CN105002014A - 清洗液、清洗设备以及安装基板的清洗方法 - Google Patents
清洗液、清洗设备以及安装基板的清洗方法 Download PDFInfo
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- 229960004418 trolamine Drugs 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/38—Products with no well-defined composition, e.g. natural products
- C11D3/386—Preparations containing enzymes, e.g. protease or amylase
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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Abstract
本发明提供一种清洗液、清洗设备以及安装基板的清洗方法,即使是无铅焊料等新型焊料也能够进行高品质清洗。利用清洗液(2)清洗安装基板(10)。清洗液(2)是在包含酮或芳香族类的烃类溶剂中含有有机胺类、且在该溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的药液。有机胺类包含作为仲或叔胺的二乙醇胺或三甲胺等中的至少大于或等于一种。即,清洗液(2)包含脱水的不饱和羧酸化合物(松香酸酐、新松香酸酐等)或脱水的二羧酸(蚁酸、醋酸酐、戊酸酐等)中的至少大于或等于一种。胺成分小于或等于羧酸类的当量。
Description
技术领域
本发明涉及一种清洗液、清洗设备以及安装基板的清洗方法。
背景技术
在现有技术中,例如,如日本特开2003-73699号公报所公开,已知用于除去焊接后的助焊剂残渣的清洗方法。在现有技术中,作为用于对安装基板的助焊剂进行清洗的烃类溶剂,使用将酮类/芳香族类作为基本溶剂并为了提高清洗效果而添加了乙二醇醚后得到的溶剂。
专利文献1:日本特开2003-73699号公报
近年来,为了保护环境,使用了无铅焊膏、无卤素焊膏等。另外,随着芯片的微型化,使用了粉末焊料。在这些新型焊料中,利用现有技术进行的清洗存在出现污渍或变色的问题。另外,还存在出现后续工序中的导线键合不良等接合不良、或者封装部件的剥离等缺陷等问题。
发明内容
本发明就是为了解决上述课题而提出的,其目的在于,提供一种即使是无铅焊料等新型焊料也能够进行高品质清洗的清洗液、清洗设备以及安装基板的清洗方法。
本发明所涉及的安装基板的清洗方法使用下述药液,对安装基板进行清洗,该药液是在包含酮或芳香族类的烃类溶剂中含有仲或叔有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的。
本发明所涉及的清洗液是在包含酮或芳香族类的烃类溶剂中含有仲或叔有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的清洗液。
本发明所涉及的清洗设备具备:清洗槽,其贮存有清洗液;洗涤液槽,其贮存有洗涤液;以及干燥槽,其中,所述清洗液是在包含酮或芳香族类的烃类溶剂中含有仲或叔有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的清洗液。
本发明所涉及的其它清洗设备具备:可动传送带,其载置安装基板;清洗槽,其贮存有清洗液;洗涤液槽;以及干燥槽,其从喷射部喷射干燥空气,其中,所述清洗槽能够从喷射部将所述清洗液以喷淋的方式向所述可动传送带上的所述安装基板喷射,所述清洗液是在包含酮或芳香族类的烃类溶剂中含有仲或叔有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的清洗液。
发明的效果
根据本发明,使用添加了不饱和羧酸酐化合物或羧酸酐的药液进行清洗,因而即使是无铅焊料等新型焊料也能够进行高品质清洗。
附图说明
图1是表示本发明的实施方式所涉及的清洗液、清洗设备以及安装基板的清洗方法的图。
图2是表示本发明的实施方式所涉及的清洗液、清洗设备以及安装基板的清洗方法的图。
图3是表示残渣使封装树脂剥离的情形的图。
图4是表示残渣使封装树脂剥离的情形的图。
图5是表示残渣使封装树脂剥离的情形的图。
图6是总结了本申请的发明人进行的实验的结果的图。
标号的说明
