodiment of the housing of the present application;
fig. 3 is a schematic view of a forming scene of a wrapping layer monomer and a core layer monomer respectively corresponding to a wrapping layer and a core layer in an embodiment of a shell according to the present application;
FIG. 4 is a schematic diagram of a forming scenario of a housing according to an embodiment of the present application;
FIG. 5 is a first graph of compressive stress of a wrapping layer in an embodiment of the shell of the present application;
FIG. 6 is a third schematic compressive stress diagram of the casing surround of the related art;
FIG. 7 is a schematic view of a superposition of a first compressive stress and a second compressive stress of a wrapping layer in an embodiment of the shell of the present application;
FIG. 8 is a schematic view showing a superposition of a third compressive stress and a fourth compressive stress of a wrapping layer of a case in the related art;
FIG. 9 is a schematic structural diagram of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 10 is a schematic structural diagram of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 11 is a schematic structural view of a cross-section taken parallel to a major surface of an embodiment of the present housing;
FIG. 12 is a schematic structural view of a cross-section taken parallel to a major surface of an embodiment of the present housing;
FIG. 13 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 14 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 15 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 16 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 17 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 18 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 19 is a schematic structural diagram of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 20 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 21 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 22 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 23 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 24 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 25 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 26 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 27 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 28 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 29 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 30 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 31 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 32 is a schematic structural view of a cross-section taken perpendicular to a major surface of an embodiment of the present housing;
FIG. 33 is a schematic structural view of a cross-section taken parallel to a major surface of an embodiment of the present housing;
FIG. 34 is a schematic structural view of a cross-section taken parallel to a major surface of an embodiment of the present housing;
FIG. 35 is a schematic structural view of a cross-section taken parallel to a major surface of an embodiment of the present housing;
FIG. 36 is a schematic structural view of an embodiment of the housing of the present application;
FIG. 37 is a schematic flow chart diagram of one embodiment of a method of making the housing of the present application;
fig. 38 is a schematic flow chart illustrating an embodiment of a method for manufacturing a housing according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, in an embodiment, an electronic device includes a housing 10 and a functional device 20. The housing 10 defines an accommodating space 10a, the functional device 20 is disposed in the accommodating space 10a, and the housing 10 can protect the functional device 20 (e.g., a motherboard, a battery, etc.).
Specifically, the electronic device may be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, and the like, and the housing 10 may be a front shell, a frame, a rear cover, and the like of the electronic device, which are not limited herein.
Referring to fig. 2, in one embodiment, the shell 10 may include a core layer 11 and a wrapping layer 12, wherein the wrapping layer 12 defines a closed space 12a, the core layer 11 is filled in the closed space 12a, so that the wrapping layer 12 wraps the entire periphery of the core layer 11, and the entire outer surface and edge of the shell 10 are formed by the wrapping layer 12.
Wherein, the wrapping layer 12 and the core layer 11 can be at least one of glass, ceramic and sapphire. In practical application, both the cladding layer 12 and the core layer 11 may be made of glass, and the corresponding softening points may be greater than 400 ℃, specifically, 450 ℃, 500 ℃, 550 ℃ and the like, and specifically, common glass, microcrystalline glass, colored glass and the like may be selected according to actual requirements, and are not specifically limited herein.
It is noted that the first coefficient of thermal expansion of the core layer 11 is greater than the second coefficient of thermal expansion of the surround 12, and specifically, the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion may be no less than 5x10^ -7/deg.C, such as 5x10^ -7/deg.C, 5.5x10^ -7/deg.C, 6x10^ -7/deg.C, and so on. Wherein the thermal expansion coefficients can be thermal expansion coefficients at 0-300 ℃. In this way, after the shell 10 is heated and cooled, compressive stress is formed on the wrapping layer 12, tensile stress is formed on the core layer 11, and the wrapping layer 12 wraps the periphery of the whole core layer 11, so that the periphery of the shell 10 forms corresponding compressive stress, and technical support is provided for improving the strength of the periphery of the whole shell 10.
