CN104966501B - 用于窄边框lcd的goa电路结构 - Google Patents
用于窄边框lcd的goa电路结构 Download PDFInfo
- Publication number
- CN104966501B CN104966501B CN201510432315.8A CN201510432315A CN104966501B CN 104966501 B CN104966501 B CN 104966501B CN 201510432315 A CN201510432315 A CN 201510432315A CN 104966501 B CN104966501 B CN 104966501B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- circuit structure
- tft
- buffer unit
- narrow frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3674—Details of drivers for scan electrodes
- G09G3/3677—Details of drivers for scan electrodes suitable for active matrices only
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1237—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a different composition, shape, layout or thickness of the gate insulator in different devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78678—Polycrystalline or microcrystalline silicon transistor with inverted-type structure, e.g. with bottom gate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
- G02F1/13685—Top gates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/10—Materials and properties semiconductor
- G02F2202/104—Materials and properties semiconductor poly-Si
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Liquid Crystal (AREA)
- Liquid Crystal Display Device Control (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本发明提供一种用于窄边框LCD的GOA电路结构,包括:锁存器、与非门、缓冲器单元、以及重置单元;输入信号输入锁存器,输出信号自缓冲器单元输出;所述缓冲器单元包括由第一金属层(1)、第二金属层(2)、及设于第一金属层(1)与第二金属层(2)之间的有源层(3)构成的多个TFT;每一TFT均具有双栅极,其底栅极由第一金属层(1)形成,其源极与漏极由第二金属层(2)形成,其顶栅极也由第二金属层(2)形成,能够减小缓冲器单元中TFT的尺寸以及缓冲器单元的宽度,从而减小GOA电路的宽度,使得LCD的边框较窄。
Description
技术领域
本发明涉及液晶显示技术领域,尤其涉及一种用于窄边框LCD的GOA电路结构。
背景技术
液晶显示器(Liquid Crystal Display,LCD)具有机身薄、省电、无辐射等众多优点,得到了广泛的应用。如:液晶电视、移动电话、个人数字助理(PDA)、数字相机、计算机屏幕或笔记本电脑屏幕等,在平板显示领域中占主导地位。
现有市场上的液晶显示器大部分为背光型液晶显示器,其包括液晶显示面板及背光模组(backlight module)。液晶显示面板的工作原理是在薄膜晶体管阵列基板(ThinFilm Transistor Array Substrate,TFT Array Substrate)与彩色滤光片基板(ColorFilter,CF)之间灌入液晶分子,并在两片基板上施加驱动电压来控制液晶分子的旋转方向,以将背光模组的光线折射出来产生画面。
主动式液晶显示器中,每个像素电性连接一个薄膜晶体管(TFT),薄膜晶体管的栅极(Gate)连接至水平扫描线,漏极(Drain)连接至垂直方向的数据线,源极(Source)则连接至像素电极。在水平扫描线上施加足够的电压,会使得电性连接至该条水平扫描线上的所有TFT打开,从而数据线上的信号电压能够写入像素,控制不同液晶的透光度进而达到控制色彩与亮度的效果。GOA技术(Gate Driver on Array)即阵列基板行驱动技术,是利用液晶显示面板的阵列制程将栅极驱动电路制作在TFT阵列基板上,实现对栅极逐行扫描的驱动方式。GOA电路具有能够降低生产成本和实现窄边框设计的优点,适用于液晶显示器。
根据使用的有源层材料的不同,GOA电路可以分为非晶硅(Amorphous silicon,a-Si)GOA电路、铟镓锌氧化物(Indium Gallium Zinc Oxide,IGZO)GOA电路、低温多晶硅(LowTemperature Ploy Silicon,LTPS)GOA电路等,每种GOA电路又可以使用不同的制程。LTPS由于具有高电子迁移率和技术成熟的优点,目前被中小尺寸LCD中的GOA电路广泛使用。