2清洗液,10安装基板,20配线图案,22残渣,24封装树脂,26剥离起点,28剥离,30、40清洗设备,32、42清洗槽,34、36、45洗涤液槽,35、37、52洗涤液,38干燥槽,41可动传送带,43、46、49喷射部,44、47喷淋,50干燥空气
具体实施方式
图1以及图2是表示本发明的实施方式所涉及的清洗液、清洗设备以及安装基板的清洗方法的图。图1表示批处理式清洗,图2表示连续处理式清洗。本发明不特别限定具体的清洗处理方式,但作为优选实施方式,可以采用以批处理方式使用超声波或喷射流等进行清洗的方法、以及如图2所示以连续方式利用喷淋类型的装置进行清洗的方法。
图1所示的清洗设备30具备:清洗槽32,其贮存清洗液2,为了提高清洗效果,能够进行超声波清洗或喷射流清洗;洗涤液槽34,其贮存第一洗涤液35;洗涤液槽36,其贮存第二洗涤液37;以及干燥槽38,其能够在其内部对清洗后的安装基板10进行干燥。依次利用清洗槽32、洗涤液槽34、36浸渍安装基板10,进而利用干燥槽38对其进行干燥。
图2所示的清洗设备40具备:可动传送带41,其载置安装基板10;清洗槽42;洗涤液槽45;以及干燥槽38,其从喷射部49喷射干燥空气50。清洗槽42贮存清洗液2,能够从喷射部43将该清洗液2以喷淋44的方式向可动传送带41上的安装基板10喷射。洗涤液槽45贮存洗涤液52,能够从喷射部46将该洗涤液52以喷淋47的方式向可动传送带41上的安装基板10喷射。
使用这种清洗设备30、40,利用清洗液2清洗安装基板10。清洗液2是在包含酮或芳香族类的烃类溶剂中含有仲或叔有机胺类、且在该溶剂中添加了不饱和羧酸酐化合物或羧酸酐而得到的药液。更具体地说,有机胺类包含作为仲或叔胺的二乙醇胺或三甲胺等中的至少大于或等于一种。清洗液2包含脱水的不饱和羧酸化合物(松香酸酐、新松香酸酐等)或脱水的二羧酸(蚁酸、醋酸酐、戊酸酐等)中的至少大于或等于一种。胺成分小于或等于羧酸类的当量。安装基板10上利用焊料而安装有半导体元件或电子部件。例如,在溶液温度40度下,以10分钟的时间对安装后的助焊剂进行清洗。
酮或芳香族类通过将作为助焊剂残渣成分的松香成分(主要是松香酸盐)溶解而进行清洗。但是,由于助焊剂残渣的吸水或者与图案基底的化学反应,有时会产生污渍(变色)或导线键合接合不良。因此,在本实施方式中,添加具有还原作用的脱水的不饱和羧酸化合物(松香酸、新松香酸等)或脱水的二羧酸(醋酸酐、戊酸酐等)。针对松香酸确认了效果,但新松香酸等脱水的不饱和羧酸化合物具有同样的还原作用,因此得到同样的效果。与上述同样,利用醋酸酐进行了实验,但其它的羧酸酐也得到同等的效果。
安装基板10上的配线图案、镀层、阻焊剂(SR)等上附着的微量清洗残渣被除去,不发生污渍或变色等外观上的缺陷。另外,用于实现键合的键合垫部的残渣被除去,因此不发生接合不良。此外,在产品工作时,由于不存在作为腐蚀原因的污染物质,所以产品不发生劣化,提高可靠性。本发明能够适用于公知的各种安装基板10,但对在使用无铅焊膏、无卤素焊膏、以及粉末焊料的情况下需要高清洗性的安装基板10进行清洗时尤其有效。
另外,还可以举出如下效果:通过除去由助焊剂产生的残渣,由此在后续工序中进行树脂封装时的紧贴性也得到提高,从而提高可靠性。图3~5是表示残渣22使封装树脂24剥离的情形的图。若污垢较多,则封装树脂24与基材(这里是配线图案20)的紧贴性变差。如图3所示,如果安装基板10的配线图案20上有残渣22,则如图4所示产生剥离起点26,以此为起点开始剥离,如图5所示,剥离进一步发展从而产生了剥离28。根据本实施方式,能够防止这种剥离。
图6是总结了本申请的发明人进行的实验的结果的图。本申请的发明人进行了缺陷原因的调查,发现在清洗后的表面上,由助焊剂产生的金属氧化物或氢氧化物的微量残渣残留下来,成为污渍、变色、或者后续工序中的导线键合性变差的原因。另外,发现在现有技术中使用的溶剂中,以非极性溶媒为主,因此具有极性的残渣或金属氧化物(氢氧化物)等极性化合物的除去能力较低,所以残留了微量残渣。进一步的研究发现,通过在清洗液2中含有羧酸酐,能够提高清洗效果,解决上述问题。根据以下两点而选择了本溶剂,即,如果羧酸酐化合物存在于溶剂中,则对金属氧化物(或氢氧化物)具有还原作用,以及羧酸酐化合物也包含在焊料助焊剂中,容易得到。