In the actual production process, referring to fig. 3, a wrapping layer plate and a core layer plate can be first manufactured by using a wrapping material (i.e., a raw material of the wrapping layer 12) and a core material (i.e., a raw material of the core layer 11), respectively, and then the wrapping layer plate and the core layer plate are further cut, such as wire cutting, respectively, so as to obtain a plurality of wrapping layer units and core layer units with smaller sizes. And then carrying out shape processing such as CNC (computerized numerical control) shape processing and polishing on the numerical control machine according to actual requirements, thereby obtaining the wrapping layer monomer 121 and the core layer monomer 111. Through the polishing treatment, the wrapping layer monomer 121 and the core layer monomer 111 can be more sufficiently combined in the subsequent manufacturing of the shell 10. Note that, the wrapping layer single body 121 and the core layer single body 111 are formed in substantially the same manner, and both can be schematically illustrated by fig. 3.
Further, after obtaining the wrapping layer monomer 121 and the core layer monomer 111, the wrapping layer monomer 121 may be made to be in a flowing state by performing a heat treatment and/or a pressure treatment to encapsulate the outer periphery of the core layer monomer 111, thereby obtaining the shell 10 having the wrapping layer 12 and the core layer 11; of course, the case 10 may also be formed by simultaneously performing heat treatment and/or pressure treatment on the clad unit 121 and the core unit 111.
In an application scenario, the wrapping layer monomers 121 and the core layer monomers 111 are made of glass, when the shell 10 is manufactured, the number of the adopted wrapping layer monomers 121 is two, the number of the core layer monomers 111 is one, and the size of each wrapping layer monomer 121 is larger than that of the core layer monomer 111, for example, the length and the width of at least the wrapping layer monomer 121 are larger than those of the core layer monomer 111, so that the wrapping layer monomers 121 can form a large enough closed space 12a to fully wrap the core layer monomers.
Specifically, after obtaining the wrapping layer single body 121 and the core layer single body 111, further operations may be performed using a die casting apparatus to obtain the case 10. The die casting device can comprise a vacuum cavity, a high-temperature heating system, a laminating die and the like.
Specifically, referring to fig. 4, two wrapping layer monomers 121 and one core layer monomer 111 are respectively stacked in a mold in a vacuum chamber in a manner of wrapping layer monomer 121+ core layer monomer 111+ wrapping layer monomer 121, a high temperature heating system is started to heat the wrapping layer monomer 121 and the core layer monomer 111 to a temperature higher than the glass softening point of the two, such as 800-, so that the viscosity of the wrapping layer monomer 121 is lower than 30000Poise and is in a flowing state, the upper and lower wrapping layer monomers 121 are fused together and fully wrapped on the periphery of the core layer monomer 111, then the vacuum environment in the vacuum cavity is broken, and filling protective atmosphere such as nitrogen, argon and the like into the cavity, cooling and discharging to obtain the shell 10 comprising the wrapping layer 12 and the core layer 11.
Of course, after discharging, further machining (such as CNC machining, etc.), polishing, and further strengthening, such as chemical toughening, etc., may be performed according to actual requirements, so as to obtain a finished shell 10.
It should be noted that, during the cooling process after heating the single cladding layer 121 and the single core layer 111, due to the difference between the thermal expansion coefficients of the two, the shrinkage of the cladding layer 12 with the small thermal expansion coefficient is small, and the shrinkage of the core layer 11 with the large thermal expansion coefficient is large, so that a compressive stress (a first compressive stress F shown by an arrow in fig. 5) may be generated in the cladding layer 121) While tensile stress is generated in the core layer 11, since the wrapping layer 12 wraps the entire periphery of the core layer 11, a first compressive stress F can be formed in the entire periphery of the shell 101And thus the strength of the entire periphery of the housing 10 can be improved.
In the related art, referring to fig. 6, the shell may also be composed of a wrapping layer 22 and a core layer 21, specifically, a glass with a low thermal expansion coefficient is fused to two sides of a glass with a high thermal expansion coefficient at a high temperature by an overflow method to form a sandwich structure, that is, the wrapping layer 22 only covers two sides of the core layer 21, but not the entire periphery of the core layer 21, and during a cooling process, the glass with a low thermal expansion coefficient is shrunk and the glass with a high thermal expansion coefficient is shrunk greatly, so that a compressive stress (a third compressive stress F shown by an arrow in fig. 6) is formed on the wrapping layer 22 (see an arrow in fig. 6)3) And a tensile stress is formed in the core layer 21.
