CN118027735A - Anti-cracking solder resist ink and preparation method thereof - Google Patents
Anti-cracking solder resist ink and preparation method thereof Download PDFInfo
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- CN118027735A CN118027735A CN202410305616.3A CN202410305616A CN118027735A CN 118027735 A CN118027735 A CN 118027735A CN 202410305616 A CN202410305616 A CN 202410305616A CN 118027735 A CN118027735 A CN 118027735A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 39
- 238000005336 cracking Methods 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
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- 239000002904 solvent Substances 0.000 claims abstract description 18
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical class N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 239000000178 monomer Substances 0.000 claims abstract description 10
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims abstract description 10
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 9
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 229920001971 elastomer Polymers 0.000 claims abstract description 9
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- 238000006243 chemical reaction Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 11
- 229910052582 BN Inorganic materials 0.000 claims description 8
- 239000013067 intermediate product Substances 0.000 claims description 8
- 239000000047 product Substances 0.000 claims description 8
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical group C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000012024 dehydrating agents Substances 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- -1 photoinitiator Substances 0.000 claims description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical group [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
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- 239000000976 ink Substances 0.000 description 29
- 230000000052 comparative effect Effects 0.000 description 10
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- 239000002253 acid Substances 0.000 description 3
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical group COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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- 238000011056 performance test Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
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- 150000008064 anhydrides Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
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- 239000012767 functional filler Substances 0.000 description 1
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- 230000002045 lasting effect Effects 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention relates to an anti-cracking solder mask ink and a preparation method thereof, wherein the anti-cracking solder mask ink comprises a component A and a component B, and the component A comprises the following components in parts by weight: 30-60 parts of epoxy acrylic resin, 6-12 parts of UV monomer, 5-10 parts of SEBS elastomer, 10-30 parts of modified filler, 1-3 parts of photoinitiator, 1-6 parts of auxiliary agent and solvent; the component B comprises the following components in parts by weight: 1-10 parts of epoxy resin, 1-10 parts of auxiliary agent and solvent; the modified filler is SEBS-maleic anhydride copolymer modified boron nitride. According to the invention, components such as epoxy acrylic resin and SEBS elastomer are compounded, and simultaneously, the SEBS-maleic anhydride copolymer modified boron nitride is used as a filler, so that a good synergistic effect is generated, and the compatibility and the crosslinking density among various components are effectively improved, and the stability and the mechanical property are better.
Description
Technical Field
The invention relates to the technical field of solder resist ink, in particular to anti-cracking solder resist ink and a preparation method thereof.
Background
With the continuous progress of network and communication technologies, components such as copper-clad plates, circuit boards and the like used in electronic products are required to have higher reliability and higher speed, and related manufacturers have raised higher and higher requirements in the aspects of dielectric constant, dielectric loss factor, heat resistance and the like. And how to reduce the dielectric constant and dielectric loss of solder resist ink which is an important component of a PCB becomes the focus of research in the field.
The existing solder resist ink product generally uses phenolic epoxy resin as a matrix, and is compounded with components such as epoxy resin, UV monomer and the like to form a solder resist ink composition, and the solder resist ink composition is subjected to ultraviolet curing and then is subjected to heating curing to obtain a coating film. However, the products have difficulty in meeting the transmission requirement of electronic signals and have great defects. While increasing the content of functional fillers with low dielectric constants can overcome the drawbacks of dielectric properties, it is possible to affect the compatibility between the components, resulting in a decrease in the stability, mechanical properties of the product. Therefore, how to provide a solder resist ink with low dielectric constant and excellent mechanical and thermal conductivity is a problem to be solved in the art.
In view of the foregoing, it is necessary to develop a new technical solution to solve the drawbacks of the prior art.
Disclosure of Invention
Based on the above, the invention provides an anti-cracking solder mask ink and a preparation method thereof. According to the invention, components such as epoxy acrylic resin and SEBS elastomer are compounded, and simultaneously, the SEBS-maleic anhydride copolymer modified boron nitride is used as a filler, so that a good synergistic effect is generated, and the compatibility and the crosslinking density among various components are effectively improved, and the stability and the mechanical property are better.
