Classifications

• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
  • A61B1/00064—Constructional details of the endoscope body
  • A61B1/0011—Manufacturing of endoscope parts
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
  • A61B1/00112—Connection or coupling means
  • A61B1/00114—Electrical cables in or with an endoscope
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
  • A61B1/00112—Connection or coupling means
  • A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
  • A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
  • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
  • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
  • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
  • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
  • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
  • G02B23/2492—Arrangements for use in a hostile environment, e.g. a very hot, cold or radioactive environment
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B17/00—Insulators or insulating bodies characterised by their form
  • H01B17/26—Lead-in insulators; Lead-through insulators
  • H01B17/30—Sealing
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
  • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
  • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
  • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/028—Bending or folding regions of flexible printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/032—Organic insulating material consisting of one material
  • H05K1/0346—Organic insulating material consisting of one material containing N
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0014—Shaping of the substrate, e.g. by moulding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/06—Hermetically-sealed casings
  • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0154—Polyimide
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1327—Moulding over PCB locally or completely
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49155—Manufacturing circuit on or in base
  • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
  • Y10T29/4916—Simultaneous circuit manufacturing

Definitions

• Hermetic bushing method of making a hermetic bushing, circuit board and surgical instrument
• the invention relates to a hermetic passage for a video endoscope for passing electrical lines from a first subspace into a second subspace, in particular from a distally arranged hermetically sealed housing into an endoscope shaft, comprising a partition wall for hermetically sealing the two subspaces, a method for manufacturing a hermetic implementation, a circuit board and a surgical instrument.
• optics such as a straight-ahead or side-looking lens, which is often followed by an image sensor or pair of image sensors that convert the received light into electronic image information forward to the proximal as electronic signals. Pairs of
• image sensors can be used in stereoscopic video endoscopes to provide a spatial impression, to enhance color reproduction, or to adjust for various sensitivities or different analyzes requiring different optical properties.
• endoscopes A basic requirement of endoscopes is the ability to autoclave. When autoclaving, the endoscope is treated under high pressure with hot steam. In the case of optical endoscopes, and in particular video endoscopes, it is necessary to protect the optical components and the image sensor against vapor, which otherwise may settle on the optic on cooling and adversely affect the optical quality of the system. Video endoscopes are therefore usually hermetically sealed. The hermetic seal prevents the penetration of steam into the hermetically sealed area. This extends in conventional video optics from the stem tip to the handle.
• both the optics and the image sensor are located in a hermetically sealed space. Therefore, a hermetically sealed through-connection of the electrical supply and signal lines must be present.
• These electrical lines with which among other things the electrical signals are transmitted inside the endoscope shaft, are usually cables with several shielded and / or unshielded strands.
• the hermetically sealed plated-through hole is made by means of metal pins or metallic contact pins cast in glass. The electrical cables are soldered directly to the metal pins.
• the rotation of these two optical components against each other takes place in hermetically sealed space.
• the image rotation is generated in the handle of the optics by the user and must be transferred to the top.
• the tightness from the handle to the top of the video endoscope must be ensured.
• the space in the cladding tube is limited and is used to realize a hermetically sealed unit, to transmit an image rotation, to transport light and to ensure a mechanically strong structure.
• the electrical leads are twisted between the image sensor or the image sensors and the hermetic feedthrough.
• the cable is therefore soldered to the pins of the hermetic feedthrough so that its central axis is on the rotation plane of rotation. Since the cable is also split open and the individual strands are soldered to the hermetic connector, the cable can be twisted evenly with little force.
• each endoscope must have its own video optics unit, ie the unit comprising the optics with lens and the image sensor.
• a modular structure with different lengths, which may also be nationally different, is thus complex.
• there are alternative known methods for performing signals with an at least sufficiently high Tightness for example the gluing or casting of cables or Flexboard with adhesives.
• these feedthroughs can be used to a limited extent because moisture can penetrate both between the signal conductor and the potting compound and between the potting compound and the cavity to be sealed.
• the present invention has for its object to provide a hermetic implementation, a method for their preparation and a surgical instrument available, which with good signal quality improved sealing hermetic housing and easy installation is given.
• the printed circuit board produced in thin-film technology is in contrast to the previously used connectors very easy and automated contactable because their contact surfaces can be arranged in a plane.