However, since the wrapping layer 22 does not wrap the entire periphery of the core layer 21 in the related art, the portion of the core layer 21 that is not wrapped by the wrapping layer 22, i.e., the edge portion, does not generate a corresponding compressive stress, or generates a smaller compressive stress, which is negligible, i.e., the edge portion of the shell is not reinforced accordingly.
In contrast, the entire periphery of the housing 10, including the edges, can be strengthened, which can reduce the occurrence of the fracture of the housing 10, and on the other hand, the relatively thin housing 10 can also have a considerable strength, so as to meet the use requirement of the user for lightness and thinness to some extent. Moreover, since the core layer 11 is completely wrapped by the wrapping layer 12, the strength of the core layer 11 has relatively little influence on the overall strength of the shell 10, and thus, there are many choices in terms of material, shape, and the like.
It is noted that the first compressive stress F generated in the wrapping layer 12 based on the difference between the first thermal expansion coefficient and the second thermal expansion coefficient is described above1Satisfies the following formula (1):
wherein, CTEA、CTEBRespectively, the first coefficient of thermal expansion of surround 12 and the second coefficient of thermal expansion of core layer 11, as described above, the difference between the two may be no less than 5x10^ -7/deg.C; Δ T is the difference between the normal temperature and the lower of the strain point of the cladding layer 12 and the strain point of the core layer 11, i.e., Δ T ═ TOften times-min{TShould 1，TApplication 2In which T isShould 1Strain point, T, of the envelope 12Application 2Is the strain point of the core layer 11; emodA、EmodBThe young modulus of the wrapping layer 12 and the young modulus of the core layer 11 are respectively greater than 50GPa, specifically 51GPa, 52GPa, 53GPa and the like, wherein the larger the young modulus of the wrapping layer 12 and the core layer 11 is, the larger the compressive stress finally formed on the wrapping layer 12 is, and the more specifically, the young modulus can be selected according to actual requirements; t is tA、tBRespectively, the thickness of the wrapping layer 12 and the thickness of the core layer 11 in a direction perpendicular to a main surface 13 (shown in fig. 2) of the case 10, wherein the main surface 13 of the case 10 is a large-area surface of the case 10. The thickness of the wrapping layer 12 and the thickness of the core layer 11 may be 0.02-2mm, such as 0.02mm, 0.04mm, 0.05mm, 0.1mm, 0.5mm, 1mm, 2mm, etc., wherein the thickness t of the wrapping layer 12 isAThickness t of core layer 11BCan be equal toOr may be different and not limited herein; v isAIs the poisson's ratio of the wrapping layer 12.
It is understood that in some embodiments, the CTE may be increased to some extent by increasing the CTEBAnd CTEAThe difference between the two to increase the first compressive stress F formed on the wrapping layer 121Thereby further improving the strength of the housing 10.
In one embodiment, referring to fig. 7, after obtaining the shell 10, the shell 10 may be further chemically tempered to further generate another compressive stress, i.e. a second compressive stress F, on the wrapping layer 122。
In particular, the compressive stress may be generated by ion exchange reaction of the wrapping layer 12. The wrapping layer 12 may be made of a material capable of performing ion exchange, specifically, high alumina silica glass, and more specifically, at least one of lithium alumina silica glass, sodium alumina silica glass, and the like.
Specifically, the casing 10 may be soaked in a salt furnace at a temperature such that the casing 10 reacts to convert small ions (e.g., Li) at the surface layer of the casing 10+、Na+Etc.) is replaced with a large ion (e.g., K) in a salt furnace+) So that the surface volume of the shell 10 is increased and a second compressive stress F is further generated on the surface of the shell 102Tensile stress is generated inside, thereby further reinforcing the housing 10.
It is noted that after further chemical tempering, a first compressive stress F has been created in the surround 12, as shown in fig. 71On the basis of the first pressure stress F, further superposing a second pressure stress F2Moreover, since the entire outer layer of the case 10 is formed by the wrapping layer 12, the surface layer of the entire case 10 can be further reinforced.
As described above, in the related art, the wrapping layer 22 covers only both sides of the core layer 21, and does not cover the edge portion of the core layer 21. After further chemical tempering, although the chemical tempering is not affected by the difference between the thermal expansion coefficients of the wrapping layer 22 and the core layer 21, a fourth compressive stress F is further generated on the entire outer surface of the shell4(as shown in FIG. 8), but becauseThe third compressive stress F2Only on the envelope 12 and therefore corresponds to the edge portion of the shell being only chemically tempered, in contrast to the shell 10 of the previous embodiment of the present application which still has a higher strength.