The invention aims to provide a cracking-resistant solder resist ink, which comprises an A component and a B component,
The component A comprises the following components in parts by weight:
The component B comprises the following components in parts by weight:
1-10 parts of epoxy resin
1-10 Parts of auxiliary agent
5-10 Parts of a solvent;
Wherein,
The modified filler is SEBS-maleic anhydride copolymer modified boron nitride.
Further, the UV monomer is selected from monomers containing acrylic acid units.
Further, the auxiliary agent is selected from one or more of leveling agent, defoamer, ultraviolet absorber, dispersant and antioxidant.
Further, the preparation method of the modified filler comprises the following steps:
s1, dispersing boron nitride in a solvent, then adding a silane coupling agent, heating for reaction, and purifying to obtain an intermediate product;
S2, blending the SEBS-maleic anhydride copolymer and the intermediate product, adding a dehydrating agent, heating for reaction, and purifying to obtain the modified filler.
Further, in the step S1, the temperature of the heating reaction is 60-90 ℃ and the time is 5-10h.
Further, in step S1, the silane coupling agent is an aminosilane coupling agent.
Further, in the step S2, the temperature of the heating reaction is 80-90 ℃ and the time is 12-36h.
Further, in step S2, the dehydrating agent is dicyclohexylcarbodiimide.
Another object of the present invention is to provide a method for preparing the anti-cracking solder resist ink, comprising the following steps:
mixing epoxy acrylic resin, UV monomer, modified filler, SEBS elastomer, photoinitiator, auxiliary agent and solvent for reaction to obtain a component A; and (3) carrying out blending reaction on epoxy resin, an auxiliary agent and a solvent to obtain a component B, then blending the component A and the component B, uniformly stirring and dispersing, and then grinding and filtering to obtain a product.
The invention has the following beneficial effects:
According to the anti-cracking solder mask ink provided by the invention, epoxy resin and epoxy acrylic resin are adopted as matrix resin, and modified boron nitride is adopted as filler, the components firstly react boron nitride with an aminosilane coupling agent to obtain an intermediate product, amino is introduced into the surface of boron nitride, then the intermediate product reacts with SEBS-maleic anhydride copolymer, and an SEBS chain segment is grafted on the surface of boron nitride through the reaction of the amino and an anhydride group, so that the filler has better dispersibility, the hardness and toughness of an ink coating are improved, meanwhile, the modified filler has good compatibility with the organic resin and the SEBS elastomer, and the elastic chain segments can be mutually wound and crosslinked to form a network structure, so that the synergistic effect is exerted, and the mechanical strength of the ink is effectively enhanced; in addition, the oxygen-containing groups introduced on the surface of the modified filler can also generate intermolecular forces with active groups of other components, so that the stability of the product is further improved. The anti-cracking solder resist ink provided by the invention can take effect for a long time and lasting time, and has a good application prospect.
Detailed Description
In order to more clearly illustrate the technical solution of the present invention, the following examples are set forth. The starting materials, reactions and workup procedures used in the examples are those commonly practiced in the market and known to those skilled in the art unless otherwise indicated.
The words "preferred," "more preferred," and the like in the present disclosure refer to embodiments of the present disclosure that may provide certain benefits in some instances. However, other embodiments may be preferred under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
It should be understood that, except in any operating examples, or where otherwise indicated, quantities or all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending upon the desired properties to be obtained by the present invention.
The following substances are adopted in the embodiment of the invention:
The epoxy resin is bisphenol A epoxy resin E-12.
UV monomer is a mixture of trimethylolpropane triacrylate (TMPTA) and polydipentaerythritol hexaacrylate (DPHA) in a mass ratio of 1:1.
The photoinitiator is a photoinitiator 819.
The auxiliary agent comprises toner, a leveling agent and a dispersing agent in a mass ratio of 2:1:1, wherein the toner is carbon black, the leveling agent is isopropanol, and the dispersing agent is sodium dodecyl sulfate.