随着显示技术的发展,人们对LCD的美观提出了更高的要求,边框的宽度作为审美的要素之一,受到各LCD生产商的高度重视。多种因素都会影响LCD的边框宽度,如框胶材料、切割技术、机台精度等,除上述因素外,GOA电路的宽度也是重要的影响因素之一。
图1所示为GOA电路的基本工作原理示意图。GOA电路主要具有两项基本功能:第一是输入扫描脉冲信号(Gate pulse)功能,驱动面板内的扫描线(Gate line),打开显示区内的TFT,使得数据线(Data line)能够对像素进行充电;第二是移位寄存功能,当第n个扫描脉冲信号G(n)输出完成后,可以通过时钟信号控制进行第n+1个扫描脉冲信号G(n+1)的输出,并依此传递下去。
图2所示为CMOS制程下GOA电路的基本结构框图。该GOA电路由四部分组成:锁存器(Latch)、与非门(NAND)、缓冲器单元(Buffer)、以及重置单元(Reset),所述锁存器电性连接与非门及重置单元,所述与非门电性连接锁存器及缓冲器单元。重置信号输入重置单元,输入信号与第一时钟信号输入锁存器,第二时钟信号输入与非门,输出信号自缓冲器单元输出。由于缓冲器单元为输出级,需要具有很强的驱动能力,通常缓冲器单元内TFT的尺寸很大,占用很大的布局空间,不利于减小LCD边框的宽度。
请同时参阅图3与图4,现有的GOA电路中的缓冲器单元包括由第一金属层10、第二金属层20、及设于第一金属层10与第二金属层20之间的有源层30构成的多个TFT;每一TFT的栅极由第一金属层10形成,每一TFT的源极与漏极由第二金属层20形成,源极与漏极分别位于栅极的两侧;有源层30对应TFT的源极与漏极的区域为离子重掺杂区域301,TFT的源极与漏极分别经由一过孔601连接有源层30的离子重掺杂区域301,有源层30对应TFT的源极与漏极之间的区域为沟道区域302。由于该现有的缓冲器单元仅使用第一金属层10形成TFT的栅极,有源层30的沟道区域302位于栅极上方,厚度薄、阻抗大,为了提升缓冲器单元的驱动能力,通常需要把沟道区域302的长度增长,该种方法虽然增大了缓冲器单元的驱动能力,但是缓冲器单元的宽度也会随之增大,相应的GOA电路的宽度增大,不利于减小LCD边框的宽度。
发明内容
本发明的目的在于提供一种用于窄边框LCD的GOA电路结构,能够减小缓冲器单元中TFT的尺寸以及缓冲器单元的宽度,从而减小GOA电路的宽度,使得LCD的边框较窄。
为实现上述目的,本发明提供一种用于窄边框LCD的GOA电路结构,包括:锁存器、与非门、缓冲器单元、以及重置单元,所述锁存器电性连接与非门及重置单元,所述与非门电性连接锁存器及缓冲器单元;输入信号输入锁存器,输出信号自缓冲器单元输出;
所述缓冲器单元包括由第一金属层、第二金属层、及设于第一金属层与第二金属层之间的有源层构成的多个TFT;每一TFT均具有双栅极,其底栅极由第一金属层形成,其源极与漏极由第二金属层形成,其顶栅极也由第二金属层形成。
所述源极、漏极分别位于底栅极及顶栅极的两侧;所述有源层对应TFT的源极、漏极的区域为离子重掺杂区域,所述有源层对应TFT的源极与漏极之间的区域为沟道区域。
TFT的源极与漏极分别经由一过孔连接有源层的离子重掺杂区域。
在所述第一金属层与有源层之间还设有底栅极绝缘层,在有源层与第二金属层之间还设有顶栅极绝缘层;所述过孔贯穿所述顶栅极绝缘层。
所述第一金属层的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
所述第二金属层的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
所述有源层的材料为低温多晶硅。
所述底栅极绝缘层与顶栅极绝缘层的材料为氧化硅、氮化硅或二者的组合。
本发明的有益效果:本发明提供一种用于窄边框LCD的GOA电路结构,其缓冲器单元中的TFT在有源层的沟道区域下方设有由第一金属层形成的底栅极,在有源层的沟道区域上方设有由第二金属层形成的顶栅极,有源层的沟道区域厚度较厚、阻抗较小,显著增加了缓冲器单元中的TFT的驱动能力,在相同的驱动能力下,缓冲器单元中TFT的尺寸得以减小,从而缓冲器单元的宽度减小,GOA电路的宽度减小,使得LCD的边框可以做的更窄。
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
附图说明
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。
附图中,
图1为GOA电路的基本工作原理示意图;
图2为CMOS制程下GOA电路的基本结构框图;
图3为现有GOA电路中的缓冲器单元的平面俯视示意图;
图4为对应于图3中A-A处的剖面结构示意图;
图5为本发明用于窄边框LCD的GOA电路结构的平面俯视示意图;
图6为对应于图5中B-B处的剖面结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
本发明提供一种用于窄边框LCD的GOA电路结构。请参阅图2、图5、与图6,本发明的GOA电路结构同样包括:锁存器、与非门、缓冲器单元、以及重置单元,所述锁存器电性连接与非门及重置单元,所述与非门电性连接锁存器及缓冲器单元;输入信号与第一时钟信号输入锁存器,第二时钟信号输入与非门,输出信号自缓冲器单元输出。
所述缓冲器单元包括由第一金属层1、第二金属层2、及设于第一金属层1与第二金属层2之间的有源层3构成的多个TFT;每一TFT均具有双栅极,其底栅极由第一金属层1形成,其源极与漏极由第二金属层2形成,其顶栅极也由第二金属层2形成。
具体地,所述源极、漏极分别位于底栅极及顶栅极的两侧;所述有源层3对应TFT的源极、漏极的区域为离子重掺杂区域31,所述有源层3对应TFT的源极与漏极之间的区域为沟道区域32。
在所述第一金属层1与有源层3之间还设有底栅极绝缘层5,在有源层3与第二金属层2之间还设有顶栅极绝缘层6。TFT的源极与漏极分别经由一贯穿所述顶栅极绝缘层6的过孔61连接有源层3的离子重掺杂区域31。
所述第一金属层1的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