In an embodiment, the core layer 11 may also be glass that is subjected to physical tempering treatment and/or chemical tempering treatment, that is, the core layer monomer 111 used in manufacturing the shell 10 is glass that is subjected to physical tempering treatment and/or chemical tempering treatment, so that the strength of the shell 10 can be further improved.
Further, referring to fig. 9, in order to satisfy the strength of housing 10 itself, as described above, in the direction perpendicular to main surface 13 of housing 10, thickness t of wrapping layer 12 isACan be 0.02-2mm, specifically such as 0.02mm, 0.04mm, 0.05mm, 0.1mm, 0.5mm, 1mm, 2mm, etc.
In addition, the thicknesses t of the clad layers 12 on both sides of the core layer 11 in the direction perpendicular to the main surface 13 of the case 10AMay be equal, as shown in fig. 9, or may not be equal, as shown in fig. 10, which is not limited herein.
Further, the thickness t of the core layer 11 in a direction perpendicular to the main surface 13 of the case 10BMay be 0.02 to 2mm, specifically, 0.02mm, 0.04mm, 0.05mm, 0.1mm, 0.5mm, 1mm, 2mm, etc., and the total thickness t of the housing 10 may be greater than 0.1mm, for example, 0.15mm, 0.2mm, 0.5mm, 1mm, 2mm, 4mm, etc. When the casing is made of glass, the higher the rigidity of the glass, the lower the toughness, and the total thickness t can be set according to the rigidity and toughness required for the casing in actual production.
Referring to fig. 11, the wrapping layer 12 has a thickness t in a direction parallel to the major surface 13 of the casing 10CMay be 0.02 to 2mm, specifically, 0.02mm, 0.04mm, 0.05mm, 0.1mm, 0.5mm, 1mm, 2mm, etc., and is not particularly limited herein. It should be noted that the thickness of the wrapping layer 12 is set to meet the strength requirement of the edge portion of the shell 10.
In addition, in a direction parallel to the main surface 13 of the housing 10,thickness t of the clad layer 12 on both sides of the core layer 11CMay be equal, as shown in fig. 9 and fig. 11, or may not be equal, as shown in fig. 10 and fig. 12, which is not limited herein.
Referring to fig. 13, the wrapping layer 12 includes a first major surface 122 and a second major surface 123 opposite to each other, and a first side surface 124 and a second side surface 125 opposite to each other and connected to the first major surface 122 and the second major surface 123, respectively.
Specifically, the first main surface 122 and the second main surface 123 refer to surfaces of the wrapping layer 12 having a large area, specifically, corresponding to the main surface 13 of the case 10. In some application scenarios, the first main surface 122 and the second main surface 123, i.e. the main surface 13 of the housing 10; in other applications, the housing 10 may further include other structural layers disposed about the outer periphery of the wrapping layer 12, and the first major surface 122 and the second major surface 123 may not be the major surface 13 of the housing 10. In addition, the first side surface 124 and the second side surface 125 are faces connecting between the first main surface 122 and the second main surface 123. It is noted that the number of side surfaces connecting between the first main surface 122 and the second main surface 123 may be plural, and the first side surface 124 and the second side surface 125 may be only two of them.
In one embodiment, referring to fig. 13 to 21, the first main surface 122 and the second main surface 123 may be parallel to each other and extend straight.
In one application scenario, as shown in fig. 13, the connection between the first main surface 122 and the first side surface 124, the connection between the first main surface 122 and the second side surface 125, and the connection between the second main surface 123 and the first side surface 124, and the connection between the second main surface 123 and the second side surface 125 are all rounded connections, and are all disposed in a curved manner toward different directions away from the housing 10.
In one application scenario, as shown in fig. 14, the connection between the first main surface 122 and the first side surface 124, the connection between the first main surface 122 and the second side surface 125, and the connection between the second main surface 123 and the first side surface 124, and the connection between the second main surface 123 and the second side surface 125 are all right-angle connections.
In one application scenario, as shown in fig. 15, the connection between the first main surface 122 and the first side surface 124, the connection between the first main surface 122 and the second side surface 125, and the connection between the second main surface 123 and the first side surface 124, and the connection between the second main surface 123 and the second side surface 125 are all oblique angle connections.