• These thin-film circuit boards which have a thickness of less than 1 00 pm, in most cases less than 50 ⁇ m, have a high degree of flexibility, so that they can also be twisted to a sufficient extent for twists, for example to change the viewing direction ,
• the plastic material and the plastic of the printed circuit board of the same crosslinkable material or different crosslinkable materials in particular of a polyimide.
• the plastic compound and / or the plastic of the printed circuit board are preferably not completely crosslinked or cured before postcrosslinking, so that they can enter into a cohesive connection with one another as a result of the postcrosslinking.
• Polyimide, but also other post-crosslinkable materials, offers or offer material properties which are suitable for the intended use as a partition both from the stability and from the tightness.
• the printed circuit board and the plastic compound are in a ring, in particular a metal ring, a cast.
• the metal ring then serves to connect to the other parts of the surgical instrument to form and seal the hermetically sealed housing.
• the housing may also be a separate part of the endoscope shaft itself.
• the hermetic passage can also be dimensioned the same for hermetic housings of different lengths, ie for different endoscope types.
• the ring has an undercut which is filled by the plastic compound.
• the undercut which is filled by the plastic mass, thus forming a labyrinth seal, which effectively prevents a passage of water vapor.
• the object underlying the invention is also achieved by a method for producing a hermetic implementation for a video endoscope, in which electrical lines are performed by a partition from a first subspace in a second subspace, which is further developed by one in a thin-film technique manufactured, in particular flexible, printed circuit board in which the electrical lines are embedded in a non-conductive crosslinkable or crosslinked or partially crosslinked plastic, with a non-conductive crosslinkable plastic mass is poured into a mold and then for crosslinking, especially thermally, aftertreated.
• the type of post-treatment depends on the type of material chosen.
• This method is particularly suitable for producing a hermetic implementation according to the invention described above and leads to a hermetic implementation with cohesive bonding Seal between the printed circuit board and the partition, wherein the printed circuit board in particular is particularly flexible and easy to handle.
• the plastic material and the plastic of the circuit board of the same crosslinkable material or different mutually crosslinkable materials in particular a polyim id.
• the mold is preferably formed as a ring, in particular as a metal ring, wherein the cured and / or crosslinked plastic mass in the ring forms the partition wall, wherein in particular the ring has a H interschneid u ng, which is filled by the plastic material during the casting.
• the object underlying the invention is further d by a printed circuit board, in particular a hermetic implementation for a surgical instrument, in particular a circuit board according to the invention described above hermetic Naturalon tion, prepared in a thin-film technique with sequences of structured layers of metal and a plastic solved in that it is distinguished that the metal structures in cross-section form a coaxial structure through the printed circuit board, wherein one or more, in particular one, two or four, in a center of the coaxial structure angeord designated conductor to the entire circumference of one, in particular one-piece or multi-part, Mantelleiter Quilt GmbH.
• the thin-film technique used in the present invention can be, for example, a combination of applying thin plastic layers and processing them, for example by lithography and etching, wherein metal layers are applied, for example, by sputtering and subsequent photolithographic processing.
• the alternating application and processing of plastic and metal layers makes it possible to construct arbitrarily placed metal structures with up to 4 or 5 metal layers.
• one, two, four or another number of conductor tracks can be introduced into a coaxial structure, in which the conductors arranged in the center of the construction are surrounded by a one-part or multi-part sheath conductor structure.
• the sheathed conductor structure need not be circular, but may be rectangular or in some other form as long as it encloses the internal signal conductors. When the shell structure is grounded, the internal signal conductors are largely protected from external interference.
• three or more layers of the printed circuit board are structured to form a twisted conductor structure or a partially twisted conductor structure of two electrical conductors.
• a twisted conductor structure can be fabricated by means of corresponding multi-level masks that create matching and multi-level conductor patterns to produce a kind of "twisted pair" conductor that further reduces the influence of extraneous noise on signal quality
• Signal conductors may also be looped or interlocked in some other way, such as in a "partial twist” without being completely twisted.
• the object underlying the invention is also achieved by a surgical instrument, in particular video endoscope, with a hermetic implementation according to the invention described above. Such a surgical instrument advantageously also has the printed circuit board according to the invention described above.
• FIG. 1 cross sections and layer sequences for two circuit boards according to the invention in a schematic representation
• Fig. 3 cross sections, plan views and layer sequences another circuit board according to the invention schematic representation
• Fig. 4 are cross-sectional views of a plan view and layer sequences for a further circuit board according to the invention in a schematic representation.