所述第二金属层2的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
所述有源层3的材料为低温多晶硅。
所述底栅极绝缘层5与顶栅极绝缘层6的材料为氧化硅(SiOx)、氮化硅(SiNx)或二者的组合。
由于上述缓冲器单元中的TFT在有源层3的沟道区域32下方设有由第一金属1层形成的底栅极,在有源层3的沟道区域32上方设有由第二金属层2形成的顶栅极,有源层3的沟道区域32厚度较厚、阻抗较小,显著增加了缓冲器单元中的TFT的驱动能力,在相同的驱动能力下,缓冲器单元中TFT的尺寸得以减小,从而缓冲器单元的宽度减小,GOA电路的宽度减小,使得LCD的边框可以做的更窄,例如在相同的驱动能力下,现有GOA电路中的缓冲器单元的宽度为300μm左右,而本发明GOA电路结构中的缓冲器单元的宽度下降为150μm左右,相比于现有技术,本发明的GOA电路结构使得GOA电路的宽度及LCD的边框宽度减小150μm左右。
综上所述,本发明的用于窄边框LCD的GOA电路结构,其缓冲器单元中的TFT在有源层的沟道区域下方设有由第一金属层形成的底栅极,在有源层的沟道区域上方设有由第二金属层形成的顶栅极,有源层的沟道区域厚度较厚、阻抗较小,显著增加了缓冲器单元中的TFT的驱动能力,在相同的驱动能力下,缓冲器单元中TFT的尺寸得以减小,从而缓冲器单元的宽度减小,GOA电路的宽度减小,使得LCD的边框可以做的更窄。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (8)
1.一种用于窄边框LCD的GOA电路结构,其特征在于,包括:锁存器、与非门、缓冲器单元、以及重置单元,所述锁存器电性连接与非门及重置单元,所述与非门电性连接锁存器及缓冲器单元;输入信号输入锁存器,输出信号自缓冲器单元输出;
所述缓冲器单元包括由第一金属层(1)、第二金属层(2)、及设于第一金属层(1)与第二金属层(2)之间的有源层(3)构成的多个TFT;每一TFT均具有双栅极,其底栅极由第一金属层(1)形成,其源极与漏极由第二金属层(2)形成,其顶栅极也由第二金属层(2)形成。
2.如权利要求1所述的用于窄边框LCD的GOA电路结构,其特征在于,所述源极、漏极分别位于底栅极及顶栅极的两侧;所述有源层(3)对应TFT的源极、漏极的区域为离子重掺杂区域(31),所述有源层(3)对应TFT的源极与漏极之间的区域为沟道区域(32)。
3.如权利要求2所述的用于窄边框LCD的GOA电路结构,其特征在于,TFT的源极与漏极分别经由一过孔(61)连接有源层(3)的离子重掺杂区域(31)。
4.如权利要求3所述的用于窄边框LCD的GOA电路结构,其特征在于,在所述第一金属层(1)与有源层(3)之间还设有底栅极绝缘层(5),在有源层(3)与第二金属层(2)之间还设有顶栅极绝缘层(6);所述过孔(61)贯穿所述顶栅极绝缘层(6)。
5.如权利要求1所述的用于窄边框LCD的GOA电路结构,其特征在于,所述第一金属层(1)的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
6.如权利要求1所述的用于窄边框LCD的GOA电路结构,其特征在于,所述第二金属层(2)的材料为钼、钛、铝、铜、镍中的一种或多种的堆栈组合。
7.如权利要求1所述的用于窄边框LCD的GOA电路结构,其特征在于,所述有源层(3)的材料为低温多晶硅。
8.如权利要求4所述的用于窄边框LCD的GOA电路结构,其特征在于,所述底栅极绝缘层(5)与顶栅极绝缘层(6)的材料为氧化硅、氮化硅或二者的组合。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510432315.8A CN104966501B (zh) | 2015-07-21 | 2015-07-21 | 用于窄边框lcd的goa电路结构 |
PCT/CN2015/087727 WO2017012165A1 (zh) | 2015-07-21 | 2015-08-21 | 用于窄边框lcd的goa电路结构 |
US14/778,610 US20170193942A1 (en) | 2015-07-21 | 2015-08-21 | Goa circuit structure for slim-bezel lcd |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510432315.8A CN104966501B (zh) | 2015-07-21 | 2015-07-21 | 用于窄边框lcd的goa电路结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104966501A CN104966501A (zh) | 2015-10-07 |
CN104966501B true CN104966501B (zh) | 2017-07-28 |
Family
ID=54220530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510432315.8A Active CN104966501B (zh) | 2015-07-21 | 2015-07-21 | 用于窄边框lcd的goa电路结构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20170193942A1 (zh) |
CN (1) | CN104966501B (zh) |
WO (1) | WO2017012165A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900654B (zh) * | 2015-04-14 | 2017-09-26 | 深圳市华星光电技术有限公司 | 双栅极氧化物半导体tft基板的制作方法及其结构 |