In one application scenario, as shown in fig. 16, the connection between the first main surface 122 and the first side surface 124 and the connection between the first main surface 122 and the second side surface 125 are oblique angle connections, and the connection between the second main surface 123 and the first side surface 124 and the connection between the second main surface 123 and the second side surface 125 are rounded corner connections.
It should be noted that in each of the above application scenarios, in the connection between the first and second main surfaces 122 and 123 and the first and second side surfaces 124 and 125, the size of the oblique angle and the area of the corresponding oblique surface may be equal, and similarly, the radian of the corresponding rounded corner and the area of the corresponding arc surface may also be equal.
In other application scenarios, the size of the oblique angle and the area of the corresponding oblique surface may also be unequal in the connection between the first and second main surfaces 122 and 123 and the first and second side surfaces 124 and 125, and likewise, the radian of the corresponding rounded corner and the area of the corresponding arc surface may also be unequal.
Specifically, referring to fig. 17, in an application scenario, a connection between the first main surface 122 and the first side surface 124, and a connection between the second main surface 123 and the first side surface 124 and the second side surface 125 are fillet connections, but a curvature of the fillet connection between the second main surface 123 and the first side surface 124 is smaller than that of the other two fillet connections, and a connection between the first main surface 122 and the second side surface 125 is an oblique connection.
In other application scenarios, the connection between the first main surface 122 and the second main surface 123 and the first side surface 124 and the second side surface 125 are all fillet connections, and the bending directions of the fillet connections between the two opposite main surfaces and the same side face can be consistent.
Specifically, referring to fig. 18 and 19, in an application scenario, the connection between the first main surface 122 and the first side surface 124 and the connection between the first main surface 122 and the second side surface 125 are both curved in a direction away from the core layer 11, and correspondingly, the connection between the second main surface 123 and the first side surface 124 is in the same direction as the curved direction of the connection between the first main surface 122 and the first side surface 124, and has the same curvature; the connection between the second main surface 123 and the second side surface 125 coincides with the bending direction of the connection between the first main surface 122 and the second side surface 125, and the curvature is the same. Fig. 18 is compared with fig. 19, except that in fig. 18, the core layer 11 is correspondingly filled between the relative positions of the first main surface 122 and the second main surface 123 and between the fillet joints correspondingly arranged, and the core layer 11 corresponding to the fillet joints is also bent and has the same curvature as the corresponding fillet joints. In fig. 19, the core layer 11 is filled only between the relative positions of the first main surface 122 and the second main surface 123, and is not filled between the fillet connections correspondingly arranged.
Referring to fig. 20 and 21, in an application scenario, the connection between the first main surface 122 and the first side surface 124 and the connection between the first main surface 122 and the second side surface 125 are both curved in a direction away from the core layer 11, and correspondingly, the connection between the second main surface 123 and the first side surface 124 is in the same direction as the curved direction of the connection between the first main surface 122 and the first side surface 124, but has a smaller curvature; the connection between the second main surface 123 and the second side surface 125 coincides with the bending direction of the connection between the first main surface 122 and the second side surface 125, but the curvature is smaller. In comparison with fig. 21, fig. 20 is different from fig. 21 in that the core layer 11 in fig. 20 is correspondingly filled between the relative positions of the first main surface 122 and the second main surface 123 and between the fillet joints correspondingly arranged, and the portion of the core layer 11 corresponding to the fillet joints is also arranged in a curved manner, and has the same curvature as that of the fillet joint between the first side surface 124 and the second side surface 125 of the corresponding second main surface 123. Whereas in fig. 21 the core layer 11 only fills correspondingly between the relative positions of the first main surface 122 and the second main surface 123 and not between the correspondingly arranged fillet connections.
In one embodiment, referring to fig. 22, one of the first main surface 122 and the second main surface 123 is curved and extends straight away from the core layer 11.
In one embodiment, referring to fig. 23 and 24, one of the first and second main surfaces 122 and 123 is curved away from the core layer 11, and the other is curved toward the core layer 11. In fig. 23, the first main surface 122 is curved in a direction away from the core layer 11, and the second main surface 123 is curved in the same direction as the first main surface 122 and also has the same curvature. In fig. 24, the second main surface 123 is curved in a direction away from the core layer 11, and the first main surface 122 is curved in the same direction as the second main surface 123 and also has the same curvature.