Boron nitride has an average particle diameter of 10 μm.
The solvent is dibasic ester (DBE).
SEBS elastomer is Koteng 1657, purchased from Dongguan Dingxin Plastic.
SEBS-maleic anhydride copolymer FG1901G.
In the embodiment of the invention, "parts" refer to parts by weight.
The preparation method of the modified filler in the embodiment of the invention comprises the following steps:
S1, adding 10g of dried boron nitride into 150mL of absolute ethyl alcohol, carrying out ultrasonic treatment for 30min to uniformly disperse the boron nitride, adding 1g of KH550 and 10mL of deionized water, heating to 70 ℃ to react for 1h, and obtaining an intermediate product after centrifugation, washing and drying;
S2, adding 3g of SEBS-maleic anhydride copolymer into 40mL of cyclohexane, adding 3g of the intermediate product, stirring and carrying out ultrasonic treatment for 30min to uniformly disperse, adding 0.3g of Dicyclohexylcarbodiimide (DCC), heating to 85 ℃ for reaction for 24h, removing the solvent, washing and drying to obtain the modified filler.
The method for synthesizing the epoxy acrylic resin comprises the following steps:
to 300g of diethylene glycol monoethyl ether acetate, 535g of o-cresol novolac epoxy resin (EPICLON N-695 available from DIC corporation) and 180g of acrylic acid were added, and the mixture was heated to 100 ℃ and stirred, and dissolved until homogeneous. Then 2g of triphenylphosphine is added, the mixture is heated to 110 ℃ for reaction for 2 hours, and then the mixture is heated to 120 ℃ for further reaction for 12 hours. 415g of dibasic ester and 250g of tetrahydrophthalic anhydride were added to the obtained reaction solution, and reacted at 110℃for 4 hours, followed by cooling, to obtain an epoxy acrylic resin having an acid value of 89mgKOH/g as a solid component and 65% as a solid component.
Example 1
A cracking-resistant solder resist ink comprises an A component and a B component,
The component A comprises the following components in parts by weight:
The component B comprises the following components in parts by weight:
epoxy resin 5 parts
Auxiliary agent 5 parts
5 Parts of solvent;
the preparation method of the anti-cracking solder resist ink comprises the following steps:
Mixing epoxy acrylic resin, UV monomer, modified filler, photoinitiator, auxiliary agent and solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent and a solvent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 2
A cracking-resistant solder resist ink comprises an A component and a B component,
The component A comprises the following components in parts by weight:
The component B comprises the following components in parts by weight:
10 parts of epoxy resin
Auxiliary agent 10 parts
10 Parts of solvent;
the preparation method of the cracking-resistant solder resist ink is the same as that of the embodiment 1.
Example 3
A cracking-resistant solder resist ink comprises an A component and a B component,
The component A comprises the following components in parts by weight:
The component B comprises the following components in parts by weight:
8 parts of epoxy resin
Auxiliary agent 5 parts
8 Parts of solvent;
the preparation method of the cracking-resistant solder resist ink is the same as that of the embodiment 1.
Comparative example 1
The comparative example differs from example 1 in that: the modified filler was replaced with an equal mass fraction of unmodified boron nitride, and the other components and preparation method were the same as in example 1.
Comparative example 2
The comparative example differs from example 1 in that: the SEBS elastomer is replaced by CTBN toughening agent (VOK-1300X 31 of Guangzhou Sida source chemical industry) in equal mass parts, and other components and preparation methods are the same as in example 1.
Test case
The solder resist inks prepared in examples 1 to 3 and comparative examples 1 to 2 were subjected to performance test.
The test method is as follows:
Adhesion force: the solder resist inks prepared in examples and comparative examples were applied to a PCB, respectively, and then photo-cured for 1 hour (ultraviolet light having a wavelength of 395nm and an intensity of 25.0mW/cm 2) and thermally cured at 150℃for 1 hour to form a 0.5mm thick film. The films were each scored x-shaped with a needle tip, then attached to the score with cellophane adhesive tape and pulled, as assessed according to the following criteria:
Excellent: not torn off;
common: tearing off a small amount;
poor: a large amount of the paper is torn off.