• a hermetic feedthrough 10 according to the invention with a printed circuit board 20 is shown schematically in a cross section.
• the elongated printed circuit board 20 has in the plan view shown three plastic-enclosed conductor tracks 22 which terminate in open contact surfaces, not shown, at both ends of the printed circuit board 20.
• In the middle of the circuit board 20 is integrally connected to a partition 12.
• the separating layers between the conductor tracks 22 and the partition wall 12 each consist of a plastic, for example a polyimide, which has been post-crosslinked after casting, for example by a thermal treatment.
• the partition wall 12 is cast in a circumferential ring 14, for example a metal ring, which has a central undercutting an undercut 16, into which the plastic mass 24 of the partition wall 12 has penetrated and which fills this undercut 16.
• the undercut 16 in the embodiment of FIG. 1 a) is T-shaped.
• the hermetic implementation 1 0 according to FIG. 1 a) is easy to produce by the prefabricated and at least already partially cross-linked circuit board 20 is poured together with the plastic mass 24 in the ring 14 and then postcrosslinked.
• the plastic compound 24 and the plastic of the printed circuit board 20 are for example a polyimide, which is very well suited for this use.
• undercut 16 ensures that there is a labyrinth seal that effectively prevents a diffusion of water vapor, if between the plastic mass 24 of the partition wall 12 and the ring 14 should form a gap.
• Fig. 1 a are still two sectional planes A, B shown.
• the section through the sectional plane A is shown in Fig. 1 b), the section through the sectional plane B in Fig. 1 c).
• Fig. 1 b shows a section through the printed circuit board 20.
• the printed circuit board 20 consists of a total of 7 layers, of which the first, third, fifth and seventh layer, counted from above, each consist entirely of plastic, for example Polyimide, while the second, fourth and sixth layer respectively conductor tracks 22 and a wide ground conductor 23 include.
• plastic for example Polyimide
• the second, fourth and sixth layer respectively conductor tracks 22 and a wide ground conductor 23 include.
• All conductor tracks 22 and the mass surface 23 are completely surrounded by the plastic in the sectional plane A shown.
• Fig. 1 c is the section according to sectional plane B of FIG. 1 a).
• the result of the method according to the invention is that the printed circuit board 20 now merges into the dividing wall 12 from the plastics material 24 in a materially bonded, ie, transitionless manner.
• These separators wall 1 2 extends to the circumferential ring 14.
• the undercut 16 is not shown in Fig. 1 c).
• Fig. 2 are shown in the left and right image part 2 printed circuit boards 30, 31, which differ in that the circuit board 30 has a signal conductor 36 and the circuit board 31 has two signal conductors 36. In both cases, the signal conductor or conductors 36 are enclosed by a jacket structure 35, which is also constructed in a layered construction.
• the total thickness of these printed circuit boards 30, 31 as well as the printed circuit board 20 of FIG. 1 and the circuit boards shown in FIGS. 3 and 4 is less than 50 ⁇ .
• a sequence of structured layers 32 ⁇ is shown in the middle between the cross sections through the printed circuit boards 30, 31.
• Each layer 32 IVV "is referenced by corresponding lines to the corresponding layers in the cross section of the printed circuit boards 30, 31, this correspondence being highly schematic is because some layers are flat while other layers may be contoured in height.
• structured layers 32 I_VM are constructed from bottom to top in the manufacturing process, they are shown below with respect to the printed circuit boards 30, 31 from bottom to top in the following.
• the basis is a flat sheet 32 v ", the full width of the circuit boards 30, 31 has and completely consists of the plastic material used, for example, polyimide. Then a likewise flat structured layer 32 VI, is next applied at least partially centrally completely from a metal, For example, copper, nickel, gold or the like and has a good conductivity.
• a metal For example, copper, nickel, gold or the like and has a good conductivity.
• This layer 32 vl with the metal 34 forms the basis or a first part of a shell structure 35 of a Koaxialdents and is shown dark.
• a one-piece construction of a shell structure would do without such a broad base layer and instead have a more circular or oval structure in cross-section.
• the following flat structured layer 32 v is a plastic layer with two strip-shaped recesses which, after a few further steps, will be filled with a layer of metal from the layer 32 ", which represents the upper, hatched part of the shell structure.
• structured layer 32 I is a bright metallic strip embedded as a conductor 36 in the plastic, which is flanked by two dark recesses shown, which also serve to form the upper part of the coaxial structure.