In one embodiment, referring to fig. 25, the first major surface 122 and the second major surface 123 are curved away from the core layer 11.
With continued reference to fig. 13, the core layer 11 includes a first inner surface 112 and a second inner surface 113 disposed opposite to each other, and a first inner side 114 and a second inner side 115 connected to the first inner surface 112 and the second inner surface 113 respectively and disposed opposite to each other.
Specifically, the first inner surface 112, the second inner surface 113, the first inner side surface 114, and the second inner side surface 115 are all surfaces of the core layer 11 that are in contact with the cladding layer 12. Here, the first inner surface 112 and the second inner surface 113 refer to surfaces of the core layer 11 having a large area, and specifically correspond to the main surface 13 of the case 10. First interior side 114 and second interior side 115 are the surfaces that are connected between first interior surface 112 and second interior surface 113. It is noted that the number of inner side surfaces connected between the first inner surface 112 and the second inner surface 113 may be plural, and the first inner side surface 114 and the second inner side surface 115 may be only two of them.
In one embodiment, referring to fig. 13 and 26 to 28, the first inner surface 112 and the second inner surface 113 are parallel to each other and extend straight.
In one application scenario, as shown in fig. 13, the connection between first inner surface 112 and first inner side surface 114, the connection between first inner surface 112 and second inner side surface 115, and the connection between second inner surface 113 and first inner side surface 114, and the connection between second inner surface 113 and second inner side surface 115 are rounded connections.
In one application scenario, as shown in fig. 26, the connection between first inner surface 112 and first inner side surface 114, the connection between first inner surface 112 and second inner side surface 115, and the connection between second inner surface 113 and first inner side surface 114, and the connection between second inner surface 113 and second inner side surface 115 are all right-angle connections.
In one application scenario, as shown in fig. 27, the connection between first inner surface 112 and first inner side surface 114, the connection between first inner surface 112 and second inner side surface 115, and the connection between second inner surface 113 and first inner side surface 114, and the connection between second inner surface 113 and second inner side surface 115 are all beveled connections.
In one application scenario, as shown in fig. 28, the connection between the first inner surface 112 and the first inner side surface 114 and the connection between the first inner surface 112 and the second inner side surface 115 are rounded connections, and the connection between the second inner surface 113 and the first inner side surface 114 and the connection between the second inner surface 113 and the second inner side surface 115 are both bevel connections.
It should be noted that, in the connection between the first and second inner surfaces 112 and 113 and the first and second inner side surfaces 114 and 115, the size of the oblique angle and the area of the corresponding oblique surface may be equal or unequal, and likewise, the curvature of the corresponding rounded corner and the area of the corresponding arc surface may also be equal or unequal.
In one embodiment, referring to fig. 29 to 32, at least one of the first inner surface 112 and the second inner surface 113 is curved.
Specifically, in one application scenario, as shown in fig. 29, the first inner surface 112 is curved away from the second inner surface 113, and the second inner surface 113 extends straight.
In one application scenario, as shown in fig. 30, the first inner surface 112 curves away from the second inner surface 113, and the second inner surface 113 curves away from the first inner surface 112.
In one application scenario, as shown in fig. 31, the first inner surface 112 is curved towards the second inner surface 113, and the second inner surface 113 is curved towards the first inner surface 112.
In one application scenario, as shown in fig. 32, the first inner surface 112 and the second inner surface 113 are both arranged in a wavy curve.
Further, the shape of the cross section of the core layer 11 in parallel with the main surface 13 of the housing 10 may be a regular shape, for example, a square shape (as shown in fig. 11), a rectangular shape, or the like, or may also be an irregular shape, as shown in fig. 33 and 34, which is not particularly limited herein.
In one embodiment, the number of the closed spaces 12a may be one or plural, and the number of the core layers 11 is equal to the number of the closed spaces 12a, and the closed spaces 12a are filled with the core layers.
In an application scenario, the number of the core layers 11 may be multiple, during an actual production process of the shell 10, multiple monomers of the core layers 11 may be placed at intervals in the vacuum chamber, and during a continuous heating process of the high-temperature heating system, the wrapping layer 12 is converted into a flowing state, flows into an interval between the monomers of each core layer 11, and wraps the periphery of each core layer monomer 111, so as to finally obtain the shell 10 having multiple core layers 11, as shown in fig. 35. Of course, in other application scenarios, the number of the core layers 11 is not limited to one or 4 as shown in fig. 35, and may also be 2, 3, 5, and the like, which may be specifically selected according to actual requirements, and is not specifically limited herein.