CN104867870B (zh) * | 2015-04-14 | 2017-09-01 | 深圳市华星光电技术有限公司 | 双栅极氧化物半导体tft基板的制作方法及其结构 |
CN105702223B (zh) * | 2016-04-21 | 2018-01-30 | 武汉华星光电技术有限公司 | 减小时钟信号负载的cmos goa电路 |
CN106128401A (zh) * | 2016-08-31 | 2016-11-16 | 深圳市华星光电技术有限公司 | 一种双边阵列基板行驱动电路、液晶显示面板、驱动方法 |
KR102583621B1 (ko) * | 2017-12-08 | 2023-09-26 | 엘지디스플레이 주식회사 | 표시장치 및 그 제조방법 |
CN110047849B (zh) * | 2019-04-02 | 2024-06-14 | 福建华佳彩有限公司 | 一种Demux电路的TFT结构 |
CN113724667B (zh) * | 2020-04-10 | 2023-04-07 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
CN113785350B (zh) * | 2020-04-10 | 2023-06-16 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103578433B (zh) * | 2012-07-24 | 2015-10-07 | 北京京东方光电科技有限公司 | 一种栅极驱动电路、方法及液晶显示器 |
KR20140043526A (ko) * | 2012-09-21 | 2014-04-10 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
CN203134808U (zh) * | 2012-10-26 | 2013-08-14 | 北京京东方光电科技有限公司 | 一种薄膜场效应晶体管、移位寄存器、显示面板及装置 |
CN103985361B (zh) * | 2013-10-11 | 2016-06-15 | 厦门天马微电子有限公司 | 栅极驱动电路及其控制方法和液晶显示器 |
CN104576652A (zh) * | 2013-10-23 | 2015-04-29 | 群创光电股份有限公司 | 薄膜晶体管基板、其制备方法、以及包含其的显示面板 |
TWI538270B (zh) * | 2013-11-21 | 2016-06-11 | 元太科技工業股份有限公司 | 電晶體結構及其製作方法 |
CN104716091B (zh) * | 2013-12-13 | 2018-07-24 | 昆山国显光电有限公司 | 阵列基板的制备方法、阵列基板和有机发光显示器件 |
KR102319478B1 (ko) * | 2014-03-18 | 2021-10-29 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 그 제조 방법 |
CN104297970B (zh) * | 2014-10-29 | 2017-03-08 | 京东方科技集团股份有限公司 | Goa 单元、阵列基板、显示装置及制作方法 |
CN104779257B (zh) * | 2015-04-14 | 2017-11-03 | 深圳市华星光电技术有限公司 | Tft布局结构 |
-
2015
- 2015-07-21 CN CN201510432315.8A patent/CN104966501B/zh active Active
- 2015-08-21 WO PCT/CN2015/087727 patent/WO2017012165A1/zh active Application Filing
- 2015-08-21 US US14/778,610 patent/US20170193942A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2017012165A1 (zh) | 2017-01-26 |
US20170193942A1 (en) | 2017-07-06 |
CN104966501A (zh) | 2015-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104966501B (zh) | 用于窄边框lcd的goa电路结构 | |
KR102071855B1 (ko) | 반도체 장치 및 그 제작 방법 | |
US10074669B2 (en) | Display device | |
JP7417649B2 (ja) | 表示装置 | |
KR101763663B1 (ko) | 반도체 장치, 그 제작 방법 및 텔레비전 | |
CN101728435B (zh) | 半导体器件及其制造方法 | |
KR101644406B1 (ko) | 표시 장치 | |
CN101276087B (zh) | 液晶显示装置 | |
JP7451784B2 (ja) | 表示装置 | |
US9741752B1 (en) | Method for manufacturing TFT substrate | |
CN105487315A (zh) | Tft阵列基板 | |
KR20200090939A (ko) | 반도체 장치 및 반도체 장치의 제작방법 | |
CN102608816B (zh) | 液晶显示面板以及其制造方法 | |
US20140204305A1 (en) | Tft structure, lcd device, and method for manufacturing tft | |
CN103149754A (zh) | 薄膜晶体管液晶显示器件及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |