CN105001632A - High-thermal-conductivity PA10T composite material for LED lamp and preparation method thereof - Google Patents
High-thermal-conductivity PA10T composite material for LED lamp and preparation method thereof Download PDFInfo
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- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/9258—Velocity
- B29C2948/9259—Angular velocity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
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- B29C2948/92704—Temperature
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
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- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention provides a high-thermal-conductivity PA10T composite material for an LED lamp. The PA10T composite material is prepared from the following raw materials by weight: 40 to 42 parts of magnesium oxide, 20 to 22 parts of boron nitride, 2 to 3 parts of short cut glass fiber, 30 to 32 parts of polyamide PA10T, 7 to 8 parts of alumina whisker, 1 to 2 parts of nanometer titanium nitride, 1 to 2 parts of cerium oxide, 1 to 2 parts of nanometer carbon fiber, 1 to 2 parts of beryllia, 1 to 1.5 parts of polyvinyl butyral, 3 to 4 parts of ethanol and 3 to 4 parts of SEBS. According to the invention, magnesium oxide and boron nitride are used and produce good compounded and synergistic heat radiation effect; through modification of boron nitride with SEBS, the composite material has improved notch impact strength; through usage of short cut glass fiber and alumina whisker and modification, the composite material has enhanced heat conductivity coefficient and mechanical properties and the electrical properties of the composite material are maintained at a high level; and through usage of nanometer titanium nitride, cerium oxide, nanometer carbon fiber and beryllia, thermal diffusivity and cracking resistance of the material are improved.
Description
Technical field
The present invention relates to LED heat sink material field, particularly relate to a kind of high thermal conductivity LED PA10T matrix material and preparation method thereof.
Background technology
The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.
Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.
Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.
The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.
Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.
Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.
Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.
Summary of the invention
The object of the present invention is to provide a kind of high thermal conductivity LED PA10T matrix material, the thermal diffusivity of this composite heat dissipation material and splitting resistance good.
Technical scheme of the present invention is as follows:
A kind of high thermal conductivity LED PA10T matrix material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, Nano titanium nitride 1-2, cerium oxide 1-2, carbon nano fiber 1-2, beryllium oxide 1-2, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
The production method of described high thermal conductivity LED PA10T matrix material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin all to dissolve, add Nano titanium nitride, cerium oxide, carbon nano fiber again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, beryllium oxide, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Beneficial effect of the present invention
Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using Nano titanium nitride, cerium oxide, carbon nano fiber, beryllium oxide, improve thermal diffusivity and the splitting resistance of material.
Embodiment
A kind of high thermal conductivity LED PA10T matrix material, is made up of the raw material of following weight part (kilogram): magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, Nano titanium nitride 1.5, cerium oxide 1.5, carbon nano fiber 1.5, beryllium oxide 1.5, polyvinyl butyral acetal 1.3, ethanol 3.5, SEBS3.5.
The production method of described high thermal conductivity LED PA10T matrix material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 81 DEG C, be stirred to resin and all dissolve, add Nano titanium nitride, cerium oxide, carbon nano fiber again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, beryllium oxide, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Experimental data: the normal direction thermal conductivity of this heat sink material is 3.65W/mK.
Claims (2)
1. a high thermal conductivity LED PA10T matrix material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, Nano titanium nitride 1-2, cerium oxide 1-2, carbon nano fiber 1-2, beryllium oxide 1-2, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
2. the production method of high thermal conductivity LED PA10T matrix material according to claim 1, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin all to dissolve, add Nano titanium nitride, cerium oxide, carbon nano fiber again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, beryllium oxide, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
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Cited By (1)
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CN118027735A (en) * | 2024-03-18 | 2024-05-14 | 广东炎墨方案科技有限公司 | Anti-cracking solder resist ink and preparation method thereof |
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CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
CN104277455A (en) * | 2014-09-28 | 2015-01-14 | 苏州长盛机电有限公司 | Preparation method of thermally conductive and insulating material |
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Patent Citations (3)
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CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
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Non-Patent Citations (2)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN118027735A (en) * | 2024-03-18 | 2024-05-14 | 广东炎墨方案科技有限公司 | Anti-cracking solder resist ink and preparation method thereof |
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