CN104968253B - 气密馈通件、用于生产气密馈通件的方法、印刷电路板和外科器械 - Google Patents
气密馈通件、用于生产气密馈通件的方法、印刷电路板和外科器械 Download PDFInfo
- Publication number
- CN104968253B CN104968253B CN201480007535.XA CN201480007535A CN104968253B CN 104968253 B CN104968253 B CN 104968253B CN 201480007535 A CN201480007535 A CN 201480007535A CN 104968253 B CN104968253 B CN 104968253B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- plastic compound
- feedthrough component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000004033 plastic Substances 0.000 claims abstract description 64
- 229920003023 plastic Polymers 0.000 claims abstract description 64
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- 238000005192 partition Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000010409 thin film Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 18
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000007363 ring formation reaction Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 description 41
- 239000010410 layer Substances 0.000 description 40
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 13
- XRWSZZJLZRKHHD-WVWIJVSJSA-N asunaprevir Chemical compound O=C([C@@H]1C[C@H](CN1C(=O)[C@@H](NC(=O)OC(C)(C)C)C(C)(C)C)OC1=NC=C(C2=CC=C(Cl)C=C21)OC)N[C@]1(C(=O)NS(=O)(=O)C2CC2)C[C@H]1C=C XRWSZZJLZRKHHD-WVWIJVSJSA-N 0.000 description 5
- 229940125961 compound 24 Drugs 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
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- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/0011—Manufacturing of endoscope parts
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00114—Electrical cables in or with an endoscope
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
- A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2476—Non-optical details, e.g. housings, mountings, supports
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2476—Non-optical details, e.g. housings, mountings, supports
- G02B23/2492—Arrangements for use in a hostile environment, e.g. a very hot, cold or radioactive environment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surgery (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Animal Behavior & Ethology (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Radiology & Medical Imaging (AREA)
- Astronomy & Astrophysics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Electromagnetism (AREA)
- Endoscopes (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013202037.6A DE102013202037A1 (de) | 2013-02-07 | 2013-02-07 | Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument |
| DE102013202037.6 | 2013-02-07 | ||
| PCT/EP2014/000269 WO2014121912A1 (de) | 2013-02-07 | 2014-02-03 | Hermetische durchführung, verfahren zur herstellung einer hermetischen durchführung, leiterplatte und chirurgisches instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968253A CN104968253A (zh) | 2015-10-07 |
| CN104968253B true CN104968253B (zh) | 2017-04-12 |
Family
ID=50070498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480007535.XA Expired - Fee Related CN104968253B (zh) | 2013-02-07 | 2014-02-03 | 气密馈通件、用于生产气密馈通件的方法、印刷电路板和外科器械 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150340133A1 (enExample) |
| JP (1) | JP6318176B2 (enExample) |
| CN (1) | CN104968253B (enExample) |
| DE (1) | DE102013202037A1 (enExample) |
| WO (1) | WO2014121912A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4147666A1 (en) * | 2016-07-14 | 2023-03-15 | Intuitive Surgical Operations, Inc. | A pressure test port contained within a body of surgical instrument |
| US11141046B2 (en) | 2016-07-14 | 2021-10-12 | Intuitive Surgical Operations, Inc. | Endoscope including a plurality of individually testable subassemblies |
| DE102017108029B3 (de) * | 2017-04-13 | 2018-05-30 | Karl Storz Se & Co. Kg | Endoskop |
| US11063382B2 (en) | 2018-05-22 | 2021-07-13 | Flowserve Management Company | Waterproof and explosion-proof circuit board and electronic valve actuator for flow control applications |
| DE102020135029A1 (de) * | 2020-12-29 | 2022-06-30 | Olympus Winter & Ibe Gmbh | Halterung für einen Bildsensor eines chirurgischen Instruments |
| WO2022198445A1 (zh) * | 2021-03-23 | 2022-09-29 | 柯惠有限合伙公司 | 内窥镜 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8202258A (nl) * | 1982-06-04 | 1984-01-02 | Philips Nv | Inrichting met meervoudige electrische doorvoering. |
| US4598466A (en) * | 1984-11-16 | 1986-07-08 | Cordis Corporation | Feedthrough |
| JPH04241831A (ja) * | 1991-01-10 | 1992-08-28 | Toshiba Corp | 内視鏡 |
| DE4131534A1 (de) * | 1991-09-21 | 1993-04-01 | Standard Elektrik Lorenz Ag | Vorrichtung zur isolierten herausfuehrung von leiterbahnen aus einem abschirmgehaeuse |
| JPH05130972A (ja) * | 1991-11-14 | 1993-05-28 | Asahi Optical Co Ltd | 電子内視鏡の先端部 |
| US6592044B1 (en) * | 2000-05-15 | 2003-07-15 | Jacob Y. Wong | Anonymous electronic card for generating personal coupons useful in commercial and security transactions |
| DE10310070A1 (de) * | 2003-03-07 | 2004-05-06 | Siemens Ag | Vakuumdurchführung |
| JP4162659B2 (ja) * | 2005-01-11 | 2008-10-08 | 株式会社有沢製作所 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
| DE102006015176B3 (de) * | 2006-03-30 | 2007-07-05 | Olympus Winter & Ibe Gmbh | Videoendoskop mit elektrischem Leitungsanschluß |
| JP4682158B2 (ja) * | 2007-01-16 | 2011-05-11 | オリンパスメディカルシステムズ株式会社 | 撮像装置 |
| DE202009005377U1 (de) * | 2008-04-14 | 2009-07-30 | Kuvag Gmbh & Co Kg | Eingießteil und Bauteil mit derartigem Eingießteil |
| US8247883B2 (en) * | 2008-12-04 | 2012-08-21 | Palo Alto Research Center Incorporated | Printing shielded connections and circuits |
| US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| DE102009011479A1 (de) * | 2009-03-06 | 2010-09-09 | Olympus Winter & Ibe Gmbh | Chirurgisches Instrument |
| US20100307798A1 (en) * | 2009-06-03 | 2010-12-09 | Izadian Jamal S | Unified scalable high speed interconnects technologies |
| DE102009041255B3 (de) * | 2009-09-11 | 2011-02-24 | Asm Automation Sensorik Messtechnik Gmbh | Längswasser-Sperre für elektrische Leitungen |
| KR20120035246A (ko) * | 2010-10-05 | 2012-04-16 | 삼성전기주식회사 | 신호 전송용 회로기판 및 이의 제조 방법 |
-
2013
- 2013-02-07 DE DE102013202037.6A patent/DE102013202037A1/de not_active Withdrawn
-
2014
- 2014-02-03 WO PCT/EP2014/000269 patent/WO2014121912A1/de not_active Ceased
- 2014-02-03 JP JP2015556415A patent/JP6318176B2/ja active Active
- 2014-02-03 CN CN201480007535.XA patent/CN104968253B/zh not_active Expired - Fee Related
-
2015
- 2015-08-06 US US14/819,896 patent/US20150340133A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP6318176B2 (ja) | 2018-04-25 |
| JP2016507301A (ja) | 2016-03-10 |
| CN104968253A (zh) | 2015-10-07 |
| WO2014121912A1 (de) | 2014-08-14 |
| US20150340133A1 (en) | 2015-11-26 |
| DE102013202037A1 (de) | 2014-08-07 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 Termination date: 20210203 |