• structured layer 32 I ' two signal conductors 36 of the printed circuit board 31 are present. This layer is peeled off by the patterned layer 32 '', which is a repeat of the layer 32 v . All these layers are substantially planar and have the same width.
• the structured layer 32 is a metallic layer which terminates the shell structure 35.
• This structured layer 32" is not planar, but has a height distribution, since the metal applied, for example by sputtering, into the recesses of the layers 32 m " Even the top, covering structured layer 32 ', which is a pure plastic layer, is not flat, so that the entire metallic structure in the printed circuit boards 30, 31 is embedded in plastic on all sides.
• the explanations made with regard to the structured layers according to FIG. 2 essentially also apply to the printed circuit boards according to FIGS. 3 and 4. However, since in these exemplary embodiments three-dimensional structures of the respective strip conductors are realized, the number of layers increases by two. The differences from FIG. 2 relate to the three central structured layers which contain the conductor tracks. The corresponding reference numerals from FIG. 2 are increased by ten in FIG. 3 and by 20 in FIG. 4.
• FIG. 3 two cross-sections and a plan view and a sequence of layers of a circuit board 40 according to the invention are shown.
• the Roman numerals I to IX, which symbolize the different layers are shown schematically in both cross sections to the side to roughly illustrate their arrangement. It is a teilverdrillte structure in which two signal conductors 46 partially twisted, but not completely twisted, are arranged. The two signal conductors 46 are also arranged in a jacket structure 45.
• the general structure of the layer structure and of the cross section of the printed circuit board 40 corresponds approximately to that of FIG. 2.
• a middle plane 42 v is drawn in which mainly contains plastic which is electrically insulating at this point, only at the points where the signal conductors 46 are viewed in the longitudinal direction are arranged laterally to each other, this middle plane 42 through-taktmaschineen with which the upper parts with the lower parts the signal conductor 46 are connected, so that there is a three-dimensional conductor structure.
• the two signal conductors 46 each make a half turn around each other and then reverse their direction, so that a partially twisted conductor structure 47 is formed.
• This has similar shielding properties as a fully twisted ladder structure.
• FIG. 3 In the plan view, bottom left in Fig. 3, two sectional planes are shown.
• the cross section in the upper left in FIG. 3 corresponds to the left cutting line and the middle cross section to the left in FIG. 3 corresponds to the right cutting line.
• FIG. 4 a circuit board 50 is shown with respect to FIG. 3 by ten raised reference numerals, resulting in a fully twisted conductor structure 57.
• a circuit board 50 is shown with respect to FIG. 3 by ten raised reference numerals, resulting in a fully twisted conductor structure 57.
• the layers 42 '' V1 ', 52'' V1 ' in FIGS. 3 and 4 as well as the layers 32 '' V1 in FIG. 2 do not measure the complete width of the printed circuit boards 30, 31, 40, 50 , but in the respective circuit board side are also each surrounded by plastic 33.

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Health & Medical Sciences (AREA)
• Life Sciences & Earth Sciences (AREA)
• Surgery (AREA)
• Optics & Photonics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Molecular Biology (AREA)
• Veterinary Medicine (AREA)
• Radiology & Medical Imaging (AREA)
• Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
• Biomedical Technology (AREA)
• Heart & Thoracic Surgery (AREA)
• Medical Informatics (AREA)
• Biophysics (AREA)
• Animal Behavior & Ethology (AREA)
• General Health & Medical Sciences (AREA)
• Public Health (AREA)
• Pathology (AREA)
• Astronomy & Astrophysics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Architecture (AREA)
• Civil Engineering (AREA)
• Structural Engineering (AREA)
• Electromagnetism (AREA)
• Endoscopes (AREA)
• Instruments For Viewing The Inside Of Hollow Bodies (AREA)

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• 2013
  • 2013-02-07 DE DE102013202037.6A patent/DE102013202037A1/de not_active Withdrawn
• 2014
  • 2014-02-03 WO PCT/EP2014/000269 patent/WO2014121912A1/de not_active Ceased
  • 2014-02-03 JP JP2015556415A patent/JP6318176B2/ja active Active
  • 2014-02-03 CN CN201480007535.XA patent/CN104968253B/zh not_active Expired - Fee Related
• 2015
  • 2015-08-06 US US14/819,896 patent/US20150340133A1/en not_active Abandoned

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