Stability: the solder resist inks prepared in examples and comparative examples were each sampled at 200mL, filled in a transparent container and sealed, left at room temperature for 30 days, and then observed for appearance, and evaluated on the basis of the following criteria:
excellent: no sediment exists;
Common: a small amount of precipitation;
poor: a large amount of precipitate.
Elongation rate: the elongation (elongation at break) of the film was measured by a tensile-compression tester (manufactured by Shimadzu corporation).
Bending resistance: 180 ° bending was performed with the solder resist ink film as the outer side, and evaluation was performed with the following criteria:
O: the film has no cracks;
X: the film had cracks.
Acid/alkali resistance: at 20 ℃, the PCB circuit board coated with the solder resist ink is immersed in 10wt% sulfuric acid solution or 10wt% sodium hydroxide solution, taken out after 30min, and the state and the adhesiveness of the coating film are evaluated, and the judgment standard is as follows:
O: no or slight changes were found;
X: the coating film has obvious swelling or swelling and falling off.
Pencil hardness: measured based on JIS K5400. The test results are shown in Table 1.
TABLE 1 Performance test results
As can be seen from Table 1, the various properties of the anti-cracking solder resist ink prepared in the examples of the present invention are significantly better than those of comparative examples 1 to 2 in which the components were replaced. In comparative example 1, modified filler is replaced by unmodified boron nitride, and in comparative example 2, SEBS elastomer is replaced by conventional toughening agent, so that the component performance is improved insufficiently, the compatibility among components is reduced, an ideal synergistic effect cannot be generated, and the mechanical performance and stability of the ink are reduced. In conclusion, the cracking-resistant solder resist ink has good stability, acid and alkali resistance and mechanical properties, and overcomes the defects in the prior art.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (9)
1. A cracking-resistant solder resist ink is characterized in that the cracking-resistant solder resist ink comprises an A component and a B component,
The component A comprises the following components in parts by weight:
A solvent;
The component B comprises the following components in parts by weight:
1-10 parts of epoxy resin
1-10 Parts of auxiliary agent
A solvent;
Wherein,
The modified filler is SEBS-maleic anhydride copolymer modified boron nitride.
2. The anti-cracking solder resist ink of claim 1 wherein the UV monomer is selected from the group consisting of monomers containing acrylic units.
3. The anti-cracking solder resist ink of claim 1, wherein the auxiliary agent is selected from one or more of leveling agent, defoamer, ultraviolet absorber, dispersant, antioxidant.
4. The anti-cracking solder resist ink of claim 1, wherein the preparation method of the modified filler comprises the following steps:
s1, dispersing boron nitride in a solvent, then adding a silane coupling agent, heating for reaction, and purifying to obtain an intermediate product;
S2, blending the SEBS-maleic anhydride copolymer and the intermediate product, adding a dehydrating agent, heating for reaction, and purifying to obtain the modified filler.
5. The anti-cracking solder resist ink according to claim 4, wherein in step S1, the heating reaction is performed at a temperature of 60 to 90 ℃ for a time of 5 to 10 hours.
6. The anti-cracking solder resist ink according to claim 4, wherein in step S1, the silane coupling agent is an aminosilane coupling agent.
7. The anti-cracking solder resist ink according to claim 4, wherein in step S2, the heating reaction is performed at a temperature of 80 to 90 ℃ for a time of 12 to 36 hours.
8. The anti-cracking solder resist ink according to claim 4, wherein in step S2, the dehydrating agent is dicyclohexylcarbodiimide.
9. The method for preparing the anti-cracking solder mask ink according to any one of claims 1 to 8, comprising the following steps:
mixing epoxy acrylic resin, UV monomer, modified filler, SEBS elastomer, photoinitiator, auxiliary agent and solvent for reaction to obtain a component A; and (3) carrying out blending reaction on epoxy resin, an auxiliary agent and a solvent to obtain a component B, then blending the component A and the component B, uniformly stirring and dispersing, and then grinding and filtering to obtain a product.
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