Further, referring to fig. 36, in one embodiment, the housing may further include a design layer 14 formed on at least one side of the wrapping layer 12. Specifically, the appearance layer 14 may be at least one of a color layer for making the housing exhibit a certain color, a reflection layer for reflecting incident light to make the housing exhibit a highlight effect, a texture pattern layer for providing a texture effect, a light shielding layer for shielding the functional device 20 inside the electronic device, and the like, and may be specifically selected according to actual requirements, and is not limited herein.
Referring to fig. 37, an embodiment of a method for manufacturing a housing may include:
step S10: providing a wrapping material and a core material;
step S20: heating the wrapping material and the core material to enable the wrapping material to be in a flowing state and wrap the core material, so that the core material is filled in a closed space formed by the wrapping material; and
step S30: cooling the wrapping material and the core material to obtain a shell;
wherein the first coefficient of thermal expansion of the cladding material is less than the second coefficient of thermal expansion of the core material.
The housing manufacturing method in the present embodiment can be used to manufacture the housing described in the above embodiments of the present application. The wrapping material, the type of core material, the heating and cooling methods, and the equipment used in the method are the same as those in the above-mentioned embodiment of the housing, and the details are referred to the above-mentioned embodiment and will not be described herein.
It should be noted that, in the above manner, after the wrapping material and the core material are heated and cooled, compressive stress is formed on the wrapping material, and tensile stress is formed on the core material, and since the wrapping material wraps the entire periphery of the core material, corresponding compressive stress is formed on the periphery of the shell, so that the strength of the entire periphery of the shell can be improved.
Further, in some embodiments, referring to fig. 38, after step S30, the method for manufacturing the shell may further include:
step S40: and after the temperature reduction treatment, further carrying out chemical toughening treatment on the shell.
The method of chemically tempering the housing in this embodiment may also be the same as described in the housing embodiments above.
The housing in the above-described embodiment of the present application is described below as a specific example. In the embodiment, the wrapping layer is made of Corning GG3 glass, the core layer is made of domestic panda 1 substitute, and the thickness of the finally obtained composite glass shell is 1 mm.
Wherein the first coefficient of thermal expansion CTE of the wrapping layerA7.6x10^ -6/DEG C, and a second coefficient of thermal expansion CTE of the core layerB9.8x10^ -6/DEG C, the difference delta T between the normal temperature and the lower one of the strain point of the wrapping layer and the strain point of the core layer is-430 ℃, and the Young modulus Emod of the wrapping layerA69.3GPa, the Young's modulus of the core layer EmodBAt 78.2GPa, the Poisson ratio v of the wrapping layerAIs 0.23, and the wrapping layer has a thickness t in a direction perpendicular to the main surface of the caseA0.2mm, thickness t of core layerBIs 0.6 mm.
According to the formula (1), after the shell is obtained according to the manufacturing method of the shell, the pressure stress of the wrapping layer of the shell is 53.7MPa before chemical toughening is carried out, and the shell has high strength.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (15)
1. A housing, comprising:
a core layer; and
the packaging layer is defined with a closed space, and the core layer is filled in the closed space;
wherein the first coefficient of thermal expansion of the core layer is greater than the second coefficient of thermal expansion of the cladding layer.
2. The housing of claim 1,
the wrapping layer has a first compressive stress and the core layer has a tensile stress;
the first compression stress and the tensile stress are generated correspondingly by cooling the wrapping layer and the core layer after heating treatment based on the difference between the first thermal expansion coefficient and the second thermal expansion coefficient.
3. The housing of claim 2,
the first compressive stress satisfies:
wherein, CTEA、CTEBRespectively the first thermal expansion coefficient and the second thermal expansion coefficient, delta T is the difference between normal temperature and the lower of the strain point of the wrapping layer and the strain point of the core layer, EmodA、EmodBRespectively the Young's modulus of the wrapping layer and the Young's modulus, t, of the core layerA、tBRespectively, the thickness of the wrapping layer and the thickness of the core layer in a direction perpendicular to the main surface of the case, vAIs the poisson's ratio of the wrapping layer.
