JP6318176B2 - 密閉フィードスルー、密閉フィードスルーの製造方法、プリント回路基板、及び外科器具 - Google Patents

密閉フィードスルー、密閉フィードスルーの製造方法、プリント回路基板、及び外科器具 Download PDF

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JP6318176B2
JP6318176B2 JP2015556415A JP2015556415A JP6318176B2 JP 6318176 B2 JP6318176 B2 JP 6318176B2 JP 2015556415 A JP2015556415 A JP 2015556415A JP 2015556415 A JP2015556415 A JP 2015556415A JP 6318176 B2 JP6318176 B2 JP 6318176B2
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printed circuit
circuit board
feedthrough
plastic
sealed
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Japanese (ja)
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JP2016507301A (ja
JP2016507301A5 (enExample
Inventor
セバスティアン ユングバウアー
セバスティアン ユングバウアー
セバスティアン シュトゥーレ
セバスティアン シュトゥーレ
マルティン ヴィータース
マルティン ヴィータース
アレクサンダー ブルス
アレクサンダー ブルス
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Olympus Winter and Ibe GmbH
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Olympus Winter and Ibe GmbH
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/0011—Manufacturing of endoscope parts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00112—Connection or coupling means
    • A61B1/00114—Electrical cables in or with an endoscope
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00112—Connection or coupling means
    • A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
    • A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2492—Arrangements for use in a hostile environment, e.g. a very hot, cold or radioactive environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Radiology & Medical Imaging (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electromagnetism (AREA)
  • Endoscopes (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
JP2015556415A 2013-02-07 2014-02-03 密閉フィードスルー、密閉フィードスルーの製造方法、プリント回路基板、及び外科器具 Active JP6318176B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013202037.6A DE102013202037A1 (de) 2013-02-07 2013-02-07 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument
DE102013202037.6 2013-02-07
PCT/EP2014/000269 WO2014121912A1 (de) 2013-02-07 2014-02-03 Hermetische durchführung, verfahren zur herstellung einer hermetischen durchführung, leiterplatte und chirurgisches instrument

Publications (3)

Publication Number Publication Date
JP2016507301A JP2016507301A (ja) 2016-03-10
JP2016507301A5 JP2016507301A5 (enExample) 2017-02-09
JP6318176B2 true JP6318176B2 (ja) 2018-04-25

Family

ID=50070498

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JP2015556415A Active JP6318176B2 (ja) 2013-02-07 2014-02-03 密閉フィードスルー、密閉フィードスルーの製造方法、プリント回路基板、及び外科器具

Country Status (5)

Country Link
US (1) US20150340133A1 (enExample)
JP (1) JP6318176B2 (enExample)
CN (1) CN104968253B (enExample)
DE (1) DE102013202037A1 (enExample)
WO (1) WO2014121912A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4147666A1 (en) * 2016-07-14 2023-03-15 Intuitive Surgical Operations, Inc. A pressure test port contained within a body of surgical instrument
US11141046B2 (en) 2016-07-14 2021-10-12 Intuitive Surgical Operations, Inc. Endoscope including a plurality of individually testable subassemblies
DE102017108029B3 (de) * 2017-04-13 2018-05-30 Karl Storz Se & Co. Kg Endoskop
US11063382B2 (en) 2018-05-22 2021-07-13 Flowserve Management Company Waterproof and explosion-proof circuit board and electronic valve actuator for flow control applications
DE102020135029A1 (de) * 2020-12-29 2022-06-30 Olympus Winter & Ibe Gmbh Halterung für einen Bildsensor eines chirurgischen Instruments
WO2022198445A1 (zh) * 2021-03-23 2022-09-29 柯惠有限合伙公司 内窥镜

Family Cites Families (17)

* Cited by examiner, † Cited by third party
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NL8202258A (nl) * 1982-06-04 1984-01-02 Philips Nv Inrichting met meervoudige electrische doorvoering.
US4598466A (en) * 1984-11-16 1986-07-08 Cordis Corporation Feedthrough
JPH04241831A (ja) * 1991-01-10 1992-08-28 Toshiba Corp 内視鏡
DE4131534A1 (de) * 1991-09-21 1993-04-01 Standard Elektrik Lorenz Ag Vorrichtung zur isolierten herausfuehrung von leiterbahnen aus einem abschirmgehaeuse
JPH05130972A (ja) * 1991-11-14 1993-05-28 Asahi Optical Co Ltd 電子内視鏡の先端部
US6592044B1 (en) * 2000-05-15 2003-07-15 Jacob Y. Wong Anonymous electronic card for generating personal coupons useful in commercial and security transactions
DE10310070A1 (de) * 2003-03-07 2004-05-06 Siemens Ag Vakuumdurchführung
JP4162659B2 (ja) * 2005-01-11 2008-10-08 株式会社有沢製作所 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末
DE102006015176B3 (de) * 2006-03-30 2007-07-05 Olympus Winter & Ibe Gmbh Videoendoskop mit elektrischem Leitungsanschluß
JP4682158B2 (ja) * 2007-01-16 2011-05-11 オリンパスメディカルシステムズ株式会社 撮像装置
DE202009005377U1 (de) * 2008-04-14 2009-07-30 Kuvag Gmbh & Co Kg Eingießteil und Bauteil mit derartigem Eingießteil
US8247883B2 (en) * 2008-12-04 2012-08-21 Palo Alto Research Center Incorporated Printing shielded connections and circuits
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
DE102009011479A1 (de) * 2009-03-06 2010-09-09 Olympus Winter & Ibe Gmbh Chirurgisches Instrument
US20100307798A1 (en) * 2009-06-03 2010-12-09 Izadian Jamal S Unified scalable high speed interconnects technologies
DE102009041255B3 (de) * 2009-09-11 2011-02-24 Asm Automation Sensorik Messtechnik Gmbh Längswasser-Sperre für elektrische Leitungen
KR20120035246A (ko) * 2010-10-05 2012-04-16 삼성전기주식회사 신호 전송용 회로기판 및 이의 제조 방법

Also Published As

Publication number Publication date
CN104968253B (zh) 2017-04-12
JP2016507301A (ja) 2016-03-10
CN104968253A (zh) 2015-10-07
WO2014121912A1 (de) 2014-08-14
US20150340133A1 (en) 2015-11-26
DE102013202037A1 (de) 2014-08-07

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