作为试验片,准备了在安装基板10上涂敷了焊粉的中心粒径为φ32μm的第一焊膏或者中心粒径为φ21μm的第二焊膏得到的试验片。此外,第一、二焊膏为市售品。作为清洗的对比药液,使用了市售品A或B(酮/芳香族混合溶液)。溶剂C使用了在市售品A中添加了3%的二乙醇胺和2%的松香酸酐(X成分)的溶剂。溶剂D使用了在市售品A中添加了1%的三乙醇胺和0.05%的松香酸酐的溶剂。溶剂E使用了在市售品A中添加了3%的二乙醇胺和2%的二羧酸酐(Y成分)的溶剂。此时,由于松香酸酐、二羧酸酐不会溶解5%以上的量,所以将上限设为5%。作为脱水的二羧酸Y,这次使用了醋酸酐。溶剂F分别添加了1%的X、Y,溶剂G添加了0.1%的X,溶剂H中作为Y2成分添加了2%的蚁酸。
另外,作为仲或叔胺的二乙醇胺或三甲胺等有机胺类,是作为上述反应催化剂而添加的,并且具有防止由羧酸的吸湿产生的溶液氧化的作用。在实施方式中,清洗液2的调整在即将开始实验之前进行调整。但是,在应用于制造的情况下,也可以使用预先调整并保管的清洗液2。但在保管状态差的情况下,胺成分在保存过程中被消耗。在此情况下,为了准确地控制胺成分的量,在即将清洗之前添加胺成分这一做法是有效的。另外,关于所添加的胺成分,与添加反应性高的伯胺相比,添加反应性较为温和的仲、叔胺的做法具有被清洗物的损伤少的特点。例如,在铜、锡等金属图案以及部件的情况下,有可能腐蚀金属部分。
清洗方法是使各溶剂为30~60℃,浸渍试验片5~15分钟左右。清洗后用乙醇等适当的溶媒将液体冲掉后,用暖风干燥,将得到的试验片作为样本。用10倍的放大镜目视观察样本表面,查看有无污渍。另外,在键合垫上进行导线键合,通过接合面积和拉伸试验评价了紧贴强度。
如图6中所总结,确认了通过添加上述物质从而改善了仅依靠溶剂无法去除的污渍或者导线键合不良。此外,确认了通过提高清洗性还提高了作为后续工序进行树脂封装时的紧贴性。市售溶剂A、B是烃类清洗剂。关于污渍/变色,使用放大镜利用目视进行了确认。所谓导线键合性,是指导线键合的接合性,在键合之后确认拉伸强度以及剥落强度,并且针对接合面积以5个等级进行了强度表示。设想成等级0时为没有接合(紧贴),等级5为剥落前导线自身断裂。虽然程度存在差异,但不同焊膏的倾向是相同的。
Claims (9)
1.一种安装基板的清洗方法,其中,
使用下述清洗液,对安装基板进行清洗,该清洗液是在包含酮和芳香族类中的至少一者的烃类溶剂中含有有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物和羧酸酐中的至少一者而得到的。
2.根据权利要求1所述的安装基板的清洗方法,其中,
所述有机胺类是仲和叔有机胺类中的至少一者。
3.根据权利要求1或2所述的安装基板的清洗方法,其中,
所述有机胺类是二乙醇胺和三甲胺中的至少一者。
4.根据权利要求1或2所述的安装基板的清洗方法,其中,
所述不饱和羧酸酐化合物是松香酸和新松香酸中的至少一者。
5.根据权利要求1或2所述的安装基板的清洗方法,其中,
所述羧酸酐是蚁酸、醋酸酐以及戊酸酐中的至少一者。
6.一种清洗液,其是在包含酮和芳香族类中的至少一者的烃类溶剂中含有有机胺类、且在所述溶剂中添加了不饱和羧酸酐化合物和羧酸酐中的至少一者而得到的。
7.根据权利要求6所述的清洗液,其中,
所述有机胺类是仲和叔有机胺类中的至少一者。
8.一种清洗设备,其具备:
清洗槽,其贮存有清洗液;
洗涤液槽,其贮存有洗涤液;以及
干燥槽,
作为所述清洗液,使用权利要求6或7所述的清洗液。
9.一种清洗设备,其具备:
可动传送带,其载置安装基板;
清洗槽,其贮存有清洗液;
洗涤液槽;以及
干燥槽,其从喷射部喷射干燥空气,
所述清洗槽能够从喷射部将所述清洗液以喷淋的方式向所述可动传送带上的所述安装基板喷射,
作为所述清洗液,使用权利要求6或7所述的清洗液。
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CN108746017A (zh) * | 2018-06-01 | 2018-11-06 | 苏州古柏利电子科技有限公司 | 一种电子元器件酸洗装置 |
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EP2708594A1 (en) | 2012-09-18 | 2014-03-19 | Jotun A/S | Cleaning process |
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JPH08330265A (ja) * | 1995-06-01 | 1996-12-13 | Fujitsu Ltd | フラックスの洗浄方法 |
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