4. The housing of claim 3, wherein the CTE isBAnd CTEAThe difference is not less than 5x10^ -7/DEG C, EmodAAnd EmodBAre all greater than 50GPa, tA0.02-2mm, tBIs 0.02-2 mm.
5. The housing of claim 2, wherein the wrapping layer further has a second compressive stress, the second compressive stress being generated by ion exchange reaction of the wrapping layer.
6. The housing of claim 1,
the wrapping layer and the core layer are at least one of glass, ceramic and sapphire.
7. The housing of claim 6,
when the wrapping layer and/or the core layer are glass, the softening point of the glass is more than 400 ℃;
the wrapping layer and the core layer are at least one of microcrystalline glass and colored glass, and/or
The wrapping layer is made of high-alumina-silica glass and/or
The core layer is glass which is subjected to physical tempering treatment and/or chemical tempering treatment.
8. The housing of claim 7,
when the wrapping layer is high-alumina-silica glass, the wrapping layer is at least one of lithium-alumina-silica glass and sodium-alumina-silica glass.
9. The housing of claim 1,
the thickness of the wrapping layer is 0.02-2mm in a direction perpendicular to the main surface of the shell, the thickness of the core layer is 0.02-2mm, and the total thickness of the shell is more than 0.1 mm;
the wrapping layer has a thickness of 0.02 to 2mm in a direction parallel to the major surface of the housing.
10. The housing of claim 1, wherein the wrapping layer includes first and second oppositely disposed major surfaces and first and second oppositely disposed side surfaces connected to the first and second major surfaces, respectively;
the first main surface and the second main surface are parallel to each other and extend straightly, or one of the first main surface and the second main surface is arranged in a bending way towards a direction departing from the core layer, and the other main surface extends straightly, or one of the first main surface and the second main surface is arranged in a bending way towards a direction departing from the core layer, and the other main surface is arranged in a bending way towards the core layer;
the connection between the first main surface and the first side surface and the connection between the second main surface and the first side surface and the second side surface are at least one of a fillet connection, an oblique angle connection and a right angle connection respectively.
11. The housing of claim 1, wherein the core layer includes first and second oppositely disposed inner surfaces and first and second oppositely disposed inner sides connected to the first and second inner surfaces, respectively;
the first inner surface and the second inner surface are parallel to each other and extend straightly, or at least one of the first inner surface and the second inner surface is arranged in a bending way;
the first inner surface is connected with the first inner side surface and the second inner side surface respectively, and the second inner surface is connected with the first inner side surface and the second inner side surface respectively through at least one of fillet connection, bevel connection and right-angle connection.
12. The casing according to claim 1, wherein the number of the closed spaces is plural, and the number of the core layers is equal to the number of the closed spaces, and the core layers are respectively filled in the corresponding closed spaces.
13. The housing of claim 1, further comprising:
the appearance layer, set up in at least one side of parcel layer, wherein, the appearance layer includes at least one in colour layer, light shield layer, texture layer, the reflection stratum.
14. A method of making a housing, comprising:
providing a wrapping material and a core material;
heating the wrapping material and the core material to enable the wrapping material to be in a flowing state and wrap the core material, so that the core material is filled in a closed space formed by the wrapping material; and
cooling the wrapping material and the core material to obtain the shell;
wherein the first coefficient of thermal expansion of the cladding material is less than the second coefficient of thermal expansion of the core material.
15. An electronic device, comprising:
a housing defining an accommodating space;
the functional device is accommodated in the accommodating space;
wherein the housing is as claimed in any one of claims 1 to 13.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011197510.4A CN114449792A (en) | 2020-10-30 | 2020-10-30 | Shell, manufacturing method thereof and electronic equipment |
| PCT/CN2021/113799 WO2022088869A1 (en) | 2020-10-30 | 2021-08-20 | Housing and manufacturing method therefor, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011197510.4A CN114449792A (en) | 2020-10-30 | 2020-10-30 | Shell, manufacturing method thereof and electronic equipment |
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| CN114449792A true CN114449792A (en) | 2022-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011197510.4A Pending CN114449792A (en) | 2020-10-30 | 2020-10-30 | Shell, manufacturing method thereof and electronic equipment |
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| WO (1) | WO2022088869A1 (en) |
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